CN110164785A - The guard method of solder joint after a kind of bonding wire routing - Google Patents
The guard method of solder joint after a kind of bonding wire routing Download PDFInfo
- Publication number
- CN110164785A CN110164785A CN201910496262.4A CN201910496262A CN110164785A CN 110164785 A CN110164785 A CN 110164785A CN 201910496262 A CN201910496262 A CN 201910496262A CN 110164785 A CN110164785 A CN 110164785A
- Authority
- CN
- China
- Prior art keywords
- solder joint
- nozzle
- porcelain mouth
- bonding wire
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to technical field of semiconductor chip encapsulation; the guard method of solder joint after specifically a kind of bonding wire routing; the following steps are included: step 1: being arranged nozzle around bonding wire porcelain mouth, the nozzle carries out motion control with porcelain mouth or be independently arranged movement mechanism being controlled simultaneously；Step 2: the first solder joint of bonding after ball is burnt, is risen to porcelain mouth, nozzle starts to spray the fluid containing protection materials to the first solder joint, and the nozzle cut-in time lags behind porcelain mouth bonding time；Step 3: porcelain mouth is bonded the second solder joint, rises to porcelain mouth, and nozzle starts to spray the fluid containing protection materials towards the second solder joint, completes protection.The surface that the guard method of solder joint is uniformly wrapped in the first solder joint and the second solder joint by forming a protective layer after the bonding wire routing; completely cut off solder joint and external atmosphere; corrosive gas or liquid can not be contacted with solder joint to be corroded, to reach the effective protection to the first solder joint and the second solder joint.
Description
Technical field
The present invention relates to technical field of semiconductor chip encapsulation, the protection side of solder joint after specifically a kind of bonding wire routing
Method.
Background technique
Bonding wire (Bonding Wire) is that traditional integrated circuit, semi-conductor discrete device and LED light source component encapsulation produce
One of big basic raw material of the four of product is welding lead important between chip and bracket.80% or more the welding of semiconductor components and devices
It is connected using wire bonding, as integrated circuit and semiconductor devices are to high density, high integration and miniaturization, military project is produced
Requirement of the various fields such as product, smart phone, pilotless automobile, Internet of Things to semiconductor packaging process, technology, product quality
Higher and higher, bonding wire quality determines the performance of microelectronics IC package product.However, most of bonding wire is due to material
The limitation of material causes silk material to be very easy to oxidation deterioration, so that the bonding wire service life after routing reduces, influences chip interconnection
Reliability.
Scientific circles and business circles are directed to the Anticorrosion Problems of different materials bonding wire at present, have developed a variety of different
Protection technique, such as anticorrosion for filamentary silver, copper wire have: plating noble metal, light-plated silver lustre, chromic acid chemical passivation, dip-coating are organic anti-
The methods of colour-changing agent.
These methods can effectively extend storage and the guard time of bonding wire to a certain extent.However, in bonding wire
When bonding wire (Wire Bonding, WB) process, after burning ball (Electronic Flame-Off, EFO) by electronics, it is bonded silk table
The protective layer in face can be decomposed largely at high temperature, so that surface metal ball (Free-air Ball, FAB) of firing cannot have
Effect protection, eventually leads to the first solder joint, the second solder joint is completely exposed among external atmosphere, the interconnection of strong influence chip can
By property and electric property.The protection for how effectively solving solder joint after bonding wire bonding wire, is present in current wire bonding process
A great problem.
Summary of the invention
The purpose of the present invention is to provide a kind of guard methods of solder joint after bonding wire routing, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the invention provides the following technical scheme:
The guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged nozzle around bonding wire porcelain mouth, and the nozzle and porcelain mouth carry out motion control simultaneously or be independently arranged fortune
Motivation structure is controlled；
Step 2: burning the first solder joint of bonding after ball, rise to porcelain mouth, and nozzle, which starts to spray to the first solder joint, contains protection materials
Fluid, the nozzle cut-in time lags behind porcelain mouth bonding time；
Step 3: porcelain mouth is bonded the second solder joint, rises to porcelain mouth, and nozzle starts to spray the stream containing protection materials towards the second solder joint
Body completes protection.
As a further solution of the present invention: in step 1, the quantity of the nozzle is one or more.
As further scheme of the invention: in step 1, the shape of the nozzle is single round or the ring disk shape.
As further scheme of the invention: in step 2, the nozzle cut-in time lags behind the bonding of porcelain mouth
In time, delay time is 0~50s.
