CN208485840U - The integration silicon wafer that can be attached on object - Google Patents
The integration silicon wafer that can be attached on object Download PDFInfo
- Publication number
- CN208485840U CN208485840U CN201820298204.1U CN201820298204U CN208485840U CN 208485840 U CN208485840 U CN 208485840U CN 201820298204 U CN201820298204 U CN 201820298204U CN 208485840 U CN208485840 U CN 208485840U
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- layer
- hot melt
- melt adhesive
- attached
- silica gel
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
A kind of integration silicon wafer being attached on object and its manufacturing method, the integration silicon wafer include a layer of silica gel；One hot melt adhesive layer mainly includes a high temperature hot melt adhesive layer, is attached to the layer of silica gel positioned at the lower section of the layer of silica gel, and using bridging agent；One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；Wherein the high temperature hot melt adhesive layer is formed by the first formation temperature heating hot melt adhesive；The low-temperature heat melting glue-line is formed by the second formation temperature heating hot melt adhesive, and wherein second formation temperature is lower than first formation temperature.Wherein the integration silicon wafer further includes an object layer being located at below the low-temperature heat melting glue-line；Its combination is to fit to the mode of material application hot melt made of above-mentioned layer of silica gel and the hot melt adhesive layer integration on the object layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the low-temperature heat melting glue-line can be by thawing in conjunction with the object layer under second formation temperature.
Description
Technical field
The utility model relates to silica gel structure, especially a kind of integration silicon wafer and its manufacturer that can be attached on object
Method.
Background technique
The patterns such as trade mark or poster are traditionally formed on clothes, required for being mainly cut into using plastifying material
Kenel, then by the plastifying material application hot melt adhesive and garments.The degree of melting of general plastifying material is low, so higher
At a temperature of, it is most likely that plasticiser and halogen compounds are volatilized, the plasticiser and halogen compounds of these volatilizations can pass through
The contact of respiratory apparatus or skin and go deep into human body, therefore influence user health.And clothes must be worn for people,
It and is the contact to form nearly body.So when doing trade mark or poster using plastifying material, it will so that wearer is by the modeling
Change the infection of material.And plastifying material is also easy to become fragile, so influencing service life.
In view of above-mentioned the shortcomings that using plastifying material, forbid answering on clothes so European Union or other advanced countries have discussed and formulated
Trade mark or poster are formed with plastifying material.Silica gel is due to stability and thermosetting property with height, it is necessary at very high temperatures
It is possible to deformation or destroys by fire, so being made into trade mark using silica gel or poster becomes a kind of mode for that can replace.
Using the mode that silica gel material forms trade mark or poster using the liquid-state silicon gel of various colors, then penetrated using micro
Mode out, trade mark required for being formed on heat-resisting material or pattern, under being cut out after heated baking, then with cloth to cloth
The mode of sewing or fitting is fixed on dress ornament surface.The disadvantage of such mode maximum be can not largely manufacture using mold, and
Production technology is slow, relatively also influences yield and cost and required artificial.
If silica gel is directly attached on clothes, maximum problem is because silica gel can must just be consolidated at high temperature
Change, and this high temperature is not that cloth can bear, so this high-temperature technology will destroy cloth, so can not be using silica gel directly in cloth
The various patterns such as trade mark or poster are formed on material.
Therefore the utility model is wished based on proposing the brand-new material by silicon of one kind, and can be with shape on cloth or other objects
At the mode of trade mark or poster, to solve the problems, such as to meet in the above-mentioned prior art.
Utility model content
So the purpose of this utility model is to solve the problems, such as in above-mentioned well-known technique, propose that one kind can in the utility model
The integration silicon wafer being attached on object will configure a hot melt adhesive layer below silica gel, and it includes high temperature hot melt adhesive that the hot melt adhesive layer, which is,
The double-layer structure of layer and low-temperature heat melting glue-line.Allow hot melt adhesive layer in conjunction with silica gel using the high temperature hot melt adhesive layer, applies
The low-temperature heat melting glue-line allows the hot melt adhesive layer in conjunction with object such as cloth.It can not directly and cloth so solving silica gel
In conjunction with technical problem.And it is material that silica gel is used in the utility model, required for can largely being formed by mold
Various patterns reapply the mode of thermal transfer and be transferred on cloth, whole speed of production is very fast and at low cost.And silica gel
Material property changed itself is stablized, it is necessary to just understand deformation at 250 DEG C or more, and not be thermoplastic material, so the influence to environment
Far below traditional plastifying material.Namely why national governments can receive the main reason for silicon material replaces plastifying material for this.
