CN110165003B - 一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 - Google Patents
一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 Download PDFInfo
- Publication number
- CN110165003B CN110165003B CN201910319519.9A CN201910319519A CN110165003B CN 110165003 B CN110165003 B CN 110165003B CN 201910319519 A CN201910319519 A CN 201910319519A CN 110165003 B CN110165003 B CN 110165003B
- Authority
- CN
- China
- Prior art keywords
- photonic crystal
- oxide
- tin oxide
- composite film
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 229910001887 tin oxide Inorganic materials 0.000 title claims abstract description 51
- 239000004038 photonic crystal Substances 0.000 title claims abstract description 47
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 229910001930 tungsten oxide Inorganic materials 0.000 title claims abstract description 36
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 239000011258 core-shell material Substances 0.000 title claims abstract description 32
- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 38
- 239000002243 precursor Substances 0.000 claims abstract description 22
- 238000000137 annealing Methods 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 15
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 claims abstract description 14
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims description 30
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 27
- 238000002791 soaking Methods 0.000 claims description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004793 Polystyrene Substances 0.000 claims description 10
- 229920002223 polystyrene Polymers 0.000 claims description 10
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 10
- 241000252506 Characiformes Species 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 230000007935 neutral effect Effects 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 238000004729 solvothermal method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 20
- 230000001699 photocatalysis Effects 0.000 description 10
- 238000007146 photocatalysis Methods 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 238000013032 photocatalytic reaction Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
本发明属于半导体薄膜技术领域,公开了一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用。所述复合薄膜是将氯化钨和钛酸异丙酯加入溶剂中配置反应前驱液,将氧化锡光子晶体加入反应前驱液在高压反应釜内密封后,在80~120℃恒温反应后,再在450~500℃下进行退火制得。该方法采用溶剂热合成,在氧化锡光子晶体上掺杂介孔核壳结构的氧化钨和氧化钛颗粒,制作出半导体薄膜。该薄膜可作为太阳能电池的阳极应用在太阳能电池领域中。
Description
技术领域
本发明属于半导体薄膜技术领域,更具体地,涉及一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用。
背景技术
近些年,环境污染成为人们亟待解决的一个重要问题。因半导体材料展现出独特的性能,使其为催化降解污染物注入了新的活力。尤其是面对水污染处理这一严峻的挑战,半导体催化剂能够吸收利用太阳光这一绿色能源来催化降解废水中的有机物,光催化效率高、安全性好,能降解几乎所有的有机污染物,使得开发比表面积大、光催化活性高、光响应范围广的光催化材料和经济、有效、环境友好的光催化废水处理技术成为当下研究的重要内容。
