CN110191569A - A kind of test structures and methods of the back drill Aligning degree of 5G circuit board - Google Patents
A kind of test structures and methods of the back drill Aligning degree of 5G circuit board Download PDFInfo
- Publication number
- CN110191569A CN110191569A CN201910309949.2A CN201910309949A CN110191569A CN 110191569 A CN110191569 A CN 110191569A CN 201910309949 A CN201910309949 A CN 201910309949A CN 110191569 A CN110191569 A CN 110191569A
- Authority
- CN
- China
- Prior art keywords
- test
- back drill
- core plate
- circuit board
- aligning degree
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Abstract
A kind of test structure of the back drill Aligning degree of 5G circuit board, including from top to bottom successively laminating the 1st to n-th layer core plate；Wherein n is natural number, n > 2；Described 1st to n-th layer core plate further include: the 1st to w-th test cell, outlet, the second test pole, 1st to w-th test cell, the outlet are set on the m layers of core plate, second test pole runs through the m layers of core plate, it is connected between r-th of test cell and the r+1 test cell by the outlet, second test pole is connected with the outlet；Wherein r, w, m are natural number, 0 < r < w-1,1 < m < n.Present invention designed lines on core plate on PCB detect back drill offset in such a way that whether test electric current is by loop wire, and the structure and mode can be with the back drill offsets of mass detection pcb board, and speed is fast, and detection limit is big, improves detection efficiency；Meanwhile accurate offset ranges value can be provided, foundation is provided for later period adjustment.
Description
Technical field
The invention belongs to pcb board manufacturing technology fields, more particularly, to a kind of test of the back drill Aligning degree of 5G circuit board
Structures and methods.
Background technique
In the production of PCB, the effect of back drill is to bore to fall not playing the through hole section of any connection or transmitting effect, is kept away
Exempt to cause reflection, scattering, delay of high speed transmission of signals etc., brings " distortion " to signal.In back drill manufacturing process, if back drill
Now inclined hole is drilled out with one, then causes a brill part hole wall copper not bore completely, easily so as to cause signal transmission distortion.
Currently, usually use cut sections for microscopic examination back drill Aligning degree situation, heavy workload is checked, it is time-consuming and laborious and have difficult judgment etc.
Problem.The cut sections for microscopic examination mode, inefficiency take a long time, and are easy the plank missing inspection to back drill accuracy difference causing batch
It scraps or even flows to abnormal plate in client's hand, cause loss difficult to the appraisal.
Therefore, it is necessary to which the test structures and methods for providing a kind of back drill Aligning degree of new 5G circuit board solve above-mentioned skill
Art problem.
Summary of the invention
The technical problem to be solved by the invention is to provide it is a kind of convenient for detection back drill Aligning degree and detection efficiency it is high
The test structures and methods of the back drill Aligning degree of 5G circuit board.
The technical solution adopted by the present invention to solve the technical problems, a kind of test knot of the back drill Aligning degree of 5G circuit board
Structure, including from top to bottom successively laminating the 1st to n-th layer core plate；Wherein n is natural number, n > 2；
Described 1st to n-th layer core plate further include: the 1st to w-th test cell, outlet, the second test pole, the described 1st to
W-th of test cell, the outlet are set on the m layers of core plate, and second test pole runs through the m layers of core plate,
Be connected between r-th of test cell and the r+1 test cell by the outlet, second test pole with
The outlet is connected；Wherein r, w, m are natural number, 0 < r < w-1,1 < m < n；
R-th of test cell includes: the 1st to j-th group, enters line, the first test pole, and the described 1st to j-th is small
Group enters line described in and is connected with first test pole, and j-th of group is connected with the outlet, described k-th small
Group includes: a brill, back drill, loop wire, conductive line, and the loop wire is circular and is equipped with opening, the conductive line respectively with it is adjacent
The openings of two loop wires be connected, the diameter of the back drill is greater than described one diameter bored, and wherein j and k are
Natural number, 1 < k < j；
One brill, the back drill, first test pole, second test pole run through the described 1st to n-th layer core
Plate.
