CN107053571A - A kind of silica gel spike of many material layer structures is integrally formed molding attaching process - Google Patents
A kind of silica gel spike of many material layer structures is integrally formed molding attaching process Download PDFInfo
- Publication number
- CN107053571A CN107053571A CN201710302243.4A CN201710302243A CN107053571A CN 107053571 A CN107053571 A CN 107053571A CN 201710302243 A CN201710302243 A CN 201710302243A CN 107053571 A CN107053571 A CN 107053571A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- liquid
- half module
- coupling agent
- spike
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Molding attaching process is integrally formed the invention discloses a kind of silica gel spike of many material layer structures, including liquid hot melt adhesive filling step, coupling agent spraying process, baking step, layer of silica gel forming step and compression molding step, the technique of the present invention is simple, process costs are low, it is easy to implement, producing obtained silica gel spike is used to directly be pasted and fixed on after fabric face in the way of hot pressing, silica gel spike dimensional accuracy is high, dimensional stability is high, neat in edge and without tiny fracture port, and in bulk article, clothes are pasted in silica gel spike hot pressing, footwear, socks, adhesion firmness is high after the surface of the various fabrics such as cap, by repeatedly washing, pull etc. and to be not easy to come off, in the high temperature washing test of European Union's ecological textile and label testing standard, the expulsion rate of silica gel spike is 0.
Description
Technical field
The present invention relates to sheet material attaching process technical field, more particularly, to a kind of silica gel spike one of many material layer structures
Body formed molding attaching process.
Background technology
In the prior art, the surface of the various fabrics such as clothes, footwear, socks, cap is fixed with various spikes, and spike includes having
The various decoration sheets such as variously-shaped trade mark, word, mark and pattern, traditional fixing means is will decorations by processing of sewing
Piece is fixed on fabric face.
Partly use hot pressing attaching process instead at present and spike is fixed on fabric face, and spike is typically from the hot melt piece such as PU
Material is made, still, and PU materials are not what is be perfectly safe for human body, in terms of environmental protection and to the health of human body, PU materials
Technical requirements can not be fully achieved, silica gel is very safe for human body, therefore, now produces a kind of new technology, first will
Silica gel is fitted on a thin layer of PUR.
Current existing silica gel mainly has two kinds with PUR attaching process：One is printing；Another is by physical aspect
Sheet PUR and silica gel compression molding for solid, but two kinds of techniques have significant limitation above, are doing thicker product
When, if to be printed many times using typography, and adhesive fastness cannot be guaranteed, if using physical aspect for solid
Sheet PUR and silica gel compression molding, product is difficult to cut to reach design shape.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the invention to provide a kind of silica gel spike one of many material layer structures
Body formed molding attaching process, technique is simple, and process costs are low, it is easy to implement, and obtained silica gel spike is in hot pressing in fabric table
Behind face, cohesive force between layer of silica gel and hot melt adhesive layer is improved, so that there is extremely strong cohesive force between silica gel spike and fabric,
And firm pasting degree is high, it is not easy to come off by repeatedly washing, pullling etc..
In view of the deficienciess of the prior art, it is a further object of the present invention to provide a kind of silica gel of many material layer structures decorations
Piece is integrally formed molding attaching process, for produce environmental protection and to human body it is healthy it is harmless, can mold it is various careful
The silica gel spike of the shapes such as variously-shaped trade mark, word, mark and pattern, dimensional accuracy is high, and dimensional stability is high, and edge is whole
Together and without tiny fracture port.
To achieve these goals, the technical solution adopted in the present invention is：A kind of silica gel spike of many material layer structures
Molding attaching process is integrally formed, is comprised the following steps,
Liquid hot melt adhesive filling step, fills physical aspect to liquid hot melt adhesive fill area and is heated for the liquid of liquid form
Glue, obtains the liquid hot melt adhesive layer that physical aspect is liquid form；
Coupling agent spraying process, be to the surface even application physics form of liquid hot melt adhesive layer by wet spray technique
The liquid coupling agent of liquid form, in liquid hot melt adhesive layer surface formation one liquid coupling oxidant layer, so that in the mould of the first half module
Face forms the PUR coupling agent composite bed that an at least physical aspect is liquid form；
Baking step, dries PUR coupling agent composite bed, makes the PUR coupling agent after its primary solidification, primary solidification
The physical aspect of composite bed is changed into semi liquid state, newborn state, semisolid or close to solid forms；
Layer of silica gel forming step, is liquid form or the silicon of semi-solid form to the die face filling physical aspect of the second half module
Glue simultaneously forms the layer of silica gel that at least one layer of physical aspect is liquid or semi-solid form in its die face；
Compression molding step, by the first half module and the second half module matched moulds, is subsequently placed in clapper die spotting press pressurized, heated, will be tentatively solid
PUR coupling agent composite bed and layer of silica gel compression molding after change；
Obtained after finished product, die sinking at least one have multiple material layer structures, integrally formed physical aspect be solid shape
The silica gel spike of state, it is to paste to be fixed on fabric face in the way of direct hot pressing is in fabric face.
