CN110246989B - Manufacturing method of full-color OLED display - Google Patents
Manufacturing method of full-color OLED display Download PDFInfo
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- CN110246989B CN110246989B CN201910376314.4A CN201910376314A CN110246989B CN 110246989 B CN110246989 B CN 110246989B CN 201910376314 A CN201910376314 A CN 201910376314A CN 110246989 B CN110246989 B CN 110246989B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/32—Stacked devices having two or more layers, each emitting at different wavelengths
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a manufacturing method of a full-color OLED display, which comprises the following steps: sequentially manufacturing a color film layer and a flat layer on a transparent substrate to form a color film substrate; forming a water and oxygen barrier layer on the color film substrate; forming an OLED functional layer on the water-oxygen barrier layer; the film thickness of the water-oxygen blocking layer is determined according to the color film layer mask TP value and the OLED function layer mask TP value. The manufacturing method provided by the invention ensures that the film thickness of the water-oxygen blocking layer is determined according to the TP value of the color film layer mask and the TP value of the OLED functional layer mask, and the film thickness of the water-oxygen blocking layer is determined according to the TP value of the color film layer mask and the TP value of the OLED functional layer mask, so that the mismatching of the color film layer pattern and the OLED functional layer pattern caused by the mask error can be better compensated, the finally formed color film layer pattern is matched with the OLED functional layer pattern, and the display quality is effectively ensured.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a full-color OLED display.
Background
White light is combined with color filtering (CF + W) to be an important method for realizing full color display. In the manufacturing method of the full-color OLED display, generally, a color film layer is firstly disposed on a substrate, and then an OLED functional layer is disposed thereon. Wherein various rete needs to match with OLED display layer, but various rete mask version and OLED functional layer mask version are because make respectively, often have certain error for various rete mask version TP value and OLED functional layer mask version TP value deviation are great, and then the various rete pattern TP value that leads to forming and OLED functional layer pattern TP value also appear great deviation, TP (total pitch) value is the length of side of rete pattern or mask version, can make various rete and OLED functional layer pattern registrate deviation like this, reduce display quality.
Disclosure of Invention
The invention aims to solve the technical problem of providing a manufacturing method of a full-color OLED display, which can effectively solve the problem of unmatched patterns of a color film layer and an OLED functional layer caused by the deviation of a TP value of a color film layer mask and a TP value of an OLED functional layer mask.
In order to solve the technical problem, the invention provides a manufacturing method of a full-color OLED display, which comprises the following steps:
sequentially manufacturing a color film layer and a flat layer on a transparent substrate to form a color film substrate;
forming a water and oxygen barrier layer on the color film substrate;
forming an OLED functional layer on the water-oxygen barrier layer;
the film thickness of the water-oxygen blocking layer is determined according to the color film layer mask TP value and the OLED function layer mask TP value.
As a preferred scheme of the present invention, the film thickness of the water-oxygen blocking layer is proportional to a difference between TP values of a mask plate, wherein the difference between TP values of the mask plate is obtained by subtracting TP values of a color film layer from TP values of a mask plate of an OLED functional layer.
As a preferred aspect of the present invention, the film thickness of the water-oxygen barrier layer is configured to make the color film substrate expand and elongate, and make the expanded color film pattern TP value match with the OLED functional layer pattern TP value to be formed.
As a preferred scheme of the present invention, the expanded color film layer pattern TP value is matched with the OLED functional layer pattern TP value to be formed, that is, the difference between the expanded color film layer pattern TP value and the OLED functional layer pattern TP value to be formed is smaller than the error threshold.
In a preferred embodiment of the present invention, the material of the water-oxygen barrier layer is SiNx or SiOxNy.
As a preferable scheme of the invention, the water-oxygen barrier layer is manufactured by adopting a plasma chemical vapor deposition method, wherein the deposition temperature is 150-230 ℃.
In a preferred embodiment of the present invention, the thickness of the water-oxygen barrier layer is 1000 to 10000A.
In a preferable embodiment of the present invention, the water-oxygen barrier layer has a transmittance of more than 80% in a wavelength range of 400 to 700 nm.
The invention has the following technical effects: the manufacturing method provided by the invention ensures that the film thickness of the water oxygen barrier layer is determined according to the color film layer mask TP value and the OLED functional layer mask TP value, and because the water oxygen barrier layer manufactured on the color film substrate requires to manufacture a film with large density, namely the water oxygen barrier layer presents compressive stress, the color film substrate gradually generates arching from the edge to the middle towards the water oxygen barrier layer, namely the color film substrate is deformed and bent in a convex way, and then the color film substrate expands and elongates under the condition of being pulled flat again, therefore, the water oxygen barrier layer can enable the pattern of the formed color film layer to expand and become larger, the larger the thickness is, the larger the pattern expansion and become larger the color film layer is, the film thickness of the water oxygen barrier layer is determined according to the color film layer mask TP value and the OLED functional layer mask TP value, so that the color film layer pattern and the OLED functional layer pattern which are caused by the mask error can, the finally formed color film layer pattern is matched with the OLED functional layer pattern, and the display quality is effectively ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below, and it is apparent that the drawings in the following description only relate to some embodiments of the present invention and are not limiting on the present invention.
