CN110277324A - Fan-out-type module ultrasound packaging technology, equipment and structure - Google Patents
Fan-out-type module ultrasound packaging technology, equipment and structure Download PDFInfo
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- CN110277324A CN110277324A CN201910577684.4A CN201910577684A CN110277324A CN 110277324 A CN110277324 A CN 110277324A CN 201910577684 A CN201910577684 A CN 201910577684A CN 110277324 A CN110277324 A CN 110277324A
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- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
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- 239000000758 substrate Substances 0.000 claims description 35
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
The invention discloses fan-out-type module ultrasound packaging technology, equipment and structures, wherein fan-out-type module ultrasound packaging technology includes the following steps: along packaging body stacking direction, in the top surface of base station, tiling has interim bonded layer, multiple modules are placed in the interim bonded layer top surface gap, it is molded from the module top to form the injection molded layers for surrounding the module, and keeps the bottom surface of the injection molded layers and the interim bonded layer bonding；Ultrasonic relaxation is carried out to the uncured injection molded layers.In the fan-out-type module ultrasound packaging technology, after successively executing tile interim bonded layer, chip placement and injection molding and forming injection molded layers, before injection molded layers are uncured, ultrasonic relaxation is used to injection molded layers, to pass through ultrasonic relaxation, release stress is reached to injection molded layers, and reduces the effect of warpage, improves package quality and reliability.
Description
Technical field
The present invention relates to encapsulation technology fields also to relate to more specifically to a kind of fan-out-type module ultrasound packaging technology
And a kind of fan-out-type module ultrasound sealed in unit, further relate to a kind of fan-out-type module ultrasound encapsulating structure.
Background technique
With miniaturization of electronic products and integrated trend, the densification of microelectronic packaging technology is in electricity of new generation
Mainstream is increasingly becoming on sub- product.In order to comply with the hair of the products such as the development of electronic product of new generation, especially mobile phone, notebook
Exhibition, module is higher to density, speed faster, smaller, the more low direction of cost develops.Fan-out square chip level package technology
The appearance of (Fan-out Panel Level Package, FOPLP), as fan-out-type Wafer level packaging (Fan-out
Wafer Level Package, FOWLP) upgrade technique, possess broader development prospect.With traditional wire bonding mould
Block is compared, and fan-out package greatly increases the number of pins of module, reduces package dimension, is simplified encapsulation step, is shortened mould
The distance between block and substrate improve functions of modules.It is short, high with support 10nm or less manufacturing process module, interconnection path
Integrated level, ultrathin, high reliability, the advantages such as high heat-sinking capability.
The basic working procedure of fan-out package are as follows: cover interim bonding glue on substrate, install module, be molded and consolidated
Change, remove interim bonding glue and substrate, covers dielectric layer (ABF) and again wiring layer (RDL).Such process, which is also brought, to be fanned out to
Two big basic problems of type encapsulation, i.e. module drift and buckling behavior.In encapsulation process, due to materials such as plastic cement, silicon and metals
The difference of the coefficient of thermal expansion of material, will cause warpage and internal stress.Wherein, the difference of module and injected plastics material thermal expansion coefficient makes to infuse
The warpage generated in moulding material cooling procedure is the main reason that big plate grade is fanned out to that warpage generates in encapsulation technology.
It leads to the problem of in conclusion how to efficiently solve encapsulation process compared with high internal stress and warpage, is current ability
Field technique personnel's urgent problem.
Summary of the invention
In view of this, the first purpose of this invention is to provide a kind of fan-out-type module ultrasound packaging technology, this is fanned out to
Pattern block ultrasound packaging technology can efficiently solve encapsulation process and lead to the problem of compared with high internal stress and warpage, and of the invention
Two purposes are to provide a kind of fan-out-type module ultrasound sealed in unit, and third object of the present invention is to provide one kind to be fanned out to pattern
Block ultrasound encapsulating structure.
In order to reach above-mentioned first purpose, the invention provides the following technical scheme:
A kind of fan-out-type module ultrasound packaging technology, includes the following steps:
Along packaging body stacking direction, in the top surface of base station, tiling has interim bonded layer, between the interim bonded layer top surface
Gap places multiple modules, is molded from the module top to form the injection molded layers for surrounding the module, and make the injection molded layers
Bottom surface and the interim bonded layer are bonding；
Ultrasonic relaxation is carried out to the uncured injection molded layers by ultrasonic probe.
