CN110277209B - Method for manufacturing shunt resistor - Google Patents
Method for manufacturing shunt resistor Download PDFInfo
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- CN110277209B CN110277209B CN201810208505.5A CN201810208505A CN110277209B CN 110277209 B CN110277209 B CN 110277209B CN 201810208505 A CN201810208505 A CN 201810208505A CN 110277209 B CN110277209 B CN 110277209B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 13
- 239000011261 inert gas Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 19
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 15
- 239000000956 alloy Substances 0.000 description 13
- 239000007772 electrode material Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- -1 nickel chromium aluminum Chemical compound 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003172 MnCu Inorganic materials 0.000 description 1
- NWLCFADDJOPOQC-UHFFFAOYSA-N [Mn].[Cu].[Sn] Chemical compound [Mn].[Cu].[Sn] NWLCFADDJOPOQC-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 1
- UTICYDQJEHVLJZ-UHFFFAOYSA-N copper manganese nickel Chemical compound [Mn].[Ni].[Cu] UTICYDQJEHVLJZ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/02—Pressure butt welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
- B23K3/0307—Soldering irons; Bits electrically heated with current flow through the workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
A method of manufacturing a shunt resistor. In the method, a resistor plate body is provided, the resistor plate body having first and second opposite sides. The first electrode plate body and the second electrode plate body are respectively pressed on the first side surface and the second side surface of the resistor plate body, so that a first joint surface is formed between the first electrode plate body and the resistor plate body, and a second joint surface is formed between the second electrode plate body and the resistor plate body. The first conductive modules are arranged at two opposite ends of the first junction surface, and the second conductive modules are arranged at two opposite ends of the second junction surface. The first conductive module and the second conductive module apply current to the first junction surface and the second junction surface respectively, so that the first electrode plate body and the resistor plate body are welded at the first junction surface, and the second electrode plate body and the resistor plate body are welded at the second junction surface. By directly passing current at the junction, the current and heat can be concentrated at the junction, so that the energy consumption of welding the resistor module can be greatly reduced, and the production cost can be reduced.
Description
Technical Field
The present invention relates to a resistor, and more particularly, to a method for manufacturing a shunt resistor (shunt resistor) with a modular structure.
Background
In manufacturing the shunt resistor, a resistive composite material is generally formed by combining a highly conductive electrode material and a resistive alloy material by using techniques such as electron beam welding (E-beam welding), thermal seam welding (seam welding), or laser beam welding (laser beam welding). And cutting and punching (punch) the resistance composite material to form a plurality of initial models of the shunt resistors. Then, the resistance value of the initial model of the shunt resistor is adjusted by using the resistance value adjusting machine, so that the resistance value of the shunt resistor is accurate.
However, the electron beam welding operation must be performed under vacuum all the time, and thus the welding process is costly. In addition, the sputtering of the material is likely to occur during the electron beam welding, which not only affects the body of the resistive alloy material and makes the resistance control of the shunt resistor difficult, but also forms holes and/or sputtered bumps on the surface of the shunt resistor and makes the appearance of the shunt resistor poor. Furthermore, if the electron beam depth is not properly adjusted during welding, a distinct weld path is formed, and the resistance of the current dividing resistor is not well controlled. Furthermore, the stress in the resistance composite material is changed during punching, which results in a change in the resistance of the shunt resistor. Therefore, the shunt resistor fabricated by the electron beam welding technique takes much time to repair the resistance. In addition, the remaining part of the resistance composite material after stamping is not easy to recycle because the remaining part is the composite material of the electrode material and the resistance alloy material.
When the resistance composite material is welded by utilizing laser in an up-and-down alignment mode, laser is often in a small and large situation, so that the appearance of a welding bead is poor, and the resistance value of the shunt resistor is difficult to control. In addition, the laser welding technique also has the defects that the residual material is not easy to recycle and time is consumed for resistance value trimming.
Disclosure of Invention
The invention aims to provide a manufacturing method of a shunt resistor, which is characterized in that a high-conductivity electrode material and a resistance alloy material are respectively manufactured into a first electrode plate body, a second electrode plate body and a resistance plate body which can form a resistor module, and then the shunt resistor is formed by pressurizing and compacting and passing high current. Therefore, the resistance value can be accurately calculated when the resistor plate body is manufactured, the resistance value accuracy of the shunt resistor is high, the resistance value trimming time of the shunt resistor can be greatly shortened, and the productivity is effectively improved.
