CN110229635A - Integration silicon wafer and its manufacturing method that can be attached on object - Google Patents

Integration silicon wafer and its manufacturing method that can be attached on object Download PDF

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Publication number
CN110229635A
CN110229635A CN201810177675.1A CN201810177675A CN110229635A CN 110229635 A CN110229635 A CN 110229635A CN 201810177675 A CN201810177675 A CN 201810177675A CN 110229635 A CN110229635 A CN 110229635A
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China
Prior art keywords
hot melt
layer
melt adhesive
adhesive layer
attached
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CN201810177675.1A
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Chinese (zh)
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张文耀
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Individual
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Individual
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Priority to CN201810177675.1A priority Critical patent/CN110229635A/en
Publication of CN110229635A publication Critical patent/CN110229635A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

A kind of integration silicon wafer being attached on object and its manufacturing method, the integration silicon wafer include a layer of silica gel；One hot melt adhesive layer mainly includes a high temperature hot melt adhesive layer, is attached to the layer of silica gel positioned at the lower section of the layer of silica gel, and using bridging agent；One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；Wherein the high temperature hot melt adhesive layer is formed by the first formation temperature heating hot melt adhesive；The low-temperature heat melting glue-line is formed by the second formation temperature heating hot melt adhesive, and wherein second formation temperature is lower than first formation temperature.Wherein the integration silicon wafer further includes an object layer being located at below the low-temperature heat melting glue-line；Its combination is to fit to the mode of material application hot melt made of above-mentioned layer of silica gel and the hot melt adhesive layer integration on the object layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the low-temperature heat melting glue-line can be by thawing in conjunction with the object layer under second formation temperature.

Description

Integration silicon wafer and its manufacturing method that can be attached on object
Technical field
The present invention relates to silica gel structure, especially a kind of integration silicon wafer and its manufacturing method that can be attached on object.
Background technique
The patterns such as trade mark or poster are traditionally formed on clothes, required for being mainly cut into using plastifying material Kenel, then by the plastifying material application hot melt adhesive and garments.The degree of melting of general plastifying material is low, so higher At a temperature of, it is most likely that plasticiser and halogen compounds are volatilized, the plasticiser and halogen compounds of these volatilizations can pass through The contact of respiratory apparatus or skin and go deep into human body, therefore influence user health.And clothes must be worn for people, It and is the contact to form nearly body.So when doing trade mark or poster using plastifying material, it will so that wearer is by the modeling Change the infection of material.And plastifying material is also easy to become fragile, so influencing service life.
In view of above-mentioned the shortcomings that using plastifying material, forbid answering on clothes so European Union or other advanced countries have discussed and formulated Trade mark or poster are formed with plastifying material.Silica gel is due to stability and thermosetting property with height, it is necessary at very high temperatures It is possible to deformation or destroys by fire, so being made into trade mark using silica gel or poster becomes a kind of mode for that can replace.
Using the mode that silica gel material forms trade mark or poster using the liquid-state silicon gel of various colors, then penetrated using micro Mode out, trade mark required for being formed on heat-resisting material or pattern, under being cut out after heated baking, then with cloth to cloth The mode of sewing or fitting is fixed on dress ornament surface.The disadvantage of such mode maximum be can not largely manufacture using mold, and Production technology is slow, relatively also influences yield and cost and required artificial.
If silica gel is directly attached on clothes, maximum problem is because silica gel can must just be consolidated at high temperature Change, and this high temperature is not that cloth can bear, so this high-temperature technology will destroy cloth, so can not be using silica gel directly in cloth The various patterns such as trade mark or poster are formed on material.
Therefore the present invention wishes based on proposing the brand-new material by silicon of one kind, and quotient can be formed on cloth or other objects The mode of mark or poster, to solve the problems, such as to meet in the above-mentioned prior art.
