CN110277336A - IC assembling device - Google Patents
IC assembling device Download PDFInfo
- Publication number
- CN110277336A CN110277336A CN201910585956.5A CN201910585956A CN110277336A CN 110277336 A CN110277336 A CN 110277336A CN 201910585956 A CN201910585956 A CN 201910585956A CN 110277336 A CN110277336 A CN 110277336A
- Authority
- CN
- China
- Prior art keywords
- track
- assembling device
- bracket
- screening
- assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012216 screening Methods 0.000 claims abstract description 47
- 230000005540 biological transmission Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 20
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
The invention provides an IC assembling device which comprises a rack, a distributing and screening assembly, an assembling assembly and a conveying track, wherein the distributing and screening assembly is arranged on the rack in sequence and used for screening a support and an IC, the assembling assembly is used for automatically assembling the support and the IC, and the conveying track is used for connecting the distributing and screening assembly and the assembling assembly. Compared with the prior art, the IC assembling device provided by the invention has the advantages that the supports and the ICs are screened by the distributing and screening assembly, the screened supports and the screened ICs are conveyed to the assembling assembly by the conveying rail, and the supports and the ICs are correspondingly spliced and assembled by the assembling assembly one by one, so that the assembling efficiency is improved, the situations of IC assembly failure, IC reverse assembly and breakdown are avoided, the quality of assembled products is ensured, and the IC assembling device is in line with humanized and industrial design.
Description
Technical field
The invention belongs to Hall IC package technique fields, are to be related to a kind of IC assembling device more specifically.
Background technique
Hall IC component is electric elements common in electronics industry, is common component in circuit control panel.
National circuit control panel hall electric machine IC assembly is manually to assemble, and worker sentences the Hall IC component after cutting
It is assembled on locating support behind disconnected front and back sides, so that bracket and IC is formed a finished product, being then provided to production line loading board makes
With.
Since IC electronic component is small in size, not only working efficiency is low for hand assembled, and the attention of worker needs height
Concentrate large labor intensity, and there are following assembling hidden danger: 1. assembly are not in place；2. there is anti-loaded phenomenon in Hall IC；3. artificial
Assembling needs antistatic protection, once Hall IC electrostatic fails, in fact it could happen that breakdown hidden danger；Production site and material are occupied simultaneously
The waste of turnover.
Summary of the invention
The purpose of the present invention is to provide a kind of IC assembling devices, to solve hand assembled efficiency existing in the prior art
Low problem.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of IC assembling device, including rack are provided, wrap
It includes and is successively set in the rack for screening sub-material the screening component, the group for assembling bracket and IC automatically of bracket and IC
The transmission track of arrangement, connection sub-material the screening component and described group of arrangement.
Further, the sub-material screening component includes for the first screening plate of sub-material screening bracket and for sizing screen
Select the second screening plate of IC；First screening plate is separately provided for being connected to the transmission track with second screening plate
The first discharge port and the second discharge port.
Further, the transmission track includes the first track being connected to first discharge port and goes out with described second
Second track of material mouth connection.
Further, the end of first track is provided with the angle cylinder for pushing bracket to be displaced.
Further, the end of first track and second track is provided with for incuding and controlling bracket and IC
Feeding and the sensor completely expected.
Further, the support frame for being used to support first track and second track is provided in the rack.
Further, described group of arrangement includes that the end of first track and second track is arranged in and is used for
The PLC cylinder of automatic assembling bracket and IC.
Further, described group of arrangement further includes being arranged in first track and second track end and being used for
The limit mold group of limiting bracket and IC are shelved, and the height that the limit mold group is shelved is adjustable.
Further, the IC assembling device further includes rewinding disk, and the end of the PLC cylinder is provided with the connection receipts
The sliding slot of charging tray.
Further, the sliding slot is obliquely installed with horizontal plane.
