KR102369369B1 - Organic Light Emitting Display Device and Method for Manufacturing the Same - Google Patents

Abstract

According to the present invention, an organic light emitting display device includes a cation having a hydrophilic group on the surface of a protective layer covering an organic light emitting element array, thereby forming a cured film having a high hardness between the filling material and the cation during bonding, and using it as a barrier against penetration of foreign substances In addition, the thickness of the filling material can be prevented from being changed by the bonding pressure so that the filling material has a uniform thickness between the substrate and the encapsulation substrate.

Description

Organic Light Emitting Display Device and Method for Manufacturing the Same

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device in which a structure is changed to change an interlayer interface reaction to prevent damage to a film inside the device due to a foreign material generated during a process, and a method for manufacturing the same.

Recently, as we enter the information age in earnest, the field of display that visually expresses electrical information signals has developed rapidly. Display Device) has been developed and is rapidly replacing the existing cathode ray tube (CRT).

Specific examples of such a flat panel display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an organic light emitting display device. (Organic Light Emitting Device: OLED) etc. are mentioned.

Among them, an organic light emitting diode display is considered as a competitive application for compactness and vivid color display without requiring a separate light source.

The organic light emitting diode display includes an organic light emitting device that is independently driven for each sub-pixel, and the organic light emitting device includes an anode and a cathode and an organic layer including an organic light emitting layer between the anode and the cathode.

On the other hand, the organic light emitting display device, for example, has an array configuration including thin film transistors and organic light emitting devices corresponding to each sub-pixel on the lower panel side, and an encapsulation substrate is provided opposite the array to encapsulate the organic light emitting devices vulnerable to moisture. . In addition, an encapsulation substrate that surrounds an edge between the lower plate and the encapsulation substrate and positioned at the upper and lower portions, and a sealant that seals the lower plate from side ambient air are provided.

However, in a typical organic light emitting display device, a foreign material generated during the process may remain between the lower plate and the encapsulation substrate, and when bonding proceeds in this state, the foreign material may cause cracks in the insulating layer and the electrode inside the device.

In particular, in the organic light emitting display device, a lower plate and an encapsulation substrate are provided with a mother substrate including a plurality of unit panels, a unit panel area is set thereon, an array process is performed, and thereafter, scribing is performed to form a unit panel. There is a distinction between the foreign material generated during scribing of the mother substrate and the size and hardness of the foreign material, so if it remains between the lower panel and the encapsulation substrate, it is difficult to avoid contact with the foreign material or cracks in the adjacent layer. In this case, the electrode of the organic light emitting device A scotomas may also occur due to the levitation between the upper membrane and the upper membrane. This directly affects the picture quality and is the main cause of the reduction in yield.

The present invention has been devised to solve the above problems, and relates to an organic light emitting display device that prevents damage to a film inside the device due to foreign substances generated during the process by changing the structure to change the interlayer interfacial reaction, and a method for manufacturing the same will be.

The organic light emitting display device of the present invention includes a reactive layer on the surface of the protective layer surrounding the organic light emitting element array, and when bonding is performed with a filler interposed between the upper and lower plates, curing is promoted at the interface between the reactive layer and the filler to promote curing of the interface. It is possible to prevent the flow of foreign matter through the boundary.

An organic light emitting diode display according to an embodiment of the present invention includes a substrate having a plurality of sub-pixels, and an organic light-emitting device provided in each sub-pixel of the substrate, each of which includes a first electrode, an organic emission layer, and a second electrode. and a protective layer covering the upper and side surfaces of the organic light emitting devices on the substrate, a reaction film including a cationic surfactant on a surface of the protective layer, an encapsulation substrate facing the substrate, and the substrate in contact with the reaction film A filler filling between the encapsulation substrates and an encapsulation pattern surrounding the filler may be included between the substrate and the encapsulation substrate.

The filler is a cured resin layer, and may have the greatest hardness at an interface with the reaction film among the cured resin layers.

In addition, the cationic surfactant is N+, and at the interface between the reaction film and the filler, the N+ may be combined with a resin compound constituting the filler.

The reaction layer and the passivation layer may function as a barrier against foreign substances existing between the substrate and the encapsulation substrate.

In addition, the encapsulation substrate may further include a black matrix and a color filter layer on a surface facing the organic light emitting diodes. Here, the filler is directly in contact with the reaction film, the black matrix, and the color filter layer on both sides of the organic light emitting devices, and directly to the substrate and the encapsulation substrate on the side of the outermost organic light emitting devices, respectively. It has a second region that is in contact with it, and the second region may have a height greater than that of the first region.