Another objective of the present invention is to provide a method for manufacturing a shunt resistor, wherein conductive modules are disposed at two opposite ends of a junction between a first electrode plate and a resistor plate and at two opposite ends of a junction between a second electrode plate and the resistor plate, so that current can be directly conducted to the junctions, and thus the current can be concentrated to the junctions, and heat generated by the conducted current is concentrated to the junctions, thereby greatly reducing energy consumption for welding the resistor modules and further reducing the production cost of the shunt resistor.
Another object of the present invention is to provide a method for manufacturing a shunt resistor, in which the electrode material and the resistor material are modularized, so that the material utilization rate of the electrode material and the resistor material is high, the remaining part of the electrode material and the resistor material is easily recycled, and the shunt resistor can have various shapes according to the use requirement.
In accordance with the above object of the present invention, a shunt resistor manufacturing method is provided. In the method, a resistor plate body is provided, and the resistor plate body is provided with a first side surface and a second side surface which are opposite. The first electrode plate body and the second electrode plate body are respectively pressed on the first side surface and the second side surface of the resistor plate body, so that a first joint surface is formed between the first electrode plate body and the resistor plate body, and a second joint surface is formed between the second electrode plate body and the resistor plate body. The first conductive modules are arranged at two opposite ends of the first junction surface, and the second conductive modules are arranged at two opposite ends of the second junction surface. The first conductive module and the second conductive module apply current to the first junction surface and the second junction surface respectively, so that the first electrode plate body and the resistor plate body are welded at the first junction surface, and the second electrode plate body and the resistor plate body are welded at the second junction surface.
According to an embodiment of the present invention, the first side surface of the resistor plate has at least one first splicing portion, the second side surface of the resistor plate has at least one second splicing portion, the first electrode plate has at least one first joint portion, and the second electrode plate has at least one second joint portion. Before the first electrode plate body and the second electrode plate body are respectively pressed on the first side face and the second side face of the resistor plate body, the manufacturing method of the shunt resistor further comprises the step of correspondingly splicing the first joint part and the second joint part with the first splicing part and the second splicing part respectively so as to pre-bond the first electrode plate body and the second electrode plate body on the first side face and the second side face of the resistor plate body respectively.
According to an embodiment of the present invention, when the first conductive module and the second conductive module are respectively disposed at two opposite ends of the first junction surface and two opposite ends of the second junction surface, the pressing of the two opposite ends of the first junction surface and the two opposite ends of the second junction surface by the first conductive module and the second conductive module is further included.
According to an embodiment of the present invention, the first conductive module and the second conductive module include a carbon rod plate or a tungsten rod plate.
According to an embodiment of the present invention, when the current is applied, the current is substantially parallel to the first junction and the second junction.
According to an embodiment of the present invention, the applying of the current is performed under an inert gas atmosphere.
According to an embodiment of the present invention, the method for manufacturing the shunt resistor further includes disposing the first electrode plate and the second electrode plate on the first heat-conducting base and the second heat-conducting base, respectively, when the current is applied.
According to the above object of the present invention, a shunt resistor manufacturing method is further provided. In the method, a plurality of resistor modules are arranged on a conveying mechanism, wherein each resistor module comprises a resistor plate body, a first electrode plate body and a second electrode plate body, the resistor plate body is provided with a first side surface and a second side surface which are opposite, the first electrode plate body is spliced on the first side surface of the resistor plate body, and the second electrode plate body is spliced on the second side surface of the resistor plate body. And sequentially pressing each resistor module through the first electrode plate body and the second electrode plate body of each resistor module so as to form a first junction surface between the first electrode plate body of each resistor module and the first side surface of the resistor plate body and form a second junction surface between the second electrode plate body of each resistor module and the second side surface of the resistor plate body. The first conductive module and the second conductive module are used for applying current to the resistor modules transmitted by the transmission mechanism in sequence, so that the first electrode plate body of each resistor module is welded with the resistor plate body at a first joint surface, and the second electrode plate body of each resistor module is welded with the resistor plate body at a second joint surface, wherein the first conductive module and the second conductive module are respectively arranged at two opposite ends of the first joint surface between the first electrode plate body and the resistor plate body of each resistor module, and at two opposite ends of the second joint surface between the second electrode plate body of each resistor module and the resistor plate body.
According to an embodiment of the present invention, the applying the current to each resistor module further includes applying a voltage to two opposite ends of the first junction and two opposite ends of the second junction through the first conductive module and the second conductive module, respectively, wherein the current is substantially parallel to the first junction and the second junction.
According to an embodiment of the present invention, when the current is applied to each resistor module, the first electrode plate and the second electrode plate of each resistor module are respectively disposed on the first heat-conducting base and the second heat-conducting base, and the process is performed under an inert gas environment.