Summary of the invention
So it is an object of the present invention to solve the problems, such as in above-mentioned well-known technique, propose that one kind can be attached at pair in the present invention As upper integration silicon wafer, a hot melt adhesive layer will be configured below silica gel, and the hot melt adhesive layer is to include high temperature hot melt adhesive layer and low temperature The double-layer structure of hot melt adhesive layer.Allow hot melt adhesive layer in conjunction with silica gel using the high temperature hot melt adhesive layer, using the Low Temperature Thermal Melt layer allows the hot melt adhesive layer in conjunction with object such as cloth.It can not skill directly in conjunction with cloth so solving silica gel Problem in art.And it is material that silica gel is used in the present invention, various patterns required for can largely being formed by mold are again It is transferred on cloth using the mode of thermal transfer, whole speed of production is very fast and at low cost.And silica gel material property changed itself Stablize, it is necessary to just understand deformation at 250 DEG C or more, and not be thermoplastic material, so the influence to environment is far below traditional Plastifying material.Namely why national governments can receive the main reason for silicon material replaces plastifying material for this.
A kind of integration silicon wafer that can be attached on object is proposed in the present invention in order to achieve the above objectives, includes a layer of silica gel； One hot melt adhesive layer, mainly includes: a high temperature hot melt adhesive layer, is attached to the silicon positioned at the lower section of the layer of silica gel, and using bridging agent Glue-line；One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；Wherein the high temperature hot melt adhesive layer forms temperature by first Degree heating hot melt adhesive is formed；The low-temperature heat melting glue-line is formed by the second formation temperature heating hot melt adhesive, wherein second shape It is lower than first formation temperature at temperature.
Further, an adhesive tape is formed between the high temperature hot melt adhesive layer and the layer of silica gel, the material of the adhesive tape is main It is to be mixed by the high temperature hot melt adhesive layer, the layer of silica gel and the bridging agent.
Further, which is polysiloxanes.
Further, the material of the hot melt adhesive layer is thermoplastic polyurethane.
Further, first formation temperature is between 120 DEG C to 200 DEG C；Wherein second formation temperature is between 60 DEG C between 150 DEG C；Wherein first formation temperature is higher than 10 DEG C to 60 DEG C of second formation temperature.
Further, this can be attached at the silicon wafer of integrating on object and also include an object being located at below the low-temperature heat melting glue-line Part layer；Wherein the object layer will not melt under second formation temperature or generate unacceptable deformation；
Its combination is right for the mode of material application hot melt made of the layer of silica gel and hot melt adhesive layer integration is fitted to this As on layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the low-temperature hot melt adhesive Layer can be by thawing in conjunction with the object layer under second formation temperature.
Further, the material of the layer of silica gel and hot melt adhesive layer integration is previously cut to a specific kenel；Again will Entire kenel is fitted on the object layer.
Further, which is selected from text, trade mark, ad content, poster.
Further, the layer of silica gel and the material that the hot melt adhesive layer is integrated are integrated in after the object layer as waterproof or anti-skidding It is used.
Further, the constituent material of the object layer is cloth.
Further, the constituent material of the object layer is selected from rubber, metal, plastics.
The present invention also proposes a kind of manufacturing method for integrating silicon wafer that can be attached on object, includes the following steps: step A: it by a batch of hot melt adhesive, is melted to the first formation temperature and forms the high temperature hot melt adhesive layer of laminar kenel；And it will be another The hot melt adhesive of batch is melted to the second formation temperature and forms the low-temperature heat melting glue-line of laminar kenel, wherein second formation Temperature is lower than first formation temperature；Then the high temperature hot melt adhesive layer is combined into the low-temperature heat melting glue-line, and shape is integral Hot melt adhesive layer, wherein what is be located above is the high temperature hot melt adhesive layer, underlying is the low-temperature heat melting glue-line；Step B: by this One layer of bridging agent is coated above high temperature hot melt adhesive layer, then smears one layer of silica gel material in the top of the bridging agent；Step C: Then first formation temperature will be heated to above the hot melt adhesive layer, so that the high temperature hot melt adhesive above the hot melt adhesive layer Layer surface is melted, and melts the bridging agent being positioned above, therefore the bridging agent will guide the high temperature hot melt adhesive layer upper surface The hot melt adhesive material at place is melted and is penetrated into the silica gel material, so that the high temperature hot melt adhesive layer is in conjunction with the silica gel material； Step D: temperature is slowly lowered to room temperature, therefore the silica gel material of top will form a layer of silica gel；And in the high temperature hot melt adhesive Form an adhesive tape between layer and the layer of silica gel, the material of the adhesive tape mainly by the high temperature hot melt adhesive layer, the silica gel material, And the bridging agent mixes；So that the layer of silica gel is combined closely by the bridging agent and the hot melt adhesive layer, and formed Silicon material conformable layer with hot melt integration ability.
