CN110289229A - The warehouse style laminating apparatus of electronic product module - Google Patents
The warehouse style laminating apparatus of electronic product module Download PDFInfo
- Publication number
- CN110289229A CN110289229A CN201910325776.3A CN201910325776A CN110289229A CN 110289229 A CN110289229 A CN 110289229A CN 201910325776 A CN201910325776 A CN 201910325776A CN 110289229 A CN110289229 A CN 110289229A
- Authority
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- China
- Prior art keywords
- electronic product
- product module
- plate
- fixture
- electric boiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010030 laminating Methods 0.000 title claims abstract description 23
- 238000003475 lamination Methods 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 238000007599 discharging Methods 0.000 claims abstract description 20
- 230000000694 effects Effects 0.000 claims abstract description 15
- 238000009835 boiling Methods 0.000 claims description 67
- 239000004744 fabric Substances 0.000 claims description 37
- 239000000523 sample Substances 0.000 claims description 32
- 230000005611 electricity Effects 0.000 claims description 12
- 229920000297 Rayon Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000002775 capsule Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 206010037660 Pyrexia Diseases 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000003032 molecular docking Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0404—Machines for assembling batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/005—Devices for making primary cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A kind of warehouse style laminating apparatus of electronic product module, including feeding and device for discharging and several electronic product module laminaters, the electronic product module laminater is stacked on top of one another and left-right situs；The electronic product module laminater includes vacuum chamber and lamination fixture, and the vacuum chamber includes the cavity for being laminated fixture described in device；The lamination fixture fixation is set in the cavity, and the feeding and device for discharging are each lamination fixture feeding or discharging；Alternatively, the lamination fixture is arranged relative to vacuum chamber activity, the feeding and device for discharging by the lamination fixture loading with electronic product module to be laminated or draw off the cavity.The advantages of present invention has heating speed fast, high production efficiency.
Description
Technical field
The present invention relates to a kind of electronic product module process equipments, especially a kind of such as photovoltaic module, flexible circuit board, electricity
The warehouse style laminating apparatus of the electronic product modules such as the lamination between pond pole piece and battery diaphragm.
Background technique
Electronic product module, such as the lamination of photovoltaic products component is that the battery that will have been laid is put into laminating machine, is passed through
It vacuumizes the air extraction in component, and heating makes EVA fusing that battery, glass and backboard to bond together；Finally cool down
Take out mould group.For another example, the lamination of flexible circuit board is cooperated by upper air bag component and evacuated panel, by flexible circuit board be placed on by
Upper air bag component and the type that evacuated panel is constituted are intracavitary, impose enough pressure by the air bag to upper air bag component, are vacuumizing
In the environment of flexible circuit board is pressed.Lamination is the key that electronic product module produces a step, the quality of laminate quality
It will have a direct impact on the final mass of electronic product module；The heating method that layer adds will have a direct impact on the production efficiency of lamination.
The laminating method of existing electronic product module is to carry out indirect heating to the electronic product being laminated using hot wind,
It is slow there are heating rate, hot wind heat utilization efficiency is low, the big problem of energy loss；Second is that the existing mode vacuumized designs and does not conform to
Reason, there are the gas discharges between electronic product module slowly, and there are problems that part residual gas and influence product quality；But also it deposits
In the low problem of production efficiency.
Summary of the invention
In order to overcome the above problem, the present invention provides that a kind of heating speed is fast, the electronic product module storehouse of high production efficiency
Storage formula laminating apparatus.
A kind of technical solution of the invention is: a kind of warehouse style laminating apparatus of electronic product module, including feeding and discharging
Device and several electronic product module laminaters, the electronic product module laminater is stacked on top of one another, and left and right
Arrangement；The electronic product module laminater includes vacuum chamber and lamination fixture, and the vacuum chamber includes being used for device
The cavity of the lamination fixture；The lamination fixture fixation is set in the cavity, and the feeding and device for discharging are each institute
State lamination fixture feeding or discharging；Alternatively, the lamination fixture is arranged relative to vacuum chamber activity, the feeding and discharging dress
It sets and the lamination fixture with electronic product module to be laminated is packed into or is drawn off the cavity.
As improvement of the present invention, the lamination fixture is mechanical lamination fixture, the mechanical lamination fixture packet
Cope plate and lower template are included, the cope plate and lower template predetermined distance are connected as one by support column, on described
The top of template is equipped with support plate, is equipped with the straight line driving mechanism for driving the upper module lifting in the support plate；?
The inner bottom surface of the cope plate is equipped with the first electric boiling plate, or/and is equipped with the second electricity on the inner bottom surface of the lower template and adds
Hot plate.