A kind of integration silicon wafer that can be attached on object, including a silica gel are proposed in the utility model in order to achieve the above objectives
Layer；One hot melt adhesive layer specifically includes that a high temperature hot melt adhesive layer, is attached to this positioned at the lower section of the layer of silica gel, and using bridging agent
Layer of silica gel；One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；Wherein the high temperature hot melt adhesive layer is formed by first
Temperature heating hot melt adhesive is formed；The low-temperature heat melting glue-line by the second formation temperature heating hot melt adhesive formed, wherein this second
Formation temperature is lower than first formation temperature.
Further, an adhesive tape is formed between the high temperature hot melt adhesive layer and the layer of silica gel, the material of the adhesive tape is main
It is to be mixed by the high temperature hot melt adhesive layer, the layer of silica gel and the bridging agent.
Further, which is polysiloxanes.
Further, the material of the hot melt adhesive layer is thermoplastic polyurethane.
Further, first formation temperature is between 120 DEG C to 200 DEG C.
Further, second formation temperature is between 60 DEG C to 150 DEG C.
Further, which is higher than 10 DEG C to 60 DEG C of second formation temperature.
Further, it further includes an object being located at below the low-temperature heat melting glue-line that this, which can be attached at the silicon wafer of integrating on object,
Part layer；Wherein the object layer will not melt under second formation temperature or generate unacceptable deformation；
Its combination is to fit to the layer of silica gel and the mode of material application hot melt made of hot melt adhesive layer integration
On the object layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the Low Temperature Thermal
Melt layer can be by thawing in conjunction with the object layer under second formation temperature.
Further, the material of the layer of silica gel and hot melt adhesive layer integration is previously cut to a specific kenel；Again will
Entire kenel is fitted on the object layer.
Further, which is selected from text, trade mark, ad content, poster.
Further, the layer of silica gel and the material that the hot melt adhesive layer is integrated are integrated in after the object layer as waterproof or anti-skidding
It is used.
Further, the constituent material of the object layer is the cloth on clothes.
Further, the constituent material of the object layer is cloth.
Further, the constituent material of the object layer is selected from rubber, metal, plastic cement.
Detailed description of the invention
Fig. 1 shows the component combination diagram of the utility model.
Fig. 2 shows high temperature hot melt adhesive layer-low-temperature heat melting glue-line schematic diagram of the utility model.
Fig. 3, which is shown, is formed by hot melt adhesive layer after the high temperature hot melt adhesive layer of the utility model and low-temperature heat melting glue-line combine
Schematic diagram.
Fig. 4 shows that the high temperature hot melt adhesive layer top of the utility model coats bridging agent and smears silica gel above the bridging agent
The schematic diagram of material.
Fig. 5 shows the schematic diagram heated above hot melt adhesive layer in the utility model.
Fig. 6 shows the combination signal of the layer of silica gel, adhesive tape, high temperature hot melt adhesive layer and low-temperature heat melting glue-line of the utility model
Figure.
Fig. 7 shows the processing step flow chart of the utility model.
Fig. 8 shows the layer of silica gel of the utility model, the combination diagram of hot melt adhesive layer and object layer.
Fig. 9 shows that the layer of silica gel of the utility model and hot melt adhesive layer are integrated in one of object layer application examples.
Figure 10 shows that the layer of silica gel of the utility model and hot melt adhesive layer are integrated in the another application example of object layer.
Figure 11 shows one of the application of the utility model embodiment.
Figure 12 shows another embodiment of the application of the utility model.
Detailed description of the invention:
1 silicon material conformable layer
2 objects
3 object layers
4 laminated structures
10 layer of silica gel
20 hot melt adhesive layers
21 high temperature hot melt adhesive layers
22 low-temperature heat melting glue-lines
30 bridging agents
40 adhesive tapes
200 silica gel materials
300 marks
301 kenels.
Specific embodiment
Now with regard to the structure composition of the utility model, and the technical effect and advantage that can be generated, cooperate attached drawing, enumerates this reality
With one of novel preferred embodiment, detailed description are as follows.