Further, which is polysiloxanes.
Further, the material of the hot melt adhesive layer is thermoplastic polyurethane.
Further, first formation temperature is between 120 DEG C to 200 DEG C.
Further, second formation temperature is between 60 DEG C to 150 DEG C.
Further, which is higher than 10 DEG C to 60 DEG C of second formation temperature.
Further, by the mode of silicon material conformable layer application hot melt to fit on required object, by the silicon material Conformable layer is warmed to second formation temperature, so that the low-temperature heat melting glue-line below the silicon material conformable layer is in second formation temperature Lower meeting is by melting in conjunction with the object；Wherein the object will not melt or generate unacceptable under second formation temperature Deformation, and unacceptable change can't be melted under second formation temperature or be generated to the other materials of the silicon material conformable layer Shape, therefore material will not be destroyed.
Further, which a specific mark is previously cut to attach to again on the object；Wherein should Mark is selected from text, trade mark, ad content, poster.
Further, the constituent material of the object is selected from cloth, rubber, metal, plastics.
Further, in conjunction at this after the high temperature hot melt adhesive layer and the low-temperature heat melting glue-line are respectively formed in step Hot melt adhesive layer.
Further, it is initially formed the high temperature hot melt adhesive layer in step, hot melt adhesive material is then poured in high warm It applies the change of temperature to form the low-temperature heat melting glue-line in melt layer, the hot melt adhesive layer is integrally formed.
Detailed description of the invention
Fig. 1 shows component combination diagram of the invention.
Fig. 2 shows the schematic diagram of high temperature hot melt adhesive layer and low-temperature heat melting glue-line of the invention.
Fig. 3 shows the signal that hot melt adhesive layer is formed by after high temperature hot melt adhesive layer of the invention and low-temperature heat melting glue-line combine Figure.
Fig. 4 shows and coats bridging agent above high temperature hot melt adhesive layer of the invention and smear silica gel material above the bridging agent Schematic diagram.
The schematic diagram heated above hot melt adhesive layer in Fig. 5 display present invention.
Fig. 6 shows the combination diagram of layer of silica gel of the invention, adhesive tape, high temperature hot melt adhesive layer and low-temperature heat melting glue-line.
Fig. 7 shows the process step of the invention flow chart.
Fig. 8 shows the combination diagram of layer of silica gel of the invention, hot melt adhesive layer and object layer.
Fig. 9 shows that layer of silica gel and hot melt adhesive layer of the invention are integrated in one of object layer application examples.
Figure 10 shows that layer of silica gel and hot melt adhesive layer of the invention are integrated in the another application example of object layer.
Figure 11 shows one of application of the invention embodiment.
Figure 12 shows another embodiment of application of the invention.
Detailed description of the invention:
1 silicon material conformable layer
2 objects
3 object layers
4 laminated structures
10 layer of silica gel
20 hot melt adhesive layers
21 high temperature hot melt adhesive layers
22 low-temperature heat melting glue-lines
30 bridging agents
40 adhesive tapes
200 silica gel materials
300 marks
301 kenels.
Specific embodiment
Now just structure composition of the invention, and the technical effect and advantage that can be generated cooperates attached drawing, enumerates of the invention Detailed description are as follows for one preferred embodiment.
It please refers to shown in Fig. 1 to Figure 12, shows the integration silicon wafer being attached on object of the invention, including following group Part:
One layer of silica gel 10；
One hot melt adhesive layer 20 (as shown in Figure 1), mainly includes:
One high temperature hot melt adhesive layer 21 is attached to the layer of silica gel 10 positioned at the lower section of the layer of silica gel 10, and using bridging agent.
One low-temperature heat melting glue-line 22, is attached on the lower section of the high temperature hot melt adhesive layer 21.
Wherein the high temperature hot melt adhesive layer 21 is formed by the first formation temperature heating hot melt adhesive.The low-temperature heat melting glue-line 22 by Second formation temperature heating hot melt adhesive is formed, and wherein second formation temperature is lower than first formation temperature.