As further scheme of the invention: in step 2, the nozzle cut-in time lags behind the bonding of porcelain mouth
In time, delay time is 0~10000ms.
As further scheme of the invention: in step 2, the nozzle cut-in time lags behind the bonding of porcelain mouth
In time, delay time is 0~5000ms.
As further scheme of the invention: in step 1, the quantity of the nozzle is six.
Compared with prior art, the beneficial effects of the present invention are:
The guard method of solder joint completes the first solder joint in porcelain mouth using the time difference between nozzle and porcelain mouth after the bonding wire routing
After the bonding routing of the second solder joint, nozzle starts the fluid containing protection materials to the first solder joint and the injection of the second solder joint, warp
After crossing solidification, the surface that a protective layer is uniformly wrapped in the first solder joint and the second solder joint is formed, completely cuts off solder joint and external atmosphere,
Corrosive gas or liquid can not be contacted with solder joint to be corroded, to reach the effective protection to the first solder joint and the second solder joint.
Detailed description of the invention
Fig. 1 is the first state schematic diagram of the first solder joint protection in the embodiment of the present invention；
Fig. 2 is the second status diagram of the first solder joint protection in the embodiment of the present invention；
Fig. 3 is the third state schematic diagram of the first solder joint protection in the embodiment of the present invention；
Fig. 4 is the 4th status diagram of the first solder joint protection in the embodiment of the present invention；
Fig. 5 is the first state schematic diagram of the second solder joint protection in the embodiment of the present invention；
Fig. 6 is the second status diagram of the second solder joint protection in the embodiment of the present invention；
Fig. 7 is the third state schematic diagram of the second solder joint protection in the embodiment of the present invention.
In figure: 1- nozzle, the first solder joint of 2-, 3- fluid, 4- porcelain mouth, 5- pad liner, the second solder joint of 6-.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment 1
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged two single round nozzles 1 around bonding wire porcelain mouth 4, and the nozzle 1 is moved simultaneously with porcelain mouth 4
Control；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 40ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
Embodiment 2
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged three single round nozzles 1 around bonding wire porcelain mouth 4, and the nozzle 1 is moved simultaneously with porcelain mouth 4
Control；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 100ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
Embodiment 3
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged three single round nozzles 1 around bonding wire porcelain mouth 4, and the nozzle 1 carries out self-movement control；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 100ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
Embodiment 4
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged six single round nozzles 1 around bonding wire porcelain mouth 4, and the nozzle 1 carries out self-movement control；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 500ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
Embodiment 5
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged a ring disk shape nozzle 1 around bonding wire porcelain mouth 4, and the nozzle 1 is controlled with porcelain mouth 4 using same movement
System processed；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 500ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
Embodiment 6
Please refer to Fig. 1-7, in the embodiment of the present invention, the guard method of solder joint after a kind of bonding wire routing, comprising the following steps:
Step 1: being arranged a ring disk shape nozzle 1 around bonding wire porcelain mouth 4, and the nozzle 1 uses self-movement control system；
Step 2: the working time of setting nozzle 1 is delayed after porcelain mouth 4, first solder joint 2 of bonding to be done, and porcelain mouth 4 rises,
Nozzle 1 immediately begins to spray the fluid 3 containing protection materials to the first solder joint 2, and 1 cut-in time of nozzle lags behind porcelain
4 bonding time of mouth, delay time are set as 500ms；
Step 3: porcelain mouth 4 is bonded the second solder joint 6, rises to porcelain mouth 4, and nozzle 1 starts to contain protected material towards the injection of the second solder joint 6
The fluid 3 of material；
Step 4: protective layer solidification, step are completed, and protection is implemented.
Wherein, when bonding wire carries out burning ball routing, a column or whole can have first been beaten, then unified butt welding point injection contains
The fluid 3 of protection materials completes protection, ejection efficiency can be improved.
It should be further noted that first solder joint 2, the second solder joint 6 are not limited to solder joint form, the bonding wire
The guard method of solder joint can also be applied to the routing form of BBOS, BSOB etc. after routing, as long as being applied to this in wire bonding process
Method should be in equivalent protection scope.
Better embodiment of the invention is explained in detail above, but the present invention is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be without departing from the purpose of the present invention
Various changes can be made.
