CN110213894A - A kind of wiring board contour machining procedure - Google Patents

A kind of wiring board contour machining procedure Download PDF

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Publication number
CN110213894A
CN110213894A CN201910484467.0A CN201910484467A CN110213894A CN 110213894 A CN110213894 A CN 110213894A CN 201910484467 A CN201910484467 A CN 201910484467A CN 110213894 A CN110213894 A CN 110213894A
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CN
China
Prior art keywords
axis
wiring board
chamber
cutting
gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910484467.0A
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Chinese (zh)
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CN110213894B (en
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LONGNAN JUNYA ELECTRONIC TECHNOLOGY Co.,Ltd.
Original Assignee
Large Shenzhen Kechuang Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201910484467.0A priority Critical patent/CN110213894B/en
Publication of CN110213894A publication Critical patent/CN110213894A/en
Application granted granted Critical
Publication of CN110213894B publication Critical patent/CN110213894B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

The invention discloses a kind of wiring board contour machining procedures, wherein, this technique institute includes main body using equipment, and cutting chamber is equipped in the main body, and the cutting is intracavitary to be equipped with cutter device, main chamber is equipped in the cutting chamber left wall, the cutting is intracavitary to be equipped with transmission device, the polishing chamber being connected to the cutting chamber is equipped in the cutting chamber right wall, the polishing is intracavitary to be equipped with grinding device, the polishing is intracavitary to be equipped with clamping device, is equipped with power device in main chamber;The configuration of the present invention is simple, easy to operate, maintenance convenience, and cutting operation and polishing operation can be spaced work by the equipment, reduced wiring board transhipment time, improved wiring board processing and forming efficiency, reduce wiring board production cost, therefore equipment value for applications with higher.

Description

A kind of wiring board contour machining procedure
Technical field
The present invention relates to wiring board manufacture fields, and in particular to a kind of wiring board contour machining procedure.
Background technique
With the development of electronics technology, the demand of wiring board is also continuously increased, but the forming process step of wiring board compared with More, and make complicated, and in wiring board manufacturing process process, adjacent job step is discontinuous, and working efficiency is lower, from forming This is higher, and therefore, the present invention is directed to design the continuous type wiring board contour machining equipment of two steps of one kind and its processing work Skill.
Summary of the invention
The purpose of the present invention is to provide a kind of wiring board contour machining procedures, and the above-mentioned of the prior art can be overcome to lack It falls into.
A kind of wiring board contour machining procedure according to the present invention, wherein this technique institute includes main body using equipment, institute It states and is equipped with cutting chamber in main body, the cutting is intracavitary to be equipped with cutter device, and main chamber is equipped in the cutting chamber left wall, described to cut Cut it is intracavitary be equipped with transmission device, be equipped in the cutting chamber right wall with the polishing chamber that be connected to of cutting chamber, it is described polish it is intracavitary Equipped with grinding device, the polishing is intracavitary to be equipped with clamping device, is equipped with power device, the power device packet in main chamber The main motor being set in main chamber bottom wall is included, the moving axis being connected by power with the main motor is equipped in main chamber, it is described dynamic Axis top is equipped with dynamic bevel gear, and the moving axis outer wall is equipped with main pulley;The power device can drive the cutter device sliding It is dynamic, and then cut the wiring board of the transmission device transmission;
This method is technically characterized in that moving axis described in the master tape wheel drive rotates, and then drives the transmission device Rotation, and then wiring board is driven to slide back and forth, meanwhile, drive the cutter device to slide up and down, and then wiring board is cut into Prescribed level, and the clamping device rotation is driven to send the wiring board of cutting to the grinding device position, it is same with this When, the grinding device carries out the burr on polishing removal wiring board to the wiring board of cutting.