It please refers to shown in Fig. 1 to Figure 12, shows the integration silicon wafer being attached on object of the utility model, including following
Component:
One layer of silica gel 10；
One hot melt adhesive layer 20 (as shown in Figure 1), specifically includes that
One high temperature hot melt adhesive layer 21 is attached to the layer of silica gel 10 positioned at the lower section of the layer of silica gel 10, and using bridging agent.
One low-temperature heat melting glue-line 22, is attached on the lower section of the high temperature hot melt adhesive layer 21.
Wherein the high temperature hot melt adhesive layer 21 is formed by the first formation temperature heating hot melt adhesive.The low-temperature heat melting glue-line 22 by
Second formation temperature heating hot melt adhesive is formed, and wherein second formation temperature is lower than first formation temperature.
An adhesive tape 40, the material master of the adhesive tape 40 are wherein formed between the high temperature hot melt adhesive layer 21 and the layer of silica gel 10
If being mixed by the high temperature hot melt adhesive layer 21, the layer of silica gel 10 and the bridging agent.
The preferred bridging agent 30 is polysiloxanes (polysiloxan) in the utility model, and the hot melt adhesive layer 20
Material is preferably thermoplastic polyurethane (thermoplastic polyurethane).
Wherein first formation temperature is between 120 DEG C to 200 DEG C, and second formation temperature is between 60 DEG C to 150
Between DEG C.Wherein first formation temperature is higher than 10 DEG C to 60 DEG C of second formation temperature.
As shown in figure 8, the integration silicon wafer being attached on object of the utility model further includes one positioned at the low-temperature heat melting
The object layer 3 of 22 lower section of glue-line；Wherein the object layer 3 will not melt under second formation temperature or generate unacceptable change
Shape；Its combination is that the mode of material application hot melt made of the layer of silica gel 10 and the hot melt adhesive layer 20 integration is fitted to this
On object layer 3；The material that the layer of silica gel 10 and the hot melt adhesive layer 20 are integrated is warmed to second formation temperature, so that the low temperature
Hot melt adhesive layer 22 can be combined by thawing with the object layer 3 under second formation temperature.
As shown in figure 9, it is specific wherein the layer of silica gel 10 can be previously cut to one with the material that the hot melt adhesive layer 20 is integrated
Kenel 301；Entire kenel 301 is fitted on the object layer 3 again.Wherein the kenel 301 can be in text, trade mark, advertisement
Appearance, poster etc..
As shown in Figure 10, after the layer of silica gel 10 and the material of the hot melt adhesive layer 20 integration can also be integrated in the object layer 3
As waterproof or anti-skidding it is used.Show that the material for integrating the layer of silica gel 10 and the hot melt adhesive layer 20 is previously cut to a spy in figure
The laminated structure 4 of sizing state is attached to again on the object layer 3.
The constituent material of the preferred object layer 3 is cloth, rubber, metal, plastics etc..The better cloth is clothes
On cloth.
As shown in fig. 7, the manufacturing method for integrating silicon wafer being attached on object of the utility model includes the following steps:
By a batch of hot melt adhesive, it is melted to the first formation temperature and forms the high temperature hot melt adhesive layer 21 of laminar kenel.
And by another a batch of hot melt adhesive, it is melted to the second formation temperature and forms 22 (such as Fig. 2 of low-temperature heat melting glue-line of laminar kenel
It is shown), wherein second formation temperature is lower than first formation temperature.Then the high temperature hot melt adhesive layer 21 is combined into the Low Temperature Thermal
Melt layer 22, and the hot melt adhesive layer 20 (as shown in Figure 3) that shape is integral；What is be wherein located above is the high temperature hot melt adhesive layer
21, underlying is the 22 (step 900) of low-temperature heat melting glue-line.Wherein first formation temperature between 120 DEG C to 200 DEG C it
Between, and second formation temperature is between 60 DEG C to 150 DEG C.Wherein first formation temperature is higher than second formation temperature 10
DEG C to 60 DEG C.
In conjunction at the hot melt adhesive after wherein the high temperature hot melt adhesive layer 21 and the low-temperature heat melting glue-line 22 can be respectively formed
Layer 20, or is initially formed the high temperature hot melt adhesive layer 21, then hot melt adhesive material is poured on the high temperature hot melt adhesive layer 21 and
The low-temperature heat melting glue-line 22 is formed using the change of temperature, the hot melt adhesive layer 20 is integrally formed.
