CN110139722A - 制造型芯和模具的组分体系 - Google Patents
制造型芯和模具的组分体系 Download PDFInfo
- Publication number
- CN110139722A CN110139722A CN201780080347.3A CN201780080347A CN110139722A CN 110139722 A CN110139722 A CN 110139722A CN 201780080347 A CN201780080347 A CN 201780080347A CN 110139722 A CN110139722 A CN 110139722A
- Authority
- CN
- China
- Prior art keywords
- phenol
- component
- solvent
- weight
- benzyl ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title description 6
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000005011 phenolic resin Substances 0.000 claims abstract description 44
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 35
- 239000012948 isocyanate Substances 0.000 claims abstract description 33
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 27
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 27
- 239000012454 non-polar solvent Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- -1 isocyanate compounds Chemical class 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 47
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 37
- 239000002904 solvent Substances 0.000 claims description 34
- 238000000465 moulding Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 20
- 229920005862 polyol Polymers 0.000 claims description 19
- 150000003077 polyols Chemical class 0.000 claims description 19
- 239000012778 molding material Substances 0.000 claims description 18
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 16
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 16
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 16
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 16
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 16
- 125000001931 aliphatic group Chemical group 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 14
- 150000002989 phenols Chemical group 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical group CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 7
- 239000006184 cosolvent Substances 0.000 claims description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 7
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical compound OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 229930195733 hydrocarbon Natural products 0.000 claims description 6
- 150000002430 hydrocarbons Chemical group 0.000 claims description 5
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- 230000009970 fire resistant effect Effects 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229940095070 tetrapropyl orthosilicate Drugs 0.000 claims description 3
- 150000001491 aromatic compounds Chemical class 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 claims 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 2
- 150000004996 alkyl benzenes Chemical group 0.000 claims 2
- 229930003836 cresol Natural products 0.000 claims 2
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 claims 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 5
- 238000005058 metal casting Methods 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 description 36
- 239000011347 resin Substances 0.000 description 36
- 239000011230 binding agent Substances 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 10
- 238000004821 distillation Methods 0.000 description 9
- 150000003512 tertiary amines Chemical class 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229930040373 Paraformaldehyde Natural products 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- KVVSCMOUFCNCGX-UHFFFAOYSA-N cardol Chemical compound CCCCCCCCCCCCCCCC1=CC(O)=CC(O)=C1 KVVSCMOUFCNCGX-UHFFFAOYSA-N 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000004576 sand Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- NGFMICBWJRZIBI-JZRPKSSGSA-N Salicin Natural products O([C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@H](CO)O1)c1c(CO)cccc1 NGFMICBWJRZIBI-JZRPKSSGSA-N 0.000 description 5
