CN110171181B - Mechanical laminating device for electronic product components and laminating method for preventing residual gas - Google Patents
Mechanical laminating device for electronic product components and laminating method for preventing residual gas Download PDFInfo
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- CN110171181B CN110171181B CN201910325767.4A CN201910325767A CN110171181B CN 110171181 B CN110171181 B CN 110171181B CN 201910325767 A CN201910325767 A CN 201910325767A CN 110171181 B CN110171181 B CN 110171181B
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- electric heating
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- lamination
- electronic product
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- 238000010030 laminating Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005485 electric heating Methods 0.000 claims abstract description 64
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims description 62
- 229920001971 elastomer Polymers 0.000 claims description 34
- 239000004744 fabric Substances 0.000 claims description 19
- 239000000523 sample Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 229920000297 Rayon Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 230000006872 improvement Effects 0.000 description 10
- 238000009413 insulation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
Abstract
The mechanical laminating device of the electronic product component and the laminating method of the anti-residual gas thereof, wherein the device comprises a vacuum box body and a mechanical laminating fixture, the vacuum box body comprises a cavity for installing the mechanical laminating fixture, the mechanical laminating fixture is fixedly or movably arranged in the cavity, the mechanical laminating fixture comprises an upper template and a lower template, the upper template and the lower template are connected into a whole at a preset distance through a support column, a support plate is arranged above the upper template, and a linear driving mechanism for driving the upper module 1 to lift is arranged on the support plate; the inner bottom surface of the upper template is provided with a first electric heating plate, or/and the inner bottom surface of the lower template is provided with a second electric heating plate. The invention has the advantages of high heating speed, quick gas discharge between the laminated modules and basically no residual gas.
Description
Technical Field
The invention relates to a mechanical lamination device for electronic product components such as a photovoltaic component, a flexible circuit board, lamination between a battery pole piece and a battery diaphragm and a lamination method for preventing residual gas.
Background
Laminating electronic product components, such as photovoltaic product components, by placing laid cells in a laminating machine, evacuating air from the components by vacuum evacuation, and heating to melt EVA to bond the cells, glass and back plate together; and finally cooling and taking out the module. For another example, the flexible circuit board is laminated by matching the upper air bag component with the vacuum plate, placing the flexible circuit board in a cavity formed by the upper air bag component and the vacuum plate, and pressing the flexible circuit board in a vacuumized environment by applying enough pressure to the air bag of the upper air bag component. Lamination is a key step in the production of electronic product components, and the quality of lamination directly affects the final quality of the electronic product components; the heating of the layer directly affects the lamination efficiency.
The existing lamination method of the electronic product component is to indirectly heat the laminated electronic product by hot air, and has the problems of low temperature rising speed, low hot air heat utilization rate and high energy consumption; secondly, the existing vacuumizing mode is unreasonable in design, and the problems that the air among electronic product components is discharged slowly, and the product quality is affected due to partial residual air exist.
Disclosure of Invention
In order to overcome the problems, the invention provides a mechanical lamination device for electronic product components and a lamination method for preventing residual gas, wherein the mechanical lamination device has high heating speed and high gas discharge speed between the electronic product components.
The technical scheme of the invention is as follows: the mechanical laminating device for the electronic product component comprises a vacuum box body and a mechanical laminating fixture, wherein the vacuum box body comprises a cavity for installing the mechanical laminating fixture, the mechanical laminating fixture is fixedly or movably arranged in the cavity, the mechanical laminating fixture comprises an upper template and a lower template, the upper template and the lower template are connected into a whole at a preset distance through a support column, a support plate is arranged above the upper template, and a linear driving mechanism for driving the upper template to lift is arranged on the support plate; the inner bottom surface of the upper template is provided with a first electric heating plate, or/and the inner bottom surface of the lower template is provided with a second electric heating plate.
As an improvement of the invention, a first heat-insulating soft rubber mat is arranged between the lower bottom surface of the upper template and the first electric heating plate.
As an improvement of the invention, a first heat conduction soft rubber mat is arranged on the lower bottom surface of the first electric heating plate.