An adhesive tape 40, the material master of the adhesive tape 40 are wherein formed between the high temperature hot melt adhesive layer 21 and the layer of silica gel 10 If being mixed by the high temperature hot melt adhesive layer 21, the layer of silica gel 10 and the bridging agent.
The preferred bridging agent 30 is polysiloxanes (polysiloxan) in the present invention, and the material of the hot melt adhesive layer 20 Preferably thermoplastic polyurethane (thermoplastic polyurethane).
Wherein first formation temperature is between 120 DEG C to 200 DEG C, and second formation temperature is between 60 DEG C to 150 Between DEG C.Wherein first formation temperature is higher than 10 DEG C to 60 DEG C of second formation temperature.
As shown in figure 8, the integration silicon wafer being attached on object of the invention, which also includes one, is located at the low-temperature heat melting glue-line The object layer 3 of 22 lower sections；Wherein the object layer 3 will not melt under second formation temperature or generate unacceptable deformation； Its combination is right for the mode of material application hot melt made of the layer of silica gel 10 and the hot melt adhesive layer 20 integration is fitted to this As on layer 3；The material that the layer of silica gel 10 and the hot melt adhesive layer 20 are integrated is warmed to second formation temperature, so that the Low Temperature Thermal Melt layer 22 can be combined by thawing with the object layer 3 under second formation temperature.
As shown in figure 9, it is specific wherein the layer of silica gel 10 can be previously cut to one with the material that the hot melt adhesive layer 20 is integrated Kenel 301；Entire kenel 301 is fitted on the object layer 3 again.Wherein the kenel 301 can be in text, trade mark, advertisement Appearance, poster etc..
As shown in Figure 10, after the layer of silica gel 10 and the material of the hot melt adhesive layer 20 integration can also be integrated in the object layer 3 As waterproof or anti-skidding it is used.Show that the material for integrating the layer of silica gel 10 and the hot melt adhesive layer 20 is previously cut to a spy in figure The laminated structure 4 of sizing state is attached to again on the object layer 3.
The constituent material of the preferred object layer 3 is cloth, rubber, metal, plastics etc..The better cloth is clothes On cloth.
As shown in fig. 7, the manufacturing method for integrating silicon wafer being attached on object of the invention includes the following steps:
By a batch of hot melt adhesive, it is melted to the first formation temperature and forms the high temperature hot melt adhesive layer 21 of laminar kenel.And it will Another a batch of hot melt adhesive is melted to the second formation temperature and forms the low-temperature heat melting glue-line 22 of laminar kenel (such as Fig. 2 institute Show), wherein second formation temperature is lower than first formation temperature.Then the high temperature hot melt adhesive layer 21 is combined into the low-temperature heat melting Glue-line 22, and the hot melt adhesive layer 20 (as shown in Figure 3) that shape is integral；What is be wherein located above is the high temperature hot melt adhesive layer 21, Underlying is the 22 (step 900) of low-temperature heat melting glue-line.Wherein first formation temperature is between 120 DEG C to 200 DEG C, And second formation temperature is between 60 DEG C to 150 DEG C.Wherein first formation temperature is higher than 10 DEG C of second formation temperature To 60 DEG C.
In conjunction at the hot melt adhesive after wherein the high temperature hot melt adhesive layer 21 and the low-temperature heat melting glue-line 22 can be respectively formed Layer 20, or is initially formed the high temperature hot melt adhesive layer 21, then hot melt adhesive material is poured on the high temperature hot melt adhesive layer 21 and The low-temperature heat melting glue-line 22 is formed using the change of temperature, the hot melt adhesive layer 20 is integrally formed.
Because the formation temperature of the high temperature hot melt adhesive layer 21 and the low-temperature heat melting glue-line 22 is not identical, although equally by heating Glue is formed, but because formation temperature is different, physical property is also different.The high temperature hot melt adhesive layer 21 on upper layer can be in height Melt under temperature, and the low-temperature heat melting glue-line 22 of lower layer can melt at low temperature.
One layer of bridging agent 30 is coated into the top of the high temperature hot melt adhesive layer 21, then smears one in the top of the bridging agent 30 Layer silica gel material 200, (step 902) as shown in Figure 4.The preferred bridging agent 30 is polysiloxanes (polysiloxan), and is somebody's turn to do The material of hot melt adhesive layer 20 is preferably thermoplastic polyurethane (thermoplastic polyurethane).
