CN110197807A - 晶片传送盒 - Google Patents

晶片传送盒 Download PDF

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Publication number
CN110197807A
CN110197807A CN201810157016.1A CN201810157016A CN110197807A CN 110197807 A CN110197807 A CN 110197807A CN 201810157016 A CN201810157016 A CN 201810157016A CN 110197807 A CN110197807 A CN 110197807A
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CN
China
Prior art keywords
chip feeder
chip
feeder
box body
heating module
Prior art date
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Pending
Application number
CN201810157016.1A
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English (en)
Inventor
翁启云
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Macronix International Co Ltd
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Macronix International Co Ltd
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Priority to CN201810157016.1A priority Critical patent/CN110197807A/zh
Publication of CN110197807A publication Critical patent/CN110197807A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Abstract

一种晶片传送盒，包括盒体与至少一个加热模块。加热模块设置于盒体上。

Description

晶片传送盒
技术领域
本发明是有关于一种传送盒，且特别是有关于一种晶片传送盒。
背景技术
随着半导体线宽越来越微小化，由于气体污染物(Airborne MolecularContamination，AMC)对晶片具有危害性，因此对于晶片传送盒内的气体污染物的防治越来越重视。一般业界通常会使用惰性气体(如，N2)或干净气体(clean dry air，CDA)填充于晶片传送盒中，且利用抽气与充气进行换气，以减少晶片传送盒内的气体污染物，而达到防治目的。
然而，晶片传送盒内的气体污染物有时会以凝结态附着在晶片传送盒的内壁或晶片上，而对晶片造成危害，进而造成晶片合格率降低。
发明内容
本发明提供一种晶片传送盒，其有助于移除盒内的凝结态污染物。
本发明提出一种晶片传送盒，包括盒体与至少一个加热模块。加热模块设置于盒体上。
依照本发明的一实施例所述，在上述晶片传送盒中，盒体的材料例如是树脂。
依照本发明的一实施例所述，在上述晶片传送盒中，晶片传送盒例如是前开式晶片传送盒(Front-Opening Unified Pod，FOUP)或前开式晶片运输盒(Front-OpeningShipping Box，FOSB)。
依照本发明的一实施例所述，在上述晶片传送盒中，加热模块例如是加热线圈、加热灯管或其组合。
依照本发明的一实施例所述，在上述晶片传送盒中，加热模块可设置于盒体的内壁上。
依照本发明的一实施例所述，在上述晶片传送盒中，加热模块可设置于盒体的外壁上。
依照本发明的一实施例所述，在上述晶片传送盒中，加热模块可固定于盒体上。
依照本发明的一实施例所述，在上述晶片传送盒中，加热模块固定于盒体上的方式例如是锁固或黏固。
基于上述，在本发明所提出的晶片传送盒中，可通过加热模块将晶片传送盒内的凝结态污染物变成气态污染物，再利用充气与抽气的工艺将气态污染物从晶片传送盒中排出，因此有助于移除晶片传送盒内的凝结态污染物。藉此，可防止晶片传送盒内的污染物对晶片造成危害，进而可提升晶片合格率。
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，并配合附图作详细说明如下。
附图说明
图1为本发明一实施例的晶片传送盒的示意图。
图2为本发明另一实施例的晶片传送盒的示意图。
图3为移除图1的晶片传送盒内的污染物的操作示意图。
【符号说明】
100、200：晶片传送盒
102：盒体
104：加热模块
300：充气管路
302：气体
304：抽气管路
W：晶片
具体实施方式
图1为本发明一实施例的晶片传送盒的示意图。
请参照图1，晶片传送盒100包括盒体102与至少一个加热模块104。晶片传送盒100适用于晶片的储存及传输。晶片传送盒100例如是前开式晶片传送盒(FOUP)或前开式晶片运输盒(FOSB)。盒体102的材料例如是树脂。
加热模块104设置于盒体102上。加热模块104可设置于盒体102的内壁上或外壁上。在此实施例中，加热模块104是以设置于盒体102的内壁上为例来进行说明，但本发并不以此为限。在另一实施例中，加热模块104亦可设置于盒体102的外壁上。加热模块104可固定于盒体102上。加热模块104固定于盒体102上的方式例如是锁固或黏固。加热模块104例如是加热线圈、加热灯管或其组合。
此外，图1中的加热模块104的数量仅为举例说明，本发明并不以此为限，只要加热模块104的数量为至少一个即属于本发明所主张的范围。
基于上述实施例可知，在晶片传送盒100中，可通过加热模块104对晶片传送盒100进行加热，以提高晶片传送盒100内部的温度。藉此，可将晶片传送盒100内的凝结态污染物汽化成气态污染物，再利用充气与抽气的工艺将气态污染物从晶片传送盒100中排出，因此有助于移除晶片传送盒100内的凝结态污染物。藉此，可防止晶片传送盒100内的污染物对晶片造成危害，进而可提升晶片合格率。
图2为本发明另一实施例的晶片传送盒的示意图。
请同时参照图1与图2，图2的晶片传送盒200与图1的晶片传送盒100的差异如下。在晶片传送盒200中，加热模块104设置于盒体102的外壁上。此外，晶片传送盒200与晶片传送盒100中的相同的构件以相同的符号表示，且于上述实施例中已详尽地进行说明，于此不再重复说明。
基于上述实施例可知，在晶片传送盒200中，可通过加热模块104将晶片传送盒200内的凝结态污染物变成气态污染物，再利用充气与抽气的工艺将气态污染物从晶片传送盒200中排出，因此有助于移除晶片传送盒200内的凝结态污染物。藉此，可防止晶片传送盒200内的污染物对晶片造成危害，进而可提升晶片合格率。
图3为移除图1的晶片传送盒内的污染物的操作示意图。
请参照图3，在移除晶片传送盒100内的气态污染物的操作中，充气管路300提供如惰性气体(如，氮气)、干净气体(CDA)或超干净气体(extra clean dry air，XCDA)等气体302至盒体102中，再利用抽气管路304将气体302抽出，因此可通过气体302将晶片传送盒100内的污染物带出，而移除晶片传送盒100内的污染物。此外，在上述充气与抽气的工艺中，利用加热模块104对晶片传送盒100进行加热，以将晶片传送盒100内的如酸、碱或盐的凝结态污染物汽化成气态污染物，因此可利用充气与抽气的工艺将气态污染物从晶片传送盒100中排出。藉此，可防止晶片传送盒100内的污染物对晶片W造成危害，进而可提升晶片合格率。
综上所述，在上述实施例的晶片传送盒中，由于加热模块可将晶片传送盒内的凝结态污染物变成气态污染物，因此有助于移除晶片传送盒内的凝结态污染物，进而可提升晶片合格率。
虽然本发明已以实施例揭露如上，然其并非用以限定本发明，任何所属技术领域中普通技术人员，在不脱离本发明的精神和范围内，当可作些许的更动与润饰，故本发明的保护范围当以权利要求所界定的为准。