As improvement of the present invention, it is heat-insulated that first is equipped between the bottom surface and the first electric boiling plate of the cope plate
Soft rubber mat.
As improvement of the present invention, the first thermally conductive soft rubber mat is equipped on the bottom surface of first electric boiling plate.
As improvement of the present invention, the first high-temperature adhesion resistant is equipped on the bottom surface of the described first thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, the net for preventing viscose glue overflow around is equipped on the bottom surface of high-temperature adhesion resistant cloth
Lattice.
As improvement of the present invention, at least provided with first temperature probe, the temperature in first heating plate
Control probe is connect with the first signal connector for being located at cope plate.
As improvement of the present invention, on the upper bottom surface of the lower template between the second electric boiling plate be equipped with second every
Heat softenable rubber mat.
As improvement of the present invention, the second thermally conductive soft rubber mat is equipped on the upper bottom surface of second electric boiling plate.
As improvement of the present invention, the second high-temperature adhesion resistant is equipped on the upper bottom surface of the described second thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, at least provided with second temperature probe in second heating plate, described
Two temperature probes are connect with the second signal connector for being located at lower template.
As improvement of the present invention, the first electrode connecting with the first electric boiling plate is equipped on the cope plate,
The lower template is equipped with the second electrode connecting with the second electric boiling plate.
As improvement of the present invention, be equipped on the inner wall of the cavity control by control circuit with it is described first electric
First contact of pole connection, or/and the second contact being connect with the second electrode controlled by the control circuit.
As improvement of the present invention, the lamination fixture is gasbag-type lamination fixture, and the gasbag-type is laminated fixture packet
Cope plate and lower template are included, the cope plate and lower template predetermined distance are connected as one by support column, on described
The inner bottom surface of template is equipped with the first air bag, or/and the second air bag is equipped on the inner bottom surface of the lower template；Described first
The bottom surface of air bag is equipped with the first electric boiling plate, or/and the second electric boiling plate is equipped on the upper bottom surface of second air bag.
As improvement of the present invention, between the bottom surface and the first electric boiling plate of first air bag be equipped with first every
Heat softenable rubber mat.
As improvement of the present invention, the first thermally conductive soft rubber mat is equipped on the bottom surface of first electric boiling plate.
As improvement of the present invention, the first high-temperature adhesion resistant is equipped on the bottom surface of the described first thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, the net for preventing viscose glue overflow around is equipped on the bottom surface of high-temperature adhesion resistant cloth
Lattice.
As improvement of the present invention, at least provided with first temperature probe, the temperature in first heating plate
Control probe is connect with the first signal connector for being located at cope plate.
As improvement of the present invention, second is equipped between the second electric boiling plate on the upper bottom surface of second air bag
Heat-insulated soft rubber mat.
As improvement of the present invention, the second thermally conductive soft rubber mat is equipped on the upper bottom surface of second electric boiling plate.
As improvement of the present invention, the second high-temperature adhesion resistant is equipped on the upper bottom surface of the described second thermally conductive soft rubber mat
Cloth.
As improvement of the present invention, at least provided with second temperature probe in second heating plate, described
Two temperature probes are connect with the second signal connector for being located at lower template.
As improvement of the present invention, the first electrode connecting with the first electric boiling plate is equipped on the cope plate,
The lower template is equipped with the second electrode connecting with the second electric boiling plate.
The present invention is due to using several electronic product module laminaters, on the electronic product module laminater
The structure of lower stacking and left-right situs, can be improved the production efficiency of electronic product module；Due to using electrically heated side
Formula directly heats electronic product module, has the advantages that heating speed is fast, energy loss is small, meanwhile, it is produced using by having electronic
The lamination fixture of product component is packed into the intracorporal structure of chamber of vacuum chamber, vacuumizes to the cavity of entire vacuum chamber, and has
The advantages of gas discharge effect between electronic product module is good, basic noresidue gas.
Detailed description of the invention
Fig. 1 is the schematic perspective view of an embodiment of the present invention.
Fig. 2 is the side structure schematic diagram of embodiment illustrated in fig. 1.
Fig. 3 is the schematic perspective view of the laminater in the present invention with mechanical clips.
Fig. 4 is mechanical clips planar structure schematic diagram in Fig. 3.
Fig. 5 is the schematic perspective view at another visual angle of Fig. 3.
Fig. 6 is the schematic perspective view of the laminater in the present invention with gas bag type clamp.
Fig. 7 is the schematic perspective view at another visual angle of Fig. 6.
Fig. 8 is the planar structure schematic diagram of Fig. 6.
Fig. 9 is the planar structure schematic diagram of the gas bag type clamp in Fig. 6.
Figure 10 is the schematic perspective view at another visual angle of Fig. 9.