The beneficial effect of IC assembling device provided by the invention is: compared with prior art, the present invention passes through sizing screen
Component is selected to screen bracket and IC, the bracket screened and IC are sent at group arrangement by transmission track, organize arrangement
Bracket and IC are corresponded into grafting assembling, improve packaging efficiency, avoids that IC assembly is not in place, IC is anti-loaded, punctures
Situation, ensure that the quality of completed knocked down products, meet hommization and industrialization design.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the structural schematic diagram of IC assembling device provided in an embodiment of the present invention, and part-structure is not shown；
Fig. 2 is the enlarged drawing of part A in Fig. 1, and part-structure is not shown；
Fig. 3 is the partial enlarged view that limit mold assembles frame, and part-structure is not shown.
Wherein, each attached drawing main mark in figure:
1, rack；
2, sub-material screens component；21, the first screening plate；22, the second screening plate；23, the first discharge port；24, the second discharge port；
3, arrangement is organized；31, limit mold group is shelved；311, baffle；312, guide groove；32, PLC cylinder；
4, transmission track；41, the first track；42, the second track；
5, angle cylinder；6, support frame；7, rewinding disk；8, sliding slot；9, push rod.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Also referring to Fig. 1 and Fig. 2, now IC assembling device provided in an embodiment of the present invention is illustrated.The IC group
Assembling device, including rack 1 are provided with sub-material screening component 2, group arrangement 3 and transmission track 4, sub-material screening group in rack 1
Part 2 for screening bracket and IC, group arrangement 3 for assembling bracket and IC automatically, conveyor track for transmit bracket and IC and
Both ends are separately connected sub-material screening component 2 and group arrangement 3.During the work time, sub-material screening component 2 passes through high frequency vibrating respectively
Bracket and IC are screened and are sent to transmission track 4 by dynamic mode, and bracket and IC are sent to a group arrangement by transmission track 4
At 3, group arrangement 3 carries out grafting to IC and bracket automatically and completes assembling.Bracket and the packaging efficiency of IC are improved, work is alleviated
The labour of people, while improving the accuracy of assembling.
IC assembling device provided by the invention is screened component 2 by sub-material and is carried out to bracket and IC compared with prior art
The bracket screened and IC are sent at group arrangement 3 by screening, transmission track 4, and group arrangement 3 corresponds bracket and IC
Grafting assembling, improves packaging efficiency, avoids IC and assembles that not in place, IC is anti-loaded, is in the presence of puncturing, and ensure that assembling produces
The quality of product meets hommization and industrialization design.
Further, referring to Fig. 1, a kind of specific embodiment as IC assembling device provided by the invention, sub-material
It includes the first screening plate 21 and the second screening plate 22 that brush, which selects component, and the first screening plate 21 is for screening bracket, the second screening plate 22
For screening IC, in the present embodiment, the first screening plate 21 and the second screening plate 22 select digital high frequency vibrating disk, the first screening
Disk 21 makes bracket along screening feeding clockwise, and the second screening plate 22 makes IC along screening feeding counterclockwise.First screening
The junction of disk 21 and transmission track 4 is additionally provided with the first discharge port 23, and the junction of the second screening plate 22 and transmission track 4 is also
It is provided with the second discharge port 24, the second discharge port 24 carries out reversion guiding to IC so that IC180 degree translates feeding, and realization IC is positive
Feeding, bracket and IC converge in transmission track 4.
Further, a kind of specific implementation also referring to Fig. 1 and Fig. 2, as IC assembling device provided by the invention
Mode, transmission track 4 include the first track 41 and the second track 42, and the first discharge port 23 is connected to the first track 41, and second goes out
Material mouth 24 is connected to the second track 42.First track 41 is used for transmission bracket, and the second track 42 is used for transmission IC, by bracket and IC
Separately transmission, avoids bracket before assembling and IC is interfered.
Further, a kind of specific implementation also referring to Fig. 1 and Fig. 2, as IC assembling device provided by the invention
Mode, the end of the first track 41 are arranged angled cylinder 5, and angle cylinder 5 is for pushing bracket, in the present embodiment, angle gas
Cylinder 5 is designed according to the features of shape of bracket, pushes bracket one by one.