Drawings
In order to make the aforementioned and other objects, features, and advantages of the invention, as well as others which will become apparent, reference is made to the following description taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic diagram of an apparatus for manufacturing a shunt resistor according to a first embodiment of the present invention;
fig. 2 is a flow chart of a method of manufacturing a shunt resistor according to a first embodiment of the present invention;
fig. 3 is a schematic diagram of an apparatus for manufacturing a shunt resistor according to a second embodiment of the present invention; and
fig. 4 is a flowchart of a method of manufacturing a shunt resistor according to a second embodiment of the present invention.
Detailed Description
Referring to fig. 1 and fig. 2, a schematic diagram and a flowchart of an apparatus for manufacturing a shunt resistor according to a first embodiment of the invention are shown, respectively. In the present embodiment, when manufacturing the shunt resistor, step 200 is first performed to provide the resistor board 100. The resistor board body 100 has first and second opposite sides 102, 104. The resistor plate 100 may be manufactured by stamping a resistor alloy material to form a resistor plate having a desired shape and resistance. For example, the material of the resistor plate body 100 may be manganese copper tin (MnCuSn) alloy, manganese copper nickel (MnCuNi) alloy, manganese copper (MnCu) alloy, nickel chromium aluminum (NiCrAl) alloy, nickel chromium aluminum silicon (NiCrAlSi) alloy, and iron chromium aluminum (FeCrAl) alloy.
Next, step 210 is performed to provide a first electrode plate body 110 and a second electrode plate body 120, and the first electrode plate body 110 and the second electrode plate body 120 are respectively disposed beside the first side surface 102 and the second side surface 104 of the resistor plate body 100. The resistor plate body 100, the first electrode plate body 110 and the second electrode plate body 120 may constitute a resistor module 130. The resistor block 130 has a first side 132 and a second side 134 opposite to each other. Pressure 140 is then applied to the first electrode plate body 110 and the second electrode plate body 120 to press-fit the first electrode plate body 110 to the first side 102 of the resistor plate body 100 from the first side 132 of the resistor module 130 and to press-fit the second electrode plate body 120 to the second side 104 of the resistor plate body 100 from the second side 134 of the resistor module 130. In this way, the press-fitting step may cause the side surface 112 of the first electrode plate body 110 to be attached to the first side surface 102 of the resistor plate body 100, thereby forming a first junction surface 114 between the first electrode plate body 110 and the resistor plate body 100, and may cause the side surface 122 of the second electrode plate body 120 to be attached to the second side surface 104 of the resistor plate body 100, thereby forming a second junction surface 124 between the second electrode plate body 120 and the resistor plate body 100. The first junction 114 has a first end 114a and a second end 114b opposite to each other, and the second junction 124 has a first end 124a and a second end 124b opposite to each other. Depending on the magnitude of the applied current, the applied pressure 140 is preferably between about 0.1MPa (megapascals) and 10 MPa. In some examples, the first electrode plate body 110 may be pressed using the first pressing module 150, while the second electrode plate body 120 may be pressed using the second pressing module 152. The materials of the first pressing module 150 and the second pressing module 152 are preferably high temperature resistant materials, such as materials with melting point over 3000 ℃. In some illustrative examples, the first and second pressing modules 150 and 152 may be carbon rod plates or tungsten rod plates.
The first electrode plate body 110 and the second electrode plate body 120 may be formed by punching conductive electrode materials to form electrode plates having desired shapes. The material of the first electrode plate body 110 and the second electrode plate body 120 is a highly conductive material, such as copper. Thus, the first junction 114 formed between the first electrode plate body 110 and the resistive plate body 100, and the second junction 124 formed between the second electrode plate body 120 and the resistive plate body 100 are heterojunction interfaces.
In this embodiment, the first side surface 102 of the resistor plate body 100 is provided with at least one first splicing portion 106, and the second side surface 104 of the resistor plate body 100 is provided with at least one second splicing portion 108. The first splicing portion 106 and the second splicing portion 108 may have the same shape or different shapes. Furthermore, the first splicing portion 106 may be a protruding portion protruding from the first side surface 102 of the resistor board body 100, and the second splicing portion 108 may be a protruding portion protruding from the second side surface 104 of the resistor board body 100. The first splice 106 may also be a recess recessed in the first side 102 of the resistor board 100, and the second splice 108 may be a recess recessed in the second side 104 of the resistor board 100. The first and second splices 106, 108 may have different configurations, such as one being a recess and the other being a protrusion.