In further technical scheme, first half module and the second half module matched moulds coordinate, the first half module and described
The die face that second half module is closed is respectively arranged with the corresponding die cavity for being used to be molded silica gel spike at least described in one；
In the liquid hot melt adhesive filling step, to the mode of liquid hot melt adhesive fill area filling liquid PUR from heat
Melten gel instillation process or hot melt glue point note technique；
In the layer of silica gel forming step, select and irrigate to the mode of the cavity filling liquid-state silicon gel of the die face of the second half module
Technique or point note technique, select to the mode of the cavity filling semisolid silica gel of the die face of the second half module and tamp technique.
In further technical scheme, in the coupling agent spraying process, make between liquid hot melt adhesive and liquid coupling agent
Preliminary coupling reaction and micro-glue connection reaction are produced in a liquid state；
In the baking step, each first half module of the die face filled with PUR coupling agent composite bed is delivered to respectively again
Baking oven or continuous tunnel furnace, drying temperature are 180~200 DEG C, and drying to aridity is 80~90%；
In the compression molding step, the first half module and the second half module are heated simultaneously by clapper die spotting press, to the first half module
Heating-up temperature be 150~200 DEG C, be 130~150 DEG C to the heating-up temperature of the second half module, clamp time is 30~100 seconds.
In further technical scheme, in the coupling agent spraying process, from epoxide resin AB glue, acrylate AB
At least one of glue, silica gel AB glue and polyurethane adhesive are used as coupling agent.
It is first uniform in the silica gel that physical aspect is liquid form or semi-solid form in further technical scheme
The coupling agent that physical aspect is liquid form is mixed, then by the die face of silicone filler to the second half module, coupling agent selects epoxy
At least one of Resin A B glue, acrylate AB glue, silica gel AB glue and polyurethane adhesive are used as coupling agent.
The invention has the advantages that compared with the prior art,：The present invention is used to produce environmental protection and to the healthy nothing of human body
Silica gel spike harmful, with shapes such as various careful variously-shaped trade mark, word, mark and patterns, including it is linked to be one
Body or independent separated various small characters and fine pattern, and set by once molding formed technique by shaping
The silica gel spike of shape and pattern, is not required to progress and the following process such as cuts, and the dimensional accuracy of silica gel spike is high, during batch production
Dimensional stability between each product is high, neat in edge and without tiny fracture port.
In addition, the technique of the present invention is simple, process costs are low, it is easy to implement, and improve between layer of silica gel and hot melt adhesive layer
Cohesive force, has extremely strong cohesive force, between hot melt adhesive layer and fabric face between the layer of silica gel and hot melt adhesive layer of silica gel spike
Also there is extremely strong cohesive force, the adhesion firmness between silica gel spike and duty thing surface is high；Produce obtained silica gel spike
Directly pasted in the way of the viscous pressure of hot pressing and be fixed on fabric face, and clothes, footwear, socks, cap are pasted in silica gel spike hot pressing
After surface etc. various fabrics, it is not easy to come off by repeatedly washing, pullling etc.；In bulk article, in European Union, ecology is spun
In the high temperature washing test of fabric and label testing standard, the expulsion rate of silica gel spike is 0.
Embodiment
As described below is only presently preferred embodiments of the present invention, is not intended to limit the scope of the present invention.
A kind of silica gel spike of many material layer structures is integrally formed molding attaching process, comprises the following steps,
Liquid hot melt adhesive filling step, fills physical aspect to liquid hot melt adhesive fill area and is heated for the liquid of liquid form
Glue, obtains the liquid hot melt adhesive layer that physical aspect is liquid form；To the side of liquid hot melt adhesive fill area filling liquid PUR
Formula is from PUR instillation process or hot melt glue point note technique.
Coupling agent spraying process, be to the surface even application physics form of liquid hot melt adhesive layer by wet spray technique
The liquid coupling agent of liquid form, in liquid hot melt adhesive layer surface formation one liquid coupling oxidant layer, so that in the mould of the first half module
Face forms the PUR coupling agent composite bed that an at least physical aspect is liquid form, the thickness of liquid coupling oxidant layer for 0.01~
0.05mm；5~30 minutes are stood after spraying, makes to produce in a liquid state tentatively occasionally between liquid hot melt adhesive and liquid coupling agent
Close reaction and micro-glue connection reaction.Wherein, in coupling agent spraying process, from epoxide resin AB glue, acrylate AB glue, silica gel AB
At least one of glue and polyurethane adhesive are used as coupling agent.
