CN114383491A - Quick deviation checking method for mechanical drilling - Google Patents
Quick deviation checking method for mechanical drilling Download PDFInfo
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- CN114383491A CN114383491A CN202111422405.0A CN202111422405A CN114383491A CN 114383491 A CN114383491 A CN 114383491A CN 202111422405 A CN202111422405 A CN 202111422405A CN 114383491 A CN114383491 A CN 114383491A
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- hole
- deviation
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005553 drilling Methods 0.000 title claims abstract description 20
- 238000013461 design Methods 0.000 claims abstract description 31
- 238000012544 monitoring process Methods 0.000 claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 9
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 238000011161 development Methods 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000001514 detection method Methods 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 abstract description 28
- 239000002356 single layer Substances 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
Abstract
The invention discloses a quick deviation checking method of mechanical drilling, which adopts a conducting hole disc and a lead to carry out deviation module graph design, wherein the deviation module graph adopts the modes of film pasting, exposure, development and etching, and forms a graph to be conducted on each layer to be monitored; the non-conductive mechanical hole is designed at the relative position of the lead according to the deviation requirement to be monitored, penetrates through the monitoring layer, and forms a loop required in the power-on test and a form capable of being visually detected with the graph design; designing a conducting mechanical hole or a conducting laser hole at two ends of the circuit; the method is used for judging in a loop in a universal meter or a simple short-circuit clamp or an electrical measurement mode, and the resistance values of a circuit, an open circuit and a line are analyzed to confirm the deviation performance of the mechanical hole. By adopting methods such as pattern making, mechanical drilling and the like, the deviation and the deviation of each layer of the mechanical hole can be detected more effectively, and the different degrees and the direction conditions of the deviation of a single layer can be confirmed.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a quick deviation checking method for mechanical drilling.
Background
At present, the circuit board manufacture is developed towards the high, precise and precise directions, and the distance from the mechanical hole to the conductor and the distance between the mechanical holes pad are smaller and smaller under the influence of circuit design. At present, the mechanical drilling deviation is mainly detected by an X-ray machine to check the deviation condition of a mechanical hole pad or visually check whether copper is exposed on the hole wall. However, as the number of layers increases, the layers cannot be accurately offset and oriented after being stacked; in addition, whether copper is exposed on the hole wall of the non-electroplating mechanical hole or not is checked, the difficulty is increased due to the increase of the layer number, and the risk of missing detection exists.
However, the existing deviation detection has the following defects:
in the actual operation process, the mechanical hole has the deviation, but the deviation is difficult to be identified after the detection is actually overlapped due to the pad, and the deviation condition of the mechanical hole cannot be detected through the electrical test. The non-electroplating via hole is routinely checked in the industry, whether a metal conductor is exposed on the inner side of the hole wall is visually checked, but the detection is limited by visual inspection along with the increase of the number of layers, the detection leakage risk exists, the detection efficiency is low, and the identification degree is low.
Disclosure of Invention
In order to overcome the defects of the prior art, an object of the present invention is to provide a method for rapidly inspecting deviation of mechanical drilling, which can solve the problems of low detection efficiency and low recognition degree.
One of the purposes of the invention is realized by adopting the following technical scheme:
a quick deviation checking method for mechanical drilling comprises the following steps:
a pattern design step: adopting a through hole disc and a lead to carry out deviation module graph design, wherein the deviation module graph adopts the modes of film pasting, exposure, development and etching to form a graph to be conducted on each layer to be monitored;
a loop forming step: the non-conductive mechanical hole is designed at the relative position of the lead according to the deviation requirement to be monitored, penetrates through the monitoring layer, and forms a loop required in the power-on test and a form capable of being visually detected with the graph design;
a hole design step: designing a conducting mechanical hole or a conducting laser hole at two ends of the circuit;
a detection step: the method is used for judging in a loop in a universal meter or a simple short-circuit clamp or an electrical measurement mode, and the resistance values of a circuit, an open circuit and a line are analyzed to confirm the deviation performance of the mechanical hole.
Further, in the pattern design step, the width of the conductive line is defined according to design requirements.
Further, in the graphic design step, the wires and the holes are designed to be in different relative directions according to the requirement of monitoring the relative directions of the holes and the graphics.
Further, in the graphic design step, whether the conducting graphics meet requirements is checked, if yes, the next step is executed, and if not, the reworking processing is carried out.
Further, in the loop forming step, when the total number of layers is set to be 2n and the level of the mechanical hole is set to be L1-L2 n, the offset situation of the layers L2-L2 n-1 needs to be monitored, the non-conductive mechanical hole is designed to be drilled in the layer L1-2n, and the conductor patterns of each layer are distributed at the relative position of the non-conductive mechanical hole.