二氧化锡是一种非常重要的宽能级N型半导体金属氧化物(禁带宽度为3.6eV)由于其具有良好的气敏性能和独特的光学、电学性能,在气敏元件、气体传感器、电极材料及太阳能电池等多种领域有着广阔的应用前景。然而随着人们对二氧化锡的进一步研究,发现它也是一种很好的光催化剂,越来越多的人将其应用到光催化领域。光催化作用是在具有较高能量的紫外光照射下激发产生的,但是由于二氧化锡具有较宽的能级,因此只有较小波长的紫外光才能激发它的光催化作用,使得其对太阳光的利用率较低。另外,由于在光催化的过程中发挥关键作用的光生电子-空穴对不稳定而很容易复合,这也限制了二氧化锡光催化作用的发挥。因此,为了更好的发挥二氧化锡在光催化领域中的作用就必须解决两个方面的问题:(1)减小禁带宽度;(2)降低光生电子-空穴对的复合率。
发明内容
为了解决上述现有技术存在的不足和缺点,本发明的目的在于提供了一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜。
本发明另一目的在于提供了上述氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的制备方法。该方法采用溶剂热合成法在氧化锡光子晶体上负载介孔核壳结构的氧化钨和氧化钛颗粒,制作出半导体薄膜,该方法制备工艺简单且成本低廉。
本发明再一目的在于提供了上述氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的应用。
本发明的目的通过下述技术方案来实现:
一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,所述复合薄膜是将氯化钨和钛酸异丙酯加入溶剂中配置反应前驱液,将氧化锡光子晶体加入反应前驱液在高压反应釜内密封后,在80~120℃恒温反应后,再在450~500℃下进行退火制得。
优选地,所述溶剂为甲醇或乙醇。
优选地,所述氯化钨的物质的量和溶剂的体积比为(0.6~0.8)mmol:1L;所述氯化钨的质量和钛酸异丙酯的体积比为(0.05~0.15)g:(0.5~1)ml。
优选地,所述退火的时间为1~3h,所述恒温反应的时间为8~12h。
优选地,所述氧化锡光子晶体是将FTO玻璃导电面浸泡在聚苯乙烯溶液中在55~65℃恒温15~30h,然后再浸泡在氯化锡溶液中,430~500℃退火1~2h制得。
优选地,所述聚苯乙烯溶液的浓度为50~80mmol/L,所述氯化锡溶液的浓度为0.5~0.8mol/L。
所述的氧化锡光子晶体负载氧化钨和氧化钛复合薄膜的制备方法,包括如下具体步骤:
S1.将FTO导电玻璃放入食人鱼溶液浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
S2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在55~65℃恒温15~30h,然后再浸泡在氯化锡溶液中,450~500℃退火1~3h,制得氧化锡光子晶体;
S3.将氯化钨和钛酸异丙酯加入到甲醇或乙醇溶剂中配置反应前驱液;
S4.将氧化锡光子晶体放入高压反应釜内胆,将反应前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,恒温80~120℃反应8~12h后,再进行450~500℃退火1~3h处理,得到氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜。
优选地,步骤S1中所述食人鱼溶液为浓硫酸和30%过氧化氢的混合物。
优选地,步骤S1中所述浸泡的时间为8~12h,步骤S5中所述浸泡的时间为30~60s。
所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜在太阳能电池领域中的应用。
本发明通过负载介孔核壳结构的氧化钨和氧化钛实现了对二氧化锡光子晶体的改性。由于氧化钨除具有无毒、高稳定性、低成本等优点,更重要的是它的带隙能为2.4~2.8eV,具有可见光吸收,因此WO3是理想的负载对象。为了进一步提高光催化反应速率,人们通常会采用贵金属沉积、复合半导体等方式,通过这些手段构建内建电池或外加电场来促进光生电子、空穴分离。而氧化钛和氧化钨的复合物,降低了空穴和电子的复合,从而增加了参与反应的电子和空穴数量,显著提高了载流子的利用率。
与现有技术相比,本发明具有以下有益效果:
1.本发明采用溶剂热合成法,以甲醇或乙醇为溶剂,氯化钨为钨源,钛酸异丙酯为钛源,配置反应前驱液,在FTO上的氧化锡光子晶体上负载介孔核壳结构的氧化钛和氧化钨颗粒,制作出半导体薄膜。
2.本发明合成的介孔核壳结构的氧化钨和氧化钛复合薄膜可有效地提高载流子的寿命,提高材料的性能。
3.本发明所需设备和制备工艺简单、成本低廉,可直接大批量生产。
附图说明
图1为实施例1中制备的氧化锡光子晶体薄膜的表面SEM照片。
图2为实施例1制备的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的表面SEM照片。
具体实施方式
下面结合具体实施例进一步说明本发明的内容,但不应理解为对本发明的限制。若未特别指明,实施例中所用的技术手段为本领域技术人员所熟知的常规手段。除非特别说明,本发明采用的试剂、方法和设备为本技术领域常规试剂、方法和设备。
实施例1
1.FTO导电玻璃衬底的清洗:将FTO导电玻璃放入食人鱼溶液(浓硫酸和30%过氧化氢)浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在60℃恒温20h,然后再浸泡在0.5mol/L氯化锡溶液中,450℃退火2h,制得氧化锡光子晶体;
3.以40ml甲醇为溶剂,0.1g氯化钨为钨源,0.75ml钛酸异丙酯为钛源,配置反应前驱液;
4.再将氧化锡光子晶体放入高压反应釜内胆,将配置的前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,100℃恒温反应6h,在溶剂热反应后,再将其放入马弗炉进行475℃退火2h处理,得到氧化锡光子晶体负载介孔核壳结构的氧化钛和氧化钨复合薄膜。
图1为本实例制备的氧化锡光子晶体薄膜的表面SEM照片。从图1中可知,在50000倍的扫描电子显微镜下观察到的氧化锡光子晶体具有多层并有序地叠在一起,说明了氧化锡光子晶体的有序排列。图2为本实例制备的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的表面SEM照片。在200000倍的扫描电子显微镜下可以看到氧化钛均匀的包裹在氧化钨纳米颗粒上,形成完美的介孔核壳结构。
实施例2