Preferably, the filler covers the reaction film, and the outer periphery of the reaction film is inside the filler.

In addition, the method of manufacturing an organic light emitting display device of the present invention for achieving the same object includes a first step of preparing a substrate having a plurality of sub-pixels, and a first electrode, an organic light emitting layer, and A second step of providing an organic light emitting device including a second electrode, a third step of providing a protective layer covering upper and side surfaces of the organic light emitting devices on the substrate, and a cationic surfactant on the surface of the protective layer A fourth step of providing a reaction film, a fifth step of providing an encapsulation pattern on an edge of the encapsulation substrate after preparing an encapsulation substrate, a sixth step of applying a filler to an area inside the encapsulation pattern, and encapsulation of the encapsulation substrate The method may include bonding the substrate and the encapsulation substrate so that the surface on which the pattern is formed faces the reaction film on the substrate, and filling a space between the substrate and the encapsulation substrate with the filler.

Here, the fourth step consists of attaching the cationic surfactant to the surface of the protective layer by atomic layer deposition or plasma deposition, or chemical vapor deposition of a solvent including the cationic surfactant on the surface of the protective layer After that, the solvent may be volatilized to form a step.

Meanwhile, the filler in the sixth step may be a liquid uncured resin.

In this case, when the substrate and the encapsulation substrate are bonded together in the seventh step, a partially cured layer may be generated at an interface where the reaction film on the substrate and the filler of the uncured resin meet.

In addition, the partially cured layer at the interface where the reaction film and the filler meet may act as a barrier of foreign substances positioned between the substrate and the encapsulation substrate.

After the seventh step, an eighth step of curing the filler may be further included.

Effects of the organic light emitting display device and the method for manufacturing the same of the present invention are as follows.

First, a reaction film containing a cationic surfactant is formed on the surface of the protective layer that protects the organic light emitting device, and a partially cured layer is induced at the interface with the reaction film in contact with the filler. Flowing through the partially cured layer can be prevented.

Second, the partially hardened layer generated at the interface between the reaction film and the filler blocks the force of foreign substances pressing on the protective layer or the organic light emitting device, thereby stabilizing the array structure formed on the substrate. Dark ignition is prevented.

Third, since the interface between the reaction film and the filler has the highest hardness in the entire filler layer, it can act as a barrier against foreign substances, thereby preventing moisture penetration occurring when the film is damaged by foreign substances. Accordingly, it is possible to prevent the shrinkage of the filler and maintain a uniform gap between the substrate and the encapsulation substrate. Through this, it is possible to equalize the luminous characteristics for each area of the device.

1 is a plan view illustrating an organic light emitting diode display according to the present invention;
Figure 2 is a schematic cross-sectional view taken along line I ~ I' of Figure 1;
3 is a cross-sectional view of one sub-pixel in the active area of FIG. 2 ;
4A to 4C are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to the present invention.
5 is a process flowchart of an organic light emitting diode display according to the present invention;
6A to 6D are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to the present invention when a foreign material is outside the passivation layer;
7A to 7C are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to the present invention when a foreign material is present inside the passivation layer;

Advantages and features of the invention, and methods of achieving them, will become apparent with reference to the various embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the various embodiments disclosed below, but will be implemented in various different forms, and only the various embodiments of the present invention make the disclosure of the present invention complete, and in the technical field to which the present invention pertains It is provided to fully inform those of ordinary skill in the scope of the invention. Accordingly, the invention is defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining various embodiments of the present invention are exemplary, and thus the present invention is not limited to the matters shown in the drawings. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, cases including the plural are included unless otherwise explicitly stated.

In interpreting the components included in various embodiments of the present invention, it is interpreted as including an error range even if there is no separate explicit description.

In describing various embodiments of the present invention, in the case of describing the positional relationship, for example, two When the positional relationship of parts is described, one or more other parts may be positioned between the two parts unless 'directly' or 'directly' is used.

In describing various embodiments of the present invention, in the case of describing a temporal relationship, for example, a temporal precedence relationship such as 'after', 'next to', 'after', 'before', etc. When is described, a case that is not continuous may be included unless 'directly' or 'directly' is used.

Hereinafter, an organic light emitting diode display of the present invention and a method of manufacturing the same will be described with reference to the drawings.

1 is a plan view illustrating an organic light emitting diode display according to the present invention, and FIG. 2 is a schematic cross-sectional view taken along line I to I' of FIG. 1 . 3 is a cross-sectional view of one sub-pixel of the active area of FIG. 2 .