As an improvement of the invention, a first high-temperature anti-sticking cloth is arranged on the lower bottom surface of the first heat-conducting soft rubber mat.
As an improvement of the invention, a grid for preventing the viscose from overflowing to the periphery is arranged on the lower bottom surface of the high-temperature anti-sticking cloth.
As an improvement of the invention, at least one first temperature control probe is arranged on the first electric heating plate, and the temperature control probe is connected with a first signal connector arranged on the upper template.
A second heat-insulating soft rubber cushion is arranged between the upper bottom surface of the lower template and the second electric heating plate.
As an improvement of the invention, a second heat conduction soft rubber mat is arranged on the upper bottom surface of the second electric heating plate.
As an improvement of the invention, a second high-temperature anti-sticking cloth is arranged on the upper bottom surface of the second heat-conducting soft rubber mat.
As an improvement of the invention, at least one second temperature control probe is arranged on the second electric heating plate, and the second temperature control probe is connected with a second signal connector arranged on the lower template.
As an improvement of the present invention, a first electrode connected to a first electric heating plate is provided on the upper die plate, and a second electrode connected to a second electric heating plate is provided on the lower die plate.
The inner wall of the cavity is provided with a first contact controlled by a control circuit and connected with the first electrode, or/and a second contact controlled by the control circuit and connected with the second electrode.
The invention also provides a mechanical residual gas prevention lamination method for the electronic product component, which comprises the following steps:
s1, arranging an electronic product component to be pressurized and heated in a mechanical lamination fixture;
s2, loading the mechanical lamination clamp with the electronic product component into a cavity of a vacuum box body, and at least conducting a first electric heating plate with a power supply controlled by a control circuit;
s3, closing a box door, vacuumizing the cavity, heating the electronic product components by at least a first electric heating plate, and applying pressure to the electronic product components by a linear driving mechanism during vacuumizing, so as to uniformly heat the thermosol and exhaust air between the electronic product components;
s4, after the temperature of the electronic product component reaches a preset temperature, keeping for a preset time;
s5, opening the box door, taking out the mechanical lamination clamp with the electronic product assembly, and then cooling;
and S6, repeating the steps S1-S5, and laminating the next electronic product assembly.
As an improvement to the present invention, the steps S1 and S2 can be replaced by the following steps,
s11, loading the mechanical lamination fixture into a cavity of a vacuum box body, and at least conducting a first electric heating plate with a power supply controlled by a control circuit;
s21, arranging the electronic product component to be pressurized and heated in the mechanical lamination fixture.
The invention also provides a mechanical residual gas prevention lamination method for the electronic product component, which comprises the following steps:
s31, placing the electronic product component to be pressurized and heated into a mechanical lamination fixture fixedly arranged in a vacuum box body, wherein the mechanical lamination fixture is the mechanical lamination fixture;
s32, closing a box door, vacuumizing the cavity, heating the electronic product components by at least a first electric heating plate, and applying pressure to the electronic product components by a linear driving mechanism during vacuumizing so as to uniformly distribute thermosol and exhaust air among the electronic product components;
s33, after the temperature of the electronic product component reaches a preset temperature, keeping for a preset time;
s34, opening the box door, taking out the electronic product assembly, and then cooling;
and S35, repeating the steps S31-S34, and laminating the next electronic product assembly.
The invention directly heats the electronic product components by adopting an electric heating mode, has the advantages of high heating speed and low energy consumption, and simultaneously adopts a structure that the mechanical lamination clamp with the electronic product components is arranged in the cavity of the vacuum box body, so that the vacuum box body is vacuumized to the cavity of the whole vacuum box body, and has the advantages of good gas discharge effect among the electronic product components and basically no residual gas.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention.
Fig. 2 is a schematic plan view of the jig in the embodiment shown in fig. 1.
Fig. 3 is a schematic perspective view of another view of the embodiment of fig. 1.
Fig. 4 is a block diagram of a first embodiment of the anti-sweep lamination method of the present invention.