1.FTO导电玻璃衬底的清洗:将FTO导电玻璃放入食人鱼溶液浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在60℃恒温20h,然后再浸泡在0.7mol/L氯化锡溶液中,450℃退火2h,制得氧化锡光子晶体;
3.以30ml甲醇为溶剂,0.1g氯化钨为钨源,0.5ml的钛酸异丙酯为钛源,配置反应前驱液;
4.再将氧化锡光子晶体放入高压反应釜内胆,将配置的前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,100℃恒温反应6h。在溶剂热反应后,再将其放入马弗炉进行475℃退火2h处理;制得氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜。
实施例3
1.FTO导电玻璃衬底的清洗:将FTO导电玻璃放入食人鱼溶液浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在55恒温30h,然后再浸泡在0.8mol/L氯化锡溶液中,450℃退火2h,制得氧化锡光子晶体;
3.以30ml甲醇为溶剂,0.1g氯化钨为钨源,1ml的钛酸异丙酯作为钛源,配置反应前驱液;
4.再将氧化锡光子晶体放入高压反应釜内胆,将配置的前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,100℃恒温反应6h。在溶剂热反应后,再将其放入马弗炉进行475℃退火2h处理,制得氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜。
实施例4
1.FTO导电玻璃衬底的清洗:将FTO导电玻璃放入食人鱼溶液浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在65℃恒温15h,然后再浸泡在0.5mol/L氯化锡溶液中,500℃退火1h,制得氧化锡光子晶体;
3.以20ml甲醇为溶剂,0.1g氯化钨为钨源,0.75ml的钛酸异丙酯为钛源,配置反应前驱液;
4.再将氧化锡光子晶体放入高压反应釜内胆,将配置的前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,100℃恒温反应6h。在溶剂热反应后,再将其放入马弗炉进行475℃退火2h处理;制得氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜。
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合和简化,均应为等效的置换方式,都包含在本发明的保护范围之内。
Claims (9)
1.一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,其特征在于,所述复合薄膜是将氯化钨和钛酸异丙酯加入溶剂中配置反应前驱液,将氧化锡光子晶体加入反应前驱液在高压反应釜内密封后,在80~120℃恒温反应后,再在450~500℃下进行退火制得;所述氯化钨的物质的量和溶剂的体积比为(0.6~0.8)mmol:1L;所述氯化钨的质量和钛酸异丙酯的体积比为(0.01~0.03)g:(0.1~0.2)mL。
2.根据权利要求1所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,其特征在于,所述溶剂为甲醇或乙醇。
3.根据权利要求1所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,其特征在于,所述退火的时间为1~3h,所述恒温反应的时间为8~12h。
4.根据权利要求1所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,其特征在于,所述氧化锡光子晶体是将FTO玻璃导电面浸泡在聚苯乙烯溶液中在55~65℃恒温15~30h,然后再浸泡在氯化锡溶液中,430~500℃退火1~2h制得。
5.根据权利要求4所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜,其特征在于,所述聚苯乙烯溶液的浓度为50~80mmol/L,所述氯化锡溶液的浓度为0.5~0.8mol/L。
6.根据权利要求1-5任一项所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的制备方法,其特征在于,包括如下具体步骤:
S1.将FTO导电玻璃放入食人鱼溶液浸泡,然后用去离子水冲洗至中性,得到干净的FTO玻璃;
S2.将干净的FTO玻璃导电面浸泡在聚苯乙烯溶液中在55~65℃恒温15~30h,然后再浸泡在氯化锡溶液中,450~500℃退火1~2h,制得氧化锡光子晶体;
S3.将氯化钨和钛酸异丙酯加入到甲醇或乙醇溶剂中配置反应前驱液;
S4.将氧化锡光子晶体放入高压反应釜内胆,将反应前驱液倒入高压反应釜内胆,密封后放入鼓风干燥箱中,恒温80~120℃反应8~12h后,再进行450~500℃退火1~3h处理,得到氧化锡光子晶体负载介孔核壳结构的氧化钛和氧化钨复合薄膜。
7.根据权利要求6所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的制备方法,其特征在于,步骤S1中所述食人鱼溶液为浓硫酸和30%过氧化氢的混合物。
8.根据权利要求6所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜的制备方法,其特征在于,步骤S1中所述浸泡的时间为8~12h,步骤S5中所述浸泡的时间为30~60s。
9.根据权利要求1-5任一项所述的氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜在太阳能电池领域中的应用。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910319519.9A CN110165003B (zh) | 2019-04-19 | 2019-04-19 | 一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910319519.9A CN110165003B (zh) | 2019-04-19 | 2019-04-19 | 一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110165003A CN110165003A (zh) | 2019-08-23 |
