CN107553848A - A kind of injection mold temperature precise control device - Google Patents
A kind of injection mold temperature precise control device Download PDFInfo
- Publication number
- CN107553848A CN107553848A CN201710822583.XA CN201710822583A CN107553848A CN 107553848 A CN107553848 A CN 107553848A CN 201710822583 A CN201710822583 A CN 201710822583A CN 107553848 A CN107553848 A CN 107553848A
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- China
- Prior art keywords
- lower cover
- cover plate
- upper cover
- control device
- mold temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of injection mold temperature precise control device, including upper cover plate, lower cover, some heat carriers, with heat carrier some heating components correspondingly, upper cover plate is fixedly connected with lower cover, upper cover plate opens up some grooves, heat carrier is fixedly connected with lower cover, side of the heat carrier away from lower cover is stretched into groove and emerged, some cell bodies being unidirectionally open are opened up in heat carrier, heating component includes some and one-to-one heating unit of cell body, heating unit is embedded in cell body, it is in parallel between multiple heating units, the electric contact of heating unit in lower cover by drawing;By the temperature for controlling heating component so that heat carrier against position reach required optimum temperature, realize that mould different parts reach different steady temperatures, the product to conform to quality requirements produced within the maximally effective time.
Description
Technical field
The present invention relates to equipments machining die technical field, more particularly to a kind of injection mold temperature precise control device.
Background technology
Mold temperature has large effect to product molding quality, shaping efficiency.At the higher position of mold temperature, melt
Melt that the mobility of material is preferable, the products appearance surface of high quality can be obtained, but melted material hardening time can be made elongated, push up
It is yielding when going out;At the relatively low position of mold temperature, melted material is difficult to be full of die cavity, internal stress increase, causes forming part
Bad order;Simultaneously mould temperature it is more stable, the product produced is more consistent in size shape, presentation quality etc., in order to
The product to conform to quality requirements is produced in the maximally effective time, this requires mould different parts to keep different constant temperatures
Degree, the control method of mold temperature therefore, during mold design should be taken into full account, typically using heat transfer medium is set up, pass through tune
Save the temperature of heat transfer medium and then adjust the temperature of mould, but temperature can change heat transfer medium in flow process in itself,
The uniformity of mold temperature is influenceed, the temperature of mould different parts is uncontrollable, and whole mould is at a temperature of identical control,
It is unfavorable for obtaining the product of high quality.
The content of the invention
To solve technical problem present in background technology, the present invention proposes that a kind of injection mold temperature accurately controls dress
Put.
A kind of injection mold temperature precise control device proposed by the invention, including upper cover plate, lower cover, some heat conduction
Body, some heating components, upper cover plate are fixedly connected with lower cover correspondingly with heat carrier, and upper cover plate opens up some grooves,
Heat carrier is fixedly connected with lower cover, and side of the heat carrier away from lower cover is stretched into groove and emerged, and is opened up in heat carrier some
The cell body being unidirectionally open, heating component include some and one-to-one heating unit of cell body, and heating unit is embedded in cell body,
In parallel between multiple heating units, the electric contact of heating unit in lower cover by drawing.
Preferably, heating unit is resistance wire, resistance wire and cell body inwall interval pre-determined distance, and cell body inwall and resistance
Filler electrically insulating but thermally conductive is filled between silk.
Preferably, heating unit is made up of more resistance wires, more resistance wire parallel connections.
Preferably, the contact site between upper cover plate and lower cover sets groove, installs heat insulating strip in groove, works as upper cover plate
After being fixed with lower cover installation, it is in close contact between insulating collar and upper cover plate and lower cover.
Preferably, be spirally connected fixation between upper cover plate and lower cover, during upper cover plate and lower cover is screwed, heat insulating strip
Compressive deformation.
Preferably, insulating cement adhering and sealing is used between heat carrier and lower cover.