FIG. 1 is a block diagram of a method for fabricating a full-color OLED display according to the present invention;
fig. 2 is a schematic view of the arrangement of a water oxygen barrier layer provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
As shown in fig. 1, a method for manufacturing a full-color OLED display according to the present invention is shown, and the method includes the following steps:
sequentially manufacturing a color film layer and a flat layer on a transparent substrate to form a color film substrate;
forming a water and oxygen barrier layer on the color film substrate;
forming an OLED functional layer on the water-oxygen barrier layer;
the film thickness of the water-oxygen blocking layer is determined according to the color film layer mask TP value and the OLED function layer mask TP value.
Specifically, the preparation of various rete needs to form through using various rete mask version, and the preparation of OLED functional layer needs to use OLED functional layer mask version to form, and when various rete mask version TP value and OLED functional layer mask version TP value had the difference, the various rete pattern that corresponds the formation and OLED functional layer pattern also can have the difference to lead to the pattern to mismatch, influence display quality. In the manufacturing method provided in this embodiment, the film thickness of the water-oxygen barrier layer is determined according to the TP value of the color film layer mask and the TP value of the OLED functional layer mask, as shown in fig. 2, since the water-oxygen barrier requirement for manufacturing the water-oxygen barrier layer 1 on the color film substrate CF requires the manufacture of a film with a large density, that is, the water-oxygen barrier layer exhibits compressive stress, so that the color film substrate gradually arches from the edge to the middle toward the water-oxygen barrier layer, that is, the color film substrate bends in a convex shape, and then when TP value test or the OLED functional layer manufacturing is performed, the color film substrate expands and stretches under the condition that the substrate is flattened again under the suction effect of the platform, so that the water-oxygen barrier layer can expand and enlarge the pattern of the formed color film layer, and the larger the thickness of the color film layer is, the larger the pattern expansion and enlargement of the color film layer are determined according to the TP value of the color film layer mask and the TP value of the OLED The energy layer patterns are not matched, so that the finally formed color film layer patterns are matched with the OLED functional layer patterns, and the display quality is effectively ensured.
Further, in this embodiment, the film thickness of the water-oxygen blocking layer is proportional to a difference between TP values of the mask plate, wherein the difference between TP values of the mask plate is obtained by subtracting TP values of the color film layer from TP values of the OLED functional layer mask plate. In other words, it is considered that the thicker the water-oxygen barrier layer is, the greater the expansion effect on the color film substrate is, the greater the pattern increase of the color film layer is, and therefore, when the difference value obtained by subtracting the color film layer mask TP value from the OLED functional layer mask TP value is greater, the greater the film thickness of the water-oxygen barrier layer is set, and the pattern matching between the color film layer pattern and the OLED functional layer pattern can be better realized.
Specifically, the film thickness of the water-oxygen barrier layer is configured to enable the color film substrate to expand and elongate, and enable the expanded color film layer pattern TP value to be matched with the OLED function layer pattern TP value to be formed. And matching the expanded color film layer pattern TP value with the OLED functional layer pattern TP value to be formed, namely, the difference value between the expanded color film layer pattern TP value and the OLED functional layer pattern TP value to be formed is smaller than an error threshold value. For example, an error threshold may be set to be 3 μm, and when the difference between the TP value of the color film layer mask and the TP value of the OLED functional layer mask is greater than 3 μm, the difference between the TP value of the color film layer pattern and the TP value of the OLED functional layer pattern is also greater than 3 μm, resulting in poor registration. Therefore, the film thickness of the water-oxygen barrier layer can be configured according to the deviation, for example, when the film thickness of the water-oxygen barrier layer is 4000A, the TP value of the OLED functional layer pattern is larger than the TP value of the color film layer pattern by 3 μm, and at this time, the film thickness of the water-oxygen barrier layer is configured to be 8000A, so that the color film layer pattern is elongated by about 2 μm, the TP value of the OLED functional layer pattern is about 1 μm larger than the TP value of the color film layer pattern and smaller than the error threshold value by 3 μm, and the degree of overlap of the two patterns is better. For another example, when the thickness of the water and oxygen barrier layer is 4000A, the TP value of the OLED functional layer pattern is 3 μm larger than the TP value of the color film layer pattern, resulting in poor pattern registration, and the thickness of the water and oxygen barrier layer is set to 1500A, so that only stretching the color film substrate results in stretching the color film layer pattern by about 1.5 μm, and thus the TP value of the OLED functional layer pattern is about 1.5 μm larger than the TP value of the color film layer pattern, resulting in better registration of the two patterns.