Preferably, the interior diameter of the loop wire is equal with the diameter of the back drill.
Preferably, the width of the loop wire is d, and the width of the loop wire in the 1st to j-th group is equal.
Preferably, the width of the loop wire in the 1st to w-th test cell is respectively d1, d2 ..., dw；
Wherein: dw=d1+a* (w-1), a > 0.
Preferably, the difference of the diameter of the diameter of the back drill and a brill is equal to d1.
A kind of test method of the back drill Aligning degree of 5G circuit board, comprising steps of
S1: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5 the described 1st to
First test pole and second test pole are added on n-th layer core plate；
S2: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5 is at described m layers
Enter line, the conductive line, the loop wire, the outlet described in laying on core plate；
S3: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5 uses tool edge
The back drill drills through the 1st to the m layers core plate；
S4: the described in any item 5G circuit board back drill Aligning degrees of claim 1-5 are separately connected with the both ends of multimeter
First test pole in second test pole and r-th of test cell on the 1st layer of core plate in structure is tested,
In test, when multimeter short circuit, indicate that back drill offset is less than or equal to or is equal to dr；When multimeter open circuit, back is indicated
It bores offset and is greater than dr.
Preferably, in step S4, when multimeter short circuit, then stop testing, when multimeter open circuit, then r value adds 1, weight
Multiple S4 step.
Preferably, before step S1 further include: according to customer demand, determine the core plate number of plies for needing back drill, claim
In the test structure of the described in any item 5G circuit board back drill Aligning degrees of 1-5 the described 1st to the m layers of core plate be back drill
Layer, i.e., the back drill of described 1st to the m layers core plate need to bore.
Preferably, back drill Aligning degree is that b can then be produced as dr≤b；Work as dr > b, then can be deviated according to back drill
Value range (dr-b-a)-(dr-b) of amount is adjusted the drilling parameter of back drill or pcb board does not continue next process.
Compared with prior art, present invention designed lines on core plate on PCB, by testing whether electric current passes through loop wire
Mode detects back drill offset, and the structure and mode can be with the back drill offsets of mass detection pcb board, and speed is fast, detection limit
Greatly, detection efficiency is improved；Meanwhile accurate offset ranges value can be provided, foundation is provided for later period adjustment.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the invention.
Fig. 2 is main view of the invention.
Fig. 3 is main view of the invention (the 1st to m-1 layer of core plate of removal).
In figure:
1. core plate, 11. test cells, 12. outlets, 13. second test poles, 111. groups, 112. enter line, and 113. first survey
Column is tried, 1111. 1 bore, 1112. back drills, 1113. loop wires, 1114. conductive lines, 11131. openings.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the present embodiment, the number of plies n of the core plate 1 of pcb board is 10, and the quantity w of test cell 11 is 3,3 test cells
The quantity j of the group 111 of each test cell 11 is 4 in 11, and needing the number of stories m of the core plate 1 of back drill is 4, i.e., the on pcb board
Back drill 1112 on one to the 4th layer of core plate 1 needs to bore, and the width d1 of the loop wire 1113 of first layer is 4mil, a 1mil, back
Bore Aligning degree and be set as 4mil, it should be noted that the width of loop wire 1113, be exactly loop wire 1113 as route when sheet
Body width, the first test pole 113 and the second test pole 13 are conductive material.
