CN110277204B - Shunt resistor and method for manufacturing the same - Google Patents
Shunt resistor and method for manufacturing the same Download PDFInfo
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- CN110277204B CN110277204B CN201810208683.8A CN201810208683A CN110277204B CN 110277204 B CN110277204 B CN 110277204B CN 201810208683 A CN201810208683 A CN 201810208683A CN 110277204 B CN110277204 B CN 110277204B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
Abstract
A shunt resistor and a method of manufacturing the same. The shunt resistor comprises a resistor plate body, a first electrode plate body and a second electrode plate body. The resistor plate body is provided with a first side surface and a second side surface which are opposite to each other, the first side surface is provided with at least one first splicing part, and the second side surface is provided with at least one second splicing part. The first electrode plate body is welded on the first side surface of the resistor plate body. The first electrode plate body is provided with at least one first joint part, and the first joint part is correspondingly spliced and combined with the first splicing part. The second electrode plate body is welded on the second side surface of the resistor plate body. The second electrode plate body is provided with at least one second joint part, and the second joint part is correspondingly spliced and combined with the second splicing part. When the resistor plate body is manufactured, the resistance value can be accurately calculated, so that the resistance value accuracy of the shunt resistor is higher, and the productivity can be effectively improved. The electrode material and the resistance material are modularized respectively, so that the electrode material and the rest part of the resistance material are easy to recover, and the shunt resistor can have diversified shapes according to the use requirements.
Description
Technical Field
The present invention relates to a resistor, and more particularly, to a shunt resistor (shunt resistor) with a modular structure and a method for manufacturing the shunt resistor.
Background
In manufacturing the shunt resistor, a resistive composite material is generally formed by joining a highly conductive electrode material and a resistive alloy material by using a technique such as electron beam welding (E-beam welding), thermal seam welding (seam welding), or laser beam welding (laser beam welding). Then, a plurality of initial models of the shunt resistors are formed by cutting and stamping (punch) the resistance composite material. And then, adjusting the resistance value of the initial model of the shunt resistor by using the resistance value adjusting machine, so that the resistance value of the shunt resistor is accurate.
However, when the resistance composite material is welded by the electron beam welding technique, the entire welding process is performed in vacuum, which results in high welding costs. The remaining part of the resistance composite material after stamping is not easy to recycle because the remaining part is the composite material of the high-conductivity electrode material and the resistance alloy material. In addition, the sputtering of the material is likely to occur during the electron beam welding, which not only affects the body of the resistive alloy material, resulting in difficulty in controlling the resistance of the shunt resistor, but also forms holes and/or sputtered protrusions on the surface of the shunt resistor, resulting in poor appearance of the shunt resistor. Furthermore, during welding, if the depth of the electron beam is not properly adjusted, a distinct weld bead is formed, which results in poor control of the resistance of the shunt resistor. Furthermore, the stress in the resistance composite material is changed during punching, which results in a change in the resistance of the shunt resistor. Therefore, the shunt resistor fabricated by the electron beam welding technique takes much time to repair the resistance.
When the resistance composite material is welded by utilizing laser in an up-and-down alignment mode, laser is often in a small and large situation, so that the appearance of a welding bead is poor, and the resistance value of the shunt resistor is difficult to control. In addition, the laser welding technique also has the defects that the residual material is not easy to recycle and time is consumed for resistance value trimming.
Disclosure of Invention
Therefore, an object of the present invention is to provide a shunt resistor and a method for manufacturing the same, wherein a high-conductivity electrode material and a resistance alloy material are respectively formed into an electrode plate and a resistance plate which can be spliced together to form a resistor module, and then a heterogeneous interface at the spliced position of the resistor module is welded by compacting under pressure and passing a high current to form the shunt resistor. Because the resistance value can be accurately calculated when the resistor plate body is manufactured, the resistance value accuracy of the shunt resistor is higher, the resistance value trimming time of the shunt resistor can be greatly shortened, and the productivity is effectively improved.
Another object of the present invention is to provide a shunt resistor and a method for manufacturing the same, in which the electrode material and the resistor material are modularized, so that the material utilization rate of the electrode material and the resistor material is high, the remaining part of the electrode material and the resistor material is easily recycled, and the shunt resistor can have various shapes according to the use requirement.
Another objective of the present invention is to provide a shunt resistor and a method for manufacturing the same, in which a plurality of resistor modules are sequentially arranged on a conveying mechanism, and a high temperature resistant conductive module is used to connect the resistor modules in series, so that a large amount of shunt resistors can be produced at a time by simultaneously applying pressure to both side ends of the resistor modules and applying current to weld, thereby greatly improving the production efficiency.
In accordance with the above object of the present invention, a shunt resistor is provided. The shunt resistor comprises a resistor plate, a first electrode plate and a second electrode plate. The resistor plate body is provided with a first side face and a second side face which are opposite, the first side face is provided with at least one first splicing part, and the second side face is provided with at least one second splicing part. The first electrode plate body is welded on the first side face of the resistor plate body, wherein the first electrode plate body is provided with at least one first joint part, and the first joint part and the first splicing part are correspondingly spliced and combined. The second electrode plate body is welded on the second side face of the resistor plate body, wherein the second electrode plate body is provided with at least one second joint part, and the second joint part and the second splicing part are correspondingly spliced and combined.