The side surface 112 of the first electrode plate body 110 is provided with at least one first joint 116, corresponding to the structure of the first side surface 102 of the resistor plate body 100. On the other hand, the side surface 122 of the second electrode plate body 120 is provided with at least one second joint 126, corresponding to the configuration of the second side surface 104 of the resistor plate body 100. The first joint 116 is complementary in shape to the first splice 106 and correspondingly joinable to the first splice 106, and the second joint 126 is complementary in shape to the second splice 108 and correspondingly joinable to the second splice 108. Before the first electrode board body 110 is press-fitted to the first side surface 102 of the resistor board body 100 and the second electrode board body 120 is press-fitted to the second side surface 104 of the resistor board body 100, the first joint portion 116 of the first electrode board body 110 and the first splicing portion 106 corresponding to the spliced resistor board body 100, and the second joint portion 126 of the second electrode board body 120 and the second splicing portion 108 corresponding to the spliced resistor board body 100 may be provided. Thereby, the first electrode plate body 110 may be pre-bonded to the first side surface 102 of the resistor plate body 100, and the second electrode plate body 120 may be pre-bonded to the second side surface 104 of the resistor plate body 100.
Next, step 220 may be performed to provide a first conductive module 160 and a second conductive module 170, in which the first conductive module 160 includes the first conductive element 162 and the second conductive element 164 with high temperature resistance, and the second conductive module 170 includes the first conductive element 172 and the second conductive element 174 with high temperature resistance. Next, the first conductive element 162 of the first conductive module 160 is disposed on the first end 114a of the first junction 114, and the second conductive element 164 of the first conductive module 160 is disposed on the second end 114b of the first junction 114. The first conductive element 172 of the second conductive module 170 is disposed on the first end 124a of the second junction 124, and the second conductive element 174 of the second conductive module 170 is disposed on the second end 124b of the second junction 124. The first conductive element 162 and the second conductive element 164 of the first conductive module 160, and the first conductive element 172 and the second conductive element 174 of the second conductive module 170 may be made of conductive materials with a melting point over 3000 ℃. In some illustrative examples, the first conductive element 162 and the second conductive element 164 of the first conductive module 160 and the first conductive element 172 and the second conductive element 174 of the second conductive module 170 may be carbon rod plates or tungsten rod plates. In addition, the first conductive element 162 and the second conductive element 164 of the first conductive module 160 may be utilized to apply a pressure 166 to the first end 114a and the second end 114b of the first junction 114, respectively, and the first conductive element 172 and the second conductive element 174 of the second conductive module 170 may be utilized to apply a pressure 176 to the first end 124a and the second end 124b of the second junction 124, respectively. Pressures 166 and 176 may be, for example, on the order of tens of kilograms (kgf).
Then, step 230 may be performed to apply a current to the first junction 114 via the first conductive pattern 160 and to apply a current to the second junction 124 via the second conductive pattern 170 using the power source 180. The power supply 180 may be a dc power supply or an ac power supply. The power source 180 preferably applies a high current to the first junction 114 and the second junction 124. For example, the current applied by the power source 180 may be about 700A to about 800A, or higher. In some examples, the two poles of the power source 180 are connected to the first conductive element 162 and the second conductive element 164 of the first conductive module 160 through the first conductive line 182 and the second conductive line 184, respectively, and the two poles of the power source 180 are also connected to the first conductive element 172 and the second conductive element 174 of the second conductive module 170 through the first conductive line 182 and the third conductive line 186, and the second conductive line 184 and the fourth conductive line 188, respectively. The power source 180 applies current to the first junction 114 from the first end 114a and the second end 114b of the first junction 114 through the first conductive line 182 and the second conductive line 184, and the first conductive module 160. The power source 180 also applies current to the second junction 124 from the first end 124a and the second end 124b of the second junction 124 through the first conductive line 182 and the third conductive line 186, the second conductive line 184 and the fourth conductive line 188, and the second conductive module 170. In some examples, when current is applied, the current flows substantially parallel to the first junction 114 and the second junction 124.
Since the resistance at the heterogeneous first junction 114 and second junction 124 is the greatest, the current flow is the region of greatest power, and the temperature is the highest, the resistive plate body 100 and first electrode plate body 110 at the first junction 114, and the resistive plate body 100 and second electrode plate body 120 at the second junction 124, melt first. At this time, under the applied pressures 140, 166, and 176, the materials of the first electrode plate body 110 and the second electrode plate body 120 are replaced with the material of the resistance plate body 100, so that the first electrode plate body 110 and the resistance plate body 100 are welded together at the first junction surface 114, and the second electrode plate body 120 and the resistance plate body 100 are welded together at the second junction surface 124, thereby forming the shunt resistor.
