CN105848427B - The boring method of pcb board, method, pcb board and the equipment for examining pcb board drilling deviation - Google Patents

The boring method of pcb board, method, pcb board and the equipment for examining pcb board drilling deviation Download PDF

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Publication number
CN105848427B
CN105848427B CN201510018405.2A CN201510018405A CN105848427B CN 105848427 B CN105848427 B CN 105848427B CN 201510018405 A CN201510018405 A CN 201510018405A CN 105848427 B CN105848427 B CN 105848427B
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hole
back drill
drill hole
pcb board
3mil
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CN105848427A (en
Inventor
郭聪
丁大舟
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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Abstract

The embodiment of the invention discloses a kind of boring methods of pcb board, method, pcb board and the equipment of inspection pcb board drilling deviation, and the boring method of the pcb board includes: by opening up through-hole in nation of the test section preset lead to the hole site in region;N number of back drill hole is symmetrically opened up in the through-hole surrounding, the through-hole is equal with the spacing in each back drill hole in N number of back drill hole, N number of back drill hole forms a n-shaped, effectively improve the precision of contraposition, underproof product is detected in advance, yields is promoted, does not also need largely to be sliced, production cost is effectively reduced.

Description

The boring method of pcb board, method, pcb board and the equipment for examining pcb board drilling deviation
Technical field
The present invention relates to printed circuit board (PCB, Printed circuit board) manufacturing fields, more particularly to one kind The boring method of pcb board, method, pcb board and the equipment for examining pcb board drilling deviation.
Background technique
With the functional diversities that PCB is realized, component develops towards densification direction, and the working frequency of communication products is more next It is higher, it is therefore desirable to the loss of transmission process is controlled, generally use the back drill of printed circuit board to reduce pore chain path loss Consumption, i.e. extra hole copper length above signals layer after reduction back drill, to reach the low-loss purpose of drop.
In the prior art, the test method of general pcb board back drill deviation is production slice after processing back drill, and is utilized micro- Mirror judges whether the Aligning degree of back drill hole and through-hole meets the requirements, determined by Aligning degree back drill hole and through-hole whether deviation.
But need to make a large amount of slices in process, and be sliced test as destructive irreversible test, cause good Product rate reduces, and processing cost is high.
Summary of the invention
The embodiment of the present invention provides a kind of boring method of pcb board, the method for examining pcb board drilling deviation, pcb board and sets It is standby, it is able to solve in the prior art, a large amount of slices is needed when checking drilling deviation, and be sliced test as destructive irreversible survey The problem of trying, yields caused to reduce.
First aspect present invention provides a kind of boring method of pcb board, comprising:
Through-hole is opened up in nation of the test section preset lead to the hole site in region;
N number of back drill hole is symmetrically opened up in the through-hole surrounding, each back drill hole in the through-hole and N number of back drill hole Spacing is equal, and N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number;
In the hole wall metal cladding of the through-hole.
In conjunction with first aspect present invention, in the embodiment of the present invention in the first implementation of first aspect, the test Default nation of the section value in nation of section region is w, and the unilateral offset in the aperture in the back drill hole is d, and the diameter in the back drill hole is D1, The diameter of the through-hole is D2, wherein 2d≤D1-D2, wherein D1> D2+w。
In conjunction with second of implementation of first aspect present invention and first aspect, first aspect in the embodiment of the present invention In second of implementation, the spacing is a, wherein a=d.
Second aspect of the present invention provides a kind of method of inspection pcb board drilling deviation, comprising:
By pcb board and test board interlayer alignment, it is overlapped nation of test section region with test zone, obtains the first layer of through-hole Between Aligning degree R1With the second interlayer Aligning degree R in N number of back drill hole2, N number of back drill hole is symmetrically provided with the through-hole surrounding, institute It is equal with the spacing in each back drill hole in N number of back drill hole to state through-hole, N number of back drill hole forms a n-shaped, wherein N >=4, N are even number;
In R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole do not deviate;
In R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
In conjunction with second aspect, in the first implementation of second aspect of the present invention, the determination through-hole and described After back drill hole deviates further include:
Obtain the deviation post in the back drill hole;
The reason of determining the back deflection of borehole according to the deviation post.
In conjunction with the first implementation of second aspect, in second of implementation of second aspect of the present invention, described The reason of determining the back deflection of borehole according to the deviation post specifically includes:
When determining that the deviation post exceeds default first error range, the reason of determining the back deflection of borehole is whole Solid offsetting;
When determining that the deviation post exceeds default second error range, the reason of determining the back deflection of borehole is material Expect size harmomegathus.
Third aspect present invention provides a kind of pcb board, through-hole and N number of back drill hole;
The through-hole is provided with nation of the test section preset lead to the hole site in region;
N number of back drill hole is symmetrically provided with the through-hole surrounding, each back drill in the through-hole and N number of back drill hole The spacing in hole is equal, and N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number;
The hole wall of the through-hole is coated with metal layer.
