CN110265349B - 半导体基片贴膜的覆膜机 - Google Patents

半导体基片贴膜的覆膜机 Download PDF

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CN110265349B
CN110265349B CN201910535742.7A CN201910535742A CN110265349B CN 110265349 B CN110265349 B CN 110265349B CN 201910535742 A CN201910535742 A CN 201910535742A CN 110265349 B CN110265349 B CN 110265349B
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CN110265349A (zh
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田硕
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Shenzhen Hi Test Semiconductor Equipment Co ltd
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Shenzhen Hi Test Semiconductor Equipment Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
    • B26D1/065—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates for thin material, e.g. for sheets, strips or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种半导体基片贴膜的覆膜机，包括机架11，机架11一端轴接有UV膜架12和收膜杆3；UV膜架12和收膜杆3之间通过传动带2相连；机架11两侧均安装有滑杆6，滑杆6上滑动连接有滑座13；滑座13之间安装有硅胶滚轮8和水平滑轨9；滑座13上安装有连接有用于固定侧划刀的垂直刀架10；水平滑轨9上滑动连接有用于安装水平划刀14的水平刀架7；机架11中部安装有对贴膜版4定位的钢圈5。本发明能够方便更换贴模板，适应多种材料的贴膜，同时结构简单操作方便。

Description

半导体基片贴膜的覆膜机
技术领域
本发明属于自动化零部件范围，特别涉及一种超半导体基片贴膜的覆膜机结构。
背景技术
半导体是指在常温状体下导电性能介于导体与绝缘体之间的材料。近年来半导体行业发展迅猛，市场对半导体的需求呈井喷性增长。半导体基片切割作为半导体工艺的重要环节，其中切割前需要将基片贴在薄膜上，贴膜要求半导体基片与薄膜贴合紧密无气泡，同时适应全自动七切割需要保证每一盘上所贴基片的位置大致相同。但是目前还没有相关的装置。
发明内容
本发明的目的是提供一种半导体基片贴膜的覆膜机，本发明能够方便更换贴模板，适应多种材料的贴膜，同时结构简单操作方便。
为实现上述目的，本发明的技术方案如下：
一种半导体基片贴膜的覆膜机，包括机架11，机架11一端轴接有UV膜架12和收膜杆3；UV膜架12和收膜杆3之间通过传动带2相连；机架11两侧均安装有滑杆6，滑杆6上滑动连接有滑座13；滑座13之间安装有硅胶滚轮8和水平滑轨9；滑座13上安装有连接有用于固定侧划刀的垂直刀架10；水平滑轨9上滑动连接有用于安装水平划刀14的水平刀架7；机架11中部安装有对贴膜版4定位的钢圈5。
进一步的改进，所述水平刀架7上成形有供水平划刀14穿过的穿孔15，水平划刀14顶部固定有刀盖16，刀盖16底部固定有弹簧17。
进一步的改进，所述滑座13之间还安装有推杆18。
附图说明
图1为本发明的整体结构图；
图2为水平刀架的结构示意图。
具体实施方式
针对半导体基片切割的贴膜要求我们设计了一款覆膜机，能够方便更换贴模板，适应多种材料的贴膜，同时结构简单操作方便。覆膜机结构如图:UV膜1、传动带2、收膜杆3、贴膜板4、钢圈5、滑杆6、水平刀架7、硅胶滚轮8、水平滑轨9、垂直刀架10；
贴膜时首先换上对应材料的贴膜板，然后将材料基片放上贴膜板上正确位置，用手拉动UV膜使整个膜覆盖钢圈，由于收膜杆的存在，在UV膜滚轮转动时，通过皮带连接在一起的收膜杆同时转动将UV膜的下层膜收走；用手推动硅胶滚轮沿着滑杆往返运动几次，硅胶滚轮对贴膜板上的基片和UV膜具有一定的压力，保证UV膜与基片贴合充分并挤出中间的气泡保证贴合紧密；完成后，推动推杆，使得侧划刀切割贴膜板左右两侧多余的UV膜，按下水平划刀14顶部的刀盖16，然后沿水平滑轨移动，可以切割贴膜板前后两侧多余的UV膜，这样可以把钢圈以外多余的UV膜全部切掉；从贴膜板上取出钢圈和基片，贴膜完成。
具体实施方式应当比对发明内容部分进行理解，以避免不必要的误解。另外，本例所述内容只是用于帮助理解本发明的方法及其核心思想。应当指出，对于本技术领域的技术人员来说，在不脱离本发明原理的前提下，还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。

Claims (2)

1.一种半导体基片贴膜的覆膜机，包括机架（11），其特征在于，机架（11）一端轴接有UV膜架（12）和收膜杆（3）；UV膜架（12）和收膜杆（3）之间通过传动带（2）相连；机架（11）两侧均安装有滑杆（6），滑杆（6）上滑动连接有滑座（13）；滑座（13）之间安装有硅胶滚轮（8）和水平滑轨（9）；滑座（13）上安装有连接有用于固定侧划刀的垂直刀架（10）；水平滑轨（9）上滑动连接有用于安装水平划刀（14）的水平刀架（7）；机架（11）中部安装有对贴膜板（4）定位的钢圈（5）；
贴膜时首先换上对应材料的贴膜板，然后将材料基片放上贴膜板上正确位置，用手拉动UV膜使整个UV膜覆盖钢圈，由于收膜杆的存在，在UV膜滚轮转动时，通过皮带连接在一起的收膜杆同时转动将UV膜的下层膜收走；用手推动硅胶滚轮沿着滑杆往返运动几次，硅胶滚轮对贴膜板上的基片和UV膜具有压力，保证UV膜与基片贴合充分并挤出中间的气泡保证贴合紧密；完成后，推动滑座之间的推杆，使得固定在垂直刀架的侧划刀切割贴膜板左右两侧多余的UV膜，按下水平划刀（ 14） 顶部的刀盖（ 16） ，然后沿水平滑轨移动，切割贴膜板前后两侧多余的UV膜，这样把钢圈以外多余的UV膜全部切掉；从贴膜板上取出钢圈和基片，贴膜完成。
2.如权利要求1所述的半导体基片贴膜的覆膜机，其特征在于，所述水平刀架（7）上成形有供水平划刀（14）穿过的穿孔（15），水平划刀（14）顶部固定有刀盖（16），刀盖（16）底部固定有弹簧（17）。
CN201910535742.7A 2019-06-20 2019-06-20 半导体基片贴膜的覆膜机 Active CN110265349B (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1170580A (ja) * 1997-08-29 1999-03-16 Hokkai Can Co Ltd フィルム貼着装置
CN102173316A (zh) * 2010-12-21 2011-09-07 上海技美电子科技有限公司 贴膜方法及贴膜设备
CN203740181U (zh) * 2013-06-24 2014-07-30 鉅仑科技股份有限公司 贴膜机的供膜装置
CN208359465U (zh) * 2018-05-07 2019-01-11 蓝思科技(东莞)有限公司 覆膜装置及载具覆膜设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1170580A (ja) * 1997-08-29 1999-03-16 Hokkai Can Co Ltd フィルム貼着装置
CN102173316A (zh) * 2010-12-21 2011-09-07 上海技美电子科技有限公司 贴膜方法及贴膜设备
CN203740181U (zh) * 2013-06-24 2014-07-30 鉅仑科技股份有限公司 贴膜机的供膜装置
CN208359465U (zh) * 2018-05-07 2019-01-11 蓝思科技(东莞)有限公司 覆膜装置及载具覆膜设备

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