1 to 3 , the organic light emitting diode display of the present invention includes a substrate 100 having a plurality of sub-pixels SP, and each sub-pixel SP of the substrate 100 is provided with a first An organic light emitting diode (OLED) including an electrode 151 , an organic light emitting layer 152 , and a second electrode 153 , and a protective layer covering upper and side surfaces of the organic light emitting diode array OLED_A on the substrate 170 , a reaction film 230 including a cationic surfactant on a surface of the protective layer 170 , an encapsulation substrate 200 facing the substrate 100 , and the reaction film 230 in contact with the reaction film 230 . A filler 250 filling between the substrate 100 and the encapsulation substrate 200 and an encapsulation pattern 300 surrounding the filler 250 may be included between the substrate 100 and the encapsulation substrate 200 . .

Referring to the planar shape of the substrate 100 and the encapsulation substrate 200 with reference to FIG. 1 , the substrate 100 and the encapsulation substrate 200 are divided into an active area AA in the center and an outer area outside the substrate 100 . In addition, the substrate 100 is formed to protrude more from one side of the substrate 100 compared to the encapsulation substrate 200 , and this protruding area is a pad for applying an electrical signal to the thin film transistor array TFT_A formed on the substrate 100 . It is used to provide a pad portion (not shown) including electrodes.

Although the illustrated substrate 100 and the encapsulation substrate 200 are illustrated in a rectangular shape, this is an example, and they may be changed to other polygons or circles, and in any case, the substrate 100 relative to the encapsulation substrate 200 It may protrude from this one side (one side) and may be provided with a pad part.

On the other hand, the substrate 100 and the encapsulation substrate 200 are provided with an encapsulation pattern 300 having a shape surrounding the edge of the active area AA in the outer area for preventing external air from being blocked from the outside of the side surface and for vertical bonding. do. The encapsulation pattern 300 has a closed ring shape. This is to prevent the encapsulation pattern 250 from acting as a path for external air or moisture. The encapsulation pattern 300 is made of a compound of an epoxy group having an adhesive property and a resin capable of maintaining a predetermined thickness to maintain a predetermined thickness in the outer region of the substrate 100 and the encapsulation substrate 200, and has a side sealing function. .

In addition, a filler 250 is provided in the space surrounded by the encapsulation pattern 300 between the substrate 100 and the encapsulation substrate 200 to close the gap between the substrate 100 and the encapsulation substrate 200 in the active region. By keeping it constant, it is possible to maintain the homeostasis of the transmission characteristics.

Specifically, as shown in FIGS. 2 and 3 , each sub-pixel SP of the substrate 100 includes a pixel driving circuit including one or more thin film transistors (TFTs) electrically connected to the organic light emitting diode (OLED). do. The sub-pixels SP are arranged in a matrix on the substrate 100 .

Also, in the present specification, a plurality of thin film transistors TFTs positioned in the active area AA on the substrate 100 are collectively referred to as a thin film transistor array TFT_A, and a plurality of thin film transistors TFTs positioned in the active area AA on the substrate 100 in the same manner. The two organic light emitting devices OLED are collectively referred to as an organic light emitting device array OLED_A.

In addition, the thin film transistor array TFT_A and the organic light emitting device array OLED_A are provided in at least the active area AA.

The thin film transistor TFT may be provided on the buffer layer 105 of the substrate 100 . The reason for providing the buffer layer 105 is to prevent impurities in the buffer layer 105 from flowing into the upper semiconductor layer 113 .

The thin film transistor TFT includes a semiconductor layer 113 , a gate electrode 120 positioned on the semiconductor layer 113 with a gate insulating layer 115 interposed therebetween, and both ends of the semiconductor layer 113 . It includes a source electrode 131 and a drain electrode 132 .

An interlayer insulating layer 125 is provided between the gate electrode 120 and the source electrode 131 and the drain electrode 132 , and may be provided not only in the active area AA of the substrate 100 but also in the outer area. there is.

In addition, the drain electrode 132 of the thin film transistor TFT is connected to the first electrode 151 of the organic light emitting diode OLED.

The organic light emitting diode OLED may include a bank 150 having an open area corresponding to the light emitting part, and may include a light emitting part and a non-emitting part. Depending on whether the first electrode 151 is reflective, it may be divided into a top emission type or a bottom emission type. For example, when the first electrode 151 is reflective and the second electrode 153 is transmissive, a top emission method may be implemented. Since the transmission characteristics of the OLED do not change, the bank 150 may or may not overlap the thin film transistor TFT.