In conjunction with third aspect present invention, in the embodiment of the present invention in the first implementation of the third aspect, the test Default nation of the section value in nation of section region is w, and the unilateral offset in the aperture in the back drill hole is d, and the diameter in the back drill hole is D1, The diameter of the through-hole is D2, wherein 2d≤D1-D2, wherein D1> D2+w。
In conjunction with the first implementation of third aspect present invention, second of the third aspect is realized in the embodiment of the present invention In mode, the spacing a, wherein a=d.
Fourth aspect present invention provides a kind of equipment for examining the deviation that drills on pcb board,
Include:
Processing module, for being overlapped nation of test section region with test zone for pcb board and test board interlayer alignment;
Computing module, for obtaining the first interlayer Aligning degree R of through-hole1With the second interlayer Aligning degree R in N number of back drill hole2, N number of back drill hole is symmetrically provided with the through-hole surrounding, the spacing in each back drill hole in the through-hole and N number of back drill hole Equal, N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number;
Judgment module, in R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole do not deviate;? R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
As can be seen from the above technical solutions, the boring method of a kind of pcb board provided by the invention, by nation of test section The preset lead to the hole site in region opens up through-hole;Symmetrically open up N number of back drill hole in the through-hole surrounding, the through-hole with it is described N number of The spacing in each back drill hole is equal in back drill hole, and N number of back drill hole forms a n-shaped, effectively improves the accurate of contraposition Degree detects underproof product in advance, promotes yields, does not also need largely to be sliced, production cost is effectively reduced.
Detailed description of the invention
Fig. 1 is one embodiment schematic diagram of boring method of pcb board in the present embodiment;
Fig. 2 is one embodiment schematic diagram of method that pcb board drilling deviation is examined in the present embodiment;
Fig. 3 is a kind of pcb board the schematic diagram of the section structure in the present embodiment;
Fig. 4 is one structural schematic diagram of equipment that the deviation that drills on pcb board is examined in the present embodiment.
In attached drawing, component representated by each label is as follows:
1, through-hole, 2, back drill hole, 3, nation of test section region.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art are not having Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
Description and claims of this specification and term " first ", " second ", " third " " in above-mentioned attached drawing Four " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way Data be interchangeable under appropriate circumstances, so that the embodiments described herein can be in addition to illustrating herein or describing Sequence other than appearance is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that covering is non-exclusive Include, for example, the process, method, system, product or equipment for containing a series of steps or units are not necessarily limited to clearly arrange Those of out step or unit, but may include be not clearly listed or it is solid for these process, methods, product or equipment The other steps having.
The embodiment of the invention provides a kind of boring method of pcb board, examine the pcb board drilling method of deviation, pcb board and Equipment needs a large amount of slices in the prior art for solving, and is sliced test as destructive irreversible survey when checking drilling deviation The problem of trying, yields is caused to reduce, is described in detail below.
Referring to Fig. 1, a kind of boring method of pcb board in the embodiment of the present invention, comprising:
101, in nation of test section, the preset lead to the hole site in region opens up through-hole;
Printed circuit board 1 includes multilayer line layer, You Ke nation is designed on circuit board, wherein a sandwich circuit layer is in nation of section region With line pattern, other sandwich circuit layers do not have line pattern in nation of section region, and nation of section belongs to a kind of design of printed circuit board 1 Structure, for controlling deep drilling equipment in the control of the progress drilling depth of printed circuit board 1.
102, N number of back drill hole is symmetrically opened up in the through-hole surrounding;
The through-hole is equal with the spacing in each back drill hole in N number of back drill hole, and N number of back drill hole is forming one just The side N shape, wherein N >=4, N are even number;
It is understood that if through-hole surrounding opens up 4 back drill holes on nation of test section region, this 4 back drill hole phases It is equidistant for through-hole and symmetrical centered on through-hole, it, can be according to this 4 back drill holes when carrying out deviation inspection to back drill hole And through-hole carries out contraposition inspection, and to choose the parts product of deviation rapidly, and it is true according to the drift condition in each back drill hole Surely the reason of causing offset, then targetedly corrects the parts product according to actual cause.
In practical application, default nation of the section value in nation of the test section region is w, the unilateral compensation in the aperture in the back drill hole Value is d, and the diameter in the back drill hole is D1, the diameter of the through-hole is D2, wherein 2d≤D1-D2, wherein D1> D2+ w, specifically D1Depending on designing according to actual product, such as it can be arbitrary value, in addition, default nation of section value is set according to actual product design value It is fixed;
The offset d spacing a unilateral with the aperture is identical a=d, and the spacing is less than the aperture list Side, for example, then d≤3mil, d can be with value 2mil when D1=22mil, D2=16mil.
103, in the hole wall metal cladding of the through-hole.
In the embodiment of the present invention, through-hole is opened up in nation of the test section preset lead to the hole site in region;In the through-hole surrounding pair Title opens up N number of back drill hole, and the through-hole is equal with the spacing in each back drill hole in N number of back drill hole, N number of back drill hole shape At a n-shaped, the precision of contraposition is effectively improved, detects underproof product in advance, yields is promoted, does not also need A large amount of slices, are effectively reduced production cost.