In the fan-out-type module ultrasound packaging technology, tile interim bonded layer, chip placement and injection molding are successively being executed
After forming injection molded layers, before injection molded layers are uncured, ultrasonic relaxation is used to injection molded layers, to pass through ultrasonic relaxation, to injection molding
Layer reaches release stress, and reduces the effect of warpage, improves package quality and reliability.In conclusion the fan-out-type module
Ultrasonic packaging technology can efficiently solve encapsulation process and lead to the problem of compared with high internal stress and warpage.
It is preferably, described that ultrasonic relaxation is carried out to the uncured injection molded layers are as follows:
The ultrasonic probe and the injection molded layers top surface being distributed by array offset to carry out to the injection molded layers
Ultrasonic relaxation.
Preferably, the surface that the ultrasonic probe and the injection molded layers offset is coated with graphite linings.
Preferably, the ultrasonic probe in the injection molded layers with the two neighboring module gap corresponding position phase
It supports.
Preferably, it is described ultrasonic relaxation carried out to the uncured injection molded layers before further include: the base station is placed
On the rigid substrate and it is bonded the bottom surface of the base station with the rigid substrates upper surface.
Preferably, rigid substrates upper surface surrounding is bent downwardly.
In order to reach above-mentioned second purpose, the present invention also provides a kind of fan-out-type module ultrasound sealed in unit, the fans
Out pattern block ultrasound sealed in unit include the reclinate rigid substrates of upper surface surrounding and it is multiple in horizontal array distribution and
Ultrasonic probe on the upside of the rigid substrates is set, and the downside of the ultrasonic probe is coated with graphite linings.Due to this
Fan-out-type module ultrasound sealed in unit uses above-mentioned fan-out-type module ultrasound packaging technology, and due to above-mentioned fan-out-type module
Ultrasonic packaging technology has above-mentioned technique effect, then the fan-out-type module ultrasound sealed in unit should also have corresponding technology to imitate
Fruit.
In order to reach above-mentioned third purpose, the present invention also provides a kind of fan-out-type module ultrasound encapsulating structure, the fans
Pattern block ultrasound encapsulating structure includes base station out；It is covered on the interim bonded layer of the base station loading end；Multiple modules, gap are put
It sets in the interim bonded layer top surface；The module setting, the injection molding are surrounded in injection molded layers, injection molding in the module
The bottom surface of layer is bonded in the interim bonded layer upper surface；Ultrasonic generator is speeded for carrying out ultrasound to the injection molded layers
Henan.Since the fan-out-type module ultrasound encapsulating structure uses above-mentioned fan-out-type module ultrasound packaging technology, and due to above-mentioned
Fan-out-type module ultrasound packaging technology has above-mentioned technique effect, then the fan-out-type module ultrasound encapsulating structure should also have accordingly
Technical effect.
Preferably, the ultrasonic generator includes the ultrasound for being distributed in array and offseting with the injection molded layers top surface
Wave probe, the ultrasonic probe surface are coated with adherent layer.
Preferably, further include that upper surface is used for the rigid substrates that offset with the base station bottom surface, the rigid substrates it is upper
Surface surrounding is bent downwardly；The ultrasonic probe in the injection molded layers with the two neighboring module gap corresponding position
It offsets.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of fan-out-type module ultrasound packaging technology provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of fan-out-type module ultrasound encapsulating structure provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of the section structure of fan-out-type module ultrasound encapsulating structure provided in an embodiment of the present invention；
Fig. 4 is the cross-section structure that pattern block ultrasound encapsulating structure is fanned out under flexural rigidity substrate provided in an embodiment of the present invention
Schematic diagram.
It is marked in attached drawing as follows:
Ultrasonic probe 1, adherent layer 2, module 3, injection molded layers 4, interim bonded layer 5, base station 6, rigid substrates 7.