- NGFMICBWJRZIBI-UHFFFAOYSA-N alpha-salicin Natural products OC1C(O)C(O)C(CO)OC1OC1=CC=CC=C1CO NGFMICBWJRZIBI-UHFFFAOYSA-N 0.000 description 5
- 238000004817 gas chromatography Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229920002866 paraformaldehyde Polymers 0.000 description 5
- 235000013824 polyphenols Nutrition 0.000 description 5
- NGFMICBWJRZIBI-UJPOAAIJSA-N salicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1CO NGFMICBWJRZIBI-UJPOAAIJSA-N 0.000 description 5
- 229940120668 salicin Drugs 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000012159 carrier gas Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- YZYKBQUWMPUVEN-UHFFFAOYSA-N zafuleptine Chemical compound OC(=O)CCCCCC(C(C)C)NCC1=CC=C(F)C=C1 YZYKBQUWMPUVEN-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- 239000006004 Quartz sand Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- UFMJCOLGRWKUKO-UHFFFAOYSA-N cardol diene Natural products CCCC=CCC=CCCCCCCCC1=CC(O)=CC(O)=C1 UFMJCOLGRWKUKO-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VMOWKUTXPNPTEN-UHFFFAOYSA-N n,n-dimethylpropan-2-amine Chemical compound CC(C)N(C)C VMOWKUTXPNPTEN-UHFFFAOYSA-N 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000011819 refractory material Substances 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 3
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 description 2
- XQDNFAMOIPNVES-UHFFFAOYSA-N 3,5-Dimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1 XQDNFAMOIPNVES-UHFFFAOYSA-N 0.000 description 2
- LPCJHUPMQKSPDC-UHFFFAOYSA-N 3,5-diethylphenol Chemical compound CCC1=CC(O)=CC(CC)=C1 LPCJHUPMQKSPDC-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- RCNCKKACINZDOI-UHFFFAOYSA-N 4,5-dimethylbenzene-1,3-diol Chemical compound CC1=CC(O)=CC(O)=C1C RCNCKKACINZDOI-UHFFFAOYSA-N 0.000 description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 2
- GHVHDYYKJYXFGU-UHFFFAOYSA-N Beta-Orcinol Chemical compound CC1=CC(O)=C(C)C(O)=C1 GHVHDYYKJYXFGU-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N Furaldehyde Natural products O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000006266 etherification reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000010813 internal standard method Methods 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- ZUHZZVMEUAUWHY-UHFFFAOYSA-N n,n-dimethylpropan-1-amine Chemical compound CCCN(C)C ZUHZZVMEUAUWHY-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- OIPPWFOQEKKFEE-UHFFFAOYSA-N orcinol Chemical compound CC1=CC(O)=CC(O)=C1 OIPPWFOQEKKFEE-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011877 solvent mixture Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004246 zinc acetate Substances 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- PCHXZXKMYCGVFA-UHFFFAOYSA-N 1,3-diazetidine-2,4-dione Chemical compound O=C1NC(=O)N1 PCHXZXKMYCGVFA-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- IWDFHWZHHOSSGR-UHFFFAOYSA-N 1-ethylimidazole Chemical compound CCN1C=CN=C1 IWDFHWZHHOSSGR-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- FGYADSCZTQOAFK-UHFFFAOYSA-N 1-methylbenzimidazole Chemical compound C1=CC=C2N(C)C=NC2=C1 FGYADSCZTQOAFK-UHFFFAOYSA-N 0.000 description 1
- JKTAIYGNOFSMCE-UHFFFAOYSA-N 2,3-di(nonyl)phenol Chemical compound CCCCCCCCCC1=CC=CC(O)=C1CCCCCCCCC JKTAIYGNOFSMCE-UHFFFAOYSA-N 0.000 description 1