In the present invention, the injection mold temperature precise control device that is proposed, upper and lower cover plates is fixedly connected, upper cover plate installation
On mould, heat carrier is fixed on lower cover and stretched out by upper cover plate, and all heat carriers collectively form temperature control modules,
Each heat carrier is mounted on heating component, each heating component independent control, therefore different heating components can produce not
With the temperature of size, by the temperature for controlling heating component so that heat carrier against position reach required optimum temperature,
And the position is maintained optimum temperature, realize that mould different parts reach different steady temperatures, in the maximally effective time
Inside produce the product to conform to quality requirements.
Brief description of the drawings
Fig. 1 is a kind of exploded perspective view of injection mold temperature precise control device proposed by the present invention.
Fig. 2 is the structural representation of heat carrier proposed by the present invention.
Embodiment
Referring to Figures 1 and 2, a kind of injection mold temperature precise control device proposed by the present invention, including upper cover plate 1, under
2,28 heat carriers 3 of cover plate and 3 one-to-one 28 heating components of heat carrier;Upper cover plate 1 is connected with lower cover 2 by screw thread
Connect, upper cover plate 1 opens up 28 grooves 11, and side of the heat carrier 3 away from lower cover is stretched into groove 11 and emerged, opened in heat carrier 3
If 9 cell bodies 31 being unidirectionally open, heating unit 32 is provided with each cell body 31, and parallel connection side is used between heating unit 32
Formula connects, and therefore, the damage of some heating unit 32 has no effect on other heating units 32 and worked, and heating unit 32 uses two simultaneously
The resistance wire of connection is formed, and full insulating heat-conduction material is filled between resistance wire and the inwall of cell body 31, and Heat Conduction Material produces resistance wire
Heat conduct to mould, the electric contact of resistance wire is drawn out of lower cover 2, is easy to resistance wire to be engaged with power supply
The injection mold temperature precise control device of the present embodiment it is specifically used in, upper cover plate 1 is fixed on mould, is led
The side that hot body 3 is stretched out by upper cover plate 1 is fitted in die surface, and resistance wire is powered, and resistance wire converts electrical energy into heat energy
So that wire temperature rise produces heat, heat is conducted to mould by Heat Conduction Material and heat carrier 3, so as to cause heat conduction
The die part temperature rise that body 3 is bonded, reach the purpose of regulation mold temperature, according to temperature needed for mould different parts not
Together, the i.e. achievable different parts of temperature for adjusting each resistance wire reach optimum temperature, are produced within the maximally effective time
The product to conform to quality requirements.
In the present embodiment, the injection mold temperature precise control device proposed, in a specific embodiment, upper cover plate
1 is provided with groove 12, and heat insulating strip 4 is installed in groove 12, after upper cover plate 1 and the fixed installation of lower cover 2, the compressive deformation of heat insulating strip 4,
It is in close contact with upper cover plate 1 and lower cover 2, plays a part of insulation, the heat for avoiding resistance wire from producing leaks and causes temperature
Control effect is bad.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (6)
1. a kind of injection mold temperature precise control device, it is characterised in that including upper cover plate (1), lower cover (2), multiple lead
Hot body (3), heating component, upper cover plate (1) are fixedly connected with lower cover (2), and upper cover plate (1) opens up multiple grooves (11), heat conduction
Body (3) is fixedly connected with lower cover (2), and side of the heat carrier (3) away from lower cover is stretched into groove (11) and emerged, heating component
Corresponded with heat carrier (3), open up multiple cell bodies (31) being unidirectionally open in heat carrier (3), heating component include it is multiple with
The one-to-one heating unit (32) of cell body (31), heating unit (32) are embedded in cell body (31), multiple heating units (32)
Between it is in parallel, the electric contact of heating unit (32) in lower cover (2) by drawing.
2. injection mold temperature precise control device according to claim 1, it is characterised in that heating unit (32) is electricity
Silk, resistance wire and cell body (31) interval pre-determined distance are hindered, and cell body (31) is filled electrically insulating but thermally conductive between inwall and resistance wire
Filler.