Specific embodiment
The embodiment of the invention discloses a kind of fan-out-type module ultrasound packaging technologies, to efficiently solve encapsulation process generation
The problem of compared with high internal stress and warpage.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-Fig. 4 is please referred to, Fig. 1 is the flow chart of fan-out-type module ultrasound packaging technology provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of fan-out-type module ultrasound encapsulating structure provided in an embodiment of the present invention；Fig. 3 mentions for the embodiment of the present invention
The schematic diagram of the section structure of the fan-out-type module ultrasound encapsulating structure of confession；Fig. 4 is flexural rigidity base provided in an embodiment of the present invention
The schematic diagram of the section structure of pattern block ultrasound encapsulating structure is fanned out under plate.
In a specific embodiment, present embodiments provide a kind of fan-out-type module ultrasound packaging technology, with for pair
Module 3 is packaged, and wherein module 3 generally refers to chip, wherein fan-out-type module ultrasound packaging technology the specific can be that
Wafer scale fan-out package technique or big plate grade fan-out package technique.Specifically, fan-out-type module ultrasound packaging technology master
It comprises the following steps:
Step 100: along packaging body stacking direction, in the top surface of base station 6, tiling has interim bonded layer 5,
Wherein packaging body stacking direction refers to the stacked direction of module 3, interim bonded layer 5 and base station 6, general next
It says, packaging body stacking direction is up and down direction.For the convenience of description, be base with base station 6, i.e. base station 6 is towards interim bonded layer 5
Direction be top to, and be reversed bottom to.Wherein in the top surface of base station 6, tiling has interim bonded layer 5, and specifically tile size
Consistent with 4 size of injection molded layers finally needed to form, specific tile mode can refer to the prior art.
Step 200: placing multiple modules 3 in the interim 5 top surface gap of bonded layer.
In interim bonded layer 5 and then the placement modules 3 of tiling, modules 3 are along interim bonded layer 5 tiling direction
It is set side by side, the relative positional relationship between modules 3 to be fixed by interim bonded layer 5.Specific each mould
Relative positional relationship between block 3 is configured as needed, and in general modules 3 are in array manner, and each other
With certain gap.
Step 300: injection molding is at the top of the module 3 to form the injection molded layers 4 for surrounding the module 3, and makes the injection molding
The bottom surface of layer 4 and the interim bonded layer 5 are bonding.
Be molded at the top of module 3 to form the injection molded layers 4 for surrounding module 3, and formed the bottom surfaces of injection molded layers 4 be temporarily bonded
Layer 5 is bonding, is shifted with being effectively prevented from module 5, and wherein the top surface of injection molded layers 4 generally forms plane, and top surface is answered
When the top surface for being higher than module 3, to carry out all standing to module 3.After injection molding forms injection molded layers 4, modules 3 are closely embedded in note
It moulds in layer 4, with when removing interim bonded layer 5 in the later period, the bottom surface of module 3 is exposed, to facilitate connection, and the bottom surface of injection molded layers 4
Bottom surface with module 3 is generally within same plane.
Step 400: ultrasonic relaxation is carried out to the uncured injection molded layers 4 by ultrasonic probe.
Wherein ultrasonic relaxation, which refers to, provides energy by ultrasound, and in microstructure, Material Physics state trend is equal
It is even consistent, reduce the stress for solidifying and generating.Specifically, it is main by one ultrasonic unit of setting, it will be ultrasonic by probe
Wave is transferred to injection molded layers 4.It is emphasized that wherein the operation of step 400 progress ultrasound should speed before the solidification of injection molded layers 4
Henan, to guarantee to be able to carry out stress elimination inside injection molded layers 4.It should be noted that wherein carrying out ultrasonic relaxation, it can be and infusing
The cured progress in the process of layer 4 is moulded, can also approach but not yet be fully cured when progress, treatment temperature depends on injection molded layers 4
The material properties of material itself.It should be noted that wherein uncured should include not being fully cured.
It should be noted that executing step 400 after the solidification of injection molded layers 4, it is also necessary to remove interim bonded layer 5 and base station
6, dielectric layer (ABF) and again wiring layer (RDL) are then covered, it is specific to operate to complete entire fan-out-type module ultrasound encapsulation
Mode can refer to the prior art, and details are not described herein.Specifically be wherein routed again can before the injection molding of step 300,
It can be arranged in after the injection molding of step 300.