Preferably, the transmission device includes being set to the symmetrical longitudinal bands axis in the intracavitary and front and back of the cutting, the longitudinal bands axis Right end is equipped with vertical roller, and transmission is equipped with longitudinal bands between the vertical roller of front and rear sides, and the longitudinal bands axis left end of front side, which is equipped with, to be located at Right bevel gear in main chamber, the longitudinal bands axis outer wall are equipped with lower gear, and the cutting is intracavitary to be equipped with symmetrical cross Tape spool, the cross band shaft rear end are equipped with barrel roll, and transmission is equipped with cross band, the cross band axis in left side between the barrel roll of the left and right sides Front end is equipped with rear bevel gear, and the cutting is intracavitary to be equipped with upper axis, before the upper axis right end with the rear bevel gear equipped with engaging Bevel gear, the upper axis left end are equipped with the gear being located in main chamber, lower axle are equipped in main chamber, and the lower axle is left End is equipped with left gear, and the lower axle right end is equipped with the right gear engaged with the lower gear;The transmission device can will be to be cut The wiring board cut is sent to the cutter device position;
It is characterized by: the dynamic bevel gear is dynamic described by the right bevel gear, the longitudinal bands axis, the vertical roller strap Longitudinal bands rotation, and then drive wiring board forward slip to be cut, when wiring board front-rear position slides into the limit, the main electricity Machine starts high-speed reverse and works and by the dynamic bevel gear, the right bevel gear, the longitudinal bands axis, the lower gear, described Right gear, the lower axle, the left gear, the gear, the upper axis, the preceding bevel gear, the rear bevel gear, institute Cross band axis, the barrel roll drive cross band rotation are stated, when wiring board slides into most rear side, the cross band drives wiring board Cutting position is slid into the right.
Preferably, the cutter device includes the cutting axis intracavitary set on the cutting, and the cutting axis right end, which is equipped with, to be turned Disk, the cutting is intracavitary to be slidably equipped with cutter, hinged by connecting rod between the cutter and the turntable, described Cutting axis left end is equipped with the upper belt-wheel being located in main chamber, and left axle is equipped in main chamber, and the left axle left end is equipped with hypodermis Band, transmission is equipped with the first belt between the lower belt and the upper belt-wheel, and the left axle right end is equipped with and the mantle tooth Take turns the unidirectional bevel gear of engagement;The cutter device, which is used to for wiring board to be cut into producer, requires specification;
It is characterized by: the dynamic bevel gear passes through the unidirectional bevel gear, the left axle, the lower belt, described One belt, the upper belt-wheel, the cutting axis, the turntable, the connecting rod drive cutter slide up and down, to wiring board into Row cutting.
Preferably, the clamping device includes the clamping axis intracavitary set on the polishing, and the clamping axis bottom end is equipped with position In being equipped with shaft in the dividing gear in main chamber, main chamber, the shaft top is equipped with and engages with the dividing gear Sector gear, the shaft bottom end is equipped with from belt wheel, and the transmission between belt wheel and the main pulley is equipped with the second skin Band is rotatably equipped with eight groups of clamping bars on the clamping axis outer wall, wherein clamping bar setting symmetrical above and below described in every two groups, and And elasticity is equipped with goring push spring between the upper and lower clamping bar, this is carried out specifically for sentencing wherein clamping bar described in one group Bright, the clamping bar is rotatably equipped with last item far from described clamping axis one end, and elasticity is equipped between the last item and the clamping bar Holddown spring, the last item are equipped with the briquetting for fixing circuit board far from described clamping bar one end, and the last item is far from the pressure Block one end is equipped with pinion;The clamping device for fixing circuit board and send the wiring board cut down to the polishing Setting position;
It is characterized by: the main pulley is by described from belt wheel, the shaft, the sector gear, the indexing tooth Wheel, the clamping axis drive the clamping bar rotation, and the wiring board under cutting is transferred to polishing position.