If the first electrode 151 is transmissive, the second electrode 153 is reflective, and when the bottom light is emitted, the configuration of the lower side of the first electrode 151 affects the transmittance. In this case, the bank 150 may be overlapped with a thin film transistor TFT including wiring, and the bank 150 may be covered by the thin film transistor TFT. In this case, the bank 150 may be a light blocking material such as black resin.

On the other hand, for example, in the case of the top emission method, the light emitted from the upper organic light emitting layer 152 and the light reflected from the first electrode 151 and emitted upward from the organic light emitting layer 152 are encapsulated. The light of a specific color per sub-pixel may be transmitted through the substrate 200 or transmitted through the color filter layer 220 provided on the organic light emitting diode (OLED) to filter the color. In some cases, the color filter layer 220 and the black matrix layer 210 may be omitted if an organic light emitting layer having a different light emitting color is applied to each of the organic light emitting devices.

As shown, the color filter layer 220 may be provided on the encapsulation substrate 200 , or on the organic light emitting diode (OLED) on the substrate 100 by adjusting the thickness according to the transmission characteristics and provided at any position. can be

In the thin film transistor array TFT_A, the buffer layer 105 , the gate insulating layer 115 , and the interlayer insulating layer 135 functioning as at least an insulating layer are not only the active area AA but also an outer area outside the active area AA on the substrate 100 . may extend to the edge of the substrate 100 , and these insulating layers may protect the electrodes of the thin film transistor array TFT_A or function as interlayer insulation. Relatively, since these insulating layers are outside the organic light emitting device array OLED_A, they may have a barrier function at the bottom and the outside with respect to the organic light emitting device OLED, which is vulnerable to moisture.

In addition, an electrode (second electrode 153 in FIG. 2 ) on the emission side of the organic light emitting diode (OLED) including the first electrode 151 , the second electrode 153 , and the organic light emitting layer 152 therebetween) A capping layer 160 may be further provided on the surface. The capping layer 160 protects the second electrode 153 and functions as an out coupling. In some cases, the capping layer 160 may be omitted, include a material capable of improving out-coupling properties in the second electrode 153 , or may be provided by stacking such a material with a metal constituting the second electrode 153 . there is.

In addition, a protective layer 170 covering the organic light emitting device array OLED_A and the capping layer 160 from the top surface and the side surface is provided. The protective layer 170 is an inorganic silicon insulating film of approximately 1 μm in diameter and prevents moisture or external air remaining between the substrate 100 and the encapsulation substrate 200 from entering the organic light emitting diode (OLED). do.

In addition, the organic light emitting diode display of the present invention includes a thin reaction film 230 having a thickness of less than 10 Å on the surface of the protective layer 170 . The reaction film 230 includes a cationic surfactant, is attached to the protective layer 170, acts as a hydrophilic group, and forms a fast cured film instantaneously at the interface with the filler 250 contacting the surface in the bonding process. Accordingly, when the filler 250 is spread in the space between the substrate 100 and the encapsulation substrate 200 , the foreign material (see 400 in FIG. 6A ) between the substrate 100 and the encapsulation substrate 200 is moved inside the cured film. It functions as a barrier to prevent entry, or functions as a barrier to prevent foreign substances (see 450 in FIG. 7A ) inside the protective layer 170 from escaping to the outside of the cured film.

In addition, the cured film formed between the reaction film 230 and the filler 250 serves to accelerate curing when the filler 250 spreads in the space between the substrate 100 and the encapsulation substrate 200 , or 450). Accordingly, it is possible to prevent the internal structure of the organic light emitting device array OLED_A from being cracked.

In addition, by providing the reaction film 230, the hardness of the interface between the reaction film 230 and the filler 250 is relatively larger than the inside of the filler 250, so that the pressure that the filler 250 presses during the bonding process is Since the configuration of the organic light emitting element array OLED_A is not significantly affected, it is possible to prevent a thickness variation for each region due to a shape change or damage of the organic light emitting element array OLED_A, and thus image quality can be improved.

On the other hand, the cationic surfactant included in the reaction film 230 mainly includes N + as a cation. This is because when a general H + cation is on the surface of the protective layer, H + cations are incorporated into the protective layer and the curing properties of the surface of the protective layer are lowered, whereas N + cations remain reactive on the surface of the protective layer 170, and the reactive group is A hydrophilic group promotes the curing reaction of the interface when the cations adhere to the filler 250 , and the surface of the reaction film 230 on the cured protective layer 170 may function as a kind of barrier against foreign substances.