It is indicated in figure:
100, fixture, 200, vacuum chamber, cavity 210 are mechanically laminated；300, electronic product module laminater, 400, feeding
And device for discharging, 500, material assembly line；
1, cope plate, the 12, first electric boiling plate, the 13, first heat-insulated soft rubber mat, the 14, first thermally conductive soft rubber mat, 15, first
High-temperature adhesion resistant cloth, 16, grid；17, first electrode, the 18, first signal connector, 30, electronic product module；
2, lower template, the 22, second electric boiling plate, the 23, second heat-insulated soft rubber mat, the 24, second thermally conductive soft rubber mat, 25, second
High-temperature adhesion resistant cloth；26, second electrode, 27, second signal connector.
3, support rod, 4, support plate, 5, straight line driving mechanism can be cylinder or electric cylinders etc..
Specific embodiment
In the description of the present invention, it is to be understood that, "center" in term, "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of instructions such as " right sides " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing this hair
Bright and simplified description, rather than the device or component of indication or suggestion meaning must have a particular orientation, with specific orientation
Construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only,
It is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
Connect ", " connected " shall be understood in a broad sense, for example, it may be fixedly connected, be also possible to dismantling connection or integral type connection；It can be with
It is mechanical connection, is also possible to be electrically connected；It can be directly connected, be also possible to indirectly connected through an intermediary, can be
The connection of two component internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
The concrete meaning of invention.
Referring to Figure 1 and what Fig. 2, Fig. 1 and Fig. 2 disclosed is a kind of warehouse style laminating apparatus of electronic product module, including upper
Material and device for discharging 400, in the present embodiment, the feeding and device for discharging 400 are robots, certainly, the feeding and discharging
Device 400 can also be but be not limited to XYZ feeding and cutting agency and several electronic product module laminaters 300,
The electronic product module laminater 300 is stacked on top of one another (in the present embodiment, to depict four layers of superposition, indeed according to equipment
The height of installation space can select the suitable superposition number of plies) and left-right situs (in the present embodiment, draw 8 rows and tie side by side
Structure can be selected indeed according to the size of production capacity demand and suitably organize number side by side)；The electronic product module laminater
300 include vacuum chamber 200 and lamination fixture 100, and the vacuum chamber 200 includes for being laminated fixture 100 described in device
Cavity 210；In the present embodiment, the fixation of lamination fixture 100 is located in the cavity 210, the feeding and device for discharging 400
By the electronic product module 30 on material assembly line 500, each lamination fixture in cavity 210 is packed into or drawn off
100, here it is the fixed connection types of so-called lamination fixture 100 and vacuum chamber 200.In the present embodiment, the material
Assembly line 500 includes that upper layer feeding assembly line 510, middle layer discharging assembly line 520 and lower layer's fixture reflux assembly line 530 form.
The feeding and device for discharging 400 include robot 410 and the guide rail structure 420 for robot 410 to be arranged.
Obviously, the lamination fixture 100, which also can be designed so that, is arranged (that is relative to 200 activity of vacuum chamber
The lamination fixture 100 can take out out of vacuum chamber 200, or be packed into vacuum chamber 200 in), at this moment, the feeding and
Lamination fixture 100 with electronic product module 30 to be laminated can be packed into or be drawn off the cavity by device for discharging 400
210；Here it is the movable connection types of so-called lamination fixture 100 and vacuum chamber 200.
Laminater during the present invention will now be explained with reference to the accompanying drawings.
Fig. 3 to Fig. 5 is referred to, what Fig. 3 to Fig. 5 was disclosed is a kind of mechanical laminater 300, including vacuum chamber 200
With mechanical lamination fixture 100, the vacuum chamber 200 includes the cavity for being mechanically laminated fixture 100 described in device
210, the mechanical lamination fixture 100 is fixed or movable to be located in the cavity 210, and the mechanical lamination fixture 100 wraps
Cope plate 1 and lower template 2 are included, the cope plate 1 and 2 predetermined distance of lower template are connected as one by support column 3, in institute
The top for stating cope plate 1 is equipped with support plate 4, is equipped with the linear drives for driving the cope plate 1 to go up and down in the support plate 4
Mechanism 5；The first electric boiling plate 12 is equipped on the inner bottom surface of the cope plate 1, or/and on the inner bottom surface of the lower template 2
Equipped with the second electric boiling plate 22.