Baking step, dries PUR coupling agent composite bed, makes the PUR coupling agent after its primary solidification, primary solidification
The physical aspect of composite bed is changed into semi liquid state, newborn state, semisolid or close to solid forms；Specifically, by die face filled with heat
Each first half module of melten gel coupling agent composite bed is delivered to baking oven or continuous tunnel furnace respectively again, and drying temperature is 180~200 DEG C, is dried
It is 80~90% to do to aridity
Layer of silica gel forming step, to the die face filling physical aspect of the second half module for the liquid-state silicon gel of liquid form and at it
Die face forms the layer of silica gel that at least one layer of physical aspect is liquid form, or is to the die face filling physical aspect of the second half module
The silica gel of semi-solid form simultaneously forms the layer of silica gel that at least one layer of physical aspect is semi-solid form in its die face；To the second half module
Die face cavity filling liquid-state silicon gel mode from instillation process or point note technique, filled out to the die cavity of the die face of the second half module
Fill the mode of semisolid silica gel from tamping technique, by physical aspect for semi-solid form silica gel extrusion packing in the second half module
Die face die cavity in.
It is first liquid form or semi-solid shape in physical aspect before layer of silica gel forming step in preferred embodiment
Homogeneous mixture reason form is the coupling agent of liquid form in the silica gel of state, then by the die face of silicone filler to the second half module
In, coupling agent can select one-component coupling agent or two-component coupling agent, for example, coupling agent selects epoxide resin AB glue, propylene
At least one of acid esters AB glue, silica gel AB glue and polyurethane adhesive are used as coupling agent.
Compression molding step, by the first half module and the second half module matched moulds, is subsequently placed in clapper die spotting press pressurized, heated, will be tentatively solid
PUR coupling agent composite bed and layer of silica gel compression molding after change；First half module and the second half module matched moulds coordinate,
The die face that first half module and second half module are closed, which is respectively arranged with, corresponding to be used to be molded silica gel spike at least described in one
Die cavity, specifically, heated by clapper die spotting press to the first half module and the second half module simultaneously, the heating-up temperature to the first half module is 150
~200 DEG C, the heating-up temperature to the second half module is 130~150 DEG C, and clamp time is 30~100 seconds.
Obtained after finished product, die sinking at least one have multiple material layer structures, integrally formed physical aspect be solid shape
The silica gel spike of state, it is to paste to be fixed on fabric face in the way of direct hot pressing is in fabric face.
Above content is only presently preferred embodiments of the present invention, for one of ordinary skill in the art, according to the present invention's
Thought, will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Limitation.
Claims (5)
1. a kind of silica gel spike of many material layer structures is integrally formed molding attaching process, it is characterised in that：Comprise the following steps,
Liquid hot melt adhesive filling step, the liquid hot melt adhesive that physical aspect is liquid form is filled to liquid hot melt adhesive fill area,
Obtain the liquid hot melt adhesive layer that physical aspect is liquid form；
Coupling agent spraying process, by wet spray technique to liquid hot melt adhesive layer surface even application physics form be liquid
The liquid coupling agent of form, in liquid hot melt adhesive layer surface formation one liquid coupling oxidant layer, so that in the die face shape of the first half module
Into the PUR coupling agent composite bed that an at least physical aspect is liquid form；
Baking step, dries PUR coupling agent composite bed, is combined the PUR coupling agent after its primary solidification, primary solidification
The physical aspect of layer is changed into semi liquid state, newborn state, semisolid or close to solid forms；
Layer of silica gel forming step, to the die face filling physical aspect of the second half module be the silica gel of liquid form or semi-solid form simultaneously
It is liquid or the layer of silica gel of semi-solid form to form at least one layer of physical aspect in its die face；
Compression molding step, by the first half module and the second half module matched moulds, is subsequently placed in clapper die spotting press pressurized, heated, after primary solidification
PUR coupling agent composite bed and layer of silica gel compression molding；
At least one is obtained after finished product, die sinking has the multiple material layer structures, integrally formed physical aspect for solid forms
Silica gel spike, it is to paste to be fixed on fabric face in the way of direct hot pressing is in fabric face.
2. a kind of silica gel spike of many material layer structures according to claim 1 is integrally formed molding attaching process, it is special
Levy and be：
First half module and the second half module matched moulds coordinate, and the die face of the first half module and second half module is respectively arranged with
The corresponding die cavity for being used to be molded silica gel spike at least described in one；
In the liquid hot melt adhesive filling step, PUR is selected to the mode of liquid hot melt adhesive fill area filling liquid PUR
Instillation process or hot melt glue point note technique；
In the layer of silica gel forming step, instillation process is selected to the mode of the cavity filling liquid-state silicon gel of the die face of the second half module
Or point note technique, selected to the mode of the cavity filling semisolid silica gel of the die face of the second half module and tamp technique.