And, as the cationic surfactant containing N+, Octenidine dihydrochloride, CTAB (Cetrimonium bromide), CPC (Cetylpyridinium chloride), BAC (Benzalkonium chloride), BZT (Benzethonium chloride), Dimentyldioctadecylammonium chloride, DODAB (Dioctadecyldimetnylammonium bromide), etc. can be heard

On the other hand, the reaction film 230 is very thin with a thickness of less than 10 Å, and the included cations are chemically combined with the filler 250 at the interface, so that the spread and curing of the filler 250 in the bonding process is completed. In this state, the reaction film 230 may be observed as a kind of interface having different hardness between the protective layer 160 and the filler 250 rather than having a distinct film characteristic.

Here, the filler 250 starts to harden from the surface in contact with the reaction film 230 , and the hardness is highest at the interface with the reaction film 230 in terms of the entire thickness.

Meanwhile, the filler 250 stably maintains a thickness between the upper surface of the organic light emitting diode (OLED) and the color filter layer 220 on the encapsulation substrate 200 . When sealing between the substrate 100 and the encapsulation substrate 200 only with the encapsulation pattern 300 , an empty space is generated between the substrate 100 and the encapsulation substrate 200 , and the encapsulation substrate 200 is subjected to the user’s daily stimulation. After the gap between the substrate 100 and the substrate 100 was reduced, restoration was difficult, but the filling material 250 was filled in the space between the substrate 100 and the encapsulation substrate 200 and the substrate 100 and the encapsulation substrate 200 were physically stimulated. A change in the gap between them can be prevented.

The filler 250 is a cured resin layer in the completed organic light emitting display device, and is a transparent resin having a transmittance of 90% or more in a cured state so as not to impair the transmittance of light emitted from the organic light emitting diode (OLED). The filler 250 of the resin layer cured in the same environment has a lower hardness than the encapsulation pattern 300 and has some elasticity, so it can serve as a buffer against external impact.

The filler 250 may have the greatest hardness at the interface with the reaction film 230 , because the first curing reaction occurs when the filler 250 and the reaction film 230 come into contact with each other.

In addition, cations such as N+ included in the reaction film 230 may be combined with a resin compound constituting the filler 250 at the interface between the reaction film 230 and the filler 250 .

The protective layer 170 together with the reaction layer 230 may function as a barrier against foreign substances existing between the substrate 100 and the encapsulation substrate 200 .

2 shows a bar in which the thin film transistor array TFT_A including an insulating film is relatively extended to the outer region compared to the organic light emitting element array OLED_A, and the upper portion of the thin film transistor array TFT_A on the substrate 100 and the encapsulation substrate ( 200) indicates a point provided with the encapsulation pattern 300 in contact with the surface. In fact, the encapsulation pattern 300 may be in direct contact with the surface of the substrate 100 and the encapsulation substrate 200 , or may be in direct contact with the insulating film by interposing an insulating film on at least one of them.

On the other hand, the black matrix 210 , which is not described on the side of the encapsulation substrate 200 , is provided at the boundary of each sub-pixel to prevent color mixing of light emitted from adjacent sub-pixels. If the light emitted from the lower portion can be distinguished for each sub-pixel SP, the black matrix 210 may be omitted in some cases.

Referring to FIG. 2 , the first filler 250 is in direct contact with the reaction film 230 on the organic light emitting device array OLED_A and the black matrix 210 and the color filter layer 220 on both surfaces, respectively. The region A and the reaction film 230 on the side of the outermost organic light emitting devices are in contact with the side, and directly on the thin film transistor array TFT_A and the encapsulation substrate 200 on the substrate 100 from the bottom and the top, respectively. It can be seen that the second region (B) is separated from each other, and the thickness is large in the second region (B). The drawing shows a state in which the insulating film of the thin film transistor array TFT_A is formed up to the outer region on the substrate 100 side. In some cases, the insulating film is patterned in the outer region of the substrate 100 to form a second region (B). In this case, the filler 250 may directly contact the encapsulation substrate 200 and the substrate 100 from the top and bottom.

Here, the filler 250 is formed to cover the reaction film 230 and has a larger area than the reaction film 230 . Accordingly, it is preferable that the outer periphery of the reaction film 230 is inside the filler 250 . This means that when the filler 250 spreads out from the inner region of the encapsulation pattern 300 during the bonding process, the filler 250 sufficiently covers the upper portion and the side of the reaction film 230, and in this process, the reaction film 230 and This is to induce rapid hardening between the interfaces of the filler 250 . And, as described above, the thin cured film generated at the interface between the reaction film 230 and the filler 250 promotes curing in areas other than the contact portion with the reaction film 230 when the filler 250 spreads. can do it In this case, in the completed organic light emitting display device, the filler 250 may sufficiently cover the reaction film 230 , so that the entire upper surface of the reaction film 230 may be used as an interface with the filler.