Fig. 5 is a block diagram of a second embodiment of the anti-sweep lamination method of the present invention.
Fig. 6 is a block diagram of a third embodiment of the anti-sweep lamination method of the present invention.
The figures indicate:
100. mechanical lamination jig, 200, vacuum box, cavity 210;
1. the upper template, 12, a first electric heating plate, 13, a first heat insulation soft rubber mat, 14, a first heat conduction soft rubber mat, 15, a first high-temperature anti-sticking cloth, 16 and a grid; 17. the first electrode, 18, the first signal connector, 30, the electronic product assembly;
2. the lower template 22, a second electric heating plate 23, a second heat-insulating soft rubber mat 24, a second heat-conducting soft rubber mat 25 and a second high-temperature anti-sticking cloth; 26. second electrode, 27, second signal connector.
3. The support rods 4, the support plates 5 and the linear driving mechanism can be an air cylinder or an electric cylinder.
Detailed Description
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or component to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of the two components. It will be understood by those of ordinary skill in the art that the terms described above are in the specific sense of the present invention.
Referring to fig. 1 to 3, fig. 1 to 3 disclose a mechanical laminating apparatus for an electronic product assembly, comprising a vacuum box 200 and a mechanical laminating jig 100, wherein the vacuum box 200 comprises a cavity 210 for installing the mechanical laminating jig 100, the mechanical laminating jig 100 is fixedly or movably arranged in the cavity 210, the mechanical laminating jig 100 comprises an upper die plate 1 and a lower die plate 2, the upper die plate 1 and the lower die plate 2 are integrally connected with each other at a predetermined distance through a support column 3, a support plate 4 is arranged above the upper die plate 1, and a linear driving mechanism 5 for driving the upper die plate 1 to lift is arranged on the support plate 4; a first electric heating plate 12 is provided on the inner bottom surface of the upper die plate 1, or/and a second electric heating plate 22 is provided on the inner bottom surface of the lower die plate 2.
In this embodiment, the mechanical lamination jig 100 has the following structure from bottom to top: the lower die part comprises a lower die plate 2, a second heat-insulating soft rubber mat 23, a second electric heating plate 22, a second heat-conducting soft rubber mat 24 and a second high-temperature anti-sticking cloth 25; the grid 16, the first high-temperature anti-sticking cloth 15, the first heat-conducting soft rubber pad 14, the first electric heating plate 12, the first heat-insulating soft rubber pad 13 and the upper template 1, the electronic product assembly 30 is arranged between the grid 16 and the second high-temperature anti-sticking cloth 25, the first electric heating plate 12 and the second electric heating plate 22 are used for heating, and meanwhile, the linear driving mechanism 5 is used for providing mechanical pressure to laminate the electronic product assembly 30.
The present embodiment is described taking a dual heating plate as an example, but the present invention does not exclude the case where only one of the heating plates is used, i.e., only the first electric heating plate 12 or only the second electric heating plate 22 is used.
In this embodiment, by heating both sides of the electronic product assembly 30, the non-adhered materials in each layer of the electronic product assembly 30 are melted into a whole, and become a qualified product.
The profiling of the lower die plate 2 and the upper die plate 1 in the embodiment is obtained according to the shape of the electronic product assembly 30, when the lower die plate 2 and the upper die plate 1 are in relative position, the first electric heating plate and the second electric heating plate are flexible electric heating plates, and the flexible electric heating plates are preferably manufactured on a flexible rubber pad by using heating materials such as a resistor sheet, a resistor wire and the like through a vulcanization process, so that the flexible rubber pad becomes a flexible heating body which can be bent to achieve the purpose of adhering with the surface of a product; it is obvious that the present invention is also suitable for laminating the planar electronic product assembly 30, except that the upper bottom surface of the lower mold plate 2 and the lower bottom surface of the upper mold plate 1 should be planar, and the first and second electric heating plates are not necessarily flexible electric heating plates, but may be hard electric heating plates composed of a first high-temperature release cloth, a first silicone layer, a first heating element and an aluminum plate, or may be hard electric heating plates composed of a first high-temperature release cloth, a first silicone layer, a first heating element, an aluminum plate, a second heating element, a second silicone layer and a second high-temperature release cloth.