According to an embodiment of the present invention, the first splicing portion and the second splicing portion are both concave portions, and the first joining portion and the second joining portion are both convex portions. Or the first splicing part and the second splicing part are both convex parts, and the first joint part and the second joint part are both concave parts.
According to an embodiment of the present invention, the shapes of the first splicing portion and the second splicing portion are different from each other, and the shapes of the first joining portion and the second joining portion are different from each other.
According to the above object of the present invention, a shunt resistor manufacturing method is further provided. In the method, a resistor plate body, a first electrode plate body and a second electrode plate body are provided, wherein the resistor plate body is provided with a first side surface and a second side surface which are opposite, the first side surface is provided with at least one first splicing part, the second side surface is provided with at least one second splicing part, the first electrode plate body is provided with at least one first joint part, and the second electrode plate body is provided with at least one second joint part. Correspondingly splicing the first joint part and the first splicing part and correspondingly splicing the second joint part and the second splicing part so as to pre-bond the first electrode plate body to the first side surface of the resistor plate body and pre-bond the second electrode plate body to the second side surface. And performing a pressing step on the first electrode plate body and the second electrode plate body so as to enable the first electrode plate body to be attached to the first side surface of the resistor plate body to form a first splicing joint surface and enable the second electrode plate body to be attached to the second side surface of the resistor plate body to form a second splicing joint surface. Current is applied to the first electrode plate body, the second electrode plate body and the resistance plate body through the first electrode plate body and the second electrode plate body, so that the first electrode plate body and the resistance plate body are welded at a first splicing joint surface, and the second electrode plate body and the resistance plate body are welded at a second splicing joint surface.
According to an embodiment of the present invention, the applying of the current to the first electrode plate, the second electrode plate and the resistor plate is performed under an inert gas environment.
According to an embodiment of the present invention, the first high-conductivity module and the second high-conductivity module are respectively pressed on the first electrode plate and the second electrode plate to perform the pressing step, and a power supply is used to apply a current to the first electrode plate, the second electrode plate and the resistor plate through the first high-conductivity module and the second high-conductivity module.
According to an embodiment of the present invention, when the current is applied to the first electrode plate, the second electrode plate and the resistor plate, the method for manufacturing the shunt resistor further includes disposing the first electrode plate and the second electrode plate on the first heat-conducting base and the second heat-conducting base, respectively.
According to the above object of the present invention, a shunt resistor manufacturing method is also provided. In the method, a plurality of resistor modules are arranged on a conveying mechanism, wherein each resistor module comprises a resistor plate body, a first electrode plate body and a second electrode plate body, the resistor plate body is provided with a first side surface and a second side surface which are opposite, the first electrode plate body is spliced on the first side surface of the resistor plate body, and the second electrode plate body is spliced on the second side surface of the resistor plate body. And pressing each resistor module through the first electrode plate body and the second electrode plate body of each resistor module so that the first electrode plate body of each resistor module is attached to the first side surface of the resistor plate body to form a first splicing joint surface and the second electrode plate body is attached to the second side surface of the resistor plate body to form a second splicing joint surface. Current is applied to the resistor modules through the first electrode plate body and the second electrode plate body of each resistor module, so that the first electrode plate body of each resistor module and the resistor plate body are welded at a first splicing joint surface, and the second electrode plate body of each resistor module and the resistor plate body are welded at a second splicing joint surface.
According to an embodiment of the present invention, the resistor modules have opposite first side ends and second side ends, and the resistor modules are connected in series by using a plurality of first carbon rod plates located at the first side ends of the resistor modules and a plurality of second carbon rod plates located at the second side ends of the resistor modules, or connected in series by using a plurality of first tungsten rod plates located at the first side ends of the resistor modules and a plurality of second tungsten rod plates located at the second side ends of the resistor modules. The step of pressing the resistor modules comprises pressing the first carbon rod plate and the second carbon rod plate from the first side end and the second side end of the resistor modules by using a pressing die, or pressing the first tungsten rod plate and the second tungsten rod plate from the first side end and the second side end of the resistor modules.
According to an embodiment of the present invention, the applying of the current to the resistor modules is performed under an inert gas atmosphere.
Drawings
In order to make the aforementioned and other objects, features, and advantages of the invention, as well as others which will become apparent, reference is made to the following description taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic cross-sectional view of a shunt resistor according to a first embodiment of the present invention;
fig. 2A is a schematic diagram of a shunt resistor according to a second embodiment of the present invention;
FIG. 2B is a schematic cross-sectional view of the shunt resistor taken along section line AA of FIG. 2A;
fig. 3A is a schematic diagram of a shunt resistor according to a third embodiment of the present invention;
fig. 3B is a schematic sectional view of the shunt resistor obtained by cutting along a section line BB of fig. 3A;
fig. 4 is a schematic perspective view of a shunt resistor according to a fourth embodiment of the present invention;
FIG. 5 is a schematic diagram of an apparatus for manufacturing a shunt resistor according to an embodiment of the present invention;
FIG. 6 is a flow chart of a method of fabricating a shunt resistor according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of an apparatus for manufacturing a shunt resistor according to another embodiment of the present invention; and
fig. 8 is a flow chart of a method of manufacturing a shunt resistor according to another embodiment of the present invention.