Meanwhile, the encapsulation pattern 300 is also called a dam in terms of the function of preventing the filler 250 from overflowing to the outside.

Hereinafter, a method of manufacturing an organic light emitting diode display will be described.

4A to 4C are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to the present invention, and FIG. 5 is a process flowchart of the organic light emitting display device according to the present invention.

The individual configurations of the substrate 100 and the encapsulation substrate 200 refer to FIGS. 1 to 3 .

First, a substrate 100 having a plurality of sub-pixels is prepared ( 100S).

Next, a thin film transistor array TFT_A is formed on the substrate 100 by including a pixel driving circuit including at least one thin film transistor TFT in each sub-pixel of the substrate ( 110S).

Next, an organic light emitting diode (OLED) including a first electrode 151 , an organic light emitting layer 152 , and a second electrode 153 is connected to a thin film transistor (TFT) provided in each sub-pixel, respectively. An array (OLED_A) is formed (120S). In some cases, a capping layer 160 may be provided on the second electrode 153 to improve out-coupling.

Next, a protective layer 170 covering the top and side surfaces of the organic light emitting device array OLED_A on the substrate 100 is formed (130S).

Next, a reaction film 230 including a cationic surfactant is formed on the surface of the protective layer 170 (140S). The reaction layer 230 is formed by attaching a reactive material including an N+ cationic surfactant to the surface of the passivation layer by an atomic layer deposition method or a plasma deposition method. Alternatively, after chemical vapor deposition of a solvent including N + cationic surfactant on the surface of the protective layer 170, the solvent is volatilized to form a thin solid reaction film 230 leaving only N + cations. there is.

After preparing the encapsulation substrate 200 in a process line different from that of the substrate 100 ( 200S), the process may be performed in parallel with the process performed on the substrate 100 .

First, the black matrix 210 and the color filter layer 220 are formed on the encapsulation substrate 200 (210S).

Then, the encapsulation pattern 300 is formed on the edge of the encapsulation substrate 200 (220S). The encapsulation pattern 300 has a predetermined thickness on a closed loop, which is approximately a thickness required between the substrate 100 and the encapsulation substrate 200 in an organic light emitting diode display (OLED), and is 10 μm to 35 μm. can be equivalent to

Next, a filling material 250a is applied or dropped onto the inner region of the encapsulation pattern 300 (230S). The filling material 250a is dropped on the surfaces of the black matrix 210 and the color filter layer 220 in a dot manner in a liquid and uncured state (220S). The filling material 250a is liquid and has fluidity, and when it is dropped on the surface of the encapsulation substrate 200 , it does not remain only in the dropped area and may gradually spread to the surroundings. And, when the filling material 250a flows, the encapsulation pattern 300 functions as a dam to prevent the filling material 250a from flowing over.

Next, as shown in FIG. 4A , the substrate 100 having the reaction film 230 on the surface and the encapsulation substrate 200 having the encapsulation pattern 300 and the filling material 250a on the surface face the substrate 100 and adhere to each other (300S).

Specifically, in the bonding of the substrate 100 and the encapsulation substrate 300 , first, after the filling material 250a faces the reaction film 230 , as shown in FIG. 4B , the encapsulation pattern 300 on the encapsulation substrate 200 . After maintaining the adhesion state to a level that touches the thin film transistor array (A) on the substrate 100, and leaving a certain period of time, the space between the substrate 100 and the encapsulation substrate 200 is dropped Let the filling material 250a fill. The reaction film 230 having a cationic surfactant in the initial deposition is bonded to each other at an interface in contact with the filling material 250a to form a cured film 2500 . In addition, the cured film 2500 can prevent foreign substances generated between the substrate 100 and the encapsulation substrate 200 from flowing from the top to the bottom or from the bottom to the top with the cured film 2500 as a boundary. . At the initial stage of cementation, as shown in FIG. 4B , the filling material 250a is dropped in a dot manner, so that the high point of each filling material 250a and the reaction film 230 meet in each region where the filling material 250a is located. A cured film 2500 may be partially formed.

When the encapsulation substrate 200 and the substrate 100 are kept facing each other for a certain period of time, the filling material 250a having the cured film 2500 on the opposite surface is formed between the substrate 100 and the encapsulation substrate 200 . will fill the space.