- BPRYUXCVCCNUFE-UHFFFAOYSA-N 2,4,6-trimethylphenol Chemical compound CC1=CC(C)=C(O)C(C)=C1 BPRYUXCVCCNUFE-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- IWTFOFMTUOBLHG-UHFFFAOYSA-N 2-methoxypyridine Chemical compound COC1=CC=CC=N1 IWTFOFMTUOBLHG-UHFFFAOYSA-N 0.000 description 1
- ZAISDHPZTZIFQF-UHFFFAOYSA-N 2h-1,4-thiazine Chemical compound C1SC=CN=C1 ZAISDHPZTZIFQF-UHFFFAOYSA-N 0.000 description 1
- HRUHVKFKXJGKBQ-UHFFFAOYSA-N 3,5-dibutylphenol Chemical compound CCCCC1=CC(O)=CC(CCCC)=C1 HRUHVKFKXJGKBQ-UHFFFAOYSA-N 0.000 description 1
- PEZSSBYAUDZEMO-UHFFFAOYSA-N 3,5-dicyclohexylphenol Chemical compound C=1C(O)=CC(C2CCCCC2)=CC=1C1CCCCC1 PEZSSBYAUDZEMO-UHFFFAOYSA-N 0.000 description 1
- PWRBCZZQRRPXAB-UHFFFAOYSA-N 3-chloropyridine Chemical compound ClC1=CC=CN=C1 PWRBCZZQRRPXAB-UHFFFAOYSA-N 0.000 description 1
- MWVTWFVJZLCBMC-UHFFFAOYSA-N 4,4'-bipyridine Chemical compound C1=NC=CC(C=2C=CN=CC=2)=C1 MWVTWFVJZLCBMC-UHFFFAOYSA-N 0.000 description 1
- AQIIVEISJBBUCR-UHFFFAOYSA-N 4-(3-phenylpropyl)pyridine Chemical compound C=1C=NC=CC=1CCCC1=CC=CC=C1 AQIIVEISJBBUCR-UHFFFAOYSA-N 0.000 description 1
- ZNPSUQQXTRRSBM-UHFFFAOYSA-N 4-n-Pentylphenol Chemical compound CCCCCC1=CC=C(O)C=C1 ZNPSUQQXTRRSBM-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- MSFGJICDOLGZQK-UHFFFAOYSA-N 5-ethylbenzene-1,3-diol Chemical compound CCC1=CC(O)=CC(O)=C1 MSFGJICDOLGZQK-UHFFFAOYSA-N 0.000 description 1
- MSGWPRJSDVBBGP-UHFFFAOYSA-N C=O.C1(=CC=CC=C1)O.C(C1=CC=CC=C1)OCC1=CC=CC=C1 Chemical compound C=O.C1(=CC=CC=C1)O.C(C1=CC=CC=C1)OCC1=CC=CC=C1 MSGWPRJSDVBBGP-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910014571 C—O—Si Inorganic materials 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical class N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 1
- 241000208202 Linaceae Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
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- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
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- ZQDWUJIBGXKPDZ-UHFFFAOYSA-N trimethoxy(7-oxabicyclo[4.1.0]heptan-4-yl)silane Chemical compound C1C([Si](OC)(OC)OC)CCC2OC21 ZQDWUJIBGXKPDZ-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/162—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents use of a gaseous treating agent for hardening the binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/2246—Condensation polymers of aldehydes and ketones
- B22C1/2253—Condensation polymers of aldehydes and ketones with phenols
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
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- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22C9/00—Moulds or cores; Moulding processes
- B22C9/12—Treating moulds or cores, e.g. drying, hardening
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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- C08G18/72—Polyisocyanates or polyisothiocyanates
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- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
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Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mold Materials And Core Materials (AREA)
- Polyurethanes Or Polyureas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种基于苄基醚型酚醛树脂和异氰酸酯制备用于金属铸造的含有非极性溶剂的粘合剂的组分体系。
Description
技术领域
本发明涉及一种用于使用酚醛树脂-聚氨酯冷箱(PUCB)和/或酚醛树脂-聚氨酯自硬(PUNB)方法基于苄基醚型酚醛树脂和异氰酸酯制备含有非极性溶剂的粘合剂的组分体系。此外,本发明涉及一种含有粘合剂和模制基础材料的模制材料混合物以及该组分体系用于金属铸造的应用。
背景技术
根据PUCB和/或PUNB方法制造型芯和模具在铸造行业中有重要意义。在此,双组分聚氨酯体系用于粘合耐火模制基础材料。多元醇组分由每分子具有至少两个OH基团的多元醇组成,异氰酸酯组分由每分子具有至少两个NCO基团的异氰酸酯组成。此外,使用酚醛树脂作为多元醇组分。模制基础材料和粘合剂构成的混合物(也简称为模制材料混合物)的固化在PUCB方法中借助低沸点叔胺实现,在模制之后,低沸点叔胺以气态或作为气溶胶穿过模制材料混合物(参见US 3409579)。通常,这借助载气,例如空气、氮气或CO2实现,在载气中加入至少一种叔胺。在PUNB方法中,液体叔胺和/或金属化合物作为催化剂被加入模制材料混合物中。