Please refer to Fig. 2, a kind of method for examining pcb board drilling deviation provided in an embodiment of the present invention, comprising:
201, by pcb board and test board interlayer alignment, it is overlapped nation of test section region with test zone;
202, the first interlayer Aligning degree R of through-hole is obtained1With the second interlayer Aligning degree R in N number of back drill hole2
N number of back drill hole is symmetrically provided with the through-hole surrounding, each back drill in the through-hole and N number of back drill hole The spacing in hole is equal, and N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number.
203, according to R1Judge whether the through-hole deviates, according to R2Judge whether the back drill hole deviates;
Specific judgment criteria is as follows:
In R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole do not deviate;
In R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
Optionally, after the determination through-hole and the back drill hole deviate further include:
Obtain the deviation post in the back drill hole;
The reason of determining the back deflection of borehole according to the deviation post specifically can be deviation post and pre- bidding Level, which is set, to be compared;
It is specific to determine that offset reason mode is as follows in practical application:
When determining that the deviation post exceeds default first error range, the reason of determining the back deflection of borehole is whole Solid offsetting;
When determining that the deviation post exceeds default second error range, the reason of determining the back deflection of borehole is material Size harmomegathus is expected, for example, through-hole and back drill hole can be led in preset cycle-index with the variation of stress, the variation of stress Pore wall crack, interlaminar separation or aperture fracture etc..
In the embodiment of the present invention, by obtaining the first interlayer Aligning degree R of through-hole for pcb board and test board interlayer alignment1 With the second interlayer Aligning degree R in N number of back drill hole2, according to R1Judge whether the through-hole deviates, according to R2Judge the back drill hole Whether deviate, whether directly range estimation can confirm drills qualified twice, effectively improves the precision of contraposition, detects not conforming in advance The product of lattice promotes yields, does not also need largely to be sliced, production cost is effectively reduced.
Referring to Fig. 3, a kind of pcb board in the embodiment of the present invention, which is equipped with through-hole 1 and N number of back drill Hole 2;
The through-hole 1 is provided with the preset lead to the hole site in nation of test section region 3;
N number of back drill hole 2 is symmetrically provided with 1 surrounding of through-hole, the through-hole 1 with it is each in N number of back drill hole 2 spacing of back drill hole is equal, and N number of back drill hole 2 forms a n-shaped, and wherein N >=4, N are even number;
The hole wall of the through-hole 1 and the hole wall in each back drill hole 2 are coated with metal layer.
Wherein, default nation of the section value in nation of the test section region is w, and the offset that the aperture in the back drill hole 2 is unilateral is D, the diameter in the back drill hole are D1, the diameter of the through-hole is D2, wherein 2d≤D1-D2, wherein D1> D2+ w, specific D1Root Factually depending on the product design of border, such as it can be arbitrary value, in addition, default nation of section value is set according to actual product design value;
The offset d spacing a unilateral with the aperture is identical a=d, and the spacing is less than the aperture list Side, for example, then d≤3mil, d can be with value 2mil when D1=22mil, D2=16mil.
In the embodiment of the present invention, by opened up on nation of test section region 3 through-hole 1 and symmetrically be provided with 1 surrounding of through-hole, with The equidistant back drill hole 2 of through-hole 1 can carry out contraposition inspection according to this 4 back drill holes and through-hole, to choose deviation rapidly Parts product, effectively improves the precision of contraposition, detects underproof product in advance, promotes yields, does not also need a large amount of Slice, is effectively reduced production cost.
Referring to Fig. 4, a kind of equipment for examining the deviation that drills on pcb board provided in an embodiment of the present invention, comprising:
Processing module 401, for being overlapped nation of test section region with test zone for pcb board and test board interlayer alignment;
Computing module 402, for obtaining the first interlayer Aligning degree R of through-hole1With the second interlayer Aligning degree in N number of back drill hole R2, N number of back drill hole is symmetrically provided with the through-hole surrounding, the through-hole and each back drill hole in N number of back drill hole Spacing is equal, and N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number;
Judgment module 403, in R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole be not inclined It moves;In R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
In the embodiment of the present invention, pcb board and test board interlayer alignment are made nation of test section region and surveyed by processing module 401 Area coincidence is tried, computing module 402 obtains the first interlayer Aligning degree R of through-hole1With the second interlayer Aligning degree R in back drill hole2, sentence Disconnected module 403 judges whether the through-hole and the back drill hole deviate, and to reach in the case where not having to a large amount of slices, can mention The preceding technical effect for screening rejected part product, greatly increases the production efficiency, reduces cost.
Above to a kind of boring method of pcb board provided by the present invention, the method for examining pcb board drilling deviation, pcb board And equipment is described in detail, it is used herein that a specific example illustrates the principle and implementation of the invention, The above description of the embodiment is only used to help understand the method for the present invention and its core ideas;Meanwhile for the one of this field As technical staff, according to the thought of the present invention, there will be changes in the specific implementation manner and application range, to sum up institute It states, the contents of this specification are not to be construed as limiting the invention.