Further, a kind of specific embodiment as IC assembling device provided by the invention, the first track 41 and
The end of two tracks 42 is provided with sensor, sensor be used to incude and control bracket and IC feeding and full material, so as to effective
The supply of ground control IC and bracket.
Further, a kind of specific implementation also referring to Fig. 1 and Fig. 2, as IC assembling device provided by the invention
Mode is provided with support frame 6 in rack 1, and support frame 6 is used to support the first track 41 and the second track 42, and support frame 6 makes
The middle part of one track 41 and the second track 42 is supported, so that the first track 41 and the second track 42 and group arrangement 3, first
Screening plate 21, the connection of the second screening plate 22 are more stable.
Further, a kind of specific implementation also referring to Fig. 1 and Fig. 2, as IC assembling device provided by the invention
Mode, group arrangement 3 includes PLC cylinder 32, and PLC cylinder 32 is arranged in the end of the first track 41 and the second track 42, is used for
Automatic assembling bracket and IC, bracket and IC act cooperation cycle operation by PLC cylinder 32 and photoelectricity and realize automatic assembling.
Further, a kind of specific implementation also referring to Fig. 1 and Fig. 2, as IC assembling device provided by the invention
Mode, group arrangement 3 further include that limit mold group shelves 31, and limit mold group shelves 31 settings in the first transmission track 4 and the
The end of two transmission tracks 4, limit mold group are shelved 31 pairs of brackets and IC and are limited in assembling, convenient for oneself of bracket and IC
Dynamic assembling, wherein the height that limit mold group shelves 31 is adjustable.It adjusts limit mold group and shelves 31 convenient for neatly cooperating first
Track 41 and the second track 42 carry out the docking of bracket and IC.
Specifically, referring to Fig. 3, limit mold group shelve be provided on 31 for stop limit IC barrier plate 311,
The end of PLC cylinder 32 is connected with the push rod 9 for pushing IC Yu bracket grafting, when IC is sent to baffle by the second track 42
When 311, push rod 9 pushes IC and bracket to carry out grafting, and limit mold group, which is shelved, to be also provided with for bracket and IC transmission on 31
It is slid after guide groove 312, bracket and IC grafting along guide groove 312, finally leaves limit mold group and shelve 31.
Further, referring to Fig. 1, a kind of specific embodiment as IC assembling device provided by the invention, IC group
Assembling device further includes rewinding disk 7, and the end of PLC cylinder 32 is provided with sliding slot 8, and sliding slot 8 is connected to rewinding disk 7, and PLC cylinder 32 exists
Will bracket and IC assemble after be pushed into sliding slot 8, bracket and IC along sliding slot 8 enter rewinding disk 7 after being completed.
Further, a kind of specific embodiment as IC assembling device provided by the invention, sliding slot 8 and horizontal plane incline
The top of tiltedly setting, rewinding disk 7 is lower than the first track 41 and the second track 42, so that bracket and IC can be smooth after being completed
Enter rewinding disk 7, blocking is occurred with non-slip groove 8 and causes bracket and IC impaired.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of IC assembling device, including rack, it is characterised in that: including being successively set in the rack for screening bracket
With the sub-material of IC screening component, the group arrangement for assembling bracket and IC automatically, the connection sub-material screening component and described
The transmission track of group arrangement.
2. IC assembling device as described in claim 1, it is characterised in that: the sub-material screening component includes screening for sub-material
First screening plate of bracket and the second screening plate that IC is screened for sub-material；First screening plate and second screening plate point
It is not provided with the first discharge port and the second discharge port for being connected to the transmission track.
3. IC assembling device as claimed in claim 2, it is characterised in that: the transmission track includes and first discharge port
First track of connection and the second track being connected to second discharge port.
4. IC assembling device as claimed in claim 3, it is characterised in that: the end of first track is provided with for pushing
The angle cylinder of bracket displacement.
5. IC assembling device as claimed in claim 3, it is characterised in that: the end of first track and second track
It is provided with for incuding and controlling bracket and IC feeding and the full sensor expected.
6. IC assembling device as claimed in claim 3, it is characterised in that: be provided in the rack and be used to support described first
The support frame of track and second track.