对于用于制造金属铸造用模具和型芯的模制材料混合物中的粘合剂,使用芳烃已经成为普遍的做法,并且已经提出使用其他非极性溶剂。在此背景下,硅酸酯和/或硅酸衍生物具有重要作用。
EP 1057554 B1描述了一种四烷基硅酸盐在冷箱粘合剂体系中作为溶剂的应用。苄基醚树脂的详细描述没有涉及醚化羟甲基并且仅涉及具有1至8个碳原子的烷基的烷基酚。有利地,在酚醛树脂组分中,烷基硅酸盐、烷基硅酸盐低聚物或它们的混合物的含量为1至40重量百分比。优选地,添加共溶剂,其特别是极性增加溶剂,例如二元酯、未指明的C4至C6二羧酸甲酯的混合物。浓度的限制和对共溶剂的偏好表明在较高浓度的烷基硅酸盐中溶解不足。这通过EP 1057554 B1的实施例说明,根据该实施例,它们在酚醛树脂组分中总是具有至少5重量百分比的二元酯。使用的C4至C6二羧酸没有详细说明。
WO2009/130335A2描述了用烷基硅酸盐再酯化的苄基醚树脂,目的是在苄基醚树脂中引入无机聚合物单元。同样,在非常高的分子量时可能需要添加共溶剂。从实施例可以看出,根据该发明的可熔酚醛树脂完全可溶于四乙基硅酸盐。
DE 102015201614 A1描述了在冷箱粘合剂中使用烷基硅酸盐的另一个实施方案,冷箱粘合剂由具有游离和/或醚化羟甲基(具有C1至C4醇)的可熔酚醛树脂以及烷基硅酸盐和/或烷基硅酸盐低聚物以及至少一种选自C4至C6二羧酸二烷基酯的组的化合物组成。优选的是C4至C6二羧酸的二甲酯。使用的C4至C6二羧酸未指出。优选是非醚化的苄基醚树脂。
DE 102004057671 B4描述了苄基醚树脂,其羟甲基基团用C1至C10醇(特别优选正丁基)醚化。同时,结构式公开了具有1至10个碳原子的烷基的烷基酚的应用。除了实验例2、4、5和9外,没有提及在纯四乙基硅酸盐中的溶解。值得注意的是,醚化苄基醚树脂的含量为75至90重量百分比。
EP 1 137 500 B1描述了醚化的苄基醚树脂。为此,用羟基甲烷基团(-CH2-OH)将C1至C8醇醚化至25摩尔百分比。烷基酚不是单独要求保护的,在专利文件中的直至C26链的一般性列举中提到。在权利要求和实施例中没有提及非极性溶剂。
DE 102006037288 A1描述了用腰果酚改性的PUCB粘合剂。通过添加腰果酚降低了单体浓度。没有提及硅酸酯和硅酸酯低聚物作为溶剂。
发明内容
本发明的目的是提供一种苄基醚型酚醛树脂,它完全溶于非极性溶剂中,因此在没有或只含少量共溶剂的情况下均匀溶解在溶液中。这是有利的,因为已知共溶剂(例如二羧酸酯)在铸造过程中导致额外的排放,例如通过与甲基丙烯酸酯反应。
该目的可以通过独立权利要求的主题来实现。有利的改进方案是从属权利要求的主题或接下来描述。
因此,本发明涉及特定的非极性溶剂和可能的共溶剂在基于苄基醚型酚醛树脂的多元醇组分中的应用。组分体系的其他成分是异氰酸酯组分,其中异氰酸酯每分子具有至少两个异氰酸酯基团。
苄基醚型酚醛树脂具有被脂族烃基取代的苯酚作为单体组分,其在芳族化物处由具有11-26个碳原子,优选12-18个碳原子和0-4个双键的脂族烃基取代。
优选0至3个双键被取代,其中酚醛树脂中的烃基取代的苯酚的含量为0.5至20重量百分比。烃基优选在间位或对位,特别是在间位。在苄基醚型酚醛树脂中,烃取代的酚基团、特别是腰果酚和/或腰果二酚的含量在0.5-20重量百分比之间,优选0.5-15重量百分比,特别优选2-12重量百分比。
多元醇组分含有能够在室温下溶解苄基醚型酚醛树脂的溶剂。溶剂的至少95重量百分比是非极性溶剂,非极性溶剂定义为烃、烷基/烷氧基硅烷、烷基/烷氧基硅氧烷及它们的混合物。
发明的详细说明
苄基醚型酚醛树脂具有例如以下一般结构,其中单体单元在统计学上相关联:
下面给出的结构式仅代表可能的链接变体的一个实例。在该实例中所示的仅ο,ο'键实际上也能以在任意的实施方式键合到ο,p'或p,p'。但是,o,ο'变体是优选的(o=ortho,p=para)。
x=0-20,特别是1-10
y=0-20,尤其是2到10
z=0-100,特别是1-5,特别优选1,
具有平均值x+y+z>2,
R=-H;烃基
并且分别独立于x和y
A=-H;烃基;-O-烃基;-OH和
B=-H;烃基;-O-烃基;OH,
其中,对于至少一个A或至少一个B,A和/或B是烃基。
为了获得苄基醚型酚醛树脂,相关于酚化合物的摩尔数,优选使用至少相等摩尔数的醛化合物。优选地,醛化合物与酚化合物的摩尔比为1.05∶1.0至2.5∶1,更优选为1.1∶1至2.2∶1,特别优选为1.2∶1至2.0∶1。
苄基醚型酚醛树脂的制备按照本领域技术人员已知的方法实现。在此,酚化合物和醛化合物在存在二价金属离子的情况下,在优选低于130℃的温度下反应。蒸馏所得的水。为此目的,可以为反应混合物加入合适的夹带剂,例如甲苯或二甲苯,或者在减压下进行蒸馏。
用于制备苄基醚型酚醛树脂的合适催化剂是二价金属离子的盐,例如Mn,Zn,Cd,Mg,Co,Ni,Fe,Pb,Ca和Ba,尤其是Zn盐。优选使用乙酸锌。用量并不重要。相对于酚化合物和醛化合物的总量,金属催化剂的典型量为0.02至0.3重量百分比,优选0.02至0.19重量百分比。
这种树脂例如在US 3485797和EP 1 137500 B1中描述,其公开内容在此参考引入,引入不仅关于苄基醚型酚醛树脂本身而且也关于其制备。
令人惊讶地发现,根据一个设计方案,当苄基醚型酚醛树脂在聚合链中的统计分布中含有多个下列键时,则得到苄基醚型酚醛树脂的溶解:
a)R-CH2-O-R1
b)R-CH2-R2
c)R-CH2-O-CH2-R2
d)R2-CH2-R2
e)R2-CH2-O-CH2-R2
f)R2-CH2-O-R1
但是另外一方面优选的是,
g)不含Si-O-Si和
h)不含C-O-Si键。
其中,
R表示单-(作为端基)或双键(在两侧键合到链中)酚基,其至少被亚甲基或亚甲基醚基团键合到另一个酚基团上。
R1表示C1至C18的、优选C1至C12,特别优选C1至C9的饱和或不饱和和/或直链或支链的碳链,作为端基。
R2表示单-或双键取代的酚基,其游离或者经由亚甲基或亚甲基醚基团与另一个酚环键合,其具有一个或两个C11至C26碳链,特别是C12至C18碳链,它们彼此独立并且位于酚羟基旁边的邻位和/或对位和/或间位(分别相对于酚羟基)。优选是间位。碳链可彼此独立地为饱和或不饱和和/或支链或直链。每个碳链任选所包含的双键的数量不受限制,可以在1和4之间。特别优选的是腰果酚和/或腰果二酚和/或烷基氢化的腰果酚和/或烷基氢化的腰果二酚,它们各自具有完全饱和的烷基链。在另一个实施方案中,腰果酚和/或腰果二酚可另外在酚醛树脂组分中以不结合的方式存在,而不加入到苄基醚树脂结构中。此外,还可以存在一个或两个羟基。
优选地,在苄基醚类型的酚醛树脂中,最多25摩尔百分比的-CH2OH基团被醚化,特别是用C1至C12,尤其是C1至C4烃基醚化。
在苄基醚型酚醛树脂中的烃取代的酚基R2,特别是腰果酚和/或腰果二酚的含量为0.5与20重量百分比之间,优选0.5-15重量百分比,特别优选0.5-12重量百分比。R2通常是腰果酚或腰果二酚。
合适的酚基R的实例是苯酚,邻甲酚,间甲酚,对甲酚,3,5-二甲苯酚,3,4-二甲苯酚,3,4,5-三甲基苯酚,3-乙基苯酚,3,5-二乙基苯酚,对叔丁基苯酚,3,5-二丁基苯酚,对戊基苯酚,环己基苯酚,对辛基苯酚,对壬基苯酚,二壬基苯酚,3,5-二环己基苯酚,对叔丁基苯酚,对苯基苯酚,3,5-二甲氧基苯酚和对苯氧基苯酚。
优选的多元酚基R具有2-4个酚羟基。合适的多元酚的具体实例是邻苯二酚,间苯二酚,氢醌,连苯三酚,间苯三酚,2,5-二甲基间苯二酚,4,5-二甲基间苯二酚,5-甲基间苯二酚或5-乙基间苯二酚。还可以使用不同的单-和多羟基和/或取代和/或缩合的酚组分的混合物来制备苄基醚树脂。
用于制备酚醛树脂组分的其它合适的醛除甲醛外还具有下式的醛:
R-CHO,
其中,R是碳原子基团,优选具有2-8个,特别优选1-3个碳原子。具体实例是乙醛,丙醛,糠醛和苯甲醛。特别优选使用甲醛,其为含水形式,作为对甲醛或三恶烷。
用作非极性溶剂的根据本发明的化合物具有以下结构
a)烷基/烷氧基硅烷(n=0)或烷基/烷氧基硅氧烷(n>1),特别是硅酸酯和/或硅酸酯低聚物
n=0-20
R=分别独立于n和另一个R C1至C6-烃基;-O-烃基(C1-至C6)
和/或