3. a kind of silica gel spike of many material layer structures according to claim 1 or 2 is integrally formed molding attaching process, its
It is characterised by：
In the coupling agent spraying process, make to produce preliminary coupling between liquid hot melt adhesive and liquid coupling agent in a liquid state
Reaction and micro-glue connection reaction；
In the baking step, each first half module of the die face filled with PUR coupling agent composite bed is delivered to baking oven respectively again
Or continuous tunnel furnace, drying temperature is 180~200 DEG C, and drying to aridity is 80~90%；
In the compression molding step, the first half module and the second half module are heated simultaneously by clapper die spotting press, the first half module is added
Hot temperature is 150~200 DEG C, and the heating-up temperature to the second half module is 130~150 DEG C, and clamp time is 30~100 seconds.
4. a kind of silica gel spike of many material layer structures according to claim 1 or 2 is integrally formed molding attaching process, its
It is characterised by：In the coupling agent spraying process, from epoxide resin AB glue, acrylate AB glue, silica gel AB glue and polyurethane
At least one of glue is used as coupling agent.
5. a kind of silica gel spike of many material layer structures according to claim 1 or 2 is integrally formed molding attaching process, its
It is characterised by：First homogeneous mixture reason form is liquid in the silica gel that physical aspect is liquid form or semi-solid form
The coupling agent of form, then by the die face of silicone filler to the second half module, coupling agent selects epoxide resin AB glue, acrylate AB
At least one of glue, silica gel AB glue and polyurethane adhesive are used as coupling agent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710302243.4A CN107053571B (en) | 2017-05-02 | 2017-05-02 | A kind of silica gel spike integrated molding molding attaching process of more material layer structures |
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| CN201710302243.4A CN107053571B (en) | 2017-05-02 | 2017-05-02 | A kind of silica gel spike integrated molding molding attaching process of more material layer structures |
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| CN107053571B CN107053571B (en) | 2019-02-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229635A (en) * | 2018-03-05 | 2019-09-13 | 张文耀 | Integration silicon wafer and its manufacturing method that can be attached on object |
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| JPH11335472A (en) * | 1998-03-23 | 1999-12-07 | Fuji Kobunshi Kogyo Kk | Electromagnetic wave-absorbing and heat conductive silicone gel-molded sheet and production thereof |
| JP2003094593A (en) * | 2001-09-20 | 2003-04-03 | Dainippon Printing Co Ltd | Decorative paper and method for manufacturing decorative plate using the same |
| US20030104746A1 (en) * | 1998-10-02 | 2003-06-05 | 3M Innovative Properties Company | Laminated composites |
| CN101143476A (en) * | 2006-09-13 | 2008-03-19 | 利保烙印标企业股份有限公司 | Method for forming silastic product with back glue |
| CN106426969A (en) * | 2016-09-09 | 2017-02-22 | 北京航空航天大学 | Preparation technology of high-intensity and large-deformation type flexible stressed skin |
| CN106515242A (en) * | 2016-12-17 | 2017-03-22 | 东莞市松烁硅胶科技有限公司 | Silica gel and cloth 3D pattern trademark label in-mold forming transfer printing process |
-
2017
- 2017-05-02 CN CN201710302243.4A patent/CN107053571B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11335472A (en) * | 1998-03-23 | 1999-12-07 | Fuji Kobunshi Kogyo Kk | Electromagnetic wave-absorbing and heat conductive silicone gel-molded sheet and production thereof |
| US20030104746A1 (en) * | 1998-10-02 | 2003-06-05 | 3M Innovative Properties Company | Laminated composites |
| JP2003094593A (en) * | 2001-09-20 | 2003-04-03 | Dainippon Printing Co Ltd | Decorative paper and method for manufacturing decorative plate using the same |
| CN101143476A (en) * | 2006-09-13 | 2008-03-19 | 利保烙印标企业股份有限公司 | Method for forming silastic product with back glue |
| CN106426969A (en) * | 2016-09-09 | 2017-02-22 | 北京航空航天大学 | Preparation technology of high-intensity and large-deformation type flexible stressed skin |
| CN106515242A (en) * | 2016-12-17 | 2017-03-22 | 东莞市松烁硅胶科技有限公司 | Silica gel and cloth 3D pattern trademark label in-mold forming transfer printing process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229635A (en) * | 2018-03-05 | 2019-09-13 | 张文耀 | Integration silicon wafer and its manufacturing method that can be attached on object |
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| CN107053571B (en) | 2019-02-26 |
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