Then the top of the hot melt adhesive layer 20 is heated to first formation temperature (as shown in Figure 5), so that the heat 21 surface of high temperature hot melt adhesive layer of 20 top of melt layer is melted, and melts the bridging agent 30 being positioned above, therefore the bridge formation Agent 30 will guide the hot melt adhesive material at 21 upper surface of high temperature hot melt adhesive layer to melt and penetrate into the silica gel material 200, therefore So that the high temperature hot melt adhesive layer 21 is combined (step 903) with the silica gel material 200.
Temperature is slowly lowered to room temperature, therefore the silica gel material 200 of top will form a layer of silica gel 10 (such as Fig. 6 institute Show).And an adhesive tape 40 is formed between the high temperature hot melt adhesive layer 21 and the layer of silica gel 10, the material of the adhesive tape 40 is mainly It is mixed by the high temperature hot melt adhesive layer 21, the silica gel material 200 and the bridging agent 30.So that the layer of silica gel 10 passes through The bridging agent 30 and combine closely with the hot melt adhesive layer 20, and formed have hot melt integration ability 1 (step of silicon material conformable layer 904)。
In the present invention most important application be the silicon material conformable layer 1 application hot melt mode be able to fit to required for it is right As upper.Wherein the object will not melt under second formation temperature or generate unacceptable deformation.
Its mode is that the silicon material conformable layer 1 is warmed to second formation temperature, so that 1 lower section of silicon material conformable layer Low-temperature heat melting glue-line 22 can be by thawing in conjunction with the object under second formation temperature.And the silicon material conformable layer 1 Unacceptable deformation can't be melted under second formation temperature or be generated to other materials, therefore will not destroy material.
Integration in relation to above-mentioned silicon material conformable layer 1 Yu cloth, can be used in a variety of actual applications.
Wherein 1 integral cutting of silicon material conformable layer is specifically indicated 300 (as shown in figure 11) at one by an embodiment, can For text, trade mark, ad content, poster etc..Then further according to above explained application second formation temperature, so that the silicon The low-temperature heat melting glue-line 22 of 1 lower section of material conformable layer can be combined by thawing with object 2 under second formation temperature.So whole 300 (such as text, trade mark, ad content, posters) of a mark can be fitted on the object 2.The wherein preferred object 2 Constituent material is cloth, rubber, metal, plastics etc..The better cloth is the cloth on clothes.
This application examples can contribute to apply the logo trademark on such as clothes, this is the manufacture that general dress ornament is not avoided that Program.
The application of the combination of the silicon material conformable layer 1 and object 2 can also be used in other techniques in the present invention.
Wherein another embodiment by 1 integral cutting of silicon material conformable layer at a specific kenel, then further according to above stating It is bright using second formation temperature so that the low-temperature heat melting glue-line 22 of 1 lower section of silicon material conformable layer is in second formation temperature It is lower (as shown in figure 12) to be combined with object 2 by melting.Wherein the constituent material of the preferred object 2 be cloth, rubber, Metal, plastics etc..The better cloth is the cloth on clothes.It, which is acted on, is mainly waterproof or on-slip, because of silica gel Material itself has the function of waterproof and on-slip, it is possible to position appropriate in the clothes is bonded, to generate waterproof or stop Sliding effect.
Most important advantage is a hot melt adhesive layer will to be configured below silica gel, and the hot melt adhesive layer is to include high temperature in the present invention The double-layer structure of hot melt adhesive layer and low-temperature heat melting glue-line.Allow hot melt adhesive layer and silica gel knot using the high temperature hot melt adhesive layer It closes, allows the hot melt adhesive layer in conjunction with object such as cloth using the low-temperature heat melting glue-line.It can not be straight so solving silica gel Connect the technical problem in conjunction with cloth.And it is material that silica gel is used in the present invention, and institute can be largely formed by mold The mode that the various patterns needed reapply thermal transfer is transferred on cloth, and whole speed of production is very fast and at low cost.And Silica gel material property changed itself is stablized, it is necessary to just understand deformation at 250 DEG C or more, and not be thermoplastic material, so to environment It influences to be far below traditional plastifying material.Namely why national governments can receive the main original that silicon material replaces plastifying material for this Cause.