Preferably, the grinding device includes slidably being set to the intracavitary sliding block of the polishing, is equipped in the sliding block Chamber is converted, polishing axis is equipped in the sliding block, the polishing axis outer wall, which is equipped with, is located at the intracavitary sanding block of the polishing, institute It is intracavitary from bevel gear equipped with the conversion is located to state polishing axis bottom end, the conversion is intracavitary to be equipped with mandrel, the core back-end Equipped with the positive bevel gear engaged from bevel gear, belt chamber is equipped in the polishing chamber antetheca, the polishing is intracavitary to be set There is set axis, by spline fitted between the set axis and the mandrel, set axis front end is equipped with intracavitary positioned at the belt Secondary pulley, main chamber is interior to be equipped with countershaft, and the countershaft front end, which is equipped with, is located at the intracavitary positive belt wheel of the belt, the positive band Transmission is equipped with third belt between wheel and the secondary pulley, and the countershaft rear end is equipped with bevel pinion, sets on the countershaft outer wall There is the slave gear being located in main chamber, be equipped with the auxiliary-motor being located in main chamber antetheca in main chamber, in main chamber Equipped with the positive axis being connected by power with the auxiliary-motor, the positive shaft rear end be equipped with the master gear engaged from gear, it is described Grinding device includes the Synchronization Component symmetrical above and below being equipped with for rotating wiring board, wherein Synchronization Component includes being set to described beat Rotary shaft above and below mill chamber in the inner wall of two sides, the rotary shaft are equipped with close to described polishing chamber one end and engage with the pinion Spur gear, the rotary shaft is equipped with front pulley far from described polishing chamber one end, synchronization is rotatably equipped in the clamping axis Axis, two sides are equipped with symmetrical rear belt wheel to the synchronizing shaft up and down, and transmission is equipped with the 4th between the rear belt wheel and the front pulley Belt, the rotary shaft bottom end of downside are equipped with the bevel gear wheel for being located at and engaging in main chamber and with the bevel pinion; The grinding device carries out polishing operation to the wiring board under cutting;
It is characterized by: the auxiliary-motor, which starts to work and passes through the positive axis, drives the master gear rotation, Jin Ertong The bevel pinion, the positive belt wheel rotation are driven from gear described in crossing, the positive belt wheel passes through the secondary pulley, the set Axis, the mandrel, the positive bevel gear, it is described from bevel gear, the polishing axis drive sanding block rotation, meanwhile, it is described Bevel pinion passes through the bevel gear wheel, the rotary shaft, the spur gear, the pinion, the last item, the briquetting Wiring board rotation is driven, and then carries out polishing operation.
The beneficial effects of the present invention are: the configuration of the present invention is simple, easy to operate, maintenance convenience, and the equipment can will be cut Operation and polishing operation are not spaced work, reduce wiring board transhipment time, improve wiring board processing and forming efficiency, reduce route Plate production cost, therefore equipment value for applications with higher.
Detailed description of the invention
In order to illustrate more clearly of inventive embodiments or technical solution in the prior art, to embodiment or will show below There is attached drawing needed in technical description to be briefly described.
Fig. 1 is a kind of overall structure diagram of wiring board contour machining procedure institute use device of the invention;
Fig. 2 is the structural schematic diagram of A-A in Fig. 1;
Fig. 3 is the structural schematic diagram of cutter in Fig. 1;
Fig. 4 is the structural schematic diagram of B in Fig. 1;
Fig. 5 is the structural schematic diagram of C in Fig. 2;
Fig. 6 is the structural schematic diagram of D in Fig. 2.
Specific embodiment
Below with reference to above-mentioned diagram, the present invention is described in detail, wherein for sake of convenience, now to hereafter described Orientation provides as follows: consistent with the up and down direction of Fig. 1 projection relation itself all around described in hereafter.