Detailed Description
Fig. 1 is a cross-sectional view of a shunt resistor according to a first embodiment of the invention. In the present embodiment, the shunt resistor 100 mainly includes a resistor plate 110, a first electrode plate 120 and a second electrode plate 130. The resistor plate 110 with a desired shape and resistance can be manufactured by stamping the resistor alloy material. The material of the resistor plate body 110 includes, but is not limited to, manganese copper tin (MnCuSn) alloy, manganese copper nickel (MnCuNi) alloy, manganese copper (MnCu) alloy, nickel chromium aluminum (NiCrAl) alloy, nickel chromium aluminum silicon (NiCrAlSi) alloy, and iron chromium aluminum (FeCrAl) alloy.
The resistor plate body 110 comprises a first side surface 112 and a second side surface 114 opposite to each other, wherein the first side surface 112 is provided with at least one first splicing portion 116, and the second side surface 114 is provided with at least one second splicing portion 118. The first splicing portion 116 disposed on the first side surface 112 and the second splicing portion 118 disposed on the second side surface 114 may have the same shape or different shapes. For example, as shown in fig. 1, the first splicing portion 116 and the second splicing portion 118 have substantially the same shape. In addition, the first splicing portion 116 and the second splicing portion 118 can be two recessed portions recessed in the first side surface 112 and the second side surface 114, respectively. The first splicing portion 116 and the second splicing portion 118 can also be two protruding portions respectively protruding from the first side surface 112 and the second side surface 114. In some specific examples, the first and second splices 116, 118 may have different configurations, such as one of the first and second splices 116, 118 being a recess and the other being a protrusion.
The first and second electrode plate bodies 120 and 130 may be formed by stamping a conductive electrode material to form electrodes having a desired shape. The first electrode plate 120 and the second electrode plate 130 are where the shunt resistor 100 gives current and magnitude voltage. The material of the first electrode plate body 120 and the second electrode plate body 130 is a highly conductive material, such as copper. The first electrode plate body 120 has a side surface 122, and the side surface 122 of the first electrode plate body 120 may be welded to the first side surface 112 of the resistive plate body 110. The side surface 122 of the first electrode plate body 120 is provided with at least one first joint portion 124. The number of the first joint portions 124 of the first electrode board body 120 is the same as the number of the first splicing portions 116 of the first side surface 112 of the resistor board body 110, the positions of the first joint portions 124 correspond to the positions of the first splicing portions 116, and the first joint portions 124 are complementary to the first splicing portions 116 in shape and can be correspondingly spliced and combined with the first splicing portions 116. The first joint part 124 may be a protrusion protruding from the side surface 122 of the first electrode plate body 120, corresponding to the shape of the first splicing part 116. In the example where the first splicing portion 116 is a protruding portion, the first joint portion 124 may be a recessed portion recessed in the side surface 122 of the first electrode plate body 120.
The second electrode plate body 130 has a side surface 132, and the side surface 132 of the second electrode plate body 130 may be welded to the second side surface 114 of the resistor plate body 110. The side surface 132 of the second electrode plate body 130 is provided with at least one second joint portion 134. The number of the second joint portions 134 of the second electrode board body 130 is the same as the number of the second splicing portions 118 of the second side surface 114 of the resistor board body 110, the positions of the second joint portions 134 correspond to the positions of the second splicing portions 118, and the second joint portions 134 and the second splicing portions 118 have complementary shapes and can be correspondingly spliced and combined with the second splicing portions 118. The second joint part 134 may be a protruding part protruding from the side surface 132 of the second electrode plate body 130, or may be a recessed part recessed from the side surface 132 of the second electrode plate body 130, depending on the shape of the second splicing part 118.
The shapes of the first joint portion 124 of the first electrode plate body 120 and the second joint portion 134 of the second electrode plate body 130 may be the same as or different from each other. For example, as shown in fig. 1, the first engaging portion 124 and the second engaging portion 134 have substantially the same shape. The shapes of the first joint portion 124 and the second joint portion 134 may be different from each other, for example, one of the first joint portion 124 and the second joint portion 134 is a concave portion, and the other is a convex portion, depending on the shapes of the first splicing portion 116 and the second splicing portion 118 correspondingly spliced on the resistor board 110.
In the present embodiment, the first side surface 112 of the resistor plate 110 is welded to the side surface 122 of the first electrode plate 120, and the first splicing portion 116 of the resistor plate 110 is welded to the second joining portion 124 of the first electrode plate 120, so that the first electrode plate 120 can be adhered to the first side surface 112 of the resistor plate 110. The second side surface 114 of the resistor plate body 110 is welded to the side surface 132 of the second electrode plate body 130, and the second splicing portion 118 of the resistor plate body 110 is also welded to the second joint portion 134 of the second electrode plate body 130, so that the second electrode plate body 130 can be adhered to the second side surface 114 of the resistor plate body 110 to form the shunt resistor 100. Since the difference between the resistance value of the punched resistance plate 110 and the required resistance value of the shunt resistor 100 is not large, and the resistance value does not need to be punched and cut, only the resistance value of the initial model of the shunt resistor 100 needs to be slightly modified after the first electrode plate 120, the second electrode plate 130 and the resistance plate 110 are welded.