Then, the filling material 250a may be cured using heat or UV (ultra violet) to cure the liquid filling material 250a to form the filling material 250 as shown in FIG. 4C . In this case, during the curing process, the cured film 2500 may function as a curing accelerator film.

Hereinafter, in the organic light emitting diode display of the present invention, a difference in a cured film generated during a bonding process according to a position of a foreign material will be described based on a manufacturing method of each organic light emitting display device.

In addition, the drawings shown below show the prevention of foreign matter from flowing by the cured film formed at the interface between the reaction film and the filling material, which is not directly related to the thin film transistor array and the capping layer and the encapsulation substrate side of the substrate side. The description of the black matrix and color filter layer of , is omitted.

6A to 6D are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to the present invention when the foreign material is outside the passivation layer.

As shown in FIG. 6A , an organic light emitting device array OLED_A is formed on the substrate 100 , and a protective layer 170 is formed to cover the organic light emitting device array OLED_A. In addition, a reaction film 230 including a cationic surfactant is formed on the surface of the protective layer 170 . When a foreign material 400 is generated outside the protective layer 170 , the foreign material 400 becomes the reaction film 230 . ) exist outside.

Next, as shown in FIG. 6B , the encapsulation substrate 200 on which the filling material 250a is dropped on the surface is opposed to the substrate 100 .

As shown in FIG. 6c by gradually applying pressure, when the encapsulation pattern 300 comes into contact with the substrate 100 and the filling material 250a meets the surface of the reaction film 230, the resin forming the filling material 250a and the reaction The cationic component of the film 230 may combine to form a thin cured film 2500 at the interface. In addition, the cured film 2500 has a greater hardness than the liquid filling material 250a or the protective layer 170 , and the cured film 2500 serves as a barrier, and the foreign material 400 penetrates into the protective layer 170 . to prevent becoming

As shown in FIG. 6D , after the filling of the filling material 250a between the substrate 100 and the encapsulation substrate 200 is completed, the interface between the reaction film 230 and the filling material 250a is widened and the cured film 2500 . is increased, and then, when the filling material 250a is cured by applying heat or UV to form the filling material 250 , the cured film 2500 serves as a seed as a curing accelerator.

In addition, in the organic light emitting display device completed in this way, the cured film 2500 acts as a barrier between the substrate 100 and the encapsulation substrate 200 to encapsulate the substrate 100 and the substrate 100 after the process is completed as well as during the process. It is possible to prevent foreign substances remaining between the substrates 200 from penetrating into the organic light emitting diode (OLED) over time.

7A to 7C are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to the present invention when a foreign material is inside the passivation layer.

7A , when the organic light emitting device array OLED_A is formed on the substrate 100 , a foreign material 450 generated during the process may remain on the organic light emitting device array.

After that, when the protective layer 170 is deposited to cover the organic light emitting device array OLED_A and formed, the protective layer 170 thin to about 1 μm covers the foreign material 450 having a larger diameter than this, The protective layer 170 at the portion where the foreign material 450 is located protrudes.

Then, as shown in FIG. 7B, a reaction film 230 including a cationic surfactant is formed on the surface of the protective layer 170. Since the reaction film 230 has a very thin thickness within 10 Å, the protective layer ( 170) is provided in a state in which the surface step difference is reflected.

If the reaction film 230 is not provided, and the protective layer 170 having a surface step due to a foreign material directly comes into contact with the filling material 250a on the inner surface of the encapsulation substrate facing it, and then the bonding process is performed, Due to the large diameter and high hardness of the foreign material, when pressure is applied during bonding, the foreign material 450 may damage the upper protective layer 170 and the lower organic light emitting device array OLED_A. On the other hand, in the method of manufacturing an organic light emitting display device of the present invention, when the reaction layer 230 is provided on the surface of the protective layer 170 and adhesion is performed, the positive ions of the reaction layer 230 and the filling material 250a ) is initially reacted to form a cured film 2500 on the contact surface, thereby reducing the pressure transferred to the foreign material 450 under the cured film 2500 . Accordingly, it is possible to prevent the protective layer 170 from being destroyed or the filling material 250a from being damaged due to the foreign material 450 .

After the filling of the filling material 250a between the substrate 100 and the encapsulation substrate 200 is completed, the interface between the reaction film 230 and the filling material 250a is widened, and the area of the cured film 2500 is increased. After the filling of the filling material 250a is completed, heat or UV is applied to cure the filling material 250a as shown in FIG. 7c , when the filling material 250 is formed, the cured film 2500 serves as a curing accelerator and a seed.