As shown in figures 1 to 6, a kind of wiring board contour machining procedure of the invention, wherein the equipment includes main body 11, institute It states and is equipped with cutting chamber 34 in main body 11, cutter device 100 is equipped in the cutting chamber 34, is equipped in 34 left wall of cutting chamber Main chamber 15, the cutting chamber 34 is interior to be equipped with transmission device 200, is equipped in 34 right wall of cutting chamber and the cutting chamber 34 connects Logical polishing chamber 99, the polishing chamber 99 is interior to be equipped with grinding device 300, is equipped with clamping device 400, institute in the polishing chamber 99 It states and is equipped with power device 500 in main chamber 15, the power device 500 includes the main motor 22 in 15 bottom wall of main chamber, The moving axis 21 being connected by power with the main motor 22 is equipped in main chamber 15,21 top of moving axis is equipped with dynamic bevel gear 19,21 outer wall of moving axis is equipped with main pulley 20;The power device 500 can drive the cutter device 100 to slide, into And cut the wiring board that the transmission device 200 transmits.
Valuably, the transmission device 200 includes and front and back symmetrical longitudinal bands axis 55 interior set on the cutting chamber 34, institute It states 55 right end of longitudinal bands axis and is equipped with vertical roller 98, transmission is equipped with longitudinal bands 24 between the vertical roller 98 of front and rear sides, and the described of front side is indulged 55 left end of tape spool is equipped with the right bevel gear 54 being located in main chamber 15, and 55 outer wall of longitudinal bands axis is equipped with lower gear 56, Symmetrical cross band axis 64 is equipped in the cutting chamber 34,64 rear end of cross band axis is equipped with barrel roll 65, the cross of the left and right sides Transmission is equipped with cross band 66 between roller 65, and 64 front end of cross band axis in left side is equipped with rear bevel gear 63, sets in the cutting chamber 34 There is upper axis 61, upper 61 right end of axis is equipped with the preceding bevel gear 62 engaged with the rear bevel gear 63, upper 61 left end of axis Equipped with the gear 60 being located in main chamber 15, lower axle 58 is equipped in main chamber 15,58 left end of lower axle is equipped with left tooth Wheel 57,58 right end of lower axle are equipped with the right gear 59 engaged with the lower gear 56;The transmission device 200 can will be to be cut The wiring board cut is sent to 100 position of cutter device.
Valuably, the cutter device 100 includes the cutting axis 13 in the cutting chamber 34, the cutting axis 13 Right end is equipped with turntable 33, is slidably equipped with cutter 31 in the cutting chamber 34, the cutter 31 and the turntable 33 it Between it is hinged by connecting rod 32,13 left end of cutting axis is equipped with the upper belt-wheel 12 being located in main chamber 15, main chamber 15 Interior to be equipped with left axle 17,17 left end of left axle is equipped with lower belt 16, is driven and sets between the lower belt 16 and the upper belt-wheel 12 There is the first belt 14,17 right end of left axle is equipped with the unidirectional bevel gear 18 engaged with the dynamic bevel gear 19;The cutting dress It sets 100 and requires specification for wiring board to be cut into producer.
Valuably, the clamping device 400 includes the clamping axis 30 in the polishing chamber 99, the clamping axis 30 Bottom end is equipped with the dividing gear 35 being located in main chamber 15, is equipped with shaft 28 in main chamber 15,28 top of shaft is set There is the sector gear 29 engaged with the dividing gear 35,28 bottom end of shaft is equipped with from belt wheel 27, described from belt wheel 27 Transmission is equipped with the second belt 23 between the main pulley 20, is rotatably equipped with eight groups of clamping bars on 30 outer wall of clamping axis 25, wherein the setting symmetrical above and below of clamping bar 25 described in every two groups, also, elasticity is equipped with pushing tow bullet between the upper and lower clamping bar 25 Spring 26, this is described in detail for sentencing wherein clamping bar 25 described in one group, and the clamping bar 25 is far from the clamping axis 30 1 End is rotatably equipped with last item 68, and elasticity is equipped with holddown spring 69, the last item 68 between the last item 68 and the clamping bar 25 It is equipped with the briquetting 67 for fixing circuit board far from described 25 one end of clamping bar, the last item 68 is set far from described 67 one end of briquetting There is pinion 71;The clamping device 400 is sent for fixing circuit board and by the wiring board cut down to polishing dress Set 300 positions.