Referring to fig. 2A and fig. 2B, fig. 2A is a schematic top view of a shunt resistor according to a second embodiment of the invention, and fig. 2B is a schematic cross-sectional view of the shunt resistor taken along a section line AA of fig. 2A. The shunt resistor 100a of the present embodiment is similar to the shunt resistor 100, and the difference between the first and second joint portions 116a and 118a of the resistor plate 110a is different from the first and second joint portions 116 and 118 of the resistor plate 110, respectively, and the first and second joint portions 124a and 134a of the first and second electrode plate bodies 120a and 130a are different from the first and second joint portions 124 and 134a and 130a of the first and second electrode plate bodies 120 and 130, respectively.
In the shunt resistor 100a, the first joint portion 116a and the second joint portion 118a of the resistor plate 110a are protruding portions, the first joint portion 116a is protruded on the first side surface 112a of the resistor plate 110a, and the second joint portion 118a is protruded on the second side surface 114a of the resistor plate 110 a. The first and second splicing portions 116a and 118a may have an inverted T-shape in top view. Corresponding to the first and second splices 116a and 118a of the resistor plate body 110a, the first and second joints 124a and 134a are recessed portions, and the first and second joints 124a and 134a are recessed into the side surface 122a and 132a of the first and second electrode plate bodies 120a and 130a, respectively. In a preferred embodiment, as shown in fig. 2B, the first joint portion 124a does not penetrate through the electrode board body 120a, the second joint portion 134a does not penetrate through the electrode board body 130a, and the first joint portion 116a and the second joint portion 118a of the resistor board body 110a are respectively disposed in the first joint portion 124a and the second joint portion 134a and are carried by the first electrode board body 120a and the second electrode board body 130 a.
Referring to fig. 3A and 3B, fig. 3A is a schematic top view of a shunt resistor according to a third embodiment of the invention, and fig. 3B is a schematic cross-sectional view of the shunt resistor taken along a section line BB of fig. 3A. The shunt resistor 100b of the present embodiment is similar to the shunt resistor 100a, and the difference between the first and second splicing portions 116b and 118b of the resistor plate 110b is different from the first and second splicing portions 116a and 118a of the resistor plate 110a, respectively, and the first and second joint portions 124b and 134b of the first and second electrode plate bodies 120b and 130b are different from the first and second joint portions 124a and 134a of the first and second electrode plate bodies 120a and 130a, respectively.
In the shunt resistor 100b, the first joint portion 116b and the second joint portion 118b respectively protruding from the first side surface 112b and the second side surface 114b of the resistor plate 110b are arc-shaped protrusions. The first joint portion 124b and the second joint portion 134b, which are respectively recessed into the side surface 122b of the first electrode plate 120b and the side surface 132b of the second electrode plate 130b, are both concave arc portions corresponding to the first splicing portion 116b and the second splicing portion 118b of the resistor plate 110 b. In a preferred embodiment, as shown in fig. 3B, the first joint portion 124B does not penetrate through the first electrode board body 120B, the second joint portion 134B does not penetrate through the second electrode board body 130B, and the first joint portion 116B and the second joint portion 118B of the resistor board body 110B are respectively disposed in the first joint portion 124B and the second joint portion 134B and are carried by the first electrode board body 120B and the second electrode board body 130B.
Fig. 4 is a schematic perspective view of a shunt resistor according to a fourth embodiment of the invention. The shunt resistor 100c of the present embodiment is similar to the shunt resistor 100b, and the difference between the two shunt resistors is that the resistor plate body 110c has two first splicing portions 116c and two second splicing portions 118c, the first electrode plate body 120c has two first joint portions 124c, and the second electrode plate body 130c has two second joint portions 134 c.
In the shunt resistor 100c, the first splicing portion 116c and the second splicing portion 118c respectively protruding from the first side surface 112c and the second side surface 114c of the resistor plate 110c are both upright cylindrical-like protrusions. The first joint portion 124c recessed into the side surface 122c of the first electrode plate 120c and the second joint portion 134c recessed into the side surface 132c of the second electrode plate 130c are vertical arc-shaped concave arc portions corresponding to the first joint portion 116c and the second joint portion 118c of the resistor plate 110 c. In the present embodiment, the first joint portion 124c does not penetrate through the first electrode board 120c, the second joint portion 134c does not penetrate through the second electrode board 130c, and the first joint portion 116c and the second joint portion 118c are respectively disposed in the first joint portion 124c and the second joint portion 134c and carried by the first electrode board 120c and the second electrode board 130 c.