7. IC assembling device as described in claim 1, it is characterised in that: described group of arrangement includes being arranged in first rail
The end of road and second track and the PLC cylinder for being used to assemble bracket and IC automatically.
8. IC assembling device as claimed in claim 7, it is characterised in that: described group of arrangement further includes being arranged described first
Track and second track end and limit mold group for limiting bracket and IC is shelved, what the limit mold group was shelved
It is highly adjustable.
9. IC assembling device as claimed in claim 8, it is characterised in that: the IC assembling device further includes rewinding disk, described
The end of PLC cylinder is provided with the sliding slot for being connected to the rewinding disk.
10. IC assembling device as claimed in claim 9, it is characterised in that: the sliding slot is obliquely installed with horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910585956.5A CN110277336A (en) | 2019-07-01 | 2019-07-01 | IC assembling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910585956.5A CN110277336A (en) | 2019-07-01 | 2019-07-01 | IC assembling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110277336A true CN110277336A (en) | 2019-09-24 |
Family
ID=67963866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910585956.5A Pending CN110277336A (en) | 2019-07-01 | 2019-07-01 | IC assembling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110277336A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586425B1 (en) * | 2005-12-14 | 2006-06-08 | 티.비텔레콤(주) | Apparatus for manufacturing mike connector |
| KR20080047958A (en) * | 2006-11-27 | 2008-05-30 | 이상재 | Press for attaching accessory |
| US20110027058A1 (en) * | 2009-07-31 | 2011-02-03 | Tokyo Electron Limited | Assembly method of transfer mechanism and transfer chamber |
| CN105563819A (en) * | 2016-03-09 | 2016-05-11 | 利辛县富亚纱网有限公司 | Magnetic snap continuous production device |
| KR101650489B1 (en) * | 2016-04-25 | 2016-08-24 | 주식회사 에스탑 | Apparatus for sorting parts |
| CN106312499A (en) * | 2016-08-31 | 2017-01-11 | 宁波赛特威尔电子有限公司 | Transmitting tube transferring device |
| CN106670776A (en) * | 2016-12-12 | 2017-05-17 | 吴江市金澜机械制造有限公司 | Rapid grouping and automatic pre-assembling system |
| CN207043679U (en) * | 2017-07-31 | 2018-02-27 | 深圳市灿弘自动化科技有限公司 | A kind of zoom lens apparatus automatization assembling |
| CN210073780U (en) * | 2019-07-01 | 2020-02-14 | 珠海格力新元电子有限公司 | IC assembling device |
-
2019
- 2019-07-01 CN CN201910585956.5A patent/CN110277336A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100586425B1 (en) * | 2005-12-14 | 2006-06-08 | 티.비텔레콤(주) | Apparatus for manufacturing mike connector |
| KR20080047958A (en) * | 2006-11-27 | 2008-05-30 | 이상재 | Press for attaching accessory |
| US20110027058A1 (en) * | 2009-07-31 | 2011-02-03 | Tokyo Electron Limited | Assembly method of transfer mechanism and transfer chamber |
| CN105563819A (en) * | 2016-03-09 | 2016-05-11 | 利辛县富亚纱网有限公司 | Magnetic snap continuous production device |
| KR101650489B1 (en) * | 2016-04-25 | 2016-08-24 | 주식회사 에스탑 | Apparatus for sorting parts |
| CN106312499A (en) * | 2016-08-31 | 2017-01-11 | 宁波赛特威尔电子有限公司 | Transmitting tube transferring device |
| CN106670776A (en) * | 2016-12-12 | 2017-05-17 | 吴江市金澜机械制造有限公司 | Rapid grouping and automatic pre-assembling system |
| CN207043679U (en) * | 2017-07-31 | 2018-02-27 | 深圳市灿弘自动化科技有限公司 | A kind of zoom lens apparatus automatization assembling |
| CN210073780U (en) * | 2019-07-01 | 2020-02-14 | 珠海格力新元电子有限公司 | IC assembling device |
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