B)烃,特别是烷基/链烯基。从苯开始,烷基和/或链烯基在芳环上彼此独立地被取代,其链长为C1至C30,优选C1至C20,特别优选C1至C16。彼此独立地,苯的1至6个环氢可被烷基和/或链烯基取代,优选1至4个,特别优选1至3个环氢被取代。与此无关,烷基或链烯基可以是直链或支链。
也可以将非极性溶剂彼此混合。
合适的烷基/烷氧基硅烷或烷基/烷氧基硅氧烷例如是:原硅酸酯,其中1,2或3个醇基被已取代或未取代的烃基取代;式R1 nSi(OR)4-n的化合物,其中n=1,2或3,其中每个基团R都独立于任何其他基团R是有机基团,优选支链或无支链的C1至C30烷基或芳基,如相应结合第一方面所定义的。
R1在此是被取代或未被取代的、支链的或无支链的烃基,并且在n=2或3的情况下,基团R1是相同的或不同的。基团R1优选为被取代或未被取代的、支链或无支链的C1至C30烷基或被取代的或未被取代的芳基,特别优选是被取代的或未被取代的、支链或无支链的C1至C6烷基或被取代的或未被取代的C6至C10芳基。最优选的是未被取代的、支链或无支链的C1至C6烷基或未取代的苯基。其中又特别优选甲基,乙基和丙基。
优选地,改性酯选自以四烷氧基硅烷,单烷基三烷氧基硅烷,二烷基二烷氧基硅烷,三烷基单烷氧基硅烷,单芳基烷氧基硅烷,二芳基二烷氧基硅烷和三芳基单烷氧基硅烷构成的组,其中,烷基或烷氧基优选为C1至C6烷基。优选地,改性酯选自以四乙氧基硅烷,四丙氧基硅烷,甲基三甲氧基硅烷,甲基三乙氧基硅烷,甲基三丙氧基硅烷,甲基三丁氧基硅烷,乙基三甲氧基硅烷,甲基三乙氧基硅烷,乙基三乙氧基硅烷,正丙基三甲氧基硅烷,正丙基三乙氧基硅烷,异丙基三甲氧基硅烷,异丙基三乙氧基硅烷,乙烯基三甲氧基硅烷,乙烯基三乙氧基硅烷,3-缩水甘油氧基丙基三甲氧基硅烷,3-环氧丙氧基丙基三乙氧基硅烷,3,4-环氧环己基三甲氧基硅烷,二甲氧基二甲基硅烷,二乙氧基二甲基硅烷,二乙基二甲氧基硅烷和二乙基二乙氧基硅烷构成的组。特别优选的是原硅酸四乙酯,原硅酸四丙酯,它们的混合物和它们的低聚物或低聚物的混合物。特别优选的是原硅酸四乙酯和原硅酸四丙酯或它们的混合物。
在另一个实施方式中,已发现为苄基醚型酚醛树脂添加共溶剂可改善溶解性。由此,可以配制硅酸酯含量更高的均相溶液。有利的共溶剂例如是二羧酸二酯。
优选地,苄基醚型酚醛树脂(苄基醚树脂加溶剂)含有小于1.5重量百分比的水,特别优选小于1.0重量百分比,尤其优选小于0.8重量百分比的水。
优选地,苄基醚型酚醛树脂(苄基醚树脂加溶剂)含有小于2.0重量百分比的脂族醇,特别优选小于1.5重量百分比的脂族醇,尤其优选小于1.0重量百分比的C1至C18的脂族醇。
在一个优选的实施方式中,当使用硅酸酯和/或硅酸酯低聚物作为溶剂时,苄基醚型酚醛树脂(苄基醚树脂加溶剂)含有小于1.5重量百分比的脂族醇,特别优选小于1.0重量百分比,尤其优选小于0.8重量百分比的脂族醇。
优选地,溶剂的用量相关于多元醇组分为10至70重量百分比,特别优选为26至55重量百分比,尤其优选41至50重量百分比。
如果使用根据本发明的共溶剂,优选用量为相关于多元醇组分0.5至9.6重量百分比,特别优选1至7.9重量百分比,尤其优选1至4.9重量百分比。
粘合剂体系的异氰酸酯组分包含脂族、脂环族或芳族单体或聚合异氰酸酯,优选每分子平均具有2至5个异氰酸酯基团。根据所需的性质,也可以使用异氰酸酯的混合物。
合适的异氰酸酯包括脂族异氰酸酯,例如,六亚甲基二异氰酸酯,脂环族异氰酸酯,例如4,4'-二环己基甲烷二异氰酸酯及其二甲基衍生物。合适的芳族异氰酸酯的实例是甲苯-2,4-二异氰酸酯,甲苯-2,6-二异氰酸酯,1,5-萘二异氰酸酯,三苯甲烷三异氰酸酯,亚二甲苯基二异氰酸酯及其甲基衍生物,以及多亚甲基多苯基异氰酸酯。优选的异氰酸酯是芳族异氰酸酯,特别优选的是多亚甲基多苯基多异氰酸酯,例如像技术上的4,4'-二苯基甲烷二异氰酸酯,即具有一定含量的异构体和高级同系物的4,4'-二苯基甲基二异氰酸酯。
异氰酸酯也可以通过使二价异氰酸酯彼此反应而衍生化,使得它们的一部分异氰酸酯基团衍生为缩二脲、脲基甲酸酯、脲二酮或碳二亚胺基团。值得注意的是例如具有异氰酸酯基团的二聚产物,例如来自MDI或TDI。然而,这种衍生的异氰酸酯是优选的,但是仅用作除了上述非衍生化的异氰酸酯之外的一种成分。
优选地,异氰酸酯的用量如下,即异氰酸酯基团的数量为80至120%,相关于树脂的游离羟基数。
粘合剂体系的异氰酸酯组分优选用作有机溶剂中的溶液或有机溶剂的组合。因此,溶剂例如可以使粘合剂的组分保持在足够低的粘度状态。此外,溶剂使得耐火模制材料获得均匀交联及其流动性。
作为异氰酸酯组分的成分的溶剂,使用非极性溶剂,例如本发明所述的或极性溶剂或它们的混合物。在本发明的意义上,溶剂的类型不受限制。
除了已经提到的成分之外,粘合剂体系可以含有其他添加剂,例如。硅烷(例如,根据EP 1137500 B1),内部脱模剂,例如脂肪醇(例如根据U.S.4,602,069),干性油(例如根据U.S.4,268,425),螯合剂(例如根据U.S.5,447,968),流动改进剂,如硅氧烷表面活性剂,和用于延长加工时间的添加剂(例如根据U.S.4,540,724),或它们的混合物。
此外,本发明涉及一种模制材料混合物,其包含粘合剂,该模制材料混合物基于苄基醚型酚醛树脂、耐火模制基础材料和异氰酸酯以及可能的催化剂,并且本发明涉及由模制材料混合物在固化后制作的型芯、模具和进料器。本发明还涉及型芯、模具和进料器用于金属铸造、特别是铁和铝铸造的应用。
作为耐火模制基础材料(以下也简称模制基础材料),可以使用常规并且已知的用于制造铸模的材料以及它们的混合物。合适的实例是石英砂,锆英砂,铬矿石,橄榄石,蛭石,铝土矿,耐火土和所谓的人造模制基础材料,即通过工业方法造型成球形或近似球形(例如椭圆形)的模制基础材料。对此的实例包括玻璃珠、玻璃颗粒或人造的球形的陶瓷砂-所谓的还有或“Carboaccucast”,以及空心微球,因为它们可以作为飞灰的成分分离,例如硅酸铝空心球(所谓的微球)。所提及的耐火材料的混合物同样也是可能的。
特别优选的是模制基础材料,其包含相关于耐火模制基础材料超过50重量百分比的石英砂。耐火模制基础材料应理解为具有高熔点(熔融温度)的物质。优选地,耐火模制基础材料的熔点高于600℃,优选高于900℃,特别优选高于1200℃,尤其优选高于1500℃。
耐火模制基础材料优选占模制材料混合物的大于80重量百分比,特别是大于90重量百分比,特别优选大于95重量百分比。
耐火模制基础材料的平均直径通常在100μm与600μm之间,优选在120μm与550μm之间,特别优选在150μm与500μm之间。粒度可以例如根据DIN ISO 3310筛来确定。特别优选的是以下颗粒形状,其最大长度延展与最小纵向延展(彼此垂直并且分别对于所有空间方向)之比为1∶1至1∶5或1∶1至1∶3,也就是说,其例如不是纤维状的。
耐火模制基础材料优选具有自由流动状态,特别是为了能够在常规的型芯射出机中加工根据本发明的模制材料混合物。
合适的催化剂是叔胺。对于PUCB方法,使用挥发性叔胺,例如三甲胺(“TMA”,CASRN 75-50-3),二甲基乙胺(“DMEA”,CAS 75-64-9),二甲基异丙胺(“DMIPA”,CAS 996-35-0),二甲基丙胺(“DMPA”,CAS RN 926-63-6)和三乙胺(“TEA”,CAS RN 121-44-8)。对于PUNB方法,使用液态叔胺。这包括在室温(25℃)下的液态叔胺以及加热到例如40℃之后是液态的或溶解在适当溶剂中的叔胺。实例是三(3-二甲基氨基)丙胺,异喹啉,芳基吡啶类(如苯基吡啶),吡啶,吖啶,2-甲氧基吡啶,哒嗪,3-氯吡啶,喹啉,N-甲基咪唑,N-乙基咪唑,4,4'-联吡啶,4-苯基丙基吡啶,1-甲基苯并咪唑和1,4-噻嗪。
此外,本发明涉及一种用于制备模制材料混合物的方法,包括
(a)将耐火模制基础材料与根据本发明的粘合剂(至少苄基醚酚醛树脂,溶剂和异氰酸酯)以相关于耐火模制基础材料的量的0.2至15重量百分比,优选0.3至14重量百分比,特别优选0.4至12重量百分比的粘合量混合,并且同时加入催化剂(在PUNB方法中)或单独随后加入(在PUCB方法中)以获得模制材料混合物,
(b)将步骤(a)中获得的模制材料混合物引入模制工具中;
(c)必要时加入单独随后添加的催化剂(PUCB)并在模制工具中将模制材料混合物用本发明的催化剂固化,以便得到型芯或铸模;和
(d)随后将型芯或铸模与工具分离并且必要时进一步固化。
为了制备模制材料混合物,首先可以将粘合剂体系的组分混合,然后加入耐火模制基础材料中。但是,也可以将粘合剂的组分以任意顺序同时或依次加入耐火模制基础材料中。