Further, in the loop forming step, whether the relative position design of the non-conductive mechanical hole meets the requirements is checked, if so, the next step is executed, and if not, the rework processing is carried out.
Further, in the detection step, if the relative distance between the mechanical hole and the lead is Amil and the line width is Bmil, a is greater than B, when the deviation of the mechanical drilling is greater than or equal to a, the lead is disconnected to form an open circuit, whether the lead is in the open circuit state is measured, and if yes, whether line width fracture occurs at the intersection position of the mechanical hole and the lead is observed by adopting X-ray or CT.
Further, in the detecting step, the size change of the position or distance of the mechanical hole relative to the lead is analyzed, and the deviation condition of the mechanical hole and the graph is monitored by the detecting module.
Further, in the detection step, the width of the conducting wire is increased or narrowed, and the deviation condition of the mechanical hole and the pattern is analyzed through the change of the resistance value or the size of the conducting wire gap.
Further, in the detection step, the data of the on-circuit, the off-circuit and the line resistance value are subjected to summary analysis to form a record table.
Compared with the prior art, the invention has the beneficial effects that:
1. by adopting methods such as pattern making, mechanical drilling and the like, the deviation and the deviation of each layer of the mechanical hole can be detected more effectively, and the different degrees and the direction conditions of the deviation of a single layer can be confirmed.
2. The mechanical drilling module can be tested in various modes, and the problems of process monitoring and finished product monitoring are solved simultaneously. Meanwhile, the design is more flexible, and different deviation sizes and directions can be monitored according to requirements; the PCB can be designed along with a PCB finished product board, has better traceability and detection capability, and reduces leakage caused by manual detection; in addition, 100% full detection conditions can be provided, and the condition that the product is abnormally leaked is reduced.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a method for inspecting mechanical drill hole for fast deviation according to a preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view of the deflection detection;
FIG. 3 is a front view of an unbiased condition;
FIG. 4 is a front view of the offset condition of the unshown contour lines;
FIG. 5 is a front view showing the deviation of the contour lines;
FIG. 6 is a front view of the offset condition;
FIG. 7 is a schematic view of monitoring 360 degree directional misalignment;
FIG. 8 is a schematic illustration of monitoring X, Y for directional misalignment.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-8, a method for inspecting a mechanical drill hole for fast deviation includes the following steps:
a pattern design step: adopting a through hole disc and a lead to carry out deviation module graph design, wherein the deviation module graph adopts the modes of film pasting, exposure, development and etching to form a graph to be conducted on each layer to be monitored;
preferably, in the pattern design step, the width of the conductive line is defined according to design requirements. According to the requirement of monitoring the relative direction of the hole and the graph, the lead and the hole are designed to be in different relative directions. And checking whether the conducting graph meets the requirements, if so, executing the next step, and if not, performing rework processing.
If mechanical drilling is needed on an L1-2n layer, the monitoring deviation level is an L2-L2 n-1 layer, deviation module graphs are designed in L2, L3, Ln +2 … L2n-2 and L2n-1, and via pad graphs are designed in L1 and L2 n. The pattern is designed to form a loop required for the power-on test and a visually detectable pattern with holes. Specifically, the offset module pattern forms a to-be-connected pattern on each layer to be monitored through the processes of film pasting, exposure, development, etching and the like. The width of the conductive line can be defined according to the design requirement.
Specifically, different relative directions of the lead and the hole can be designed according to the requirement of monitoring the relative direction of the hole and the graph, wherein the lead of the detection module is designed to form different angles or arc lengths; referring to FIG. 7, if the guide is designed as two 180 degree arcs, the hole is formed to be 360 degrees with respect to the pattern, so as to monitor the deviation of the hole with respect to the pattern in 360 degrees; referring to fig. 8, the conductive lines are designed in the vertical and horizontal directions, and the monitoring is performed in four directions, but not limited thereto. If the monitoring direction changes, the arc length can be designed from 0 to 360 degrees according to requirements; if the monitoring direction changes, straight lines with different angles can be designed according to requirements, and the angles can be 0-360 degrees; if the monitoring direction changes, straight lines, arc lines, single groups and multiple groups in different directions can be designed according to requirements. If each layer of confirmation is needed, each layer is designed in a staggered mode; if all layers are merged and monitored, all layers are merged and designed; the test deviation degree can be one or more according to the requirement, and the test deviation degree can be designed in a combined mode according to the requirement.