Referring to attached drawing 1-3, a kind of test structure of the back drill Aligning degree of 5G circuit board, including from top to bottom successively laminate 10
Layer core plate 1, the test structure of the back drill Aligning degree of 5G circuit board further include 3 test cells 11 being located on 10 layers of core plate 1, go out
Line 12, the second test pole 13；3 test cells 11, outlet 12 are set on the 4th layer of core plate 1, and the second test pole 13 runs through 10 layers
It is connected between 1,3 test cells 11 of core plate by outlet 12, the second test pole 13 is connected with outlet 12；
Each test cell 11 includes: 4 groups 111, enter line 112,113,4 groups 111 of the first test pole lead to respectively
It crosses and is connected into line 112 with the first test pole 113, the 4th in 3 test cells 11 group 111 is connected with outlet 12, each
Group 111 includes: a brill 1111, back drill 1112, loop wire 1113, conductive line 1114, and loop wire 1113 is circular and is equipped with opening
11131, conductive line 1114 is connected with the opening 11131 of two adjacent loop wires 1113 respectively, the interior diameter of loop wire 1113 with
The diameter of back drill 1112 is equal, and the diameter of back drill 1112 is greater than a diameter for boring 1111；
One, which bores 1111, back drill 1112, the first test pole 113, runs through 10 layers of core plate 1.
The width of loop wire 1113 in each group 111 is equal.
The width of loop wire 1113 in 1st to the 3rd test cell 11 is respectively 4mil, 5mil, 6mil.Back drill 1112
The difference of the diameter of diameter and a brill 1111 is 4mil.
A kind of test method of the back drill Aligning degree of 5G circuit board, comprising steps of
S1: 3 first the second test poles of test pole 113 and 1 13 are added on pcb board；
S2: it lays on the 4th layer of core plate 1 into line 112, conductive line 1114, loop wire 1113, outlet 12；
S3: the 1st to the 4th layer of core plate 1 is drilled through along back drill 1112 using nozzle is bored；
S4: on the 1st layer of core plate 1 on PCB, the both ends of multimeter are separately connected the second test pole 13 and the first test
The first test pole 113 in unit 11.In test, when multimeter short circuit, indicate that back drill offset is less than or equal to 4mil；
When multimeter open circuit, indicate that back drill offset is greater than 4mil.In the 1st test of test cell 11, when multimeter short circuit, i.e.,
It when back drill offset is less than or equal to 4mil, then can be produced, be simultaneously stopped the 2nd test cell 11 of detection and the 3rd
Test cell 11；
It, must detection the 2nd when multimeter is opened a way, i.e., back drill offset is greater than 4mil in the 1st test of test cell 11
The both ends of multimeter are separately connected the first test pole in the second test pole 13 and the second test cell 11 by a test cell 11
113.In test, when multimeter short circuit, indicate that back drill offset is less than or equal to 5mil, but be greater than 4mil；When multimeter is opened
Lu Shi indicates that back drill offset is greater than 5mil.When multimeter short circuit in this test, i.e. back drill offset is less than or equal to 5mil,
But be greater than 4mil when, then can be according to the value range of back drill offset: 4mil-5mil, adjust back drill 1112 drilling parameter or
Person's pcb board is simultaneously stopped the 3rd test cell 11 of detection without next process.
It, must detection the 3rd when multimeter is opened a way, i.e., back drill offset is greater than 5mil in the 2nd test of test cell 11
A test cell 11.The both ends of multimeter are separately connected the first test pole in the second test pole 13 and third test cell 11
113.In test, when multimeter short circuit, indicate that back drill offset is less than or equal to 6mil, but be greater than 5mil；When multimeter is opened
Lu Shi indicates that back drill offset is greater than 6mil.When multimeter short circuit in this test, i.e. back drill offset is less than or equal to 6mil,
But be greater than 5mil when, then can be according to back drill offset ranges value: 5mil-6mil, adjust back drill 1112 drilling parameter or
The pcb board is without next process.