为了获得模制材料混合物的组分的均匀混合,可以使用常规方法。此外,模制材料混合物还可含有其它常规成分,例如氧化铁、磨碎的亚麻纤维、木粉颗粒、沥青和难熔金属。
根据本发明,固化可以通过PUCB或PUNB方法实现。在PUCB方法的情况下,为了固化,低沸点叔胺借助惰性载气以气态或作为气溶胶穿过模制的模制材料混合物。省略了添加单独的催化剂。可以使用所有已知的冷箱胺催化剂。在PUNB方法的情况下,胺或金属催化剂可以已经溶解在粘合剂体系中或作为单独组分混入耐火材料中,其中,相关于耐火材料中的粘合剂总含量,加入量为大约0.1重量百分比-约5重量百分比。
通过该方法制造的模制体本身可具有铸造领域中常见的任意形状。在一个优选的实施方式中,模制体是铸造模具、型芯或进料器的形式。它们的特征在于高机械稳定性。
此外,本发明涉及该模制体用于金属铸造,特别是铁和铝铸造的应用。
具体实施方式
下面根据优选实施方式或实验例详细解释本发明,但不限于此。
实验例
所应用的组分
异氰酸酯组分:由80%的Lupranat M 20 S和20%的Dynasylan A构成的均匀混合物
催化剂706-二甲基丙胺,供应商ASK-Chemicals GmbH
石英砂H 32-供应商Quarzwerke GmbH
Lupranat M 20 S:聚合二苯甲烷二异氰酸酯(MDI),官能度2.6,供应商BASF SE
DBE-C4-C6二羧酸的二甲酯混合物,供应商DuPont
Dynasilan A-原硅酸四乙酯单体,供应商Evonik Industries,游离乙醇含量<0.5%
Solvesso 100-溶剂石脑油灯,供应商EXXON Mobile
硅烷GLYMO-3-缩水甘油氧基丙基三甲氧基硅烷,供应商Evonik Industries
99%苯酚-供应商Sigma Aldrich
91-93%多聚甲醛,供应商INEOS Paraform
醋酸锌二水合物-供应商Sigma Aldrich
正丁醇-供应商Sigma Aldrich
Palmer 1500-1,由约95%腰果酚和约5%腰果二酚构成的混合物,供应商PalmerInternational
所有百分比均表示重量百分比。
苄醚树脂合成(苄醚型酚醛树脂)
根据EP 1057554 A1制备的苄基醚树脂实施例1
(对照)
在配有搅拌器、回流冷凝器和温度计的反应容器中加入1540g苯酚(99%),704g多聚甲醛(91%)和0.44g乙酸锌二水合物。在搅拌下,在60分钟内将温度保持均匀升至105℃,直至达到1,550的折射率(20℃)。此后,将冷凝器转换到常压蒸馏,并在1小时内将温度升至125至126℃。在此温度下,进一步蒸馏直至达到1,593的折射率(20℃)。此后,施加真空并在减压下蒸馏至1,612的折射率(20℃)。产率约为82%。通过气相色谱法确定的游离酚含量为10.5重量百分比,通过气相色谱法确定的水杨苷(2-羟基苄基醇)含量为8.4重量百分比。
苄基醚树脂实施例2
根据DE 102004057671 B4的树脂A的实施例2制备
(对照)
在配有搅拌器、回流冷凝器和温度计的反应容器中加入234g苯酚(99%)、107g多聚甲醛(91%)和0.295g二水合乙酸锌。在搅拌下,将温度在90分钟内均匀升高至110℃并在110℃下保持45分钟。然后转换到蒸馏,并在60分钟内将温度升至126℃。进一步蒸馏直至达到1,590至1,592的折射率(20℃)。然后在真空(<30毫巴)下进一步蒸馏至1.613至1.615的折射率(20℃)。
随后,将温度降至100℃,每12重量份的所得苄基醚树脂加入9重量份的正丁醇。在30分钟内,使苄基醚树脂组合物达到回流温度并回流4小时。在这种情况下,在填充有正丁醇的分离器中连续除去所得的反应水,其中贫水相返回到反应混合物中。温度从119℃升至127℃。在120℃,在真空(<30毫巴)下蒸馏出过量的正丁醇。
根据DE 102006037288 A1的实施例2的苄基醚树脂实施例3
在配有搅拌器、回流冷凝器和温度计的反应容器中加入698.4g苯酚(99%)、302.6g多聚甲醛(91%)和0.35g乙酸锌二水合物。在搅拌下,在60分钟内将温度均匀升至105至115℃并保持,直至达到1.5590的折射率(25℃)。随后,加入50g Palmer 1500-1,并将冷凝器转换到常压蒸馏,并在1小时内将温度升至124至126℃。在此温度下进一步蒸馏直至达到1.5940的折射率(25℃)。然后,施加真空并在减压下蒸馏至约1.600的折射率(25℃)。通过气相色谱法确定的游离酚含量为12.5重量百分比,水杨苷含量为9.5重量百分比。
苄基醚树脂实施例4
在配有搅拌器、回流冷凝器和温度计的反应容器中加入698.4g苯酚(99%)、302.6g多聚甲醛(91%)和0.35g乙酸锌二水合物。在搅拌下,在60分钟内将温度均匀升至105至115℃并保持,直至达到1.5590的折射率(25℃)。随后,加入50g Palmer 1500-1,将冷凝器转换到常压蒸馏,并在1小时内将温度升至124至126℃。在此温度下进一步蒸馏,直至达到1.5940的折射率(25℃)。然后,施加真空并在减压下蒸馏至约1.600的折射率(25℃)。随后,每90重量份的所得树脂加入10重量份的正丁醇,并在122-124℃保持回流60分钟。然后,在真空下除去未反应的丁醇。树脂的折射率约为1.5970(25°)。通过气相色谱法确定的游离酚含量为10.3重量百分比,水杨苷含量为8.2重量百分比。
粘度测量
借助Brookfield旋转粘度计、“小样品”法,21号转子在100转/分钟和25℃下确定粘度。
苯酚和水杨苷含量的测量
苯酚和水杨苷含量借助气相色谱法如下确定。
方法说明:
校准:内标法,每种待确定的物质进行7点校准
内标:2,4,6三甲基苯酚p.A.
标准物质:苯酚p.A.和水杨醇(邻羟基苄醇)p.A.
气相色谱仪:Agilent 7890Plus,带FID、毛细管柱、自动采样器和Agilent化学工作站
设备参数:
引入系统:分流/不分流进样器,运行时间2分钟后20ml/min,分流50:1(79.9ml/min)
温度:280℃
载气:氢5.0,流速1ml/min,常数-流动方法
毛细管柱:HP-5MS,HP 19091S-105,长50m,直径0.2mm,薄膜0.33μm
温度程序:60℃至1.5分钟;以4.0℃/min至140℃,保持0分钟,然后以20℃/min至325℃,在325℃保持6分钟
检测器:FID,温度320℃
燃料气体氢气5.0,20ml/min,合成空气5.0,350ml/min,补充气体:氮气5.0,25ml/min
自动进样器:10μl-GC注射器,1μl剂量,快速注射模式
定量:Agilent化学工作站标准设置,内部标准方法,以重量百分比给出结果
冷稳定性的确定
将溶液(A1至B9)在-18℃冷冻24小时,然后在再次达到室温后目测评估均匀性,而不搅拌或摇动样品容器。
溶剂极性的经验参数:ET(30)值
借助负溶剂化变色吡啶鎓N-酚盐甜菜碱染料ET(30),通过测量最长波的Vis/NIR吸收带(在25℃和1巴下)确定溶剂混合物的极性。在此,高ET(30)值对应于高溶剂极性。值可以从以下文章中获取:
C.Reichardt,Chem.Rev.1994,94,2319-2358。
C.Reichardt,G.Liebigs Ann。1995,1579-1582。
R.Eberhardt,S.Loebbecke,B.Neidhart,C.Reichardt,Liebigs Ann./Recueil1997,1195-1199。
C.Reichardt,Green Chem.2005,7,339-351。
V.G.Machado,R.I.Stock,C.Reichardt,Chem.Rev.2014,114,10429-10475。
溶解性的确定
在达到苄基醚树脂合成(实施例1至4)的最终值(终止标准)后,立即通过引入机械能(搅拌和/或摇动)将热苄基醚树脂加入到表1和2中列出的物质的室温测量的溶剂或溶剂混合物中。在混合物无空气后进行溶解性的最终评估。
确定强度,单位N/cm2
在Hobart混合器中,将由石英砂H 32构成的砂混合物加上0.60%的上述粘合剂组合物(各自用于实施例A1至B6)和0.60%异氰酸酯组分均匀混合2分钟。将该砂混合物转移到型号为Roeper H 1的型芯射出机中,分别将尺寸为220mm×22.4mm×22.4mm(长×宽×高)的两个型芯在4巴的射出压力下借助压缩空气置入模具中。借助催化剂706(0.5ml,在2巴的漂洗压力下放气10秒)固化砂子。固化后移除型芯,并在15秒后或30秒后、在室温下储存24小、并在室温下储存24小时之后,在相对湿度为98%(24小时98%rLf)的封闭室中利用Multiserw弯曲设备确定强度。