Valuably, the grinding device 300 includes the sliding block 52 being slidably set in the polishing chamber 99, the cunning It is equipped with conversion chamber 72 in block 52, polishing axis 74 is equipped in the sliding block 52,74 outer wall of polishing axis, which is equipped with, is located at described beat Sanding block 53 in mill chamber 99, it is described polishing 74 bottom end of axis be equipped be located at it is described conversion chamber 72 in from bevel gear 73, it is described Convert chamber 72 in be equipped with mandrel 49,49 rear end of mandrel be equipped with the positive bevel gear 50 engaged from bevel gear 73, it is described Polish and be equipped with belt chamber 46 in 99 antetheca of chamber, be equipped with set axis 48 in the polishing chamber 99, the set axis 48 and the mandrel 49 it Between by spline fitted, 48 front end of set axis is equipped with the secondary pulley 47 being located in the belt chamber 46, in main chamber 15 Equipped with countershaft 41,41 front end of countershaft be equipped be located at the belt chamber 46 in positive belt wheel 44, the positive belt wheel 44 with it is described Transmission is equipped with third belt 45 between secondary pulley 47, and 41 rear end of countershaft is equipped with bevel pinion 40, on 41 outer wall of countershaft Equipped with the slave gear 77 being located in main chamber 15, the auxiliary-motor being located in 15 antetheca of main chamber is equipped in main chamber 15 43, be equipped with the positive axis 42 being connected by power with the auxiliary-motor 43 in main chamber 15,42 rear end of positive axis be equipped with it is described from The master gear 78 that gear 77 engages, the grinding device 300 include the Synchronization Component symmetrical above and below being equipped with for rotating wiring board 301, wherein Synchronization Component 301 includes the rotary shaft 76 in polishing about the 99 two sides inner wall of chamber, the rotary shaft 76 are equipped with the spur gear 75 engaged with the pinion 71 close to described polishing 99 one end of chamber, and the rotary shaft 76 is far from described 99 one end of chamber of polishing is equipped with front pulley 38, rotatably equipped with synchronizing shaft 97 in the clamping axis 30, on the synchronizing shaft 97 Lower two sides are equipped with symmetrical rear belt wheel 36, are driven between belt wheel 36 and the front pulley 38 after described and are equipped with the 4th belt 37, under 76 bottom end of the rotary shaft of side is equipped with the bevel gear wheel 39 for being located at and engaging in main chamber 15 and with the bevel pinion 40;Institute The wiring board stated under 300 pairs of grinding device cuttings carries out polishing operation.
When the device is in use, main motor 22 starts to work and drives main pulley 20,19 turns of dynamic bevel gear by moving axis 21 Dynamic, dynamic bevel gear 19 drives longitudinal bands 24 to rotate, and then drives route to be cut by right bevel gear 54, longitudinal bands axis 55, vertical roller 98 Plate forward slip, at the same time, dynamic bevel gear 19 by unidirectional bevel gear 18, left axle 17, lower belt 16, the first belt 14, Upper belt-wheel 12, cutting axis 13, turntable 33, connecting rod 32 drive cutter 31 to slide up and down, and cut to wiring board, meanwhile, it is main Belt wheel 20 will be cut by driving clamping bar 25 to rotate from belt wheel 27, shaft 28, sector gear 29, dividing gear 35, clamping axis 30 The wiring board cut off is transferred to polishing position, and at the same time, auxiliary-motor 43 starts to work and drives master gear by positive axis 42 78 rotations, and then by driving bevel pinion 40, positive belt wheel 44 to rotate from gear 77, positive belt wheel 44 passes through secondary pulley 47, set axis 48, mandrel 49, positive bevel gear 50, drive sanding block 53 to rotate from bevel gear 73, polishing axis 74, meanwhile, bevel pinion 40 is logical It crosses bevel gear wheel 39, rotary shaft 76, spur gear 75, pinion 71, last item 68, briquetting 67 and drives wiring board rotation, and then carry out Polishing operation, when wiring board front-rear position slides into the limit, main motor 22 starts high-speed reverse and works and pass through dynamic bevel gear 19, right bevel gear 54, longitudinal bands axis 55, lower gear 56, right gear 59, lower axle 58, left gear 57, gear 60, upper axis 61, preceding Bevel gear 62, rear bevel gear 63, cross band axis 64, barrel roll 65 drive cross band 66 to rotate, horizontal when wiring board slides into most rear side Band 66 drives wiring board to slide into cutting position to the right, and the recovery of main motor 22 rotates forward.