Fig. 5 and fig. 6 are a schematic diagram and a flowchart of an apparatus for manufacturing a shunt resistor according to an embodiment of the invention. In the present embodiment, when manufacturing the shunt resistor 260, step 300 is first performed to provide the resistor plate body 200, the first electrode plate body 210, and the second electrode plate body 220. The resistor board 200 has a first side 202 and a second side 204 opposite to each other, wherein the first side 202 is provided with at least one first splicing portion 206, and the second side 204 is provided with at least one second splicing portion 208. Corresponding to the configuration of the first side 202 and the second side 204 of the resistor plate body 200, the side 212 of the first electrode plate body 210 is provided with at least one first joint 214, and the side 222 of the second electrode plate body 220 is provided with at least one second joint 224. The first joint 206 of the resistor board body 200 may be correspondingly joined to the first joint 214 of the first electrode board body 210, and the second joint 208 of the resistor board body 200 may be correspondingly joined to the second joint 224 of the second electrode board body 220. The materials and manufacturing methods of the resistor plate 200, the first electrode plate 210, and the second electrode plate 220, and the forms and variations of the joints and joints are the same as those of the above embodiments, and are not described herein again.
Next, step 310 is performed, wherein the first joint portion 214 of the first electrode board body 210 and the first splicing portion 206 corresponding to the splicing resistance board body 200, and the second joint portion 224 of the second electrode board body 220 and the second splicing portion 208 corresponding to the splicing resistance board body 200. Thus, the first electrode plate body 210 may be pre-bonded to the side surface 202 of the resistor plate body 200, and the second electrode plate body 220 may be pre-bonded to the side surface 204 of the resistor plate body 200, thereby forming the resistor module 260 a. The resistor module 260a has a first side 262 and a second side 264 opposite to each other.
Next, step 320 is performed to apply pressure 230 to the first electrode plate body 210 and the second electrode plate body 220, so as to respectively press and bond the first electrode plate body 210 and the second electrode plate body 220 toward the resistance plate body 200 from the first side end 262 and the second side end 264 of the resistor module 260a to the first side surface 202 and the second side surface 204 of the resistance plate body 200. The pressure 230 is preferably between about 0.1MPa (megapascals) and 10MPa, depending on the magnitude of the current passed. By this pressing step, the side surface 212 of the first electrode plate body 210 is attached to the first side surface 202 of the resistor plate body 200 to form the first mating junction 216, and the side surface 222 of the second electrode plate body 220 is attached to the second side surface 204 of the resistor plate body 200 to form the second mating junction 226, wherein both the first mating junction 216 and the second mating junction 226 are heterojunction junctions. In some examples, the first electrode plate 210 may be pressed by the high temperature resistant first high conductivity module 250, and the second electrode plate 220 may be pressed by the high temperature resistant second high conductivity module 252. The high temperature resistant first high-conductivity module 250 and the second high-conductivity module 252 may be made of a conductive material having a melting point higher than 3000 ℃. In some illustrative examples, the first and second high conductivity modules 250 and 252 may be carbon rod plates, tungsten rod plates, or other high conductivity and high melting point materials (e.g., stainless steel).
Then, step 330 is performed to apply current to the first electrode plate body 210, the second electrode plate body 220, and the resistor plate body 200 via the first electrode plate body 210 and the second electrode plate body 220 on both sides of the resistor plate body 200 by the power supply 240. The power supply 240 may be a dc power supply or an ac power supply. In addition, the magnitude of the current applied by the power source 240 is related to the pressure 230 applied between the resistor plate body 200 and the first and second electrode plate bodies 210 and 220. For example, if the pressure 230 is low, the contact resistance between the resistive plate body 200 and the first and second electrode plate bodies 210, 220 is high, a low current may be applied; if the pressure 230 is high, the resistance of the contact between the resistive plate body 200 and the first and second electrode plate bodies 210, 220 is low, and thus a high current may be applied. However, too high a pressure 230 may affect a higher resistance of the resistor plate 200 and a lower contact resistance between the resistor plate 200 and the first and second electrode plates 210, 220, and the heat provided by the high current may cause the material of the resistor plate 200 to anneal, thereby stabilizing the resistance of the resistor plate 200, and therefore step 330 is preferably performed by applying a high current. In some illustrative examples, the current applied by the power supply 240 may be about 700A to about 800A, or higher.
In some examples, two poles of the power source 240 are connected to the first high-conductivity module 250 and the second high-conductivity module 252 on two sides of the resistor module 260a through the first conducting line 242 and the second conducting line 244, respectively. The power supply 240 applies current to the first electrode plate 210, the second electrode plate 220, and the resistor plate 200 via the first conductive line 242 and the first high conductivity module 250, and the second conductive line 244 and the second high conductivity module 252. Since the resistance is greatest at the first and second dissimilar splice junctions 216, 226, the current flow is in the region of greatest power, and the temperature is highest, the resistive plate body 200 and the first and second electrode plate bodies 210, 220 at the first and second splice junctions 216, 226 are melted first. At this time, under the external pressure force 230, the materials of the first electrode plate body 210 and the second electrode plate body 220 are replaced with the material of the resistance plate body 200, so that the first electrode plate body 210 and the resistance plate body 200 are welded together at the first splice joint surface 216, and the second electrode plate body 220 and the resistance plate body 200 are welded together at the second splice joint surface 226, so that the shunt resistor 260 is formed.