除非另有说明,以重量百分比计。
n.m.=不可测量
表1显示了作为对照引用的苄基醚树脂及其溶解性。
除非另有说明,以重量百分比计。
表2显示了根据本发明的苄基醚树脂混合物及其溶解性。
表3显示了根据本发明的苄基醚树脂混合物及其溶解性。
n.m.=不可测量
表4显示了强度的对照
表5显示了根据本发明的模制材料混合物的强度
从结果表中可以看出,造成根据本发明的苄基醚树脂混合物B1-B6的根据实例3和4的苄基醚树脂完全溶解在原硅酸四乙酯和Solvesso 100中。在其他实例中也通过较低粘度和改善的冷稳定性说明了这一点。考虑到在相同残余苯酚含量下的粘度(因为苯酚也同样降低了粘度,实例A1、A6、B1或A3、A7、B3),根据实例3和4的苄基醚树脂的树脂同样得到稀薄的树脂溶液。
尽管苄基醚树脂2在非极性溶剂中也显示出良好的溶解性,但是为此不能获得令人满意的瞬时强度。
考虑到实例B3至B5和B4至B6,可以看出添加腰果酚/腰果二酚改善了粘合剂的耐湿性并有助于改善砂型芯的可塑性。
Claims (20)
1.一种用于固化模制材料混合物的组分体系,所述组分体系至少具有在空间上彼此分开的
-多元醇组分,其中,所述多元醇组分含有苄基醚型酚醛树脂和溶剂;
-由每分子具有至少2个异氰酸酯基团的一种或多种异氰酸酯化合物构成的异氰酸酯组分;
其中,苄基醚型酚醛树脂具有至少一个被脂族烃基取代的苯酚作为单体组分,所述苯酚在芳族化物处由具有11至26个碳原子和0至4个双键的脂族烃基取代,并且酚醛树脂中烃基取代的苯酚的含量为0.5至20重量百分比;其中多元醇组分含有溶剂,所述溶剂的至少95重量百分比是非极性溶剂,并且所述非极性溶剂选自烃、烷基/烷氧基硅烷、烷基/烷氧基硅氧烷及它们的混合物,并且所述苄基醚型酚醛树脂在所述溶剂中溶解。
2.根据权利要求1所述的组分体系,其中,苄基醚型酚醛树脂的最多25摩尔百分比的-CH2-OH基团被C1至C12、特别是C1至C4烃基基团醚化。
3.根据前述权利要求中至少一项所述的组分体系,其中,所述溶剂的用量为,相关于所述多元醇组分的10至70重量百分比,特别优选26至55重量百分比,尤其优选41至50重量百分比。
4.根据前述权利要求中至少一项所述的组分体系,其中,所述酚醛树脂含有小于2.5重量百分比,优选小于2重量百分比的游离酚。
5.根据前述权利要求中至少一项所述的组分体系,其中,所述多元醇组分还含有游离水杨醇,其中,所述游离酚与所述游离水杨醇的重量比例为至少1比1或1比大于1。
6.根据前述权利要求中至少一项所述的组分体系,其中,所述非极性溶剂是烷基苯,优选是具有7至13个碳原子的烷基苯,特别是三甲基苯和丙基苯。
7.根据前述权利要求中至少一项所述的组分体系,其中,所述非极性溶剂是C6至C22烷烃。
8.根据前述权利要求中至少一项所述的组分体系,其中,所述烷基/烷氧基硅烷是原硅酸四乙酯或原硅酸四丙酯,它们的低聚物,以及它们的混合物。
9.根据前述权利要求中至少一项所述的组分体系,其中,所述非极性溶剂的ΕT(30)值小于35。
10.根据前述权利要求中至少一项所述的组分体系,其中,所述溶剂含有二羧酸二酯,优选支链二羧酸二酯作为共溶剂。
11.根据前述权利要求中至少一项所述的组分体系,其中,所述苄基醚型酚醛树脂含有苯酚和甲酚作为单体组分,其中引入到所述酚醛树脂中的甲酚的摩尔含量小于或等于引入到所述酚醛树脂中的苯酚的摩尔含量。
12.根据前述权利要求中至少一项所述的组分体系,其中,所述多元醇组分包含
a)小于1.5重量百分比的水,特别优选小于1.0重量百分比,并且尤其优选小于0.8重量百分比的水。
13.根据前述权利要求中至少一项所述的组分体系,其中,所述多元醇组分包含
a)少于2重量百分比,特别优选少于1.5重量百分比,尤其优选少于1.0重量百分比的脂族醇,或
b)如果使用烷基/烷氧基硅烷、烷基/烷氧基硅氧烷或它们的混合物,则包含小于1.5重量百分比,优选小于1.0重量百分比,特别优选小于0.8重量百分比的脂族醇。
14.根据前述权利要求中至少一项所述的组分体系,其中,所述酚醛树脂根据DIN5567-1测量的平均分子量(MW)为600至1200g/mol,特别是600至1000g/mol。
15.根据前述权利要求中至少一项所述的组分体系,还包括在空间上分离的耐火模制基础材料作为另外的组分。
16.根据前述权利要求中至少一项所述的组分体系,其中,被脂族烃基取代的苯酚作为单体组分进一步通过一个或多个以下特征来表征:
a)脂族烃基具有0至3个双键;
b)由所述脂族烃基取代的苯酚作为单体以0.5至15重量百分比,优选2至12重量百分比引入到所述苄基醚型酚醛树脂中;
c)脂族烃基连接在苯酚单体组分的间位或对位,优选连接到间位;
d)被所述脂族烃基取代的苯酚是腰果二酚和/或腰果酚。
17.一种模制材料混合物,通过将根据权利要求1-16中至少一项的多元醇组分和异氰酸酯组分与耐火模制基础材料组合而制备。
18.一种用于制作模具、型芯或进料器的方法,其中,通过将根据权利要求1-16中任一项所述的多元醇组分和异氰酸酯组分与耐火模制基础材料组合并根据PU-No-Bake和PU-Cold-Box方法固化来制备。
19.一种将多元醇组分作为异氰酸酯粘合剂的成分的应用,其中,所述多元醇组分含有苄基醚型酚醛树脂和溶剂;
-由每分子具有至少2个异氰酸酯基团的一种或多种异氰酸酯化合物构成的异氰酸酯组分;
其中,所述酚醛树脂具有至少一个烃取代的苯酚作为单体组分,苯酚在芳族化物处由具有11至26个碳原子和0至4个双键的脂族烃基取代,并且酚醛树脂中烃取代的苯酚的含量为0.5至20重量百分比;
其中,多元醇组分含有溶剂,所述溶剂的至少95重量百分比是非极性溶剂,并且所述非极性溶剂选自烃、烷基/烷氧基硅烷,烷基/烷氧基硅氧烷及它们的混合物,并且
所述苄基醚型酚醛树脂在所述溶剂中溶解。
20.根据权利要求19所述的应用,其中,作为单体组分的被脂族烃基取代的苯酚还通过一个或多个下列特征来表征:
a)脂族烃基具有0至3个双键;
b)由脂族烃基取代的苯酚作为单体以0.5至15重量百分比,优选2至12重量百分比引入到所述苄基醚型酚醛树脂中;
c)脂族烃基连接在苯酚单体结构单元的间位或对位,优选连接到间位;
d)被脂族烃基取代的苯酚是腰果二酚和/或腰果酚。
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DE102016125702.8A DE102016125702A1 (de) | 2016-12-23 | 2016-12-23 | Komponentenystem zur Herstellung von Kernen und Formen |
PCT/DE2017/101104 WO2018113852A1 (de) | 2016-12-23 | 2017-12-22 | Komponentensystem zur herstellung von kernen und formen |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6465542B1 (en) * | 1999-06-01 | 2002-10-15 | Hüttenes-Albertus Chemische Werke GmbH | Binder system for moulding mixtures for the production of moulds and cores |
DE102006037288A1 (de) * | 2006-08-09 | 2008-02-14 | Ashland-Südchemie-Kernfest GmbH | Verwendung von Cashew-Nutshell Derivaten in Gießereibindemitteln aus Polyurethanbasis |
CN102717024A (zh) * | 2012-06-29 | 2012-10-10 | 济南圣泉集团股份有限公司 | 冷芯盒法环氧树脂双组份粘结剂、铸造混合物、铸造成型体 |
CN103080179A (zh) * | 2010-07-30 | 2013-05-01 | Ask化学品股份有限公司 | 利用环甲缩醛的用于制造型芯和铸模的基于聚氨酯的粘合剂体系、模制材料混合物和方法 |