In the present embodiment, the mechanical structure for being laminated fixture 100 is sequentially consisted of: part of the lower die, lower template 2, the
Two heat-insulated soft rubber mats 23, second the 22, second thermally conductive soft rubber mat 24 of electric boiling plate and the second high-temperature adhesion resistant cloth 25；Grid 16,
First the 15, first thermally conductive soft rubber mat 14 of high-temperature adhesion resistant cloth, first the 12, first heat-insulated soft rubber mat 23 of electric boiling plate and cope plate
1, electronic product module 30 is located between grid 16 and the second high-temperature adhesion resistant cloth 25, is added using the first electric boiling plate 12 and the second electricity
Hot plate 22 heats it, meanwhile, mechanical compression is provided using straight line driving mechanism 5, electronic product module 30 is laminated.
The present embodiment is illustrated by taking double heating plates as an example, and still, the present invention is not excluded for only using one of those
The case where heating plate, only uses the first heating plate 12 or only uses the second heating plate 22.
In the present embodiment, by making the non-adhesion in electronic product module 30 to 30 Double-side Heating of electronic product module
Each layer material melts are integrated, and become qualified products.
The profiling of lower template 2 and cope plate 1 in the present embodiment is that the shape of foundation electronic product module 30 obtains,
When lower template 2 and cope plate 1 are opposite position, the first electric boiling plate and the second electric boiling plate should be flexible electric boiling plate, soft
Property electric boiling plate flexible material is preferably worked by sulfuration process with the fever such as adding thermal resistance such as resistor disc, resistance wire material
On rubber mat, a kind of flexible flexible heater body is made, to achieve the purpose that be bonded with product surface；Obviously, of the invention
It is also suitable for being laminated planar electronic product module 30, only under the upper bottom surface and cope plate 1 of its lower template 2
Bottom surface should be plane, the first electric boiling plate and the not necessarily flexible electric boiling plate of the second electric boiling plate, can be the first high temperature
The hard electric boiling plate that adhesion-proof cloth, the first layer of silica gel, first heating element and aluminium sheet are constituted, can also be the first high-temperature adhesion resistant
What cloth, the first layer of silica gel, first heating element, aluminium sheet, second heatiing element, the second layer of silica gel and the second high-temperature adhesion resistant cloth were constituted
Hard electric boiling plate.
In the present embodiment, the first heat-insulated soft effect of rubber mat 13 is to reduce the fever of the first heating plate 12 to conduct to cope plate 1,
To reduce energy loss；Likewise, the effect of the second heat-insulated soft rubber mat 23 is identical.First heat-insulated soft rubber mat 13 and second every
If heat softenable rubber mat 23 be it is soft there is good heat-proof quality again with certain pull resistance, it can be but not
It is limited to make of aluminium silicate wool.
First thermally conductive soft rubber mat 14 and the second thermally conductive soft effect of rubber mat 24 are: conduction heat and uniform heat, and have
Having has micro-displacement inside rubber mat under external pressure, to improve the uniformity that external force is transmitted to product surface；First is thermally conductive soft
Property rubber mat 14 and the second thermally conductive soft rubber mat 24 can be made of liquid-state silicon gel.
The effect of first high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth: prevent electronic product module 30 thermally conductive soft with first
Property rubber mat 14 and the second thermally conductive soft 24 rubber mat of rubber mat have certain adhesive, increase the mobility of micro-displacement inside rubber mat；
First high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth can be made of Teflon cloth.
Grid 16 acts on: when preventing electronic product module 30 from melting, preventing hot melt adhesive in electronic product module 30 to electricity
The surrounding of sub- product component 30 is overflowed, and raising prevents 30 sealing effect of electronic product module.Grid material will have softness
Property, there is stretch-resistance again, can be made of various soft plastics or Teflon.
In the present embodiment, the first electrode 17 connecting with the first electric boiling plate 12 is equipped on the cope plate 1, described
Lower template 2 is equipped with the second electrode 26 connecting with the second electric boiling plate 22；In the present embodiment, the first electrode 17 and second
Electrode 26 is respectively the first electric boiling plate 12 and the second electric heating for connecting with the corresponding contacts on the inner wall of cabinet 200
Plate 22 provides external power supply referring to the description of following pairs of laminater；Obviously, if mechanically lamination fixture 100 directly fixation is set
When setting in cabinet 200, the mode that first electrode 12 and second electrode 22 are connect with the corresponding contacts on the inner wall of cabinet 200,
It is readily modified as the mode of direct route docking.
Preferably, in first heating plate 12 at least provided with first temperature probe, the temperature probe with set
It is connected in the first signal connector 18 of cope plate 1；First temperature probe number can be set as needed, when first electricity plus
When the area of hot plate 12 is big, the first temperature probe can be arranged using Distributed Multi, in the temperature for obtaining more points.
Preferably, at least provided with second temperature probe, second temperature probe in second heating plate 22
It is connect with the second signal connector 27 for being located at lower template 2；Likewise, the number of the second temperature probe can according to need and set
It is fixed, when the area of the second electric boiling plate 22 is big, the second temperature probe can be arranged using Distributed Multi, obtain more points
Temperature.