In the present embodiment, the application of current to the first electrode plate 210, the second electrode plate 220, and the resistor plate 200 is preferably performed in an inert gas 270 (e.g., nitrogen or argon) environment to protect the weld from oxidation. In addition, when current is applied to the first electrode plate 210, the second electrode plate 220, and the resistor plate 200, the first electrode plate 210 and the second electrode plate 220 may be placed on the first heat-conducting base 280 and the second heat-conducting base 282, respectively. In some illustrative examples, the first thermally conductive base 280 is closer to the first high conductivity module 250 and away from the first mating interface 216, and the second thermally conductive base 282 is closer to the second high conductivity module 252 and away from the second mating interface 226, such that the first and second thermally conductive bases 280 and 282 are utilized to conduct heat away from the first and second electrode plate bodies 210 and 220, respectively, to concentrate the heat at the first and second mating interfaces 216 and 226.
In the method, the electrode material and the resistance alloy material are respectively manufactured into the first electrode plate body 210 and the second electrode plate body 220 which can be spliced with each other, and the resistance plate body 200, and then the first electrode plate body 210 and the second electrode plate body 220 are respectively welded to the first side surface 202 and the second side surface 204 of the resistance plate body 200 in a pressurizing and high current supplying manner, so that the resistance value of the resistance plate body 200 can be calculated firstly. In addition, after welding, punching and cutting are not needed, so that the resistance value accuracy of the shunt resistor 260 can be improved, the resistance value trimming time of the shunt resistor 260 can be greatly shortened, and the productivity can be improved. In addition, the electrode material and the resistance alloy material are respectively cut into the first electrode plate 210 and the second electrode plate 220, and then are welded with the resistance plate 200, so that the utilization rate of the electrode material and the resistance material is high, the recovery of the rest part is simple, and the shunt resistor can have diversified shapes according to actual requirements.
Fig. 7 and fig. 8 are a schematic diagram and a flowchart of an apparatus for manufacturing a shunt resistor according to another embodiment of the invention. The embodiment adopts a batch production mode, and can realize rapid mass production. In some embodiments, step 500 may be performed to provide a plurality of resistor modules 260a as shown in fig. 5, and the resistor modules 260a are sequentially arranged on the conveying mechanism 400. The transport mechanism 400 transports the resistor module 260a forward along the direction 402. The resistor modules 260a are transversely arranged on the conveying mechanism 400, and the first electrode plate 210 and the second electrode plate 220 of each resistor module 260a can respectively protrude out of two opposite sides of the conveying mechanism 400. The transfer mechanism 400 may be, for example, a conveyor belt. The structure of the resistor module 260a is described in the above embodiments, and is not described herein.
Next, step 510 may be performed to apply pressure 410 to the resistor modules 260a through the first electrode plate body 210 and the second electrode plate body 220 of each resistor module 260a, so as to press-fit the first electrode plate body 210 and the second electrode plate body 220 to the first side surface 202 and the second side surface 204 of the resistor plate body 200 from the first side end 262 and the second side end 264 of each resistor module 260a, respectively. Thus, as shown in fig. 5, the side surface 212 of the first electrode plate body 210 may be attached to the first side surface 202 of the resistor plate body 200 to form a first splice junction 216, and the side surface 222 of the second electrode plate body 220 may be attached to the second side surface 204 of the resistor plate body 200 to form a second splice junction 226. Depending on the magnitude of the current applied, the pressure 410 is preferably between about 0.1MPa and 10 MPa.
In some examples, a plurality of high temperature resistant first high-conductivity modules 420 and a plurality of high temperature resistant second high-conductivity modules 422 may be respectively disposed at the first side 420 and the second side 422 of the resistor module 260a, and the first high-conductivity modules 420 and the second high-conductivity modules 422 are utilized to apply the pressure 410 to the resistor module 260 a. When the first high-conductivity module 420 and the second high-conductivity module 422 are respectively pressed against the first side 262 and the second side 264 of the resistor module 260a, the resistor modules 260a are connected in series through the first high-conductivity module 420 and the second high-conductivity module 422. The high temperature resistant first high-conductivity module 420 and the second high-conductivity module 422 may be made of a conductive material having a melting point higher than 3000 ℃. For example, the first high conductivity module 420 and the second high conductivity module 422 may be carbon rod plates or tungsten rod plates. In some illustrative examples, when the pressing step is performed on the resistor module 260a, the pressing die 430 may be used to press the first high-conductivity module 420 and the second high-conductivity module 422 from the first side 262 and the second side 264 of the resistor module 260a, respectively, and then the pressing force 410 may be applied to the resistor module 260a by the first high-conductivity module 420 and the second high-conductivity module 422.
Then, step 520 may be performed to simultaneously apply current to the resistor modules 260a via the first and second electrode plates 210 and 220 of each resistor module 260a using the power source 440. The power source 440 may be a dc power source or an ac power source. In some illustrative examples, the current applied by the power source 440 may be about 700A to about 800A or higher.