Because the formation temperature of the high temperature hot melt adhesive layer 21 and the low-temperature heat melting glue-line 22 is not identical, although equally by heating
Glue is formed, but because formation temperature is different, physical property is also different.The high temperature hot melt adhesive layer 21 on upper layer can be in height
Melt under temperature, and the low-temperature heat melting glue-line 22 of lower layer can melt at low temperature.
One layer of bridging agent 30 is coated into the top of the high temperature hot melt adhesive layer 21, then smears one in the top of the bridging agent 30
Layer silica gel material 200, (step 902) as shown in Figure 4.The preferred bridging agent 30 is polysiloxanes (polysiloxan), and is somebody's turn to do
The material of hot melt adhesive layer 20 is preferably thermoplastic polyurethane (thermoplastic polyurethane).
Then the top of the hot melt adhesive layer 20 is heated to first formation temperature (as shown in Figure 5), so that the heat
21 surface of high temperature hot melt adhesive layer of 20 top of melt layer is melted, and melts the bridging agent 30 being positioned above, therefore the bridge formation
Agent 30 will guide the hot melt adhesive material at 21 upper surface of high temperature hot melt adhesive layer to melt and penetrate into the silica gel material 200, therefore
So that the high temperature hot melt adhesive layer 21 is combined (step 903) with the silica gel material 200.
Temperature is slowly lowered to room temperature, therefore the silica gel material 200 of top will form a layer of silica gel 10 (such as Fig. 6 institute
Show).And an adhesive tape 40 is formed between the high temperature hot melt adhesive layer 21 and the layer of silica gel 10, the material of the adhesive tape 40 is mainly
It is mixed by the high temperature hot melt adhesive layer 21, the silica gel material 200 and the bridging agent 30.So that the layer of silica gel 10 passes through
The bridging agent 30 and combine closely with the hot melt adhesive layer 20, and formed have hot melt integration ability 1 (step of silicon material conformable layer
904)。
Most important application is that the mode of the silicon material conformable layer 1 application hot melt is able to required for fitting in the utility model
Object on.Wherein the object will not melt under second formation temperature or generate unacceptable deformation.
Its mode is that the silicon material conformable layer 1 is warmed to second formation temperature, so that 1 lower section of silicon material conformable layer
Low-temperature heat melting glue-line 22 can be by thawing in conjunction with the object under second formation temperature.And the silicon material conformable layer 1
Unacceptable deformation can't be melted under second formation temperature or be generated to other materials, therefore will not destroy material.
Integration in relation to above-mentioned silicon material conformable layer 1 Yu cloth, can be used in a variety of actual applications.
Wherein 1 integral cutting of silicon material conformable layer is specifically indicated 300 (as shown in figure 11) at one by an embodiment, can
For text, trade mark, ad content, poster etc..Then further according to above explained application second formation temperature, so that the silicon
The low-temperature heat melting glue-line 22 of 1 lower section of material conformable layer can be combined by thawing with object 2 under second formation temperature.So whole
300 (such as text, trade mark, ad content, posters) of a mark can be fitted on the object 2.The wherein preferred object 2
Constituent material is cloth, rubber, metal, plastics etc..The better cloth is the cloth on clothes.
This application examples can contribute to apply the logo trademark on such as clothes, this is the manufacture that general dress ornament is not avoided that
Program.
The application of the combination of the silicon material conformable layer 1 and object 2 can also be used in other techniques in the utility model
In.
Wherein another embodiment by 1 integral cutting of silicon material conformable layer at a specific kenel, then further according to above stating
It is bright using second formation temperature so that the low-temperature heat melting glue-line 22 of 1 lower section of silicon material conformable layer is in second formation temperature
It is lower (as shown in figure 12) to be combined with object 2 by melting.Wherein the constituent material of the preferred object 2 be cloth, rubber,
Metal, plastics etc..The better cloth is the cloth on clothes.It, which is acted on, is mainly waterproof or on-slip, because of silica gel
Material itself has the function of waterproof and on-slip, it is possible to position appropriate in the clothes is bonded, to generate waterproof or stop
Sliding effect.