Preferably, the first electrode 17 connecting with the first electric boiling plate 12 is equipped on the cope plate 1, in the lower die
Plate 2 is equipped with the second electrode 26 connecting with the second electric boiling plate 22.
The first touching connecting with the first electrode controlled by control circuit is equipped on the inner wall of the cavity 210
Point, or/and the second contact being connect with the second electrode controlled by the control circuit.
Fig. 6 to Fig. 8 is referred to, Fig. 6 to Fig. 8 revealed is a kind of gasbag-type laminater, including 200 He of vacuum chamber
Gasbag-type is laminated fixture 110, and the vacuum chamber 200 includes the cavity 210 for the lamination fixture 110 of gasbag-type described in device,
Gasbag-type lamination fixture 110 can be it is fixed or movable be arranged in the cavity 210, when being actively installed on cavity 210
When interior, it is equipped on the inner wall of the cavity 210 and can connecting with the first electrode 12 for control is not drawn by control circuit
First contact, or/and the second contact that can be connect with the second electrode 22 controlled by the control circuit；When fixation is set
When in cavity 210, the first electrode 12 or/and second electrode 23 can directly be connect with external power supply, the gasbag-type layer
Pressure fixture 110 is above-mentioned gasbag-type lamination fixture.
It, can be gentle by the gas-tpe fitting 220 being located on air bag with tracheae when air bag is open air bag in the present embodiment
Road conversion equipment 230 connects, and air bag inner cavity is kept to communicate with atmosphere；Electronic product module 30 is put into gasbag-type lamination nip
In tool 110, gasbag-type lamination fixture is integrally put into vacuum chamber 200, chamber door 250 is closed by switch door cylinder 240, is led to
It crosses vacuum pipe 260 cavity 210 of vacuum chamber 100 is carried out being evacuated down to negative pressure 100Pa or more, passes through the first air bag 11
Or/and second air bag 21 expand, to electronic product module 30 press, and pass through the first electric boiling plate 12 or/and the second electric heating
Plate 23 heats, and electronic product module 30 is made to reach 150 DEG C -160 DEG C, heat-insulation pressure keeping 10-20 minutes；It is then cooling, and take out production
Product.
When air bag is sealed air bag, a certain amount of air can be filled with into air bag by gas-tpe fitting 220, keeps gas
The air tight gas leakage in 24 hours of capsule is less than 50pa；Gasbag-type lamination fixture is integrally put into vacuum chamber 200, switch is passed through
Door cylinder 240 closes chamber door 250, carries out being evacuated down to negative pressure by cavity 210 of the vacuum pipe 260 to vacuum chamber 100
100Pa or more is expanded by the first air bag 11 or/and the second air bag 21, is pressed to electronic product module 30, and passes through the first electricity
Heating plate 12 or/and the heating of the second electric boiling plate 23, make electronic product module 30 reach 150 DEG C -160 DEG C, heat-insulation pressure keeping 10-20
Minute；It is then cooling, and take out product.
When air bag is flow controlling type air air bag, gas-tpe fitting 220 and gas circuit conversion equipment 230 are connected with tracheae
Come, the tracheae of gas circuit conversion equipment 230 is connect with solenoid valve 270；Gasbag-type lamination fixture is integrally put into vacuum chamber 200
In, chamber door 250 is closed by switch door cylinder 240, take out by cavity 210 of the vacuum pipe 260 to vacuum chamber 100 true
Sky arrives negative pressure 100Pa or more, and air bag does not generate pressure to electronic product module 30 at this time, opens solenoid valve 270, is passed through to air bag
Air, and electronic product module 30 is laminated by the expansion of the first air bag 11 or/and the second air bag 21, and is added by the first electricity
Hot plate 12 or/and the heating of the second electric boiling plate 23, make electronic product module 30 reach 150 DEG C -160 DEG C, heat-insulation pressure keeping 10-20 points
Clock；It is then cooling, and take out product.The benefit of the laminater of this structure can be according to different electronic product modules 30
It needs, it can be achieved that being laminated in predetermined amount of time to electronic product module 30.
Fig. 9 and Figure 10 are referred to, what Fig. 9 and Figure 10 were disclosed is a kind of reality of the gasbag-type lamination fixture 110 in the present invention
Example, including cope plate 1 and lower template 2 are applied, the cope plate 1 and 2 predetermined distance of lower template pass through support column 3 and be connected as one
Body, gasbag-type are laminated fixture 110 from the bottom up successively are as follows: lower template 2, second the 21, second heat-insulated soft rubber mat 22, second of air bag
The thermally conductive soft rubber mat 24 of heating plate 23, second, the second high-temperature adhesion resistant cloth 25, electronic product module 30, grid 16, the first high temperature are anti-
The thermally conductive soft rubber mat 14 of sticky cloth 15, first, first the 12, first heat-insulated soft rubber mat 13 of heating plate, the first air bag 11 and upper mold 1.