Claims (7)
1. the guard method of solder joint after a kind of bonding wire routing, which comprises the following steps:
Step 1: being arranged nozzle (1) around bonding wire porcelain mouth (4), and the nozzle (1) and porcelain mouth (4) carry out motion control simultaneously
Or it is independently arranged movement mechanism and is controlled；
Step 2: burning bonding the first solder joint (2) after ball, rise to porcelain mouth (4), and nozzle (1) starts to spray to the first solder joint (2)
Fluid (3) containing protection materials, nozzle (1) cut-in time lag behind porcelain mouth (4) bonding time；
Step 3: porcelain mouth (4) is bonded the second solder joint (6), rises to porcelain mouth (4), and nozzle (1) starts to spray towards the second solder joint (6)
Fluid (3) containing protection materials completes protection.
2. the guard method of solder joint after bonding wire routing according to claim 1, which is characterized in that described in step 1
The quantity of nozzle (1) is one or more.
3. the guard method of solder joint after bonding wire routing according to claim 2, which is characterized in that described in step 1
The shape of nozzle (1) is single round or the ring disk shape.
4. the guard method of solder joint after bonding wire routing according to claim 1 to 3, which is characterized in that step 2
In, nozzle (1) cut-in time lags behind in porcelain mouth (4) bonding time, and delay time is 0~50s.
5. the guard method of solder joint after bonding wire routing according to claim 4, which is characterized in that described in step 2
Nozzle (1) cut-in time lags behind in porcelain mouth (4) bonding time, and delay time is 0~10000ms.
6. the guard method of solder joint after bonding wire routing according to claim 5, which is characterized in that described in step 2
Nozzle (1) cut-in time lags behind in porcelain mouth (4) bonding time, and delay time is 0~5000ms.
7. the guard method of solder joint after bonding wire routing according to claim 2, which is characterized in that described in step 1
The quantity of nozzle (1) is six.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910496262.4A CN110164785A (en) | 2019-06-10 | 2019-06-10 | The guard method of solder joint after a kind of bonding wire routing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910496262.4A CN110164785A (en) | 2019-06-10 | 2019-06-10 | The guard method of solder joint after a kind of bonding wire routing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110164785A true CN110164785A (en) | 2019-08-23 |
Family
ID=67628284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910496262.4A Pending CN110164785A (en) | 2019-06-10 | 2019-06-10 | The guard method of solder joint after a kind of bonding wire routing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106021A (en) * | 2019-12-30 | 2020-05-05 | 重庆四联光电科技有限公司 | Semiconductor bonding process based on silver-based bonding wire |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141504A (en) * | 1995-05-31 | 1997-01-29 | 日本电气株式会社 | Method of mfg. semiconductor device and apparatus for same |
| CN101872729A (en) * | 2010-05-28 | 2010-10-27 | 日月光封装测试(上海)有限公司 | Routing device, and protective gas automatic switching system and method thereof |
| CN103887407A (en) * | 2014-03-19 | 2014-06-25 | 浙江古越龙山电子科技发展有限公司 | Miniature SMD light emitting diode and production process thereof |
| CN105047573A (en) * | 2015-06-30 | 2015-11-11 | 南通富士通微电子股份有限公司 | Soldering tin anti-corrosion treatment method in semiconductor packaging and wire bonding process |
| CN210006699U (en) * | 2019-07-16 | 2020-01-31 | 中芯长电半导体（江阴）有限公司 | Wire bonding equipment |
-
2019
- 2019-06-10 CN CN201910496262.4A patent/CN110164785A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141504A (en) * | 1995-05-31 | 1997-01-29 | 日本电气株式会社 | Method of mfg. semiconductor device and apparatus for same |
| CN101872729A (en) * | 2010-05-28 | 2010-10-27 | 日月光封装测试(上海)有限公司 | Routing device, and protective gas automatic switching system and method thereof |
| CN103887407A (en) * | 2014-03-19 | 2014-06-25 | 浙江古越龙山电子科技发展有限公司 | Miniature SMD light emitting diode and production process thereof |
| CN105047573A (en) * | 2015-06-30 | 2015-11-11 | 南通富士通微电子股份有限公司 | Soldering tin anti-corrosion treatment method in semiconductor packaging and wire bonding process |
| CN210006699U (en) * | 2019-07-16 | 2020-01-31 | 中芯长电半导体（江阴）有限公司 | Wire bonding equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106021A (en) * | 2019-12-30 | 2020-05-05 | 重庆四联光电科技有限公司 | Semiconductor bonding process based on silver-based bonding wire |
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Application publication date: 20190823 |
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