3. injection mold temperature precise control device according to claim 1, it is characterised in that heating unit (32) is by more
Root resistance wire forms, more resistance wire parallel connections.
4. injection mold temperature precise control device according to claim 1, it is characterised in that in upper cover plate (1) with
Contact site between cover plate (2) sets groove (12), heat insulating strip (4) is installed in groove (12), when upper cover plate (1) and lower cover
(2) after installation is fixed, it is in close contact between insulating collar and upper cover plate (1) and lower cover (2).
5. injection mold temperature precise control device according to claim 4, it is characterised in that upper cover plate (1) and lower cover
Be spirally connected fixation between plate (2), during upper cover plate (1) and lower cover (2) is screwed, heat insulating strip (4) compressive deformation.
6. injection mold temperature precise control device according to claim 1, it is characterised in that heat carrier (3) and lower cover
Insulating cement adhering and sealing is used between plate (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710822583.XA CN107553848A (en) | 2017-09-13 | 2017-09-13 | A kind of injection mold temperature precise control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710822583.XA CN107553848A (en) | 2017-09-13 | 2017-09-13 | A kind of injection mold temperature precise control device |
Publications (1)
Publication Number | Publication Date |
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CN107553848A true CN107553848A (en) | 2018-01-09 |
Family
ID=60979825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710822583.XA Withdrawn CN107553848A (en) | 2017-09-13 | 2017-09-13 | A kind of injection mold temperature precise control device |
Country Status (1)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108556296A (en) * | 2018-04-04 | 2018-09-21 | 安徽安缆模具有限公司 | A kind of injection mold temperature precise control device |
CN108637176A (en) * | 2018-04-18 | 2018-10-12 | 安徽威克电子配件有限公司 | A kind of heated type die apparatus |
CN108655344A (en) * | 2018-04-18 | 2018-10-16 | 安徽威克电子配件有限公司 | A kind of temperature adjustable type mould processing device |
CN112238646A (en) * | 2019-07-19 | 2021-01-19 | 苏州汉扬精密电子有限公司 | Hot pressing and cold pressing combined integrated mechanism |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1954987A (en) * | 2005-10-25 | 2007-05-02 | 山下电气株式会社 | Metal mold for forming synthetic resin |
CN201385407Y (en) * | 2009-01-23 | 2010-01-20 | 浙江工业大学 | Heating device of thermosetting plastic injection mould |
EP2527125A2 (en) * | 2011-05-25 | 2012-11-28 | LG Electronics Inc. | Mold apparatus |
-
2017
- 2017-09-13 CN CN201710822583.XA patent/CN107553848A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1954987A (en) * | 2005-10-25 | 2007-05-02 | 山下电气株式会社 | Metal mold for forming synthetic resin |
CN201385407Y (en) * | 2009-01-23 | 2010-01-20 | 浙江工业大学 | Heating device of thermosetting plastic injection mould |
EP2527125A2 (en) * | 2011-05-25 | 2012-11-28 | LG Electronics Inc. | Mold apparatus |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108556296A (en) * | 2018-04-04 | 2018-09-21 | 安徽安缆模具有限公司 | A kind of injection mold temperature precise control device |
CN108637176A (en) * | 2018-04-18 | 2018-10-12 | 安徽威克电子配件有限公司 | A kind of heated type die apparatus |
CN108655344A (en) * | 2018-04-18 | 2018-10-16 | 安徽威克电子配件有限公司 | A kind of temperature adjustable type mould processing device |
CN112238646A (en) * | 2019-07-19 | 2021-01-19 | 苏州汉扬精密电子有限公司 | Hot pressing and cold pressing combined integrated mechanism |
CN112238646B (en) * | 2019-07-19 | 2024-03-19 | 苏州汉扬精密电子有限公司 | Hot-pressing and cold-pressing combined integrated mechanism |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180109 |
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WW01 | Invention patent application withdrawn after publication |