In the fan-out-type module ultrasound packaging technology, tile interim bonded layer 5, chip placement and injection molding are successively being executed
After forming injection molded layers 4, before injection molded layers 4 are uncured, ultrasonic relaxation is used to injection molded layers 4, to pass through ultrasonic relaxation, to note
Modeling layer 4 reaches release stress, and reduces the effect of warpage, improves package quality and reliability.In conclusion this is fanned out to pattern
Block ultrasound packaging technology can efficiently solve encapsulation process and lead to the problem of compared with high internal stress and warpage.
In order to preferably carry out ultrasonic relaxation, so that ultrasound is preferably transferred to injection molded layers 4.Step preferably wherein herein
400: ultrasonic relaxation is carried out to uncured injection molded layers 4, specifically: the ultrasonic probe 1 and injection molded layers 4 being distributed by array
Top surface offsets to carry out ultrasonic relaxation to injection molded layers 4.So that more uniform ultrasonic reception is born in 4 top surface of injection molded layers, with steady
Carry out ultrasound relaxation.It should be noted that 4 top surface of injection molded layers and ultrasonic wave can be made in order to preferably carry out ultrasonic relaxation
There is certain abutting force between probe 1.Wherein ultrasonic wave should be set side by side along the extending direction of injection molded layers 4, generally in square
A burst of column distribution, and be generally uniformly distributed.Specifically, wherein the oscillation intensity of ultrasonic probe 1 and arrangement mode and density can
Freely to adjust and require to be designed according to specific encapsulation.
Specifically, in order to avoid the ultrasonic wave that ultrasonic probe 1 issues has an impact internal chip, herein preferably its
Corresponding position offsets middle ultrasonic probe 1 with two neighboring 3 gap of module in the injection molded layers 4.That is, injection molded layers 4
The upper position abutted with ultrasonic probe 1 is not position corresponding with chip, but the position being staggered with chip, i.e., adjacent
Interstitial site between two chips.When later period again gets off each chip cutting, i.e., from injection molded layers 4 and 1 phase of ultrasonic probe
The position cutting supported.
Further, it is contemplated that the needs of ultrasonic probe 1 are abutted with injection molded layers 4, and are in the uncured state of injection molded layers 4
It is lower to be abutted with injection molded layers 4.In order to avoid ultrasonic probe 1 is adhered in injection molded layers 4, preferred ultrasonic probe 1 and injection molding herein
The surface that layer 4 offsets is coated with adherent layer 2, and the specific adherent layer 2 can be powder bed, can be graphite linings, specifically may be used
To be graphite bisque, play the role of the substances such as barrier oil, water.
Further, in order to preferably make injection molded layers 4 absorb ultrasonic wave, preferred above-mentioned steps 400 herein: to uncured
Injection molded layers 4 carry out ultrasonic relaxation, before further include: base station 6 is placed on rigid substrates 7 to and is made bottom surface and the rigidity of base station 6
7 upper surface of substrate fitting, to be that above interim bonded layer 5, module 3 and injection molded layers 4 carry out to base station 6 by rigid substrates 7
Support.Wherein the upper surface of rigid substrates 7 can be horizontal plane, can also be other faces.Further, rigidity preferably wherein
7 upper surface surrounding of substrate is bent downwardly, so that upper surface type in curved surface, i.e. 7 upper surface of rigid substrates have upper convex curvature, with right
Warpage plays the role of negative compensation, and choosing for amount of curvature can be according to structure, material properties and the processing technology etc. of encapsulation itself
Parameter is designed, and is preferably minimized warpage as far as possible.Wherein base station 6, injection molded layers 4 and module 3 generate corresponding bending,
And the ultrasonic probe 1 therein positioned at surrounding compared to middle part ultrasonic probe 1 bottom of to protrusion.