The beneficial effects of the present invention are: the configuration of the present invention is simple, easy to operate, maintenance convenience, and the equipment can will be cut Operation and polishing operation are not spaced work, reduce wiring board transhipment time, improve wiring board processing and forming efficiency, reduce route Plate production cost, therefore equipment value for applications with higher.
The above, the specific embodiment only invented, but invent protection scope be not limited thereto, it is any not The change or replacement expected by creative work should all be covered within the protection scope of invention.Therefore, the protection of invention Range should be determined by the scope of protection defined in the claims.

Claims (5)

1. a kind of wiring board contour machining procedure of the invention, wherein this technique institute includes main body using equipment, in the main body Equipped with cutting chamber, the cutting is intracavitary to be equipped with cutter device, main chamber is equipped in the cutting chamber left wall, the cutting is intracavitary to be equipped with Transmission device, the cutting chamber right wall is interior to be equipped with the polishing chamber being connected to the cutting chamber, and the polishing is intracavitary to be equipped with dress of polishing It sets, the polishing is intracavitary to be equipped with clamping device, power device is equipped in main chamber, the power device includes being set to the master Main motor in the wall of bottom of chamber, main chamber is interior to be equipped with the moving axis being connected by power with the main motor, and the moving axis top is equipped with dynamic Bevel gear, the moving axis outer wall are equipped with main pulley;The power device can drive the cutter device to slide, and then cut institute State the wiring board of transmission device transmission;
This method is technically characterized in that moving axis described in the master tape wheel drive rotates, and then drives the transmission device rotation, And then wiring board is driven to slide back and forth, meanwhile, drive the cutter device to slide up and down, and then wiring board is cut into regulation greatly It is small, and the clamping device rotation is driven to send the wiring board of cutting to the grinding device position, it is at the same time, described to beat Mill apparatus carries out the burr on polishing removal wiring board to the wiring board of cutting.
2. one of according to claim 1 wiring board contour machining procedure, wherein the transmission device includes being set to described cut The symmetrical longitudinal bands axis in intracavitary and front and back is cut, the longitudinal bands axis right end is equipped with vertical roller, is driven and sets between the vertical roller of front and rear sides There are longitudinal bands, the longitudinal bands axis left end of front side is equipped with the right bevel gear being located in main chamber, and the longitudinal bands axis outer wall is equipped with Lower gear, the cutting is intracavitary to be equipped with symmetrical cross band axis, and the cross band shaft rear end is equipped with barrel roll, the barrel roll of the left and right sides Between transmission be equipped with cross band, the cross band axis front end in left side is equipped with rear bevel gear, and the cutting is intracavitary to be equipped with upper axis, it is described on Axis right end is equipped with the preceding bevel gear engaged with the rear bevel gear, and the upper axis left end is equipped with the upper tooth being located in main chamber Wheel, main chamber is interior to be equipped with lower axle, and the lower axle left end is equipped with left gear, and the lower axle right end is equipped with and engages with the lower gear Right gear;The transmission device can send wiring board to be cut to the cutter device position;
Turn it is characterized by: the dynamic bevel gear moves the longitudinal bands by the right bevel gear, the longitudinal bands axis, the vertical roller strap It is dynamic, and then wiring board forward slip to be cut is driven, when wiring board front-rear position slides into the limit, the main motor starts height Fast reverse operation simultaneously passes through the dynamic bevel gear, the right bevel gear, the longitudinal bands axis, the lower gear, the right gear, institute State lower axle, the left gear, the gear, the upper axis, the preceding bevel gear, the rear bevel gear, the cross band axis, institute It states barrel roll and drives the cross band rotation, when wiring board slides into most rear side, the cross band drives wiring board to slide into the right and cuts Cut position.
