CN110176424A - 一种吸嘴安装牢固的清洁型芯片拾取设备 - Google Patents
一种吸嘴安装牢固的清洁型芯片拾取设备 Download PDFInfo
- Publication number
- CN110176424A CN110176424A CN201910312828.3A CN201910312828A CN110176424A CN 110176424 A CN110176424 A CN 110176424A CN 201910312828 A CN201910312828 A CN 201910312828A CN 110176424 A CN110176424 A CN 110176424A
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- Prior art keywords
- suction nozzle
- fixing axle
- suction pipe
- connecting column
- sleeve
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910312828.3A CN110176424B (zh) | 2019-04-18 | 2019-04-18 | 一种吸嘴安装牢固的清洁型芯片拾取设备 |
Applications Claiming Priority (1)
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CN201910312828.3A CN110176424B (zh) | 2019-04-18 | 2019-04-18 | 一种吸嘴安装牢固的清洁型芯片拾取设备 |
Publications (2)
Publication Number | Publication Date |
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CN110176424A true CN110176424A (zh) | 2019-08-27 |
CN110176424B CN110176424B (zh) | 2021-09-17 |
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CN201910312828.3A Active CN110176424B (zh) | 2019-04-18 | 2019-04-18 | 一种吸嘴安装牢固的清洁型芯片拾取设备 |
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CN (1) | CN110176424B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112295978A (zh) * | 2020-10-14 | 2021-02-02 | 杨龙兵 | 一种防脱落型芯片吸附设备 |
CN112520412A (zh) * | 2020-12-11 | 2021-03-19 | 南京思达捷信息科技有限公司 | 一种稳定高的芯片生产设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013105823A (ja) * | 2011-11-11 | 2013-05-30 | Disco Abrasive Syst Ltd | 板状物の分割方法 |
CN203882129U (zh) * | 2014-02-19 | 2014-10-15 | 深圳深爱半导体股份有限公司 | 芯片键合设备的芯片无法吸起报警装置 |
CN205704170U (zh) * | 2016-06-01 | 2016-11-23 | 佛山市联智新创科技有限公司 | 一种金属废料块抓取装置 |
CN107871684A (zh) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | 倒装芯片贴装机以及半导体器件的制造方法 |
CN207508273U (zh) * | 2017-11-16 | 2018-06-19 | 曲靖中铭科技有限公司 | 一种异型金属注塑坯件的吸附式取放装置 |
CN108189790A (zh) * | 2018-02-06 | 2018-06-22 | 江苏卡威汽车工业集团股份有限公司 | 一种皮卡前保险杠抗冲击组件 |
-
2019
- 2019-04-18 CN CN201910312828.3A patent/CN110176424B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013105823A (ja) * | 2011-11-11 | 2013-05-30 | Disco Abrasive Syst Ltd | 板状物の分割方法 |
CN203882129U (zh) * | 2014-02-19 | 2014-10-15 | 深圳深爱半导体股份有限公司 | 芯片键合设备的芯片无法吸起报警装置 |
CN205704170U (zh) * | 2016-06-01 | 2016-11-23 | 佛山市联智新创科技有限公司 | 一种金属废料块抓取装置 |
CN107871684A (zh) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | 倒装芯片贴装机以及半导体器件的制造方法 |
CN207508273U (zh) * | 2017-11-16 | 2018-06-19 | 曲靖中铭科技有限公司 | 一种异型金属注塑坯件的吸附式取放装置 |
CN108189790A (zh) * | 2018-02-06 | 2018-06-22 | 江苏卡威汽车工业集团股份有限公司 | 一种皮卡前保险杠抗冲击组件 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112295978A (zh) * | 2020-10-14 | 2021-02-02 | 杨龙兵 | 一种防脱落型芯片吸附设备 |
CN112520412A (zh) * | 2020-12-11 | 2021-03-19 | 南京思达捷信息科技有限公司 | 一种稳定高的芯片生产设备 |
Also Published As
Publication number | Publication date |
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CN110176424B (zh) | 2021-09-17 |
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CB03 | Change of inventor or designer information |
Inventor after: Sun Jianqiang Inventor after: Huang Ruixian Inventor after: Chen Wanwen Inventor after: Xu Kai Inventor after: Wan Sheng Inventor after: Qi Kuankuan Inventor before: Qi Kuankuan |
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Effective date of registration: 20210827 Address after: 518028 1027, New Asia Guoli building, No. 18, Zhonghang Road, Huahang community, Huaqiang North Street, Futian District, Shenzhen, Guangdong Province Applicant after: Shenzhen juyingxin Electronics Co.,Ltd. Address before: 510000 Room 87-9H, 200 Fangcun Road East, Liwan District, Guangzhou City, Guangdong Province (Office only) Applicant before: GUANGZHOU JIAJIANPAI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20230412 Address after: 518101 Room 302, building D, COFCO Gonghua project, Honglang community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Kangqiao Information Technology Co.,Ltd. Address before: 518028 1027, New Asia Guoli building, No. 18, Zhonghang Road, Huahang community, Huaqiang North Street, Futian District, Shenzhen, Guangdong Province Patentee before: Shenzhen juyingxin Electronics Co.,Ltd. |
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