In some illustrative examples, the application of the electrical current to the first junction 114 and the second junction 124 is performed in an inert gas environment to protect the fusion joint from oxidation. In addition, the first electrode plate body 110 may be placed on the first thermally conductive base 190 and the second electrode plate body 120 may be placed on the second thermally conductive base 192 when current is applied to the first junction 114 and the second junction 124. In some illustrative examples, the first thermally conductive mount 190 is closer to the first compression module 150 and away from the first junction 114, and the second thermally conductive mount 192 is closer to the second compression module 152 and away from the second junction 124, such that heat is concentrated at the first junction 114 and the second junction 124 by the first thermally conductive mount 190 conducting heat away from the first electrode plate body 110 and the second electrically conductive mount 192 conducting heat away from the second electrode plate body 120.
The method comprises respectively manufacturing the first electrode plate 110 and the second electrode plate 120 of the resistor module 130 and the resistor plate 100 from the electrode material and the resistor alloy material, and respectively welding the first electrode plate 110 and the second electrode plate 120 to both sides of the resistor plate 100 by pressurizing and directly applying high current to the first junction 114 and the second junction 124. Therefore, the resistance of the resistor plate 100 can be calculated first, and then the welded resistor is not required to be cut by punching, so that the resistance accuracy of the shunt resistor can be improved, and the resistance trimming time of the shunt resistor can be greatly shortened. Secondly, the current is directly applied to the first junction 114 and the second junction 124, so that the current can be concentrated at the junctions, and the heat generated by the current can be concentrated at the junctions, thereby greatly reducing the energy consumption of the welding resistor module 130. Furthermore, the electrode material and the resistance alloy material are respectively cut into the first electrode plate 110 and the second electrode plate 120, and then are welded with the resistance plate 100, so that the utilization rate of the electrode material and the resistance material is high, the recovery of the rest part is simple, and the shunt resistor can have diversified shapes according to actual requirements.
Referring to fig. 3 and fig. 4, a schematic diagram and a flowchart of an apparatus for manufacturing a shunt resistor according to a second embodiment of the invention are shown, respectively. In the present embodiment, when manufacturing the shunt resistor, step 400 may be performed to provide a plurality of resistor modules 130 as shown in fig. 1, and the resistor modules 130 are sequentially arranged on the conveying mechanism 300. The transport mechanism 300 transports the resistor module 130 forward along the direction 302. As described in the first embodiment, when providing the resistor module 130, the first joint portion 116 of the first splicing portion 106 of the resistor board 100 and the first electrode board 110, and the second joint portion 126 of the second splicing portion 108 of the resistor board 100 and the second electrode board 120 may be correspondingly spliced. Thereby, the first electrode plate body 110 may be pre-bonded to the first side surface 102 of the resistor plate body 100, and the second electrode plate body 120 may be pre-bonded to the second side surface 104 of the resistor plate body 100. The resistor modules 130 are arranged laterally on the conveying mechanism 300, and the extending direction of the resistor modules 130 may be substantially perpendicular to the direction 302. In addition, the first electrode plate 110 and the second resistor plate 120 of each resistor module 130 may respectively protrude from two opposite sides of the conveying mechanism 300. The transfer mechanism 300 may be, for example, a conveyor belt. The structure and material of the resistor module 130 have been described in the above embodiments, and are not described herein.
Then, step 410 can be performed to sequentially press the resistor modules 130 conveyed by the conveying mechanism 300. When each resistor module 130 is pressed, the first electrode plate body 110 may be pressed from the first side end 132 of the resistor module 130 to the first side surface 102 of the resistor plate body 100 and the second electrode plate body 120 may be pressed from the second side end 134 of the resistor module 130 to the second side surface 104 of the resistor plate body 100 by applying a pressure 140 to the first electrode plate body 110 and the second electrode plate body 120. Thereby, as shown in fig. 1, the side surface 112 of the first electrode plate body 110 may be attached to the first side surface 102 of the resistive plate body 100 to form a first junction surface 114, and the side surface 122 of the second electrode plate body 120 may be attached to the second side surface 104 of the resistive plate body 100 to form a second junction surface 124. The first junction 114 and the second junction 124 may be both heterojunction formed by splicing. The first junction 114 has a first end 114a and a second end 114b opposite to each other, and the second junction 124 has a first end 124a and a second end 124b opposite to each other. Depending on the magnitude of the applied current, the applied pressure 140 is preferably between about 0.1MPa (megapascals) and 10 MPa. In this embodiment, the first pressing module 150 is also used to sequentially press the first electrode plate bodies 110 of the resistor modules 130, and the second pressing module 152 is also used to sequentially press the second electrode plate bodies 120 of the resistor modules 130.