Claims (4)

1. a kind of method for examining pcb board drilling deviation characterized by comprising
It by pcb board and test board interlayer alignment, is overlapped nation of test section region with test zone, obtains the first interlayer pair of through-hole Accuracy R1With the second interlayer Aligning degree R in N number of back drill hole2, N number of back drill hole is symmetrically provided with the through-hole surrounding, described logical Hole is equal with the spacing in each back drill hole in N number of back drill hole, and the N number of back drill hole forms a n-shaped, wherein N >= 4, N be even number;
In R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole do not deviate;
In R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
2. the method according to claim 1, wherein the determination through-hole and the back drill hole deviate it Afterwards further include:
Obtain the deviation post in the back drill hole;
The reason of determining the back deflection of borehole according to the deviation post.
3. according to the method described in claim 2, it is characterized in that, described determine that the back drill hole is inclined according to the deviation post The reason of shifting, specifically includes:
When determining that the deviation post exceeds default first error range, the reason of determining the back deflection of borehole is whole inclined It moves;
When determining that the deviation post exceeds default second error range, the reason of determining the back deflection of borehole is material ruler Very little harmomegathus.
4. a kind of equipment for examining the deviation that drills on pcb board characterized by comprising
Processing module, for being overlapped nation of test section region with test zone for pcb board and test board interlayer alignment;
Computing module, for obtaining the first interlayer Aligning degree R of through-hole1With the second interlayer Aligning degree R in N number of back drill hole2, the N A back drill hole is symmetrically provided with the through-hole surrounding, and the through-hole is equal with the spacing in each back drill hole in N number of back drill hole, N number of back drill hole forms a n-shaped, and wherein N >=4, N are even number;
Judgment module, in R1≤ 3mil, R2When≤3mil, determine that the through-hole and the back drill hole do not deviate;In R1> 3mil, R2When > 3mil, determine that the through-hole and the back drill hole deviate.
CN201510018405.2A 2015-01-14 2015-01-14 The boring method of pcb board, method, pcb board and the equipment for examining pcb board drilling deviation Active CN105848427B (en)

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CN106304654B (en) * 2016-11-01 2019-03-05 生益电子股份有限公司 A kind of method promoting back drill STUB precision and the PCB using this method
CN110493961B (en) * 2019-08-13 2021-05-11 沪士电子股份有限公司 Method for monitoring alignment degree of outer layer of PCB (printed circuit board) during multiple drilling
CN110708874B (en) * 2019-09-24 2021-06-04 珠海崇达电路技术有限公司 Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate
CN110831326B (en) * 2019-10-21 2021-07-09 鹤山市世安电子科技有限公司 Method, device and equipment for controlling tolerance of crimping hole and storage medium
CN112140229B (en) * 2020-09-28 2021-06-18 广东鼎泰高科技术股份有限公司 Back drilling tool and preparation method thereof
CN113133226B (en) * 2021-04-20 2022-03-04 梅州市志浩电子科技有限公司 Circuit board high-precision back drilling method and circuit board

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