In the embodiment, the first heat-insulating soft rubber pad 13 is used for reducing heat generated by the first electric heating plate 12 and conducted to the upper template 1 so as to reduce energy loss; likewise, the second thermal insulation soft rubber pad 23 functions the same. The first and second thermal insulation soft rubber mats 13 and 23 are soft, have a certain tensile property, and have good thermal insulation properties, and can be, but not limited to, made of aluminum silicate cotton.
The first thermal conductive soft rubber pad 14 and the second thermal conductive soft rubber pad 24 function as: the heat conduction and uniform heat are carried out, and the rubber pad has tiny displacement inside under external pressure so as to improve the uniformity of external force transmission to the surface of the product; the first and second thermal conductive soft rubber pads 14 and 24 may be made of liquid silicone rubber.
Action of the first high temperature release cloth 15 and the second high temperature release cloth: the electronic product assembly 30 is prevented from being adhered to the first heat-conducting soft rubber pad 14 and the second heat-conducting soft rubber pad 24 by a certain viscosity, and the mobility of micro displacement inside the rubber pad is increased; the first high temperature release cloth 15 and the second high temperature release cloth may be made of teflon cloth.
The mesh 16 functions as: when the electronic product assembly 30 is prevented from melting, the hot melt adhesive in the electronic product assembly 30 is prevented from overflowing to the periphery of the electronic product assembly 30, and the sealing effect of the electronic product assembly 30 is improved. The mesh material has flexibility and stretch resistance, and can be made of various soft plastics or teflon.
In this embodiment, a first electrode 17 connected to a first electric heating plate 12 is provided on the upper die plate 1, and a second electrode 26 connected to a second electric heating plate 22 is provided on the lower die plate 2; in this embodiment, the first electrode 17 and the second electrode 26 are used to connect with corresponding contacts on the inner wall of the vacuum box 200, and provide external power for the first electric heating plate 12 and the second electric heating plate 22, respectively, see the following description of the laminating device; obviously, if the mechanical lamination jig 100 is fixedly disposed directly in the vacuum box 200, the manner in which the first electrode 17 and the second electrode 26 are connected with the corresponding contacts on the inner wall of the vacuum box 200 may be changed to the direct wire-bonding manner.
Preferably, at least one first temperature control probe is arranged on the first electric heating plate 12, and the temperature control probe is connected with a first signal connector 18 arranged on the upper template 1; the number of the first temperature control probes can be set according to the needs, and when the area of the first electric heating plate 12 is large, the first temperature control probes can be set in a distributed multi-point mode, and the temperatures of more points can be obtained.
Preferably, at least one second temperature control probe is arranged on the second electric heating plate 22, and the second temperature control probe is connected with a second signal connector 27 arranged on the lower template 2; similarly, the number of the second temperature control probes can be set according to the needs, and when the area of the second electric heating plate 22 is large, the second temperature control probes can be set in a distributed multi-point mode, and more temperatures can be obtained.
Preferably, the upper plate 1 is provided with a first electrode 17 connected to the first electric heating plate 12, and the lower plate 2 is provided with a second electrode 26 connected to the second electric heating plate 22.
A first contact connected with the first electrode controlled by a control circuit or/and a second contact connected with the second electrode controlled by the control circuit are arranged on the inner wall of the cavity 210.
