CN110171181A - The laminating method of the mechanical laminater of electronic product module and its anti-residual gas - Google Patents
The laminating method of the mechanical laminater of electronic product module and its anti-residual gas Download PDFInfo
- Publication number
- CN110171181A CN110171181A CN201910325767.4A CN201910325767A CN110171181A CN 110171181 A CN110171181 A CN 110171181A CN 201910325767 A CN201910325767 A CN 201910325767A CN 110171181 A CN110171181 A CN 110171181A
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- Prior art keywords
- mechanical
- plate
- electronic product
- product module
- laminater
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000010030 laminating Methods 0.000 title claims abstract description 19
- 238000003475 lamination Methods 0.000 claims abstract description 41
- 238000009835 boiling Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000004744 fabric Substances 0.000 claims description 19
- 239000000523 sample Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 2
- 238000005485 electric heating Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
Abstract
The laminating method of the mechanical laminater of electronic product module and its anti-residual gas, wherein device includes vacuum chamber and mechanical lamination fixture, vacuum chamber includes the cavity for device for mechanical formula lamination fixture, fixture is fixed or movable sets in the cavity for mechanical lamination, mechanical lamination fixture includes cope plate and lower template, cope plate and lower template predetermined distance are connected as one by support column, it is equipped with support plate in the top of cope plate, is equipped with the straight line driving mechanism for driving upper module 1 to go up and down in support plate；It is equipped with the first electric boiling plate on the inner bottom surface of cope plate, or/and is equipped with the second electric boiling plate on the inner bottom surface of lower template.The advantages of present invention has heating speed fast, and fast, basic noresidue gas is discharged in the gas being laminated between mould group.
Description
Technical field
The present invention relates to the lamination between a kind of such as photovoltaic module, flexible circuit board, battery pole piece and battery diaphragm is electric
The laminating method of the sub- mechanical laminater of product component and its anti-residual gas.
Background technique
Electronic product module, such as the lamination of photovoltaic products component is that the battery that will have been laid is put into laminating machine, is passed through
It vacuumizes the air extraction in component, and heating makes EVA fusing that battery, glass and backboard to bond together；Finally cool down
Take out mould group.For another example, the lamination of flexible circuit board is cooperated by upper air bag component and evacuated panel, by flexible circuit board be placed on by
Upper air bag component and the type that evacuated panel is constituted are intracavitary, impose enough pressure by the air bag to upper air bag component, are vacuumizing
In the environment of flexible circuit board is pressed.Lamination is the key that electronic product module produces a step, the quality of laminate quality
It will have a direct impact on the final mass of electronic product module；The heating method that layer adds will have a direct impact on the production efficiency of lamination.
The laminating method of existing electronic product module is to carry out indirect heating to the electronic product being laminated using hot wind,
It is slow there are heating rate, hot wind heat utilization efficiency is low, the big problem of energy loss；Second is that the existing mode vacuumized designs and does not conform to
Reason, there are the gas discharges between electronic product module slowly, and there are problems that part residual gas and influence product quality.
Summary of the invention
In order to overcome the above problem, the present invention provides that a kind of heating speed is fast, and the gas discharge between electronic product module
The laminating method of the mechanical laminater of fast electronic product module and its anti-residual gas.
A kind of technical solution of the invention is: a kind of mechanical laminater of electronic product module, including vacuum chamber and
Mechanical lamination fixture, the vacuum chamber includes the cavity for being mechanically laminated fixture described in device, the mechanical layer
Fixture is fixed or movable sets in the cavity for pressure, and the mechanical lamination fixture includes cope plate and lower template, the upper mold
Plate and lower template predetermined distance are connected as one by support column, support plate are equipped in the top of the cope plate, in institute
Support plate is stated equipped with for driving the straight line driving mechanism of the cope plate lifting；The is equipped on the inner bottom surface of the cope plate
One electric boiling plate, or/and the second electric boiling plate is equipped on the inner bottom surface of the lower template.
As improvement of the present invention, it is heat-insulated that first is equipped between the bottom surface and the first electric boiling plate of the cope plate
Soft rubber mat.