The working principle of the test structures and methods of the back drill Aligning degree of 5G circuit board provided by the invention are as follows: back drill 1112
Diameter it is with the interior diameter of all 11 Middle Ring Lines 1113 of test cell equal, the diameter of back drill 1112 and one bore 1111 diameter
Difference is equal to the minimum widith of all 11 Middle Ring Lines 1113 of test cell.When the hole heart of back drill 1112 and a brill 1111 is away from being 0,
1112 bias of back drill is minimum, and one bores 1111 is bored by complete.When back drill 1112 bores the 1111 hole heart away from being less than or wait with one
When the minimum widith of all 11 Middle Ring Lines 1113 of test cell, that is, back drill offset is less than or equal to all test cells 11
The minimum widith of Middle Ring Line 1113, one, which bores 1111, is located within back drill 1112, and one bores 1111 is bored by complete；At this point, back drill
1112 are located within loop wire 1113, and loop wire 1113 is in the state of connection.When back drill 1112 bores the 1111 hole heart away from being greater than with one
When the minimum widith of all 11 Middle Ring Lines 1113 of test cell, that is, back drill offset is greater than all 11 Middle Ring Lines of test cell
1113 minimum widith, one bores 1111 intersects with back drill 1112, and one, which bores 1111 only parts, is amputated；At this point, back drill 1112 with
Loop wire 1113 intersects, and loop wire 1113 is in the state disconnected.It whether is that can determine whether by 1113 mode of loop wire by test electric current
Whether amputate a brill 1111 completely when amputating back drill 1112 on pcb board out.
When the hole heart of back drill 1112 and a brill 1111 is away from the minimum widith for being greater than all 11 Middle Ring Lines 1113 of test cell,
Then tested next time.When the hole heart of back drill 1112 and a brill 1111 is away from less than or equal to 11 Middle Ring Line 1113 of test cell
Another width when.That is, back drill offset is less than or equal to another width of 11 Middle Ring Line 1113 of test cell and is greater than institute
There is the minimum widith of 11 Middle Ring Line 1113 of test cell.The different in width value of 11 Middle Ring Line 1113 of test cell and test electric current are
It is no to be combined by both loop wires 1113 it may determine that the value range of back drill offset, the value range be adjustment back drill out
Whether 1112 parameters continue next procedure offer foundation.The present invention does not have to production slice, by setting on core plate 1 on PCB
Count route, using ordinary multimeter can mass detection pcb board back drill offset, speed is fast, and detection limit is big, improves
Detection efficiency reduces the probability of error.Secondly, accurate offset ranges value can be provided, mentioned for the adjustment in later period
For foundation.Time cost and human cost are reduced simultaneously.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of test structure of the back drill Aligning degree of 5G circuit board, which is characterized in that including from top to bottom successively laminate the 1st
To n-th layer core plate；Wherein n is natural number, n > 2；
Described 1st to n-th layer core plate further include: the 1st to w-th test cell, outlet, the second test pole, the described 1st to w
A test cell, the outlet are set on the m layers of core plate, and second test pole runs through the m layers of core plate, described
Be connected between r-th of test cell and the r+1 test cell by the outlet, second test pole with it is described
Outlet is connected；Wherein r, w, m are natural number, 0 < r < w-1,1 < m < n；
R-th of test cell includes: the 1st to j-th group, enters line, the first test pole, and the 1st to j-th group is logical
Enter line described in crossing to be connected with first test pole, j-th of group is connected with the outlet, k-th of group packet
Include: a brill, back drill, loop wire, conductive line, the loop wire be circular and be equipped with opening, and the conductive line is respectively with adjacent two
The opening of a loop wire is connected, and the diameter of the back drill is greater than described one diameter bored, and wherein j and k is nature
Number, 1 < k < j；
One brill, the back drill, first test pole, second test pole run through the described 1st to n-th layer core plate.
2. the test structure of 5G circuit board back drill Aligning degree according to claim 1, which is characterized in that the loop wire it is interior
Diameter is equal with the diameter of the back drill.
3. the test structure of 5G circuit board back drill Aligning degree according to claim 2, which is characterized in that the width of the loop wire
Degree is d, and the width of the loop wire in the 1st to j-th group is equal.