A kind of more specific application, then it is routed in the packaging technology after injection moulding process, as 320 millimeters of side length
Square big plate grade fan-out package, wherein one single chip is the square chips that side length is 5 millimeters, and wherein one single chip includes
The square area that the area of fan-out area is 8 millimeters of side length.Fan-out package is using epoxy resin compound as note at this time
After moulding material injection molding, before injected plastics material solidification, structure at this time is followed successively by base station 6, interim bonded layer 5, core from top to bottom
Piece and uncured injection molded layers 4, the ultrasonic probe 1 being distributed by array are convex in the upper surface of convex rigid substrates 7
Curved surface, treatment temperature be 175 DEG C (degree Celsius), vibration frequency be 25KHz (kHz) under the conditions of, in 4 top surface of injection molded layers
Local location carries out arrayed ultrasonic relaxation 5min (5 minutes), to reduce encapsulation stress and warpage.
In another more specific application, then it is routed in the packaging technology before injection moulding process, 120 millimeters of side length
The big plate grade fan-out package process of square, wherein one single chip is the square chips that side length is 5 millimeters, wherein single core
Piece includes the square area that the area of fan-out area is 8 millimeters of side length.Fan-out package uses epoxy resin compound at this time
After injected plastics material injection molding, before injected plastics material solidification, structure at this time is followed successively by base station 6, interim bonding from top to bottom
Layer 5, dielectric layer, again wiring layer, chip and uncured injection molded layers 4, the ultrasonic probe 1 being distributed by array, convex
The upper surface of rigid substrates 7 is convex curved surface, and treatment temperature is 150 DEG C (degree Celsius), and vibration frequency is 305KHz (kilohertz
Under the conditions of hereby), the local location in 4 top surface of injection molded layers carries out arrayed ultrasonic relaxation 10min (minute), to reduce encapsulation stress
And warpage.
A kind of fan-out-type module ultrasound packaging technology provided in based on the above embodiment, the present invention also provides a kind of fans
Pattern block ultrasound sealed in unit out, specifically, the fan-out-type module ultrasound sealed in unit includes rigid substrates 7 and multiple ultrasonic waves
Probe 1, wherein the upper surface surrounding of rigid substrates 7 is bent downwardly, with for carrying above-mentioned base station 6, on corresponding rigid substrates 7
Above-mentioned steps 100 are executed to above-mentioned steps 300.Multiple ultrasonic probes 1 are distributed in horizontal array and are arranged at rigid substrates 7
Upside, and the lower end of each ultrasonic probe 1 and rigid substrates 7 in the vertical direction at a distance from be equal, in above-mentioned steps
After 300 execute, multiple ultrasonic probe 1 executes above-mentioned steps 400, i.e., carries out ultrasound to the uncured injection molded layers 4 and speed
Henan.Since the fan-out-type module ultrasound sealed in unit uses the fan-out-type module ultrasound packaging technology in above-described embodiment, institute
Above-described embodiment is please referred to the beneficial effect of the fan-out-type module ultrasound sealed in unit.Specifically, the ultrasound of array distribution
Corresponding position offsets wave probe 1 with two neighboring 3 gap of module in injection molded layers 4.Wherein ultrasonic probe 1 and injection molding
The surface that layer 4 offsets is preferably coated with graphite linings.
A kind of fan-out-type module ultrasound packaging technology provided in based on the above embodiment, the present invention also provides a kind of fans
Pattern block ultrasound encapsulating structure out, specifically, the fan-out-type module ultrasound encapsulating structure includes: base station 6；It is covered on the base station
The interim bonded layer 5 of 6 loading ends；Multiple modules 3, gap are placed on 5 top surface of interim bonded layer；Injection molded layers 4, injection molding
It is arranged in the module 3 with surrounding the module 3, the top surface of the injection molded layers 4 is plane, bottom surface is bonded in the ephemeral key
Close 5 upper surface of layer；Ultrasonic generator, for carrying out ultrasonic relaxation to the injection molded layers 4.I.e. the fan-out-type module ultrasound is sealed
Assembling structure is the state overall structure that fan-out-type module ultrasound packaging technology eliminates stress in ultrasound.Since the fan-out-type module is super
Sound encapsulating structure uses the fan-out-type module ultrasound packaging technology in above-described embodiment, so the fan-out-type module ultrasound encapsulates
The beneficial effect of structure please refers to above-described embodiment.