As improvement of the present invention, the first thermally conductive soft rubber mat is equipped on the bottom surface of first electric boiling plate.
As improvement of the present invention, the first high-temperature adhesion resistant is equipped on the bottom surface of the described first thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, the net for preventing viscose glue overflow around is equipped on the bottom surface of high-temperature adhesion resistant cloth
Lattice.
As improvement of the present invention, at least provided with first temperature probe, the temperature in first heating plate
Control probe is connect with the first signal connector for being located at cope plate.
The second heat-insulated soft rubber mat is equipped between the second electric boiling plate on the upper bottom surface of the lower template.
As improvement of the present invention, the second thermally conductive soft rubber mat is equipped on the upper bottom surface of second electric boiling plate.
As improvement of the present invention, the second high-temperature adhesion resistant is equipped on the upper bottom surface of the described second thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, at least provided with second temperature probe in second heating plate, described
Two temperature probes are connect with the second signal connector for being located at lower template.
As improvement of the present invention, the first electrode connecting with the first electric boiling plate is equipped on the cope plate,
The lower template is equipped with the second electrode connecting with the second electric boiling plate.
The first contact connecting with the first electrode controlled by control circuit is equipped on the inner wall of the cavity, or
/ and the second contact being connect with the second electrode for being controlled by the control circuit.
The present invention also provides a kind of laminating methods of the mechanically anti-residual gas of electronic product module, include the following steps:
S1, the electronic product module of heating to be pressurised is set in mechanical lamination fixture；
S2, by with electronic product module mechanical lamination fixture be packed into vacuum chamber cavity in, and at least allow first electricity
Hot plate is connected with the power supply that control circuit controls；
S3, chamber door is closed, cavity is vacuumized, allow at least the first electric hot plate electron product component to heat, when vacuumizing, directly
Line driving mechanism electron product component pressure, for the air between uniform thermosol and discharge electronic product module；
S4, after the temperature of electronic product module reaches predetermined temperature, keep the predetermined time；
S5, chamber door is opened, takes out the mechanical lamination fixture for having electronic product module, it is then cooling；
S6, S1-S5 step is repeated, next electronic product module is laminated.
As improvement of the present invention, the S1 and S2 step can be replaced with following step,
S11, mechanical lamination fixture is packed into the cavity of vacuum chamber, and the first electric hot plate and control circuit is at least allowed to control
Power supply conducting；
S21, the electronic product module of heating to be pressurised is set in mechanical lamination fixture.
The present invention also provides a kind of laminating methods of the mechanically anti-residual gas of electronic product module, include the following steps:
S31, by the electronic product module of heating to be pressurised be put into fixation be located in the intracorporal mechanical lamination fixture of case, the machine
It is above-mentioned mechanical lamination fixture that tool formula, which is laminated fixture,；
S32, chamber door is closed, cavity is vacuumized, at least the first electric hot plate electron product component is allowed to heat, when vacuumizing,
Straight line driving mechanism electron product component pressure, to hand over the air between the distribution of thermosol and discharge electronic product module；
S33, after the temperature of electronic product module reaches predetermined temperature, keep the predetermined time；
S34, chamber door is opened, takes out electronic product module, it is then cooling；
S35, S31-S34 step is repeated, next electronic product module is laminated.
The present invention directly heats electronic product module due to using electrically heated mode, the fast, energy with heating speed
Small advantage is lost in source, meanwhile, it is packed into the cavity of vacuum chamber using by the mechanical lamination fixture of having electronic product component
Structure, the cavity of entire vacuum chamber is vacuumized, and it is good with the gas discharge effect between electronic product module, substantially without
The advantages of residual gas.
Detailed description of the invention
Fig. 1 is the schematic perspective view of an embodiment of the present invention.
Fig. 2 is the planar structure schematic diagram of the fixture in embodiment illustrated in fig. 1.
Fig. 3 is another view stereo structural schematic diagram of embodiment illustrated in fig. 1.
Fig. 4 is the frame structure schematic diagram of the first embodiment of the laminating method of anti-residual gas of the invention.