In some examples, two poles of the power source 440 are connected to the first highly conductive module 420 farthest from the first side end 262 of the resistor module 260a and the second highly conductive module 422 closest to the second side end 264 of the resistor module 260a through the first and second conductive wires 442 and 444, respectively, whereby the resistor modules 260a can be connected in series with the power source 440 through the first and second highly conductive modules 420 and 422. The power source 440 applies a current to the first electrode plate body 210, the second electrode plate body 220, and the resistive plate body 200 of all the resistor modules 260a via the first conductive line 442 and the first high conductivity module 420, and the second conductive line 444 and the second high conductivity module 422, to melt the resistive plate body 200 and the first electrode plate body 210 at the first splice junction 216, and the resistive plate body 200 and the second electrode plate body 220 at the second splice junction 226. By means of the applied pressure 410, the first electrode plate body 210 of each resistor module 260a and the resistor plate body 200 are welded together at the first splice junction 216, and the second electrode plate body 220 of each resistor module 260a and the resistor plate body 200 are welded together at the second splice junction 226, thereby simultaneously forming a plurality of shunt resistors 260.
In some exemplary embodiments, the applying of the current to all the resistor modules 260a is performed in an inert gas environment to prevent oxidation of the welding spots. In addition, when a current is applied to the resistor module 260a, all of the first electrode plate 210 and the second electrode plate 220 may be respectively placed on a heat conducting base (not shown), and the heat conducting base is closer to the first high-conductivity module 420 and the second high-conductivity module 422 and further from the first splicing junction 216 and the second splicing junction 226, respectively, so that the heat of the first electrode plate 210 and the second electrode plate 220 is conducted away by the heat conducting base, and the heat is concentrated at the first splicing junction 216 and the second splicing junction 226.
In the method, the first high-conductivity module 420 and the second high-conductivity module 422 are connected in series with the plurality of resistor modules 260a, and then the first high-conductivity module 420 and the second high-conductivity module 422 apply pressure and current to the first side 262 and the second side 264 of each resistor module 260a at the same time, so that a large amount of shunt resistors 260 can be produced at one time, and the production efficiency can be greatly improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
[ notation ] to show
100 shunt resistor 100a shunt resistor
100b shunt resistor 100c shunt resistor
110 resistance plate body 110a resistance plate body
110b resistor plate body 110c resistor plate body
112 first side 112a first side
112b first side 112c first side
114 second side 114a second side
114b second side 114c second side
116 first splice 116a first splice
116b first splice 116c first splice
118 second splice 118a second splice
118b second splice 118c second splice
120 first electrode plate body 120a first electrode plate body
120b first electrode plate body 120c first electrode plate body
122 side 122a side
122b side 122c side
124 first engaging portion 124a first engaging portion
124b first engaging portion 124c first engaging portion
130 second electrode plate body 130a second electrode plate body
130b second electrode plate body 130c second electrode plate body
132 side 132a side
132b side 132c side
134 second engagement portion 134a second engagement portion
134b second engaging portion 134c second engaging portion
200 first side of resistor plate 202
204 second side 206 first splice
208 second splice 210 first electrode plate body
212 side 214 first engaging portion
216 first mating junction 220 second electrode plate body
222 side 224 second engaging portion
226 second splice junction 230 pressure
240 first conductor of power supply 242
244 second conductive line 250 first high conductivity module
252 second high conductivity module 260 shunt resistor
264 second side 270 inert gas
280 first heat conducting base 282 second heat conducting base
300 step 310 step
320 step 330 step
400 transport mechanism 402 direction
410 pressure 420 first high conductivity module
422 second high-conductivity module 430 pressurizing die
440 power supply 442 first conductor
444 second conductive line 500 step
510 step 520 step
Claims (6)
1. A method of manufacturing a shunt resistor, the method comprising:
providing a resistor plate body, a first electrode plate body and a second electrode plate body, wherein the resistor plate body is provided with a first side surface and a second side surface which are opposite, the first side surface is provided with at least one first splicing part, the second side surface is provided with at least one second splicing part, the first electrode plate body is provided with at least one first joint part, and the second electrode plate body is provided with at least one second joint part;
correspondingly splicing the first joint part and the first splicing part and correspondingly splicing the second joint part and the second splicing part to pre-bond the first electrode plate body to the first side surface of the resistor plate body and pre-bond the second electrode plate body to the second side surface to form a resistor module, wherein the resistor module is provided with a first side end and a second side end which are opposite;
performing a press-fitting step on the first electrode plate and the second electrode plate to press-fit the first electrode plate to the first side surface of the resistor plate from the first side end of the resistor module, so that the first electrode plate is attached to the first side surface of the resistor plate to form a first joint surface, and press-fitting the second electrode plate to the second side surface of the resistor plate from the second side end of the resistor module, so that the second electrode plate is attached to the second side surface of the resistor plate to form a second joint surface; and
applying a current to the first electrode plate, the second electrode plate and the resistor plate via the first electrode plate and the second electrode plate, such that the first electrode plate body and the resistor plate body are fused at the first splice junction and the second electrode plate body and the resistor plate body are fused at the second splice junction, when the current is applied to the first electrode plate body, the second electrode plate body and the resistance plate body, the method for manufacturing the shunt resistor further comprises the steps of respectively arranging the first electrode plate body and the second electrode plate body on the first heat-conducting base and the second heat-conducting base, wherein the first thermally conductive base is closer to the first side end of the resistor module than to the first splice junction, the second thermally conductive base is closer to the second side end of the resistor module than to the second splice junction.