The present embodiment is illustrated by taking double heating plates as an example, and still, the present invention is not excluded for only using one of heating plate
Situation only uses the first heating plate 12 or only uses the second heating plate 22.
In the present embodiment, by making the non-adhesion in electronic product module 30 to 30 Double-side Heating of electronic product module
Each layer material melts are integrated, and become qualified products.
Lower template 2 in the present embodiment, the second air bag 21, the profiling of cope plate 1 and the first air bag 11 are according to electronics
What the shape of product component 30 obtained, when lower template 2 and when being relatively of cope plate 1, the first electric boiling plate and the second electricity add
Hot plate should be flexible electric boiling plate, and flexible electric boiling plate is preferably logical with the fever material such as adding thermal resistance such as resistor disc, resistance wire
Over cure technique is worked on flexible material rubber mat, makes a kind of flexible flexible heater body, to reach and product table
The purpose that face paste is closed；Obviously, the present invention is also suitable for being laminated planar electronic product module 30, only its lower die
The upper bottom surface of plate 2 and the bottom surface of cope plate 1 should be plane, and the first electric boiling plate and the second electric boiling plate are not necessarily flexible
Electric boiling plate, the hard electric heating that can be constituted for the first high-temperature adhesion resistant cloth, the first layer of silica gel, first heating element and aluminium sheet
Plate can also be the first high-temperature adhesion resistant cloth, the first layer of silica gel, first heating element, aluminium sheet, second heatiing element, the second silica gel
The hard electric boiling plate that layer and the second high-temperature adhesion resistant cloth are constituted.
In the present embodiment, the first heat-insulated soft effect of rubber mat 13 is to reduce the fever of the first heating plate 12 to conduct to cope plate 1,
To reduce energy loss；Likewise, the effect of the second heat-insulated soft rubber mat 23 is identical.First heat-insulated soft rubber mat 13 and second every
If heat softenable rubber mat 23 be it is soft there is good heat-proof quality again with certain pull resistance, it can be but not
It is limited to make of aluminic acid cotton.
First thermally conductive soft rubber mat 14 and the second thermally conductive soft effect of rubber mat 24 are: conduction heat and uniform heat, and have
Having has micro-displacement inside rubber mat under external pressure, to improve the uniformity that external force is transmitted to product surface；First is thermally conductive soft
Property rubber mat 14 and the second thermally conductive soft rubber mat 24 can be made of liquid-state silicon gel.
The effect of first high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth: prevent electronic product module 30 thermally conductive soft with first
Property rubber mat 14 and the second thermally conductive soft 24 rubber mat of rubber mat have certain adhesive, increase the mobility of micro-displacement inside rubber mat；
First high-temperature adhesion resistant cloth 15 and the second high-temperature adhesion resistant cloth can be made of Teflon cloth.
Grid 16 acts on: when preventing electronic product module 30 from melting, preventing hot melt adhesive in electronic product module 30 to electricity
The surrounding of sub- product component 30 is overflowed, and raising prevents 30 sealing effect of electronic product module.Grid material will have softness
Property, there is stretch-resistance again, can be made of various soft plastics or Teflon.
In the present embodiment, the first electrode 17 connecting with the first electric boiling plate 12 is equipped on the cope plate 1, described
Lower template 2 is equipped with the second electrode 26 connecting with the second electric boiling plate 22；In the present embodiment, the first electrode 17 and second
Electrode 26 is respectively the first electric boiling plate 12 and the second electric heating for connecting with the corresponding contacts on the inner wall of cabinet 200
Plate 22 provides external power supply referring to the description of following pairs of laminater；Obviously, if the directly fixation of gasbag-type lamination fixture 110 is set
When setting in cabinet 200, the mode that first electrode 12 and second electrode 22 are connect with the corresponding contacts on the inner wall of cabinet 200,
It is readily modified as the mode of direct route docking.
Preferably, in first heating plate 12 at least provided with first temperature probe, the temperature probe with set
It is connected in the first signal connector 18 of cope plate 1；First temperature probe number can be set as needed, when first electricity plus
When the area of hot plate 12 is big, the first temperature probe can be arranged using Distributed Multi, in the temperature for obtaining more points.
Preferably, at least provided with second temperature probe, second temperature probe in second heating plate 22
It is connect with the second signal connector 27 for being located at lower template 2；Likewise, the number of the second temperature probe can according to need and set
It is fixed, when the area of the second electric boiling plate 22 is big, the second temperature probe can be arranged using Distributed Multi, obtain more points
Temperature.