Referring to fig. 4, the invention further provides a mechanical anti-residual gas lamination method for electronic product components, which comprises the following steps:
s1, arranging an electronic product component to be pressurized and heated in a mechanical lamination fixture 100, and prepressing the electronic product component through a linear driving mechanism 5;
s2, the mechanical lamination fixture 100 with the electronic product assembly 30 is arranged in the cavity 210 of the vacuum box 200, and at least the first electric heating plate 12 is conducted with a power supply controlled by a control circuit;
s3, closing the box door 250 through the door opening and closing cylinder 6, vacuumizing the cavity 210, heating the electronic product assembly 30 by at least the first electric heating plate 12, and simultaneously pressing the electronic product assembly 30 by the linear driving mechanism 5 during vacuumizing to uniformly heat the thermosol and discharge air between the electronic product assemblies 30;
s4, after the temperature of the electronic product assembly 30 reaches a preset temperature, the temperature is generally 150-160 ℃, and the preset time is generally 10-20 minutes;
s5, opening the box door, taking out the mechanical lamination fixture 100 with the electronic product assembly 30, and then cooling;
and S6, repeating the steps S1-S5, and laminating the next electronic product assembly.
Referring to fig. 5, the anti-sweep gas lamination method shown in fig. 5 is substantially the same as the anti-sweep gas lamination method shown in fig. 4, except that steps S1 and S2 may be replaced with steps,
s11, the mechanical lamination fixture 100 is installed in the cavity 210 of the vacuum box 200, and at least the first electric heating plate 12 is conducted with a power supply controlled by a control circuit; the control circuit controls the energizing time sequence under the action of the control circuit;
s21, the electronic product assembly 30 to be pressurized and heated is set in the mechanical lamination jig 100.
Referring to fig. 6, the invention further provides a mechanical anti-residual gas lamination method for electronic product components, which comprises the following steps:
s31, placing the electronic product assembly 30 to be pressurized and heated into a mechanical lamination fixture 100 fixedly arranged in a vacuum box 200, wherein the mechanical lamination fixture 100 is the mechanical lamination fixture;
s32, closing a box door through a door opening and closing cylinder 6, vacuumizing the cavity 210 through a vacuum tube 7 (the vacuum tube 7 is externally connected with a vacuum source), heating the electronic product assembly 30 by at least a first electric heating plate 12, and pressing the electronic product assembly 30 by a linear driving mechanism 5 during vacuumizing so as to uniformly heat the thermosol and discharge air between the electronic product assembly 30;
s33, when the temperature of the electronic product assembly 30 reaches a preset temperature, the temperature is generally 150-160 ℃, and the preset time is generally 10-20 minutes;
s34, opening the box door, taking out the electronic product assembly 30, and then cooling;
and S35, repeating the steps S31-S34, and laminating the next electronic product assembly 30.
It should be noted that, for the detailed explanation of the above embodiments, the purpose of explaining the present invention is to be interpreted as a better explanation of the present invention, but these descriptions should not be construed as limiting the present invention for any reason, in particular, the respective features described in the different embodiments may also be arbitrarily combined with each other to constitute other embodiments, and these features should be understood as being applicable to any one embodiment, except for the explicitly contrary descriptions.
Claims (7)
1. An electronic product component mechanical lamination device, characterized in that: the vacuum box comprises a vacuum box body (200) and a mechanical lamination fixture (100), wherein the vacuum box body (200) comprises a cavity (210) for installing the mechanical lamination fixture (100), the mechanical lamination fixture (100) is fixedly or movably arranged in the cavity (210), the mechanical lamination fixture (100) comprises an upper template (1) and a lower template (2), the upper template (1) and the lower template (2) are connected into a whole at a preset distance through a support column (3), a support plate (4) is arranged above the upper template (1), and a linear driving mechanism (5) for driving the upper template (1) to lift is arranged on the support plate (4); a first electric heating plate (12) is arranged on the inner bottom surface of the upper template (1), or/and a second electric heating plate (22) is arranged on the inner bottom surface of the lower template (2);
a first heat-insulating soft rubber pad (13) is arranged between the lower bottom surface of the upper template (1) and the first electric heating plate (12);
a first heat conduction soft rubber pad (14) is arranged on the lower bottom surface of the first electric heating plate (12);
a first high-temperature anti-sticking cloth (15) is arranged on the lower bottom surface of the first heat-conducting soft rubber pad (14);
a second heat-insulating soft rubber pad (23) is arranged between the upper bottom surface of the lower template (2) and the second electric heating plate (22);
a second heat conduction soft rubber pad (24) is arranged on the upper bottom surface of the second electric heating plate (22);
a second high-temperature anti-sticking cloth (25) is arranged on the upper bottom surface of the second heat-conducting soft rubber pad (24);
the first heat-conducting soft rubber pad (14) and the second heat-conducting soft rubber pad (24) are made of liquid silica gel;
a grid (16) for preventing the viscose from overflowing to the periphery is arranged on the lower bottom surface of the high-temperature anti-sticking cloth (15);
at least one first temperature control probe is arranged on the first electric heating plate (12), and the first temperature control probe is connected with a first signal connector (18) arranged on the upper template (1).