3. one of according to claim 1 wiring board contour machining procedure, wherein the cutter device includes being set to described cut Intracavitary cutting axis is cut, the cutting axis right end is equipped with turntable, and the cutting is intracavitary to be slidably equipped with cutter, the cutting Hinged by connecting rod between knife and the turntable, the cutting axis left end is equipped with the upper belt-wheel being located in main chamber, the master Intracavitary to be equipped with left axle, the left axle left end is equipped with lower belt, and transmission is equipped with the first skin between the lower belt and the upper belt-wheel Band, the left axle right end are equipped with the unidirectional bevel gear engaged with the dynamic bevel gear;The cutter device is for cutting wiring board It is cut into producer and requires specification;
It is characterized by: the dynamic bevel gear passes through the unidirectional bevel gear, the left axle, the lower belt, first skin Band, the upper belt-wheel, the cutting axis, the turntable, the connecting rod drive cutter to slide up and down, and cut to wiring board It cuts.
4. one of according to claim 1 wiring board contour machining procedure, wherein the clamping device includes being set to described beat Clamping axis in mill chamber, the clamping axis bottom end are equipped with the dividing gear being located in main chamber, are equipped with shaft in main chamber, The shaft top is equipped with the sector gear engaged with the dividing gear, and the shaft bottom end is equipped with from belt wheel, described from band Transmission is equipped with the second belt between wheel and the main pulley, is rotatably equipped with eight groups of clamping bars on the clamping axis outer wall, wherein Clamping bar setting symmetrical above and below described in every two groups, also, elasticity is equipped with goring push spring between the upper and lower clamping bar, and this is sentenced wherein It is described in detail for clamping bar described in one group, the clamping bar is rotatably equipped with last item far from described clamping axis one end, described Elasticity is equipped with holddown spring between last item and the clamping bar, and the last item is equipped with far from described clamping bar one end and is used for fixing circuit board Briquetting, the last item far from described briquetting one end be equipped with pinion;The clamping device is for fixing circuit board and will cut The wiring board to get off is sent to the grinding device position;
It is characterized by: the main pulley is by described from belt wheel, the shaft, the sector gear, the dividing gear, institute It states clamping axis and drives the clamping bar rotation, the wiring board under cutting is transferred to polishing position.