A loop forming step: the non-conductive mechanical hole is designed at the relative position of the lead according to the deviation requirement to be monitored, penetrates through the monitoring layer, and forms a loop required in the power-on test and a form capable of being visually detected with the graph design;
preferably, in the loop forming step, when the total number of layers is set to be 2n and the mechanical holes are located at the layers L1 to L2n, and the offset situation of the layers L2 to L2n-1 needs to be monitored, the non-conductive mechanical holes are designed to be drilled in the layers L1-2n, and the conductor patterns of the layers are distributed at the relative positions of the non-conductive mechanical holes. In the loop forming step, whether the relative position design of the non-conductive mechanical hole meets the requirements is checked, if yes, the next step is executed, and if not, the reworking processing is carried out.
Specifically, referring to fig. 7-8, when the mechanical hole is deviated, the relative position between the L1-2n non-conductive mechanical hole and the conductive wire changes, and when the positional deviation becomes relatively large, the conductive wire is cut and reduced by the non-conductive hole, and during the monitoring test, the deviation degree can be confirmed by the change of the resistance value.
A hole design step: designing a conducting mechanical hole or a conducting laser hole at two ends of the circuit;
a detection step: the method is used for judging in a loop in a universal meter or a simple short-circuit clamp or an electrical measurement mode, and the resistance values of a circuit, an open circuit and a line are analyzed to confirm the deviation performance of the mechanical hole. And summarizing and analyzing the data of the on-circuit, the off-circuit and the line resistance value and forming a recording table.
Preferably, in the detecting step, if the relative distance between the mechanical hole and the wire is Amil and the wire width is Bmil, a is greater than B, when the mechanical drilling deviation is greater than or equal to a, the wire is disconnected to form an open circuit, and whether the wire is in the open circuit state is measured, and if so, X-ray or CT is adopted to observe whether the wire width fracture occurs at the intersection position of the mechanical hole and the wire.
Preferably, in the detecting step, the size change of the position or distance of the mechanical hole relative to the wire is analyzed, and the detection module is confirmed to monitor the deviation condition of the mechanical hole and the graph.
Preferably, in the detecting step, the width of the conducting wire is increased or narrowed, and the deviation between the mechanical hole and the pattern is analyzed through the change of the resistance value or the size of the gap of the conducting wire.
Specifically, the following are exemplified:
if the relative distance between the mechanical hole and the lead is 8mil and the line width is 3mil, when the deviation of the mechanical drilling hole is more than or equal to 8mil, the lead is disconnected to form an open circuit, and the measurement result is the open circuit when the deviation is measured by a multimeter/simple short circuit clamp/electrical measurement method and the like; when the device is observed from X-ray/CT and the like, the line width of the intersection position of the mechanical hole and the conducting wire can be seen to be broken.
If the relative distance between the mechanical hole and the lead is 8mil and the line width is 3mil, when the mechanical drilling is deviated by 5-8 mil, the lead has a gap, and when the mechanical drilling is measured by a multimeter/simple short circuit clamp/electrical measurement method and the like, the resistance value of the measurement result is larger, the resistance value can be confirmed to be measured by standard coupon or counted by batch data, and the deviation degree can be judged through the change of the resistance value; when the X-ray/CT equipment is observed, the line width of the intersection position of the mechanical hole and the conducting wire is provided with a gap.
If the relative distance between the mechanical hole and the lead is 8mil and the line width is 3mil, when the deviation of the mechanical drilling hole is less than 5mil, the lead is complete, and when the deviation is measured by a multimeter/simple short circuit clamp/electrical measurement method and the like, the loop is normal, the resistance requirement is met, and the resistance can be confirmed to be measured by standard coupon measurement or batch data statistics; when the device is observed by X-ray/CT and the like, the lead can be seen to be complete, and the mechanical hole is away from the position of the lead.
The mechanical drilling module can be tested in various modes, and the problems of process monitoring and finished product monitoring are solved simultaneously. Meanwhile, the design is more flexible, and different deviation sizes and directions can be monitored according to requirements; the PCB can be designed along with a PCB finished product board, has better traceability and detection capability, and reduces leakage caused by manual detection; in addition, 100% full detection conditions can be provided, and the condition that the product is abnormally leaked is reduced.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A quick deviation checking method for mechanical drilling is characterized by comprising the following steps:
a pattern design step: adopting a through hole disc and a lead to carry out deviation module graph design, wherein the deviation module graph adopts the modes of film pasting, exposure, development and etching to form a graph to be conducted on each layer to be monitored;
a loop forming step: the non-conductive mechanical hole is designed at the relative position of the lead according to the deviation requirement to be monitored, penetrates through the monitoring layer, and forms a loop required in the power-on test and a form capable of being visually detected with the graph design;
a hole design step: designing a conducting mechanical hole or a conducting laser hole at two ends of the circuit;
a detection step: the method is used for judging in a loop in a universal meter or a simple short-circuit clamp or an electrical measurement mode, and the resistance values of a circuit, an open circuit and a line are analyzed to confirm the deviation performance of the mechanical hole.
2. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the pattern design step, the width of the conductive line is defined according to design requirements.
3. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the graphic design step, the lead and the hole are designed to be in different relative directions according to the requirement of monitoring the relative direction of the hole and the graphic.
4. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the graphic design step, whether the conducting graphics meet the requirements is checked, if yes, the next step is executed, and if not, the reworking processing is carried out.
5. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the loop forming step, when the total number of layers is set to be 2n and the level of the mechanical hole is set to be L1-L2 n, the partial deviation condition of the layers L2-L2 n-1 needs to be monitored, the non-conductive mechanical hole is designed to be drilled in the layer L1-2n, and the wire patterns of the layers are distributed at the relative positions of the non-conductive mechanical holes.
6. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the loop forming step, whether the relative position design of the non-conductive mechanical hole meets the requirements is checked, if yes, the next step is executed, and if not, the reworking processing is carried out.
7. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the detection step, if the relative distance between the mechanical hole and the lead is Amil and the line width is Bmil, A is larger than B, when the deviation of the mechanical drilling is larger than or equal to A, the lead is disconnected to form an open circuit, whether the lead is in an open circuit state is measured, and if the deviation is larger than or equal to A, whether line width fracture occurs at the intersection position of the mechanical hole and the lead is observed by adopting X-ray or CT.
8. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the detection step, the change of the position or the distance of the mechanical hole relative to the lead is analyzed, and the deviation condition of the mechanical hole and the graph is monitored by the detection module.
9. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the detection step, the width of the wire is increased or narrowed, and the deviation condition of the mechanical hole and the pattern is analyzed through the change of the resistance value or the size of a wire gap.
10. The method of claim 1, wherein the step of inspecting mechanical drill hole for rapid deviation comprises: in the detection step, the data of the resistance values of the paths, the broken circuits and the lines are summarized and analyzed to form a record table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111422405.0A CN114383491A (en) | 2021-11-26 | 2021-11-26 | Quick deviation checking method for mechanical drilling |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111422405.0A CN114383491A (en) | 2021-11-26 | 2021-11-26 | Quick deviation checking method for mechanical drilling |
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| CN114383491A true CN114383491A (en) | 2022-04-22 |
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| CN202111422405.0A Pending CN114383491A (en) | 2021-11-26 | 2021-11-26 | Quick deviation checking method for mechanical drilling |
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|---|---|---|---|---|
| US5066908A (en) * | 1989-02-27 | 1991-11-19 | Nec Corporation | Method for electrically detecting positional deviation of contact hole in semiconductor device |
| CN102054719A (en) * | 2009-10-30 | 2011-05-11 | 日月光半导体（上海）股份有限公司 | Method and structure for measuring circuit offset by using circuit substrate |
| CN104582331A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Inner-layer deviation detecting method for multi-layer circuit board |
| CN104582238A (en) * | 2013-10-22 | 2015-04-29 | 重庆方正高密电子有限公司 | PCB (printed circuit board) and manufacturing method thereof |
| CN110191569A (en) * | 2019-04-17 | 2019-08-30 | 奥士康科技股份有限公司 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
| CN113218294A (en) * | 2021-04-07 | 2021-08-06 | 奥士康科技股份有限公司 | Depth and alignment precision detection coupon for back drilling |
-
2021
- 2021-11-26 CN CN202111422405.0A patent/CN114383491A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5066908A (en) * | 1989-02-27 | 1991-11-19 | Nec Corporation | Method for electrically detecting positional deviation of contact hole in semiconductor device |
| CN102054719A (en) * | 2009-10-30 | 2011-05-11 | 日月光半导体（上海）股份有限公司 | Method and structure for measuring circuit offset by using circuit substrate |
| CN104582238A (en) * | 2013-10-22 | 2015-04-29 | 重庆方正高密电子有限公司 | PCB (printed circuit board) and manufacturing method thereof |
| CN104582331A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Inner-layer deviation detecting method for multi-layer circuit board |
| CN110191569A (en) * | 2019-04-17 | 2019-08-30 | 奥士康科技股份有限公司 | A kind of test structures and methods of the back drill Aligning degree of 5G circuit board |
| CN113218294A (en) * | 2021-04-07 | 2021-08-06 | 奥士康科技股份有限公司 | Depth and alignment precision detection coupon for back drilling |
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