Claims (8)

1.一种晶片传送盒，包括：
一盒体；以及
至少一个加热模块，设置于该盒体上。
2.如权利要求1所述的晶片传送盒，其中该盒体的材料包括树脂。
3.如权利要求1所述的晶片传送盒，其中该晶片传送盒包括前开式晶片传送盒或前开式晶片运输盒。
4.如权利要求1所述的晶片传送盒，其中该至少一个加热模块包括加热线圈、加热灯管或其组合。
5.如权利要求1所述的晶片传送盒，其中该至少一个加热模块设置于该盒体的内壁上。
6.如权利要求1所述的晶片传送盒，其中该至少一个加热模块设置于该盒体的外壁上。
7.如权利要求1所述的晶片传送盒，其中该至少一个加热模块固定于该盒体上。
8.如权利要求7所述的晶片传送盒，其中该至少一个加热模块固定于该盒体上的方式包括锁固或黏固。
CN201810157016.1A 2018-02-24 2018-02-24 晶片传送盒 Pending CN110197807A (zh)

Priority Applications (1)

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CN201810157016.1A CN110197807A (zh) 2018-02-24 2018-02-24 晶片传送盒

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201918372U (zh) * 2010-12-27 2011-08-03 武汉新芯集成电路制造有限公司 晶圆盒
CN105789084A (zh) * 2014-12-17 2016-07-20 北京北方微电子基地设备工艺研究中心有限责任公司 加热腔室以及半导体加工设备
CN105826226A (zh) * 2015-01-22 2016-08-03 应用材料公司 批量加热和冷却腔室或负载锁定装置
CN105960705A (zh) * 2014-01-21 2016-09-21 禹范济 排气装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201918372U (zh) * 2010-12-27 2011-08-03 武汉新芯集成电路制造有限公司 晶圆盒
CN105960705A (zh) * 2014-01-21 2016-09-21 禹范济 排气装置
CN105789084A (zh) * 2014-12-17 2016-07-20 北京北方微电子基地设备工艺研究中心有限责任公司 加热腔室以及半导体加工设备
CN105826226A (zh) * 2015-01-22 2016-08-03 应用材料公司 批量加热和冷却腔室或负载锁定装置

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