4. the test structure of 5G circuit board back drill Aligning degree according to claim 3, which is characterized in that the described 1st to w
The width of the loop wire in a test cell is respectively d1, d2 ..., dw；Wherein: dw=d1+a* (w-1), a > 0.
5. the test structure of 5G circuit board back drill Aligning degree according to claim 4, which is characterized in that the back drill it is straight
The difference of the diameter of diameter and a brill is equal to d1.
6. a kind of test method of the back drill Aligning degree of 5G circuit board, which is characterized in that comprising steps of
S1: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5 is the described 1st to the n-th
First test pole and second test pole are added on layer core plate；
S2: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5 is in the m layers of core plate
Enter line, the conductive line, the loop wire, the outlet described in upper laying；
S3: the test structure of 5G circuit board back drill Aligning degree according to claim 1-5, using tool described in
Back drill drills through the 1st to the m layers core plate；
S4: the test of the described in any item 5G circuit board back drill Aligning degrees of claim 1-5 is separately connected with the both ends of multimeter
First test pole in second test pole and r-th of test cell on the 1st layer of core plate in structure, test
In, when multimeter short circuit, indicate that back drill offset is less than or equal to or is equal to dr；When multimeter open circuit, indicate that back drill is inclined
Shifting amount is greater than dr.
7. the test method of the back drill Aligning degree of 5G circuit board according to claim 6, which is characterized in that in step S4,
When multimeter short circuit, then stop testing, when multimeter open circuit, then r value adds 1, repeats S4 step.
8. the test method of the back drill Aligning degree of 5G circuit board according to claim 7, which is characterized in that before step S1
Further include: according to customer demand, determine the core plate number of plies for needing back drill, the described in any item 5G circuit backboards of claim 1-5
Bore layer of the described 1st in the test structure of Aligning degree to the m layers of core plate for back drill, i.e., described 1st to the m layers core plate
The back drill needs to bore.
9. the test method of the back drill Aligning degree of 5G circuit board according to claim 8, which is characterized in that back drill Aligning degree
It can then be produced for b as dr≤b；Work as dr > b, then it can be according to value range (dr-b-a)-(dr-b) of back drill offset
The drilling parameter or pcb board for being adjusted back drill do not continue next process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309949.2A CN110191569A (en) | 2019-04-17 | 2019-04-17 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910309949.2A CN110191569A (en) | 2019-04-17 | 2019-04-17 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
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| Publication Number | Publication Date |
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| CN110191569A true CN110191569A (en) | 2019-08-30 |
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|---|---|---|---|
| CN201910309949.2A Pending CN110191569A (en) | 2019-04-17 | 2019-04-17 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| CN111722087A (en) * | 2020-06-30 | 2020-09-29 | 生益电子股份有限公司 | Back drilling deviation test board and test method |
| CN111901959A (en) * | 2020-06-19 | 2020-11-06 | 黄石沪士电子有限公司 | PCB back drilling alignment capability measuring circuit and method |
| CN114383491A (en) * | 2021-11-26 | 2022-04-22 | 广州美维电子有限公司 | Quick deviation checking method for mechanical drilling |
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| US20050005438A1 (en) * | 2003-07-11 | 2005-01-13 | Endicott Interconnect Technologies, Inc. | Method of testing printed circuit board opening spacings |
| CN105764241A (en) * | 2016-03-23 | 2016-07-13 | 中国航天科技集团公司第九研究院第七七研究所 | Method for testing alignment of printed board product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
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| CN111901959A (en) * | 2020-06-19 | 2020-11-06 | 黄石沪士电子有限公司 | PCB back drilling alignment capability measuring circuit and method |
| CN111722087A (en) * | 2020-06-30 | 2020-09-29 | 生益电子股份有限公司 | Back drilling deviation test board and test method |
| CN114383491A (en) * | 2021-11-26 | 2022-04-22 | 广州美维电子有限公司 | Quick deviation checking method for mechanical drilling |
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Application publication date: 20190830 |