2. The method of manufacturing a shunt resistor according to claim 1, wherein applying the current to the first electrode plate body, the second electrode plate body, and the resistance plate body is performed in an inert gas atmosphere.
3. The method according to claim 1, wherein the method further comprises performing the step of pressing a first highly conductive module and a second highly conductive module onto the first electrode plate and the second electrode plate, respectively, and applying the current to the first electrode plate, the second electrode plate, and the resistor plate via the first highly conductive module and the second highly conductive module by a power source.
4. A method of manufacturing a shunt resistor, the method comprising:
placing a plurality of resistor modules on a conveying mechanism, wherein each resistor module comprises a resistor plate body, a first electrode plate body and a second electrode plate body, the resistor plate body is provided with a first side surface and a second side surface which are opposite to each other, the first electrode plate body is spliced on the first side surface of the resistor plate body, the second electrode plate body is spliced on the second side surface of the resistor plate body, and each resistor module is provided with a first side end and a second side end which are opposite to each other;
pressing each resistor module through the first electrode plate body and the second electrode plate body of each resistor module to press the first electrode plate body to the first side surface of the resistor plate body from the first side end of each resistor module, so that the first electrode plate body of each resistor module is attached to the first side surface of the resistor plate body to form a first splicing joint surface, and the second electrode plate body is pressed to the second side surface of the resistor plate body from the second side end of each resistor module, so that the second electrode plate body is attached to the second side surface of the resistor plate body to form a second splicing joint surface; and
applying a current to each of the resistor modules through the first and second electrode plates of the resistor module, such that the first electrode plate body of each of the resistor modules is fused to the resistor plate body at the first splice junction and the second electrode plate body of each of the resistor modules is fused to the resistor plate body at the second splice junction, when the current is applied to each resistor module, the method for manufacturing the shunt resistor further comprises the steps of respectively arranging the first electrode plate body and the second electrode plate body on the first heat-conducting base and the second heat-conducting base, wherein the first thermally conductive base is closer to the first side end of the resistor module than to the first splice junction, the second thermally conductive base is closer to the second side end of the resistor module than to the second splice junction.
5. A method of manufacturing a shunt resistor according to claim 4, wherein the shunt resistor is formed by a method of manufacturing a semiconductor device
The resistor module is connected in series with a plurality of second carbon rod plates at the second side end of the resistor module by a plurality of first carbon rod plates at the first side end of the resistor module, or connected in series with a plurality of second tungsten rod plates at the second side end of the resistor module by a plurality of first tungsten rod plates at the first side end of the resistor module; and
the step of pressing the resistor module includes pressing the first carbon rod plate and the second carbon rod plate from the first side end and the second side end of the resistor module or pressing the first tungsten rod plate and the second tungsten rod plate from the first side end and the second side end of the resistor module by using a pressing die.
6. The method of manufacturing a shunt resistor according to claim 4, wherein the applying of the current to the resistor block is performed in an inert gas atmosphere.
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| CN201810208683.8A CN110277204B (en) | 2018-03-14 | 2018-03-14 | Shunt resistor and method for manufacturing the same |
| TW107114927A TWI660374B (en) | 2018-03-14 | 2018-05-02 | Shunt resistor and method for manufacturing the same |
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| CN201810208683.8A CN110277204B (en) | 2018-03-14 | 2018-03-14 | Shunt resistor and method for manufacturing the same |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1272945A (en) * | 1997-10-02 | 2000-11-08 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| CN1301512C (en) * | 2001-01-15 | 2007-02-21 | 松下电工株式会社 | Shunt resistance and method of adjusting shunt resistance |
| CN101097232A (en) * | 2007-03-30 | 2008-01-02 | 桐乡市伟达电子有限公司 | Forming method of current divider |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7911319B2 (en) * | 2008-02-06 | 2011-03-22 | Vishay Dale Electronics, Inc. | Resistor, and method for making same |
| KR101983959B1 (en) * | 2012-06-14 | 2019-05-29 | 스카이워크스 솔루션즈, 인코포레이티드 | Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods |
| CN105073326B (en) * | 2013-03-29 | 2018-01-30 | 杰富意钢铁株式会社 | Resistance spot welding system |
| JP6108030B2 (en) * | 2014-12-01 | 2017-04-05 | Ｊｆｅスチール株式会社 | Resistance spot welding method |
| JP6643859B2 (en) * | 2015-10-15 | 2020-02-12 | サンコール株式会社 | Manufacturing method of shunt resistor |
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2018
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1272945A (en) * | 1997-10-02 | 2000-11-08 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| CN1301512C (en) * | 2001-01-15 | 2007-02-21 | 松下电工株式会社 | Shunt resistance and method of adjusting shunt resistance |
| CN101097232A (en) * | 2007-03-30 | 2008-01-02 | 桐乡市伟达电子有限公司 | Forming method of current divider |
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| TWI660374B (en) | 2019-05-21 |
| CN110277204A (en) | 2019-09-24 |
| TW201939526A (en) | 2019-10-01 |
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