Fig. 5 is the frame structure schematic diagram of the second embodiment of the laminating method of anti-residual gas of the invention.
Fig. 6 is the frame structure schematic diagram of the 3rd embodiment of the laminating method of anti-residual gas of the invention.
It is indicated in figure:
100, fixture, 200, vacuum chamber, cavity 210 are mechanically laminated；
1, cope plate, the 12, first electric boiling plate, the 13, first heat-insulated soft rubber mat, the 14, first thermally conductive soft rubber mat, 15, first
High-temperature adhesion resistant cloth, 16, grid；17, first electrode, the 18, first signal connector, 30, electronic product module；
2, lower template, the 22, second electric boiling plate, the 23, second heat-insulated soft rubber mat, the 24, second thermally conductive soft rubber mat, 25, second
High-temperature adhesion resistant cloth；26, second electrode, 27, second signal connector.
3, support rod, 4, support plate, 5, straight line driving mechanism can be cylinder or electric cylinders etc..
Specific embodiment
In the description of the present invention, it is to be understood that, "center" in term, "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of instructions such as " right sides " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing this hair
Bright and simplified description, rather than the device or component of indication or suggestion meaning must have a particular orientation, with specific orientation
Construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only,
It is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
Connect ", " connected " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to dismantling connection, or be integrally connected；It can be with
It is mechanical connection, is also possible to be electrically connected；It can be directly connected, be also possible to indirectly connected through an intermediary, can be
The connection of two component internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
The concrete meaning of invention.
Referring to Figure 1 to Fig. 3, what Fig. 1 to Fig. 3 was disclosed is a kind of mechanical laminater of electronic product module, including true
Empty van body 200 and mechanical lamination fixture 100, the vacuum chamber 200 include for being mechanically laminated fixture 100 described in device
Cavity 210, the mechanical lamination fixture 100 is fixed or movable to be located in the cavity 210, the mechanical lamination fixture
100 include cope plate 1 and lower template 2, and the cope plate 1 and 2 predetermined distance of lower template pass through support column 3 and be connected as one
Body is equipped with support plate 4 in the top of the cope plate 1, is equipped in the support plate 4 for driving the cope plate 1 to go up and down
Straight line driving mechanism 5；The first electric boiling plate 12 is equipped on the inner bottom surface of the cope plate 1, or/and in the lower template 2
Inner bottom surface is equipped with the second electric boiling plate 22.
In the present embodiment, the mechanical structure for being laminated fixture 100 is sequentially consisted of: part of the lower die, lower template 2, the
Two heat-insulated soft rubber mats 23, second the 22, second thermally conductive soft rubber mat 24 of electric boiling plate and the second high-temperature adhesion resistant cloth 25；Grid 16,
First the 15, first thermally conductive soft rubber mat 14 of high-temperature adhesion resistant cloth, first the 12, first heat-insulated soft rubber mat 23 of electric boiling plate and cope plate
1, electronic product module 30 is located between grid 16 and the second high-temperature adhesion resistant cloth 25, is added using the first electric boiling plate 12 and the second electricity
Hot plate 22 heats it, meanwhile, mechanical compression is provided using straight line driving mechanism 5, electronic product module 30 is laminated.
The present embodiment is illustrated by taking double heating plates as an example, and still, the present invention is not excluded for only using one of those
The case where heating plate, only uses the first heating plate 12 or only uses the second heating plate 22.
In the present embodiment, by making the non-adhesion in electronic product module 30 to 30 Double-side Heating of electronic product module
Each layer material melts are integrated, and become qualified products.
The profiling of lower template 2 and cope plate 1 in the present embodiment is that the shape of foundation electronic product module 30 obtains,
When lower template 2 and cope plate 1 are opposite position, the first electric boiling plate and the second electric boiling plate should be flexible electric boiling plate, soft
Property electric boiling plate flexible material is preferably worked by sulfuration process with the fever such as adding thermal resistance such as resistor disc, resistance wire material
On rubber mat, a kind of flexible flexible heater body is made, to achieve the purpose that be bonded with product surface；Obviously, of the invention
It is also suitable for being laminated planar electronic product module 30, only under the upper bottom surface and cope plate 1 of its lower template 2
Bottom surface should be plane, the first electric boiling plate and the not necessarily flexible electric boiling plate of the second electric boiling plate, can be the first high temperature
The hard electric boiling plate that adhesion-proof cloth, the first layer of silica gel, first heating element and aluminium sheet are constituted, can also be the first high-temperature adhesion resistant
What cloth, the first layer of silica gel, first heating element, aluminium sheet, second heatiing element, the second layer of silica gel and the second high-temperature adhesion resistant cloth were constituted
Hard electric boiling plate.