Then, step 420 may be performed to provide a first conductive module 160 and a second conductive module 170, wherein the first conductive module 160 includes the first conductive element 162 and the second conductive element 164 with high temperature resistance, and the second conductive module 170 includes the first conductive element 172 and the second conductive element 174 with high temperature resistance. As shown in fig. 1, the first conductive element 162 and the second conductive element 164 of the first conductive module 160 are respectively disposed on the first end 114a and the second end 114b of the first junction 114 of the resistor module 130, and the first conductive element 172 and the second conductive element 174 of the second conductive module 170 are respectively disposed on the first end 124a and the second end 124b of the second junction 124. In addition, the first conductive element 162 and the second conductive element 164 of the first conductive module 160 can be used to apply a pressure 166 to the first end 114a and the second end 114b of the first junction 114, and the first conductive element 172 and the second conductive element 174 of the second conductive module 170 can be used to apply a pressure 176 to the first end 116a and the second end 116b of the second junction 116. The first conductive element 162 and the second conductive element 164 may have the same size or different sizes. The first conductive element 172 and the second conductive element 174 may be the same size or different sizes.
At this time, the power source 310 is used to sequentially apply a current to the first junction 114 of the resistor module 130 transmitted by the transmission mechanism 300 through the first conductive module 160, and sequentially apply a current to the second junction 124 of the resistor module 130 transmitted by the transmission mechanism 300 through the second conductive module 170. When the current is applied, the first end 114a and the second end 114b of the first junction 114 can be pressed by the first conductive element 162 and the second conductive element 164 of the first conductive module 160, and the first end 124a and the second end 124b of the second junction 124 can be pressed by the first conductive element 172 and the second conductive element 174 of the second conductive module 170, respectively. The power supply 310 may be a dc power supply or an ac power supply. In some illustrative examples, the current applied by the power supply 310 may be about 700A to about 800A or higher.
In some examples, the two poles of the power source 310 are connected to the first conductive element 162 and the second conductive element 164 of the first conductive module 160 through the first conductive line 312 and the second conductive line 314, respectively, and the two poles of the power source 310 are also connected to the first conductive element 172 and the second conductive element 174 of the second conductive module 170 through the first conductive line 312 and the third conductive line 316, and the second conductive line 314 and the fourth conductive line 318, respectively. The power supply 310 applies current to the first junction 114 from the first end 114a and the second end 114b of the first junction 114 through the first wire 312 and the second wire 314, and the first conductive module 160, and applies current to the second junction 124 from the first end 124a and the second end 124b of the second junction 124 through the first wire 312 and the third wire 316, the second wire 314 and the fourth wire 318, and the second conductive module 170, to melt the resistive plate body 100 and the first electrode plate body 110 at the first junction 114, and the resistive plate body 100 and the second electrode plate body 120 at the second junction 124. Referring to fig. 1, the first electrode plate body 110 of each resistor module 130 and the resistor plate body 100 are welded together at the first junction 114 and the second electrode plate body 120 of each resistor module 130 and the resistor plate body 100 are welded together at the second junction 124 by applying the external pressures 140, 166 and 176, so as to form a plurality of shunt resistors. In some examples, when current is applied, the current flows substantially parallel to the first junction 114 and the second junction 124.
In some illustrative examples, the applying of the current to the first junction 114 and the second junction 124 of each resistor module 130 is performed in an inert gas environment to protect the welding joint from oxidation. In addition, when current is applied to the first junction 114 and the second junction 124 of each resistor module 130, the first electrode plate body 110 may be placed on the first thermally conductive base 320, and the second electrode plate body 120 may be placed on the second thermally conductive base 322. In some illustrative examples, the first thermally conductive base 320 is closer to the first compression module 150 and away from the first junction 114, and the second thermally conductive base 322 is closer to the second compression module 152 and away from the second junction 124.