In the present embodiment, first air bag 11 or/and the second air bag 21 can be with open air bag, closed air bag or gas
Flow control standard air bag, so-called open air bag be this fixture when in use, air bag is communicated with ambient atmosphere；It is so-called closed
Formula air bag is to be not communicated with ambient atmosphere, but can fill in advance portion of air when in use and enter；The flow controlling type air
Air bag is that control air valve is provided on the interface that air bag is communicated with atmosphere, with the input air into air bag as needed.This hair
In bright, the air bag can be made of high anti-tear silica gel.
It, for ease of use, can be by cope plate 1 and the first air bag 11 with for part of the upper die in the various embodiments described above
One press strip 280 links together, and by the first heat-insulated soft rubber mat 13, first the 12, first thermally conductive soft rubber mat 14 of electric boiling plate,
First high-temperature adhesion resistant cloth 15 and grid 16 are complex as a whole by vulcanization；It can also be by 2 He of lower template for part of the lower die
Second air bag 21 passes through the second press strip link together, and the second heat-insulated soft rubber mat 23, the second electric boiling plate 22, second are led
Heat softenable rubber mat 24 and the second high-temperature adhesion resistant cloth 25 are complex as a whole by vulcanization.
In the various embodiments described above, vacuum chamber 200 and gasbag-type the lamination nip tool 110 of the laminater is split type
Weigh up formula structure, in fact, vacuum chamber 200 in the present invention and gasbag-type lamination nip tool 110 can also be designed to it is solid
Gasbag-type lamination fixture 110 is to be set in advance in vacuum chamber 200, after opening chamber door, directly by electronics by fixed pattern structure
Product component 30 is put into gasbag-type lamination fixture 110, under this state, the first electrode 17 and second electrode 26 and cabinet
On contact can be changed to the structure of direct route docking.
It should be noted that explaining in detail for the respective embodiments described above, purpose, which is only that, solves the present invention
It releases, in order to be able to preferably explain the present invention, still, these descriptions cannot be with any explanation at being to limit of the invention
System, in particular, each feature described in various embodiments can also mutual any combination, to form other implementations
Mode, in addition to there is clearly opposite description, these features should be understood to can be applied in any one embodiment, and simultaneously
It is not only limited to described embodiment.
Claims (24)
1. a kind of warehouse style laminating apparatus of electronic product module, it is characterised in that: including feeding and device for discharging (400), and
Several electronic product module laminaters (300), the electronic product module laminater (300) is stacked on top of one another, and left
Right arrangement；The electronic product module laminater (300) includes vacuum chamber (200) and lamination fixture (100), the vacuum
Cabinet (200) includes the cavity (210) for being laminated fixture (100) described in device；Lamination fixture (100) fixation is located at institute
It states in cavity (210), the feeding and device for discharging (400) are each lamination fixture (100) feeding or discharging；Alternatively,
The lamination fixture (100) is arranged relative to vacuum chamber (200) activity, and the feeding and device for discharging (400) need band
The lamination fixture (100) of the electronic product module (30) of lamination is packed into or draws off the cavity (210).
2. the warehouse style laminating apparatus of electronic product module according to claim 1, it is characterised in that: the lamination fixture
It (100) is mechanical lamination fixture, the mechanical lamination fixture includes cope plate (1) and lower template (2), the cope plate
(1) it is connected as one with lower template (2) predetermined distance by support column (3), is equipped with branch in the top of the cope plate (1)
Board (4) is equipped with the straight line driving mechanism (5) for driving the upper module (1) to go up and down in the support plate (4)；Described
The inner bottom surface of cope plate (1) is equipped with the first electric boiling plate (12), or/and the is equipped on the inner bottom surface of the lower template (2)
Two electric boiling plates (22).
3. the warehouse style laminating apparatus of electronic product module according to claim 2, it is characterised in that: in the cope plate
(1) the first heat-insulated soft rubber mat (13) is equipped between bottom surface and the first electric boiling plate (12).
4. the warehouse style laminating apparatus of electronic product module according to claim 2, it is characterised in that: add in first electricity
The bottom surface of hot plate (12) is equipped with the first thermally conductive soft rubber mat (14).
5. the warehouse style laminating apparatus of electronic product module according to claim 4, it is characterised in that: thermally conductive described first
The bottom surface of soft rubber mat (14) is equipped with the first high-temperature adhesion resistant cloth (15).
6. the warehouse style laminating apparatus of electronic product module according to claim 5, it is characterised in that: in high-temperature adhesion resistant cloth
(15) bottom surface is equipped with the grid (16) for preventing viscose glue overflow around.
7. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: described first
At least provided with first temperature probe in heating plate (12), the temperature probe connects with the first signal for being located at cope plate (1)
Connector (18) connection.
8. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: in the lower die
The second heat-insulated soft rubber mat (23) is equipped on the upper bottom surface of plate (2) between the second electric boiling plate (22).
9. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: described second
The upper bottom surface of electric boiling plate (22) is equipped with the second thermally conductive soft rubber mat (24).
10. the warehouse style laminating apparatus of electronic product module according to claim 9, it is characterised in that: led described second
The upper bottom surface of heat softenable rubber mat (24) is equipped with the second high-temperature adhesion resistant cloth (25).
11. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: described second
At least provided with second temperature probe, second temperature probe and the second letter for being located at lower template (2) in heating plate (22)
The connection of number connector (27).
12. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: in the upper mold
Plate (1) is equipped with the first electrode (17) connecting with the first electric boiling plate (12), is equipped on the lower template (2) and the second electricity
The second electrode (26) of heating plate (22) connection.
13. the warehouse style laminating apparatus of electronic product module according to claim 2 or 3, it is characterised in that: in the cavity
(210) inner wall is equipped with the first contact connecting with the first electrode controlled by control circuit, or/and by the control
The second contact of circuit control processed being connect with the second electrode.
14. the warehouse style laminating apparatus of electronic product module according to claim 1, it is characterised in that: the lamination fixture
It (100) is gasbag-type lamination fixture, the gasbag-type lamination fixture includes cope plate (1) and lower template (2), the cope plate
(1) it is connected as one with lower template (2) predetermined distance by support column (3), is set on the inner bottom surface of the cope plate (1)
There are the first air bag (11), or/and is equipped with the second air bag (21) on the inner bottom surface of the lower template (2)；In first air bag
(11) bottom surface is equipped with the first electric boiling plate (12), or/and second is equipped on the upper bottom surface of second air bag (21)
Electric boiling plate (22).
15. electronic product module gasbag-type according to claim 14 is laminated fixture, it is characterised in that: in first gas
The first heat-insulated soft rubber mat (13) is equipped between the bottom surface and the first electric boiling plate (12) of capsule (11).
16. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: described the
The bottom surface of one electric boiling plate (12) is equipped with the first thermally conductive soft rubber mat (14).
17. electronic product module gasbag-type according to claim 16 is laminated fixture, it is characterised in that: led described first
The bottom surface of heat softenable rubber mat (14) is equipped with the first high-temperature adhesion resistant cloth (15).
18. electronic product module gasbag-type according to claim 17 is laminated fixture, it is characterised in that: in high-temperature adhesion resistant cloth
(15) bottom surface is equipped with the grid (16) for preventing viscose glue overflow around.
19. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: described the
At least provided with first temperature probe, the temperature probe and the first signal for being located at cope plate (1) in one heating plate (12)
Connector (18) connection.
20. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: described the
The second heat-insulated soft rubber mat (23) is equipped on the upper bottom surface of two air bags (21) between the second electric boiling plate (22).
21. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: described the
The upper bottom surface of two electric boiling plates (22) is equipped with the second thermally conductive soft rubber mat (24).
22. electronic product module gasbag-type according to claim 21 is laminated fixture, it is characterised in that: led described second
The upper bottom surface of heat softenable rubber mat (24) is equipped with the second high-temperature adhesion resistant cloth (25).
23. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: described the
At least provided with second temperature probe in two heating plates (22), second temperature probe and it is located at the second of lower template (2)
Signal connector (27) connection.
24. electronic product module gasbag-type according to claim 14 or 15 is laminated fixture, it is characterised in that: on described
Template (1) is equipped with the first electrode (17) connecting with the first electric boiling plate (12), is equipped with and second on the lower template (2)
The second electrode (26) of electric boiling plate (22) connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910325776.3A CN110289229B (en) | 2019-04-23 | 2019-04-23 | Storage type laminating equipment for electronic product components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910325776.3A CN110289229B (en) | 2019-04-23 | 2019-04-23 | Storage type laminating equipment for electronic product components |
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| CN110289229B CN110289229B (en) | 2024-04-05 |
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| CN201910325776.3A Active CN110289229B (en) | 2019-04-23 | 2019-04-23 | Storage type laminating equipment for electronic product components |
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| TW201401395A (en) * | 2012-03-23 | 2014-01-01 | Shibaura Mechatronics Corp | Device and method for mounting electronic component |
| CN102700231A (en) * | 2012-06-28 | 2012-10-03 | 特新电路材料（东莞）有限公司 | Laminating device of circuit board laminating machine and pressing method applying laminating device |
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| CN110289229B (en) | 2024-04-05 |
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