In the present embodiment, the first heat-insulated soft effect of rubber mat 13 is to reduce the fever of the first heating plate 12 to conduct to cope plate 1,
To reduce energy loss；Likewise, the effect of the second heat-insulated soft rubber mat 23 is identical.First heat-insulated soft rubber mat 13 and second every
If heat softenable rubber mat 23 be it is soft there is good heat-proof quality again with certain pull resistance, it can be but not
It is limited to make of aluminium silicate wool.
First thermally conductive soft rubber mat 14 and the second thermally conductive soft effect of rubber mat 24 are: conduction heat and uniform heat, and have
Having has micro-displacement inside rubber mat under external pressure, to improve the uniformity that external force is transmitted to product surface；First is thermally conductive soft
Property rubber mat 14 and the second thermally conductive soft rubber mat 24 can be made of liquid-state silicon gel.
The effect of first high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth: prevent electronic product module 30 thermally conductive soft with first
Property rubber mat 14 and the second thermally conductive soft 24 rubber mat of rubber mat have certain adhesive, increase the mobility of micro-displacement inside rubber mat；
First high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth can be made of Teflon cloth.
Grid 16 acts on: when preventing electronic product module 30 from melting, preventing hot melt adhesive in electronic product module 30 to electricity
The surrounding of sub- product component 30 is overflowed, and raising prevents 30 sealing effect of electronic product module.Grid material will have softness
Property, there is stretch-resistance again, can be made of various soft plastics or Teflon.
In the present embodiment, the first electrode 17 connecting with the first electric boiling plate 12 is equipped on the cope plate 1, described
Lower template 2 is equipped with the second electrode 26 connecting with the second electric boiling plate 22；In the present embodiment, the first electrode 17 and second
Electrode 26 is respectively the first electric boiling plate 12 and the second electric heating for connecting with the corresponding contacts on the inner wall of cabinet 200
Plate 22 provides external power supply referring to the description of following pairs of laminater；Obviously, if mechanically lamination fixture 100 directly fixation is set
When setting in cabinet 200, the mode that first electrode 12 and second electrode 22 are connect with the corresponding contacts on the inner wall of cabinet 200,
It is readily modified as the mode of direct route docking.
Preferably, in first heating plate 12 at least provided with first temperature probe, the temperature probe with set
It is connected in the first signal connector 18 of cope plate 1；First temperature probe number can be set as needed, when first electricity plus
When the area of hot plate 12 is big, the first temperature probe can be arranged using Distributed Multi, in the temperature for obtaining more points.
Preferably, at least provided with second temperature probe, second temperature probe in second heating plate 22
It is connect with the second signal connector 27 for being located at lower template 2；Likewise, the number of the second temperature probe can according to need and set
It is fixed, when the area of the second electric boiling plate 22 is big, the second temperature probe can be arranged using Distributed Multi, obtain more points
Temperature.
Preferably, the first electrode 17 connecting with the first electric boiling plate 12 is equipped on the cope plate 1, in the lower die
Plate 2 is equipped with the second electrode 26 connecting with the second electric boiling plate 22.
The first touching connecting with the first electrode controlled by control circuit is equipped on the inner wall of the cavity 210
Point, or/and the second contact being connect with the second electrode controlled by the control circuit.