Because the method can sequentially and simultaneously press the first side 132 and the second side 134 of the resistor module 130 along with the transportation of the transporting mechanism 300, and the shunt resistor is continuously produced by using the welding manner that the first conductive module 160 and the second conductive module 170 directly apply current on the first junction 114 and the second junction 124 of the resistor module 130, the production efficiency can be greatly improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
[ notation ] to show
100 first side of the resistor plate 102
104 second side 106 first splice
108 second splice 110 first electrode plate body
112 side 114 first junction
114a first end 114b second end
116 first joint 120 second electrode plate body
122 side 124 second junction
124a first end 124b second end
126 second junction 130 resistor module
132 first side end 134 second side end
140 pressure 150 first pressurizing module
152 second pressurizing module 160 first conductive module
162 first conductive element 164 second conductive element
166 pressure 170 second conductive module
172 first conductive element 174 second conductive element
176 pressure 180 power supply
182 first conductive line 184 second conductive line
186 third conductive line 188 fourth conductive line
190 first heat conducting base 192 second heat conducting base
200 step 210 step
220 step 230 step
300 direction of the transfer mechanism 302
310 power supply 312 first conductor
314 second conductor 316 third conductor
318 fourth conductor 320 first heat conducting base
322 second thermally conductive base 400 step
410 step 420 step
Claims (9)
1. A method of manufacturing a shunt resistor, the method comprising:
providing a resistor plate body, wherein the resistor plate body is provided with a first side surface and a second side surface which are opposite;
pressing a first electrode plate body and a second electrode plate body onto the first side surface and the second side surface of the resistor plate body respectively, so as to form a first junction surface between the first electrode plate body and the resistor plate body and a second junction surface between the second electrode plate body and the resistor plate body;
arranging first conductive modules at two opposite ends of the first junction surface, and arranging second conductive modules at two opposite ends of the second junction surface; and
applying a current from the two ends of the first junction surface to the first junction surface via the first conductive module to cause the first electrode plate body and the resistive plate body to be fused at the first junction surface, and applying a current from the two ends of the second junction surface to the second junction surface via the second conductive module to cause the second electrode plate body and the resistive plate body to be fused at the second junction surface, wherein the current is applied substantially parallel to the first junction surface and the second junction surface.
2. The method of manufacturing a shunt resistor according to claim 1, wherein the shunt resistor is formed by a method of manufacturing a semiconductor device
The first side surface of the resistor plate body is provided with at least one first splicing part, the second side surface is provided with at least one second splicing part, the first electrode plate body is provided with at least one first joint part, the second electrode plate body is provided with at least one second joint part, and
before the first electrode plate body and the second electrode plate body are respectively pressed on the first side surface and the second side surface of the resistor plate body, the method + for manufacturing the shunt resistor further comprises correspondingly splicing the first splicing part and the second splicing part with the first joint part and the second joint part respectively so as to pre-bond the first electrode plate body and the second electrode plate body on the first side surface and the second side surface of the resistor plate body respectively.
3. The method according to claim 1, wherein the step of pressing the two opposite ends of the first junction and the two opposite ends of the second junction by the first conductive module and the second conductive module is further included when the first conductive module and the second conductive module are respectively disposed at the two opposite ends of the first junction and the two opposite ends of the second junction.
4. The method according to claim 1, wherein the first conductive pattern and the second conductive pattern comprise carbon rod plates or tungsten rod plates.
5. A method for manufacturing a shunt resistor according to claim 1, wherein the applying of the current is performed in an inert gas atmosphere.
6. The method of manufacturing a shunt resistor according to claim 1, wherein the method of manufacturing a shunt resistor further comprises placing the first electrode plate body and the second electrode plate body on a first thermally conductive base and a second thermally conductive base, respectively, when the current is applied.
7. A method of manufacturing a shunt resistor, the method comprising:
placing a plurality of resistor modules on a conveying mechanism, wherein each resistor module comprises a resistor plate body, a first electrode plate body and a second electrode plate body, the resistor plate body is provided with a first side surface and a second side surface which are opposite, the first electrode plate body is spliced on the first side surface of the resistor plate body, and the second electrode plate body is spliced on the second side surface of the resistor plate body;
sequentially pressing each resistor module through the first electrode plate body and the second electrode plate body of each resistor module so as to form a first junction surface between the first electrode plate body of each resistor module and the first side surface of the resistor plate body and form a second junction surface between the second electrode plate body of each resistor module and the second side surface of the resistor plate body; and
sequentially applying current to the first junction surfaces of the resistor modules conveyed by the conveying mechanism by using first conductive modules so that the first electrode plate body of each resistor module is welded to the resistor plate body at the first junction surface, and sequentially applying current to the second junction surfaces of the resistor modules conveyed by the conveying mechanism by using second conductive modules so that the second electrode plate body of each resistor module is welded to the resistor plate body at the second junction surface, wherein the first conductive modules and the second conductive modules are respectively arranged at two opposite ends of the first junction surface between the first electrode plate body and the resistor plate body of each resistor module, and at two opposite ends of the second junction surface between the second electrode plate body and the resistor plate body of each resistor module, wherein the current flow is substantially parallel to the first junction and the second junction when the current flow is applied to each of the resistor modules.