Most important advantage is a hot melt adhesive layer will to be configured below silica gel, and the hot melt adhesive layer is to include in the utility model
The double-layer structure of high temperature hot melt adhesive layer and low-temperature heat melting glue-line.Allow hot melt adhesive layer and silica gel using the high temperature hot melt adhesive layer
In conjunction with allowing the hot melt adhesive layer in conjunction with object such as cloth using the low-temperature heat melting glue-line.It can not so solving silica gel
Technical problem directly in conjunction with cloth.And it is material that silica gel is used in the utility model, it can be a large amount of by mold
Various patterns required for being formed reapply the mode of thermal transfer and are transferred on cloth, and whole speed of production is very fast and cost
It is low.And silica gel material property changed itself is stablized, it is necessary to just understand deformation at 250 DEG C or more, and not be thermoplastic material, so right
The influence of environment is far below traditional plastifying material.Namely why national governments can receive silicon material substitution plastifying material for this
Main cause.
Above-mentioned detailed description is only illustrating for the preferred possible embodiments of the utility model, but the embodiment is not
To limit the protection scope of the utility model, all equivalence enforcements or change done without departing from the utility model intention should all
It is included in the protection scope of the utility model.
Claims (12)
1. one kind can be attached at the integration silicon wafer on object characterized by comprising
One layer of silica gel；
One hot melt adhesive layer, specifically includes that
One high temperature hot melt adhesive layer is attached to the layer of silica gel positioned at the lower section of the layer of silica gel, and using bridging agent；
One low-temperature heat melting glue-line, is attached on the lower section of the high temperature hot melt adhesive layer；
Wherein the high temperature hot melt adhesive layer is formed by the first formation temperature heating hot melt adhesive；The low-temperature heat melting glue-line is formed by second
Temperature heating hot melt adhesive is formed, and wherein second formation temperature is lower than first formation temperature.
2. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the high temperature hot melt adhesive layer with should
An adhesive tape is formed between layer of silica gel.
3. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the bridging agent is poly- silicon oxygen
Alkane.
4. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that the material of the hot melt adhesive layer is
Thermoplastic polyurethane.
5. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that first formation temperature between
Between 120 DEG C to 200 DEG C.
6. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that second formation temperature between
Between 60 DEG C to 150 DEG C.
7. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that first formation temperature is higher than
10 DEG C to 60 DEG C of second formation temperature.
8. the integration silicon wafer on object can be attached at as described in claim 1, which is characterized in that this can be attached on object
Integrating silicon wafer further includes an object layer being located at below the low-temperature heat melting glue-line；Wherein the object layer is under second formation temperature
It will not melt or generate unacceptable deformation；
Its combination is right for the mode of material application hot melt made of the layer of silica gel and hot melt adhesive layer integration is fitted to this
As on layer；The material of the layer of silica gel and hot melt adhesive layer integration is warmed to second formation temperature, so that the low-temperature hot melt adhesive
Layer can be by thawing in conjunction with the object layer under second formation temperature.
9. the integration silicon wafer on object can be attached at as claimed in claim 8, which is characterized in that the layer of silica gel and the hot melt adhesive
The material of layer integration is integrated in after the object layer as waterproof or anti-skidding is used.
10. the integration silicon wafer on object can be attached at as claimed in claim 8 or 9, which is characterized in that the composition of the object layer
Material is the cloth on clothes.
11. the integration silicon wafer on object can be attached at as claimed in claim 8 or 9, which is characterized in that the composition of the object layer
Material is cloth.
12. the integration silicon wafer on object can be attached at as claimed in claim 8 or 9, which is characterized in that the composition of the object layer
Material is selected from rubber, metal, plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820298204.1U CN208485840U (en) | 2018-03-05 | 2018-03-05 | The integration silicon wafer that can be attached on object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820298204.1U CN208485840U (en) | 2018-03-05 | 2018-03-05 | The integration silicon wafer that can be attached on object |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208485840U true CN208485840U (en) | 2019-02-12 |
Family
ID=65254774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820298204.1U Expired - Fee Related CN208485840U (en) | 2018-03-05 | 2018-03-05 | The integration silicon wafer that can be attached on object |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208485840U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229635A (en) * | 2018-03-05 | 2019-09-13 | 张文耀 | Integration silicon wafer and its manufacturing method that can be attached on object |
-
2018
- 2018-03-05 CN CN201820298204.1U patent/CN208485840U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229635A (en) * | 2018-03-05 | 2019-09-13 | 张文耀 | Integration silicon wafer and its manufacturing method that can be attached on object |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 |