Accordingly, the cured film 2500 at the interface between the reactive film 230 having the cations generated during the bonding process and the filling material 250a is protected by the foreign substances 400 and 450 positioned inside and outside the protective layer 170 . The layer 170 serves as a barrier by preventing it from entering the inside, and preventing it from escaping to the outside and causing a change in the gap between the substrate 100 and the encapsulation substrate 200, thereby improving the reliability of the device. In addition, by increasing the hardness of the interface between the reaction layer 230 and the filling material 250a to prevent darkening due to poor adhesion and poor connection between layers that may occur when foreign substances penetrate into the organic light emitting device, organic light emitting The image quality of the display device may be improved.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Accordingly, the various embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the various embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: substrate 151: first electrode
152: organic light emitting layer 153: second electrode
TFT: thin film transistor TFT_A: thin film transistor array
OLED: organic light emitting element OLED_A: organic light emitting element array
160: capping layer 170: protective layer
200: encapsulation substrate 230: reaction film
250: filler 300: bag pattern

Claims (14)

a substrate having a plurality of sub-pixels;
an organic light-emitting device provided in each sub-pixel of the substrate and including a first electrode, an organic light-emitting layer, and a second electrode, respectively;
a protective layer covering upper portions and side surfaces of the organic light emitting diodes on the substrate;
a reaction film including a cationic surfactant on the surface of the protective layer;
an encapsulation substrate facing the substrate;
a filler filling the space between the substrate and the encapsulation substrate in contact with the reaction film; and
An encapsulation pattern surrounding the filler is included between the substrate and the encapsulation substrate,
At an interface where the reaction film and the filler meet, a cationic surfactant of the reaction film and a compound of a resin constituting the filler are chemically combined. The method of claim 1,
The filler is a cured resin layer,
An organic light emitting diode display having the greatest hardness at an interface with the reaction film among the cured resin layers. The method of claim 1,
The cationic surfactant is N+. delete The method of claim 1,
and a black matrix and a color filter layer on a surface of the encapsulation substrate facing the organic light emitting diodes. 6. The method of claim 5,
The filler is
A first region in direct contact with the reaction film on the upper portion of the organic light emitting devices, the black matrix and the color filter layer, respectively, on both surfaces, and the side of the reaction film at the side of the outermost organic light emitting devices, respectively, on the substrate and the encapsulation substrate having a second region tangent at the bottom and at the top,
The organic light emitting diode display has a height of the second region greater than that of the first region. The method of claim 1,
The filler covers the reaction film, and an outer periphery of the reaction film is inside the filler. A first step of preparing a substrate having a plurality of sub-pixels;
a second step of providing an organic light emitting device including a first electrode, an organic light emitting layer, and a second electrode in each sub-pixel of the substrate;
a third step of providing a protective layer covering upper portions and side surfaces of the organic light emitting diodes on the substrate;
a fourth step of providing a reaction film including a cationic surfactant on the surface of the protective layer;
a fifth step of providing an encapsulation pattern on an edge of the encapsulation substrate after preparing the encapsulation substrate;
a sixth step of applying a filler to the inner region of the encapsulation pattern; and
The substrate and the encapsulation substrate are bonded so that the surface on which the encapsulation pattern is formed of the encapsulation substrate is opposite to the reaction film on the substrate, the filler is filled between the substrate and the encapsulation substrate, and the reaction film and the filler meet and a seventh step of chemically bonding a cationic surfactant of the reaction layer to a resin compound constituting the filler at an interface. 9. The method of claim 8,
The fourth step may include attaching the cationic surfactant to the surface of the passivation layer by atomic layer deposition or plasma deposition. 9. The method of claim 8,
The fourth step may include chemical vapor deposition of a solvent including the cationic surfactant on the surface of the passivation layer and then volatilizing the solvent. 9. The method of claim 8,
The method of manufacturing a display device for an organic light emitting display device, wherein the filling material of the sixth step is a liquid uncured resin. 12. The method of claim 11,
in the seventh step
When bonding the substrate and the encapsulation substrate
A method of manufacturing an organic light emitting display device in which a partially cured layer is generated at an interface where the reaction film on the substrate and the filler of the uncured resin meet. 13. The method of claim 12,
The partially cured layer at the interface where the reaction layer and the filler meet serves as a barrier for foreign substances positioned between the substrate and the encapsulation substrate. 13. The method of claim 12,
After the seventh step,
The method of manufacturing an organic light emitting display device further comprising an eighth step of curing the filler.

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