Further, ultrasonic generator includes being distributed in array and offseting with 4 top surface of injection molded layers preferably wherein
Ultrasonic probe 1, wherein 1 surface of ultrasonic probe is coated with adherent layer 2, and specific adherent layer 2 is preferably graphite linings, such as graphite
Bisque.
Further, it is also preferable to include the rigid substrates 7 that upper surface is used to offset with 6 bottom surface of base station.On the rigid substrates 7
Surface can be a plane, and such as above-described embodiment, the upper surface surrounding of preferred rigid substrates 7 is bent downwardly herein.It is such as above-mentioned
Embodiment, in order to preferably protect chip, preferably wherein in ultrasonic probe 1 and injection molded layers 4 between the two neighboring module 3
The corresponding position of gap offsets.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of fan-out-type module ultrasound packaging technology, which comprises the steps of:
Along packaging body stacking direction, in the top surface of base station, tiling has interim bonded layer, puts in the interim bonded layer top surface gap
Multiple modules are set, are molded from the module top to form the injection molded layers for surrounding the module, and make the bottom surface of the injection molded layers
It is bonding with the interim bonded layer；
Ultrasonic relaxation is carried out to the uncured injection molded layers by ultrasonic probe.
2. fan-out-type module ultrasound packaging technology according to claim 1, which is characterized in that described to uncured described
Injection molded layers carry out ultrasonic relaxation are as follows:
The ultrasonic probe and the injection molded layers top surface being distributed by array offset to carry out ultrasound to the injection molded layers
Relaxation.
3. fan-out-type module ultrasound packaging technology according to claim 2, which is characterized in that the ultrasonic probe and institute
It states the surface that injection molded layers offset and is coated with graphite linings.
4. fan-out-type module ultrasound packaging technology according to claim 3, which is characterized in that the ultrasonic probe and institute
Position corresponding with the two neighboring module gap in injection molded layers is stated to offset.
5. fan-out-type module ultrasound packaging technology according to claim 1-4, which is characterized in that described to not solid
The injection molded layers changed carry out before ultrasonic relaxation further include: place on the rigid substrate the base station and make the base station
Bottom surface is bonded with the rigid substrates upper surface.
6. fan-out-type module ultrasound packaging technology according to claim 5, which is characterized in that the rigid substrates upper surface
Surrounding is bent downwardly.
7. a kind of fan-out-type module ultrasound sealed in unit, which is characterized in that including the reclinate rigid substrates of upper surface surrounding
It is distributed in horizontal array and the ultrasonic probes that are arranged on the upside of the rigid substrates with multiple, under the ultrasonic probe
Side is coated with graphite linings.
8. a kind of fan-out-type module ultrasound encapsulating structure characterized by comprising
Base station；
It is covered on the interim bonded layer of the base station loading end；
Multiple modules, gap are placed on the interim bonded layer top surface；
The module setting is surrounded in injection molded layers, injection molding in the module, and the bottom surface of the injection molded layers is bonded in described
Interim bonded layer upper surface；
Ultrasonic generator, for carrying out ultrasonic relaxation to the injection molded layers.
9. fan-out-type module ultrasound encapsulating structure according to claim 8, which is characterized in that the ultrasonic generator
Including the ultrasonic probe for being distributed in array and offseting with the injection molded layers top surface, the ultrasonic probe surface is coated with anti-
Adhesion coating.
10. fan-out-type module ultrasound encapsulating structure according to claim 9, which is characterized in that further include that upper surface is used for
The upper surface surrounding of the rigid substrates to offset with the base station bottom surface, the rigid substrates is bent downwardly；The ultrasonic probe
Corresponding position offsets with the two neighboring module gap in the injection molded layers.
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| CN114505991A (en) * | 2022-04-20 | 2022-05-17 | 广东电网有限责任公司佛山供电局 | Three-post insulator casting mold and internal stress eliminating method |
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| JP2008270415A (en) * | 2007-04-18 | 2008-11-06 | Fujitsu Ltd | Underfill composition for flip chip type semiconductor device, flip chip type semiconductor device using same, and method for producing device |
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| CN110277324B (en) | 2021-03-16 |
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