Fig. 4 is referred to, the present invention also provides a kind of laminating method of the mechanically anti-residual gas of electronic product module, including it is as follows
Step:
S1, the electronic product module of heating to be pressurised is set in mechanical lamination fixture 100, it is pre- by straight line driving mechanism 5
Pressure；
S2, the mechanical lamination fixture 100 with electronic product module 30 is packed into the cavity 210 of vacuum chamber 200, and extremely
The power supply for allowing the first electric hot plate 12 to control with control circuit less is connected；
S3, chamber door 250 is closed by switch door cylinder 6, cavity 210 is vacuumized, 12 electron of at least the first electric hot plate is allowed to produce
Product component 30 heats, and when vacuumizing, electron product component 30 presses straight line driving mechanism 5 simultaneously, is used for uniform thermosol
Air between discharge electronic product module 30；
S4, after the temperature of electronic product module 30 reaches predetermined temperature, generally 150 degrees Celsius -160 degrees Celsius, keep pre-
It fixes time, usually -20 minutes 10 minutes；
S5, chamber door is opened, takes out the mechanical lamination fixture 100 for having electronic product module 30, it is then cooling；
S6, S1-S5 step is repeated, next electronic product module is laminated.
Fig. 5 is referred to, the laminating method of anti-residual gas described in the laminating method and Fig. 4 of anti-residual gas shown in Fig. 5 is substantially the same, institute
The difference is that the S1 and S2 step can be replaced with following step,
S11, mechanical lamination fixture 100 is packed into the cavity 210 of vacuum chamber 200, and at least allow the first electric hot plate 12 with
The power supply conducting of control circuit control；The timing that control is powered when the effect of control circuit；
S21, the electronic product module 30 of heating to be pressurised is set in mechanical lamination fixture 100.
Fig. 6 is referred to, the present invention also provides a kind of laminating method of the mechanically anti-residual gas of electronic product module, including it is as follows
Step:
S31, the electronic product module 30 of heating to be pressurised is put into the fixed mechanical lamination fixture 100 being located in cabinet 200
Interior, the mechanical lamination fixture 100 is above-mentioned mechanical lamination fixture；
S32, chamber door is closed by switch door cylinder 6, passes through the external vacuum source of vacuum tube 7(vacuum tube 7) cavity 210 is taken out very
Sky allows 12 electron product component 30 of at least the first electric hot plate to heat, when vacuumizing, 5 electron product of straight line driving mechanism
Component 30 presses, for the air between uniform thermosol and discharge electronic product module 30；
S33, after the temperature of electronic product module 30 reaches predetermined temperature, generally 150 degrees Celsius -160 degrees Celsius, keep pre-
It fixes time, usually -20 minutes 10 minutes；
S34, chamber door is opened, takes out electronic product module 30, it is then cooling；
S35, S31-S34 step is repeated, next electronic product module 30 is laminated.
It should be noted that explaining in detail for the respective embodiments described above, purpose, which is only that, solves the present invention
It releases, in order to be able to preferably explain the present invention, still, these descriptions cannot be with any explanation at being to limit of the invention
System, in particular, each feature described in various embodiments can also mutual any combination, to form other implementations
Mode, in addition to there is clearly opposite description, these features should be understood to can be applied in any one embodiment, and simultaneously
It is not only limited to described embodiment.
Claims (15)
1. a kind of mechanical laminater of electronic product module, it is characterised in that: including vacuum chamber (200) and mechanical lamination
Fixture (100), the vacuum chamber (200) include the cavity (210) for being mechanically laminated fixture (100) described in device, institute
It is interior to state the fixed or movable cavity (210) that is located at of mechanical lamination fixture (100), mechanical lamination fixture (100) packet
Cope plate (1) and lower template (2) are included, the cope plate (1) and lower template (2) predetermined distance are connected by support column (3)
It is integrated, is equipped with support plate (4) in the top of the cope plate (1), is equipped in the support plate (4) for driving the upper mold
The straight line driving mechanism (5) of block (1) lifting；The first electric boiling plate (12) are equipped on the inner bottom surface of the cope plate (1), or/
The second electric boiling plate (22) are equipped with on the inner bottom surface of the lower template (2).
2. the mechanical laminater of electronic product module according to claim 1, it is characterised in that: in the cope plate
(1) the first heat-insulated soft rubber mat (13) is equipped between bottom surface and the first electric boiling plate (12).
3. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: described first
The bottom surface of electric boiling plate (12) is equipped with the first thermally conductive soft rubber mat (14).
4. the mechanical laminater of electronic product module according to claim 3, it is characterised in that: thermally conductive described first
The bottom surface of soft rubber mat (14) is equipped with the first high-temperature adhesion resistant cloth (15).
5. the mechanical laminater of electronic product module according to claim 4, it is characterised in that: in high-temperature adhesion resistant cloth
(15) bottom surface is equipped with the grid (16) for preventing viscose glue overflow around.
6. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: described first
At least provided with first temperature probe in heating plate (12), the temperature probe connects with the first signal for being located at cope plate (1)
Connector (18) connection.
7. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: in the lower die
The second heat-insulated soft rubber mat (23) is equipped on the upper bottom surface of plate (2) between the second electric boiling plate (22).
8. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: described second
The upper bottom surface of electric boiling plate (22) is equipped with the second thermally conductive soft rubber mat (24).
9. the mechanical laminater of electronic product module according to claim 8, it is characterised in that: thermally conductive described second
The upper bottom surface of soft rubber mat (24) is equipped with the second high-temperature adhesion resistant cloth (25).
10. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: described second
At least provided with second temperature probe, second temperature probe and the second letter for being located at lower template (2) in heating plate (22)
The connection of number connector (27).
11. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: in the upper mold
Plate (1) is equipped with the first electrode (17) connecting with the first electric boiling plate (12), is equipped on the lower template (2) and the second electricity
The second electrode (26) of heating plate (22) connection.
12. the mechanical laminater of electronic product module according to claim 1 or 2, it is characterised in that: in the cavity
(210) inner wall is equipped with the first contact connecting with the first electrode controlled by control circuit, or/and by the control
The second contact of circuit control processed being connect with the second electrode.
13. a kind of laminating method of the mechanically anti-residual gas of electronic product module, characterized by the following steps:
S1, the stacking mould of heating to be pressurised is mounted in mechanical lamination fixture (100)；
S2, the mechanical lamination fixture (100) with stacking mould group is packed into the cavity (210) of vacuum chamber (200), and extremely
The power supply for allowing the first electric hot plate (12) to control with control circuit less is connected；
S3, chamber door is closed, cavity (210) is vacuumized, allowed at least the first electric hot plate (12) to give stacking mould group heating, vacuumizing
When, straight line driving mechanism (5) gives stacking mould group pressure, to hand over the air between the distribution of thermosol and discharge stacking mould group；
S4, when be laminated mould group temperature reach predetermined temperature after, keep the predetermined time；
S5, chamber door is opened, takes out the mechanical lamination fixture (100) with stacking mould group, it is then cooling；
S6, S1-S5 step is repeated, next stacking mould group is laminated.
14. the laminating method of the mechanically anti-residual gas of electronic product module according to claim 13, it is characterised in that: described
S1 and S2 step can be replaced with following step,
S11, it fixture (100) will be mechanically laminated will be packed into the cavity (210) of vacuum chamber (200), and at least allow the first electric heating
Plate (12) is connected with the power supply that control circuit controls；
S21, the stacking mould of heating to be pressurised is mounted in mechanical lamination fixture (100).
15. a kind of laminating method of the mechanically anti-residual gas of electronic product module, characterized by the following steps:
S31, the stacking mould group of heating to be pressurised is put into the fixed mechanical lamination fixture (100) being located in cabinet (200),
The mechanical lamination fixture (100) is mechanical lamination fixture described in any one of claim 1 to 11 claim；
S32, chamber door is closed, cavity (210) is vacuumized, at least the first electric hot plate (12) is allowed to give stacking mould group heating, it is true taking out
When empty, straight line driving mechanism (5) gives stacking mould group pressure, to hand over the air between the distribution of thermosol and discharge stacking mould group；
S33, when be laminated mould group (30) temperature reach predetermined temperature after, keep the predetermined time；
S34, chamber door is opened, takes out stacking mould group (30), it is then cooling；
S35, S31-S34 step is repeated, next stacking mould group is laminated.
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