CN110165003B true CN110165003B (zh) | 2021-03-09 |
Family
ID=67639704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910319519.9A Expired - Fee Related CN110165003B (zh) | 2019-04-19 | 2019-04-19 | 一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110165003B (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101966450A (zh) * | 2010-07-29 | 2011-02-09 | 中国计量学院 | 一种高效复合光催化剂及其制备方法 |
CN102013328B (zh) * | 2010-11-01 | 2012-05-02 | 上海大学 | 一种染料敏化太阳能电池复合光阳极及其制备方法 |
KR20170096863A (ko) * | 2016-02-17 | 2017-08-25 | 주식회사 엘지화학 | 태양전지의 메조포러스 금속산화물 층의 제조 방법 |
CN108465465A (zh) * | 2018-04-04 | 2018-08-31 | 广东工业大学 | 一种半导体薄膜及其制备方法 |
CN109516495A (zh) * | 2018-12-13 | 2019-03-26 | 广东工业大学 | 一种氧化锡光子晶体负载氧化钨和硫化镉半导体薄膜及其制备方法和应用 |
-
2019
- 2019-04-19 CN CN201910319519.9A patent/CN110165003B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN110165003A (zh) | 2019-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yao et al. | Scale‐Up of BiVO4 Photoanode for Water Splitting in a Photoelectrochemical Cell: Issues and Challenges | |
Xiao et al. | Recent advances of metal‐oxide photoanodes: engineering of charge separation and transportation toward efficient solar water splitting | |
CN109402656B (zh) | 一种磷化钴修饰钼掺杂钒酸铋光电极的制备方法 | |
WO2021082403A1 (zh) | 一种富含表层氧空位的钒酸铋电极及其制备方法和应用 | |
Chandrasekaran et al. | Nanostructured silicon photoelectrodes for solar water electrolysis | |
CN110344029B (zh) | 一种表面羟基化氧化铁薄膜光阳极材料的制备方法 | |
CN113136602A (zh) | 一种钒酸铋/Vo-FeNiOOH复合光阳极的制备及应用 | |
CN112958116B (zh) | 一种Bi2O2.33-CdS复合光催化剂及其制备工艺 | |
CN110241439B (zh) | 一种等离子体处理制备表面羟基化wo3薄膜光电极材料的方法 | |
CN110252352A (zh) | 一种碳量子点修饰钨酸铋/有序大孔氟掺杂氧化锡复合光催化剂及其制备方法和应用 | |
CN109746001A (zh) | 一种氧化锡光子晶体负载氧化钨和硫化银复合膜及其制备方法和应用 | |
CN102909008A (zh) | 一种TiO2/SiO2-Ag-SiO2纳米复合薄膜的制备方法 | |
CN109957814B (zh) | 一种Bi-BiOI/TNA复合材料及其应用 | |
CN106086933A (zh) | 一种硅光阴极及其制备方法 | |
Wang et al. | Influence of grain size on photoelectrocatalytic performance of CuBi2O4 photocathodes | |
Rong et al. | Electron transport improvement of perovskite solar cells via intercalation of Na doped TiO2 from metal-organic framework MIL-125 (Ti) | |
WO2021103478A1 (zh) | 一种铋酸铜薄膜的制备方法 | |
Yao et al. | PPy/WO3 Co-modified TiO2 photoanode based photocatalytic fuel cell for degradation of Rhodamine B and electricity generation under visible light illumination | |
CN110165003B (zh) | 一种氧化锡光子晶体负载介孔核壳结构的氧化钨和氧化钛复合薄膜及其制备方法和应用 | |
CN110444402B (zh) | 一种提高BiVO4光阳极光电化学性能的方法 | |
CN108855193B (zh) | TaN/BiVO4异质结复合材料及其制备方法和应用 | |
WO2024051019A1 (zh) | 一种量子点敏化复合光阳极的制备方法、量子点敏化复合光阳极及应用 | |
CN105088266A (zh) | 通过在半导体材料上复合共催化剂制备光电化学电池纳米结构光电极的方法 | |
CN110665525A (zh) | 一种复合氮化碳光催化材料的钙钛矿及其制备方法和应用 | |
CN110359058B (zh) | 一种锆钛酸铅修饰的赤铁矿纳米棒阵列光阳极的制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210309 |
|
CF01 | Termination of patent right due to non-payment of annual fee |