2. The electronic product assembly mechanical lamination device of claim 1, wherein: at least one second temperature control probe is arranged on the second electric heating plate (22), and the second temperature control probe is connected with a second signal connector (27) arranged on the lower template (2).
3. The electronic product component mechanical lamination device according to claim 1 or 2, characterized in that: a first electrode (17) connected with the first electric heating plate (12) is arranged on the upper template (1), and a second electrode (26) connected with the second electric heating plate (22) is arranged on the lower template (2).
4. A mechanical lamination device for electronic product components according to claim 3, characterized in that: the inner wall of the cavity (210) is provided with a first contact which is controlled by a control circuit and is connected with the first electrode, or/and a second contact which is controlled by the control circuit and is connected with the second electrode.
5. A method of laminating against residual gas using the mechanical laminating device for electronic components of any one of claims 1 to 4, characterized in that: the method comprises the following steps:
s1, arranging a lamination module to be pressurized and heated in a mechanical lamination fixture (100);
s2, loading the mechanical lamination fixture (100) with the lamination module into a cavity (210) of the vacuum box body (200), and at least conducting the first electric heating plate (12) with a power supply controlled by a control circuit;
s3, closing a box door, vacuumizing the cavity (210), heating the laminated modules by at least a first electric heating plate (12), and applying pressure to the laminated modules by a linear driving mechanism (5) during vacuumizing so as to uniformly distribute thermosol and discharge air among the laminated modules;
s4, after the temperature of the laminated module reaches a preset temperature, keeping for a preset time;
s5, opening the box door, taking out the mechanical lamination clamp (100) with the lamination module, and then cooling;
and S6, repeating the steps S1-S5, and laminating the next lamination module.
6. The method of laminating an electronic product component with mechanical anti-sweep gas of claim 5, wherein: the steps S1 and S2 can be replaced by the following steps,
s11, loading the mechanical lamination fixture (100) into a cavity (210) of a vacuum box body (200), and at least conducting a first electric heating plate (12) with a power supply controlled by a control circuit;
s21, arranging the lamination module to be pressurized and heated in the mechanical lamination fixture (100).
7. A method of laminating against residual gas using the mechanical laminating device for electronic components of any one of claims 1 to 4, characterized in that: the method comprises the following steps:
s31, placing the lamination module to be pressurized and heated into a mechanical lamination jig (100) fixedly arranged in a vacuum box body (200), wherein the mechanical lamination jig (100) is the mechanical lamination jig according to any one of claims 1 to 4;
s32, closing a box door, vacuumizing the cavity (210), heating the laminated modules by at least a first electric heating plate (12), and applying pressure to the laminated modules by a linear driving mechanism (5) during vacuumizing so as to uniformly distribute thermosol and discharge air among the laminated modules;
s33, maintaining the laminated module (30) for a preset time after the temperature reaches a preset temperature;
s34, opening a box door, taking out the laminated module (30), and then cooling;
and S35, repeating the steps S31-S34, and laminating the next lamination module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910325767.4A CN110171181B (en) | 2019-04-23 | 2019-04-23 | Mechanical laminating device for electronic product components and laminating method for preventing residual gas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910325767.4A CN110171181B (en) | 2019-04-23 | 2019-04-23 | Mechanical laminating device for electronic product components and laminating method for preventing residual gas |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110171181A CN110171181A (en) | 2019-08-27 |
| CN110171181B true CN110171181B (en) | 2023-11-17 |
Family
ID=67689924
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