Specifically, the determination of the film thickness of the water-oxygen blocking layer according to the color film layer mask TP value and the OLED functional layer mask TP value includes determining the deviation condition of the color film layer mask TP value and the OLED functional layer mask TP value, and determining the corresponding condition of the film thickness of the water-oxygen blocking layer and the color film layer pattern expansion value; specifically, a corresponding database of the film thickness of the water-oxygen barrier layer and the expansion value of the color film layer pattern can be established, so that after the deviation between the color film layer mask TP value and the OLED functional layer mask TP value is known, the deviation condition between the color film layer pattern TP value and the OLED functional layer pattern TP value can be determined, and then the thickness of the water-oxygen barrier layer is determined according to the requirement. For example, the difference between the TP value of the mask plate may cause the difference between the TP value of the OLED functional layer pattern and the TP value of the color film layer pattern to be b, and the difference between the TP value of the manufactured OLED functional layer pattern and the TP value of the color film layer pattern is required to be smaller than an error threshold a, so that the expansion value of the color film layer pattern is at least b-a, and then the minimum film thickness of the water and oxygen blocking layer may be determined in the database by b-a.
More specifically, in the present embodiment, the material of the water-oxygen barrier layer is SiNx or SiOxNy. The water-oxygen barrier layer is manufactured by adopting a plasma chemical vapor deposition method, wherein the deposition temperature is 150-230 ℃. The thickness of the water-oxygen barrier layer is 1000-10000A; the transmittance of the water-oxygen barrier layer is more than 80% in the wavelength range of 400-700 nm.
The above-mentioned embodiments only express the embodiments of the present invention, and the description is more specific and detailed, but not understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by using the equivalent substitution or the equivalent transformation should fall within the protection scope of the present invention.
Claims (7)
1. A manufacturing method of a full-color OLED display is characterized by comprising the following steps:
sequentially manufacturing a color film layer and a flat layer on a transparent substrate to form a color film substrate;
forming a water and oxygen barrier layer on the color film substrate;
forming an OLED functional layer on the water-oxygen barrier layer;
the film thickness of the water-oxygen blocking layer is determined according to the TP value of a color film layer mask and the TP value of an OLED functional layer mask;
forming a water and oxygen barrier layer on the color film substrate and then flattening again;
and the TP value is the side length of the film layer pattern or the mask.
2. The method of claim 1, wherein the thickness of the water-oxygen barrier layer is proportional to the difference between the TP values of the mask plate, which is the difference of the TP values of the OLED functional layer mask plate minus the TP values of the color film layer mask plate.
3. The method according to claim 1, wherein the film thickness of the water-oxygen barrier layer is configured to expand and elongate the color film substrate and match an expanded color film layer pattern TP value with an OLED functional layer pattern TP value to be formed, that is, a difference between the expanded color film layer pattern TP value and the OLED functional layer pattern TP value to be formed is smaller than an error threshold.
4. The method of claim 1, wherein the water-oxygen barrier layer is made of SiNx or SiOxNy.
5. The method for manufacturing the full-color OLED display according to claim 1, wherein the water-oxygen barrier layer is manufactured by a plasma chemical vapor deposition method, wherein the deposition temperature is 150-230 ℃.
6. The method of claim 1, wherein the water-oxygen barrier layer has a thickness of 1000 to 10000A.
7. The method of claim 1, wherein the water-oxygen barrier layer has a transmittance of greater than 80% over a wavelength range of 400-700 nm.
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| JP4173722B2 (en) * | 2002-11-29 | 2008-10-29 | 三星エスディアイ株式会社 | Vapor deposition mask, organic EL element manufacturing method using the same, and organic EL element |
| CN103123927B (en) * | 2013-01-24 | 2015-05-06 | 昆山维信诺显示技术有限公司 | Pixel structure for OLED display screen and metal mask thereof |
| CN104317158B (en) * | 2014-11-14 | 2018-05-22 | 京东方科技集团股份有限公司 | A kind of mask plate, mask plate group, color membrane substrates and display device |
| CN105097878B (en) * | 2015-07-17 | 2018-02-13 | 京东方科技集团股份有限公司 | Organic EL display panel and preparation method, display device |
| CN106129270B (en) * | 2016-07-01 | 2018-06-12 | 武汉华星光电技术有限公司 | Monitor method and substrate that mask plate forms pattern position |
| CN106773259A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of color membrane substrates and preparation method thereof, display device |
| KR102369369B1 (en) * | 2017-08-04 | 2022-03-02 | 엘지디스플레이 주식회사 | Organic Light Emitting Display Device and Method for Manufacturing the Same |
| CN108531855B (en) * | 2018-05-31 | 2020-11-13 | 昆山国显光电有限公司 | Mask plate, evaporation device and manufacturing method of display device |
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