5. one of according to claim 1 wiring board contour machining procedure, wherein the grinding device includes slidably setting In being equipped with conversion chamber in the intracavitary sliding block of the polishing, the sliding block, polishing axis, the polishing axis outer wall are equipped in the sliding block Be equipped with and be located at the intracavitary sanding block of the polishing, the polishing axis bottom end be equipped be located at it is described convert it is intracavitary from bevel gear, The conversion is intracavitary to be equipped with mandrel, and the core back-end is equipped with and the positive bevel gear engaged from bevel gear, the polishing chamber Belt chamber is equipped in antetheca, intracavitary be equipped with of the polishing covers axis, described by spline fitted between the set axis and the mandrel It covers axis front end and is equipped with and be located at the intracavitary secondary pulley of the belt, countershaft is equipped in main chamber, the countershaft front end, which is equipped with, to be located at The intracavitary positive belt wheel of the belt, transmission is equipped with third belt, the countershaft rear end between the positive belt wheel and the secondary pulley Equipped with bevel pinion, the countershaft outer wall is equipped with the slave gear being located in main chamber, is equipped in main chamber positioned at described Auxiliary-motor in main chamber antetheca, main chamber is interior to be equipped with the positive axis being connected by power with the auxiliary-motor, and the positive shaft rear end is equipped with With the master gear engaged from gear, the grinding device includes the synchronization group symmetrical above and below being equipped with for rotating wiring board Part, wherein Synchronization Component includes the rotary shaft in the polishing chamber up and down two sides inner wall, and the rotary shaft is beaten close to described Mill chamber one end is equipped with the spur gear engaged with the pinion, and the rotary shaft is equipped with front pulley far from described polishing chamber one end, Rotatably equipped with synchronizing shaft in the clamping axis, two sides are equipped with symmetrical rear belt wheel, the rear belt wheel to the synchronizing shaft up and down Transmission is equipped with the 4th belt between the front pulley, the rotary shaft bottom end of downside be equipped be located in main chamber and with institute State the bevel gear wheel of bevel pinion engagement;The grinding device carries out polishing operation to the wiring board under cutting;
It is characterized by: the auxiliary-motor, which starts to work and passes through the positive axis, drives the master gear rotation, and then pass through institute It states from gear and drives the bevel pinion, the positive belt wheel rotation, the positive belt wheel passes through the secondary pulley, the set axis, institute State mandrel, the positive bevel gear, it is described from bevel gear, the polishing axis drive sanding block rotation, meanwhile, the small bevel gear Wheel drives route by the bevel gear wheel, the rotary shaft, the spur gear, the pinion, the last item, the briquetting Plate rotation, and then carry out polishing operation.
CN201910484467.0A 2019-06-05 2019-06-05 Circuit board forming processing equipment Active CN110213894B (en)

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CN110213894B CN110213894B (en) 2020-07-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113038728A (en) * 2021-05-27 2021-06-25 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07178694A (en) * 1993-12-22 1995-07-18 Toshiba Corp Cutting device for printed board
CN105376942A (en) * 2015-10-30 2016-03-02 江苏博敏电子有限公司 Stitching process equipment automatic device
CN107378707A (en) * 2017-08-01 2017-11-24 昆山寰升电子有限公司 PCB surface trimming polisher lappers
CN206747974U (en) * 2017-03-28 2017-12-15 东莞市祥宸电子科技有限公司 A kind of circuit board cutter device with polishing function
CN107743343A (en) * 2017-11-16 2018-02-27 重庆市志益鑫电子科技有限公司 A kind of circuit board processing method
CN109277833A (en) * 2018-10-18 2019-01-29 陈爱兰 A kind of processing unit (plant) of the component of machine processing synchronous polishing follow-up of cutting

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07178694A (en) * 1993-12-22 1995-07-18 Toshiba Corp Cutting device for printed board
CN105376942A (en) * 2015-10-30 2016-03-02 江苏博敏电子有限公司 Stitching process equipment automatic device
CN206747974U (en) * 2017-03-28 2017-12-15 东莞市祥宸电子科技有限公司 A kind of circuit board cutter device with polishing function
CN107378707A (en) * 2017-08-01 2017-11-24 昆山寰升电子有限公司 PCB surface trimming polisher lappers
CN107743343A (en) * 2017-11-16 2018-02-27 重庆市志益鑫电子科技有限公司 A kind of circuit board processing method
CN109277833A (en) * 2018-10-18 2019-01-29 陈爱兰 A kind of processing unit (plant) of the component of machine processing synchronous polishing follow-up of cutting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113038728A (en) * 2021-05-27 2021-06-25 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method
CN113038728B (en) * 2021-05-27 2021-08-03 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method

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