8. The method for manufacturing a shunt resistor according to claim 7, wherein when the current is applied to each of the resistor modules, the method further comprises:
and respectively applying pressure to the two opposite ends of the first junction surface and the two opposite ends of the second junction surface through the first conductive module and the second conductive module.
9. The method according to claim 7, wherein the applying of the current to each of the resistor modules is performed under an inert gas atmosphere by disposing the first electrode plate body and the second electrode plate body of each of the resistor modules on a first heat-conductive base and a second heat-conductive base, respectively.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810208505.5A CN110277209B (en) | 2018-03-14 | 2018-03-14 | Method for manufacturing shunt resistor |
| US15/963,117 US10839991B2 (en) | 2018-03-14 | 2018-04-26 | Method for manufacturing shunt resistor |
| TW107114928A TWI645423B (en) | 2018-03-14 | 2018-05-02 | Method for manufacturing shunt resistor |
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| CN201810208505.5A CN110277209B (en) | 2018-03-14 | 2018-03-14 | Method for manufacturing shunt resistor |
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| CN110277209A CN110277209A (en) | 2019-09-24 |
| CN110277209B true CN110277209B (en) | 2021-06-29 |
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| US (1) | US10839991B2 (en) |
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| CN1717754A (en) * | 2003-09-17 | 2006-01-04 | 罗姆股份有限公司 | Chip resistor and method of manufacturing the same |
| CN102640233A (en) * | 2009-12-03 | 2012-08-15 | 兴亚株式会社 | Shunt resistor and method for producing same |
| CN107710349A (en) * | 2015-06-15 | 2018-02-16 | Koa株式会社 | Resistor and its manufacture method |
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| US3808575A (en) * | 1973-04-04 | 1974-04-30 | Allen Bradley Co | Cermet fixed resistor with soldered leads |
| JP3824893B2 (en) * | 2001-07-31 | 2006-09-20 | シャープ株式会社 | Planar semiconductor device manufacturing method |
| JP4128106B2 (en) | 2003-05-21 | 2008-07-30 | 北陸電気工業株式会社 | Shunt resistor and manufacturing method thereof |
| CN1319078C (en) | 2003-07-09 | 2007-05-30 | 彭德龙 | Precision shunt resistor and manufacturing method thereof |
| CN101097232B (en) | 2007-03-30 | 2013-01-09 | 桐乡市伟达电子有限公司 | Forming method of current divider |
| US8031043B2 (en) | 2008-01-08 | 2011-10-04 | Infineon Technologies Ag | Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor |
| WO2013005824A1 (en) * | 2011-07-07 | 2013-01-10 | コーア株式会社 | Shunt resistor and manufacturing method thereof |
| KR101461829B1 (en) | 2013-11-26 | 2014-11-13 | 스마트전자 주식회사 | Manufacturing method of current sensing resistor and Current sensing resistor assembly |
| JP6700037B2 (en) | 2015-12-25 | 2020-05-27 | サンコール株式会社 | Shunt resistor and manufacturing method thereof |
| CN205810498U (en) | 2016-06-01 | 2016-12-14 | 蚌埠市双环电子集团股份有限公司 | Shunt resistance device |
| CN206639664U (en) | 2017-03-02 | 2017-11-14 | 南通华谊汽车橡塑制品有限公司 | A kind of shunt resistance device for having regulating resistor |
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2018
- 2018-03-14 CN CN201810208505.5A patent/CN110277209B/en active Active
- 2018-04-26 US US15/963,117 patent/US10839991B2/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1717754A (en) * | 2003-09-17 | 2006-01-04 | 罗姆股份有限公司 | Chip resistor and method of manufacturing the same |
| CN102640233A (en) * | 2009-12-03 | 2012-08-15 | 兴亚株式会社 | Shunt resistor and method for producing same |
| CN107710349A (en) * | 2015-06-15 | 2018-02-16 | Koa株式会社 | Resistor and its manufacture method |
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| Publication number | Publication date |
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| US20190287701A1 (en) | 2019-09-19 |
| CN110277209A (en) | 2019-09-24 |
| TW201939527A (en) | 2019-10-01 |
| US10839991B2 (en) | 2020-11-17 |
| TWI645423B (en) | 2018-12-21 |
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