Above-mentioned detailed description is only illustrating for preferred possible embodiments of the invention, but the embodiment not to It limits the scope of the invention, all equivalence enforcements or change done without departing from technical spirit of the present invention, should all include in this In the protection scope of invention.

Claims (22)

1. one kind can be attached at the integration silicon wafer on object characterized by comprising
One layer of silica gel；
One hot melt adhesive layer, specifically includes that
One high temperature hot melt adhesive layer is attached to the layer of silica gel positioned at the lower section of the layer of silica gel, and using bridging agent；
One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；
Wherein the high temperature hot melt adhesive layer is formed by the first formation temperature heating hot melt adhesive；The low-temperature heat melting glue-line is formed by second Temperature heating hot melt adhesive is formed, and wherein second formation temperature is lower than first formation temperature.
2. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the high temperature hot melt adhesive layer with should An adhesive tape is formed between layer of silica gel, the material of the adhesive tape is mainly by the high temperature hot melt adhesive layer, the layer of silica gel and the bridge formation Agent mixes.
3. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the bridging agent is poly- silicon oxygen Alkane.
4. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the material of the hot melt adhesive layer is Thermoplastic polyurethane.
5. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that first formation temperature between Between 120 DEG C to 200 DEG C；Wherein second formation temperature is between 60 DEG C to 150 DEG C；Wherein first formation temperature is higher than 10 DEG C to 60 DEG C of second formation temperature.
6. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that this can be attached on object Integrating silicon wafer further includes an object layer being located at below the low-temperature heat melting glue-line；Wherein the object layer is under second formation temperature It will not melt or generate unacceptable deformation；
Its combination is right for the mode of material application hot melt made of the layer of silica gel and hot melt adhesive layer integration is fitted to this As on layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the low-temperature hot melt adhesive Layer can be by thawing in conjunction with the object layer under second formation temperature.
7. the integration silicon wafer on object can be attached at as claimed in claim 6, which is characterized in that by the layer of silica gel and the hot melt The material of glue-line integration is previously cut to a specific kenel；Entire kenel is fitted on the object layer again.
8. the integration silicon wafer on object can be attached at as claimed in claim 7, which is characterized in that the kenel is selected from text, quotient Mark, ad content, poster.
9. the integration silicon wafer on object can be attached at as claimed in claim 6, which is characterized in that the layer of silica gel and the hot melt adhesive The material of layer integration is integrated in after the object layer as waterproof or anti-skidding is used.
10. the integration silicon wafer being attached on object as described in claim 6 or 7 or 9, which is characterized in that the object layer Constituent material is cloth.
11. the integration silicon wafer being attached on object as described in claim 6 or 7 or 9, which is characterized in that the object layer Constituent material is selected from rubber, metal, plastics.
12. one kind can be attached at the manufacturing method for integrating silicon wafer on object, characterized in that it comprises the following steps:
Step A: it by a batch of hot melt adhesive, is melted to the first formation temperature and forms the high temperature hot melt adhesive layer of laminar kenel； And by another a batch of hot melt adhesive, it is melted to the second formation temperature and forms the low-temperature heat melting glue-line of laminar kenel, wherein should Second formation temperature is lower than first formation temperature；Then the high temperature hot melt adhesive layer is combined into the low-temperature heat melting glue-line, and is formed One whole hot melt adhesive layer, wherein what is be located above is the high temperature hot melt adhesive layer, underlying is the low-temperature heat melting glue-line；
Step B: will coat one layer of bridging agent above the high temperature hot melt adhesive layer, then smear one layer of silicon in the top of the bridging agent Glue material；
Step C: then it will be heated to first formation temperature above the hot melt adhesive layer, is made above the hot melt adhesive layer with this High temperature hot melt adhesive layer surface is melted, and melts the bridging agent being positioned above, and the high temperature will be guided to heat with this bridging agent Hot melt adhesive material at glue-line upper surface is melted and is penetrated into the silica gel material, so that the high temperature hot melt adhesive layer and the silica gel Material combines；
Step D: being slowly lowered to room temperature for temperature, will form a layer of silica gel with the silica gel material above this；And it is warmed in the height An adhesive tape is formed between melt layer and the layer of silica gel, the material of the adhesive tape is mainly by the high temperature hot melt adhesive layer, the silica gel Material and the bridging agent mix；With this layer of silica gel is combined closely by the bridging agent and the hot melt adhesive layer, and Form the silicon material conformable layer with hot melt integration ability.
13. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that the bridge formation Agent is polysiloxanes.
14. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that the hot melt The material of glue-line is thermoplastic polyurethane.
15. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that this first Formation temperature is between 120 DEG C to 200 DEG C.
16. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that this second Formation temperature is between 60 DEG C to 150 DEG C.
17. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that this first Formation temperature is higher than 10 DEG C to 60 DEG C of second formation temperature.
18. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that by the silicon The mode of material conformable layer application hot melt is warmed to the second formation temperature to fit on required object, by the silicon material conformable layer Degree, so that the low-temperature heat melting glue-line below the silicon material conformable layer can pass through thawing and the object knot under second formation temperature It closes；Wherein the object will not melt under second formation temperature or generate unacceptable deformation, and the silicon material conformable layer Unacceptable deformation can't be melted under second formation temperature or be generated to other materials, therefore will not destroy material.
19. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 18, which is characterized in that by the silicon Material conformable layer is previously cut to a specific mark and is attached on the object again；Wherein the mark is in text, trade mark, advertisement Hold, poster.
20. the manufacturing method for integrating silicon wafer being attached on object as described in claim 18 or 19, which is characterized in that should The constituent material of object is selected from cloth, rubber, metal, plastics.
21. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that in step In conjunction at the hot melt adhesive layer after the high temperature hot melt adhesive layer and the low-temperature heat melting glue-line are respectively formed in A.
22. the manufacturing method for integrating silicon wafer on object can be attached at as claimed in claim 12, which is characterized in that in step It is initially formed the high temperature hot melt adhesive layer in A, then hot melt adhesive material is poured on the high temperature hot melt adhesive layer and applies changing for temperature It is deformed into the low-temperature heat melting glue-line, the hot melt adhesive layer is integrally formed.
CN201810177675.1A 2018-03-05 2018-03-05 Integration silicon wafer and its manufacturing method that can be attached on object Withdrawn CN110229635A (en)

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Publication number Priority date Publication date Assignee Title
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KR101087949B1 (en) * 2010-10-28 2011-11-28 박희대 Method of manufacturing multi-layer sheets
CN104077958A (en) * 2014-05-23 2014-10-01 晋江市深沪键升印刷有限公司 Heat transfer silica gel trademark sign, forming technique and forming device
CN106987210A (en) * 2017-05-02 2017-07-28 周红梅 It is a kind of to improve silica gel and the method for PUR cohesive force
CN107053571A (en) * 2017-05-02 2017-08-18 周红梅 A kind of silica gel spike of many material layer structures is integrally formed molding attaching process
US20170349792A1 (en) * 2014-12-19 2017-12-07 Kunshan Tianyang Hot Melt Adhesive Co., Ltd. Composite hot-melt adhesive net film and manufacturing process thereof
CN208485840U (en) * 2018-03-05 2019-02-12 张文耀 The integration silicon wafer that can be attached on object

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101429413A (en) * 2008-11-18 2009-05-13 广州市鹿山化工材料有限公司 Double-layer composite hot melt adhesive film for bonding metal and plastic
KR101087949B1 (en) * 2010-10-28 2011-11-28 박희대 Method of manufacturing multi-layer sheets
CN104077958A (en) * 2014-05-23 2014-10-01 晋江市深沪键升印刷有限公司 Heat transfer silica gel trademark sign, forming technique and forming device
US20170349792A1 (en) * 2014-12-19 2017-12-07 Kunshan Tianyang Hot Melt Adhesive Co., Ltd. Composite hot-melt adhesive net film and manufacturing process thereof
CN106987210A (en) * 2017-05-02 2017-07-28 周红梅 It is a kind of to improve silica gel and the method for PUR cohesive force
CN107053571A (en) * 2017-05-02 2017-08-18 周红梅 A kind of silica gel spike of many material layer structures is integrally formed molding attaching process
CN208485840U (en) * 2018-03-05 2019-02-12 张文耀 The integration silicon wafer that can be attached on object

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Application publication date: 20190913