CN104162625A (zh) * | 2014-08-14 | 2014-11-26 | 济南圣泉集团股份有限公司 | 一种铸造用粘结剂及其制备方法 |
CN105907077A (zh) * | 2016-04-05 | 2016-08-31 | 济南圣泉集团股份有限公司 | 无芳烃冷芯盒树脂粘结剂 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3485797A (en) | 1966-03-14 | 1969-12-23 | Ashland Oil Inc | Phenolic resins containing benzylic ether linkages and unsubstituted para positions |
US3429848A (en) | 1966-08-01 | 1969-02-25 | Ashland Oil Inc | Foundry binder composition comprising benzylic ether resin,polyisocyanate,and tertiary amine |
US4268425A (en) | 1979-05-14 | 1981-05-19 | Ashland Oil, Inc. | Phenolic resin-polyisocyanate binder systems containing a drying oil and use thereof |
US4540724A (en) | 1984-01-30 | 1985-09-10 | Ashland Oil Inc. | Phenolic resin-polyisocyanate binder systems containing a phosphorus halide and use thereof |
US4602069A (en) | 1984-04-11 | 1986-07-22 | Ashland Oil, Inc. | Phenolic resin-polyisocyanate binder systems containing a phosphorus based acid |
US5447968A (en) | 1993-07-23 | 1995-09-05 | Ashland Inc. | Polyurethane-forming binder systems containing 2,2'-dipyridyl, 1,10-phenanthroline, and their substituted alkyl derivatives |
DE19850833C2 (de) | 1998-11-04 | 2001-06-13 | Ashland Suedchemie Kernfest | Bindemittelsystem zur Herstellung von Kernen und Gießformen auf Polyurethanbasis, deren Verwendung und Verfahren zur Herstellung eines Gießformteils auf Polyurethanbasis |
DE102004057671B4 (de) | 2004-11-29 | 2007-04-26 | Hüttenes-Albertus Chemische Werke GmbH | Phenol-Formaldehydharze und Verfahren zu deren Herstellung |
DE102008007181A1 (de) * | 2008-02-01 | 2009-08-06 | Ashland-Südchemie-Kernfest GmbH | Verwendung von verzweigten Alkandiolcarbonsäurediestern in Gießereibindemitteln auf Polyurethanbasis |
DE102008055042A1 (de) | 2008-12-19 | 2010-06-24 | Hüttenes-Albertus Chemische Werke GmbH | Modifizierte Phenolharze |
MX2012000758A (es) * | 2009-07-16 | 2012-08-03 | Ask Chemicals Lp | Aglutinante de fundicion que comprende uno o mas cicloalcanos como un solvente. |
DE102010051567A1 (de) * | 2010-11-18 | 2012-05-24 | Ashland-Südchemie-Kernfest GmbH | Bindemittel auf Polyurethanbasis zur Herstellung von Kernen und Gießformen unter Verwendung von Isocyanaten enthaltend eine Urethonimin- und/oder Carbodiimid-Gruppe, eine Formstoffmischung enthaltend das Bindemittel und ein Verfahren unter Verwendung des Bindemittels |
DE102015201614A1 (de) | 2014-09-10 | 2016-03-10 | Hüttenes-Albertus Chemische Werke GmbH | Zweikomponenten-Bindemittelsystem für den Polyurethan-Cold-Box-Prozess |
EP3283541B1 (de) * | 2015-04-14 | 2023-06-07 | HÜTTENES-ALBERTUS Chemische Werke Gesellschaft mit beschränkter Haftung | Phenolharz-komposition zur verwendung im polyurethan-cold-box- und/oder no-bake-verfahren sowie entsprechende zweikomponenten-bindemittelsysteme, verwendungen und verfahren |
DE102015107016A1 (de) * | 2015-05-05 | 2016-06-23 | Ask Chemicals Gmbh | Verfahren zur Reduzierung von freiem Formaldehyd in Benzylether-Harzen |
-
2016
- 2016-12-23 DE DE102016125702.8A patent/DE102016125702A1/de not_active Withdrawn
-
2017
- 2017-12-22 PL PL17835801T patent/PL3558559T3/pl unknown
- 2017-12-22 DE DE112017006507.0T patent/DE112017006507A5/de not_active Withdrawn
- 2017-12-22 RU RU2019122280A patent/RU2759194C2/ru active
- 2017-12-22 BR BR112019013024-1A patent/BR112019013024B1/pt active IP Right Grant
- 2017-12-22 PT PT178358016T patent/PT3558559T/pt unknown
- 2017-12-22 EP EP17835801.6A patent/EP3558559B1/de active Active
- 2017-12-22 JP JP2019534156A patent/JP7227906B2/ja active Active
- 2017-12-22 MX MX2019007551A patent/MX2019007551A/es unknown
- 2017-12-22 WO PCT/DE2017/101104 patent/WO2018113852A1/de unknown
- 2017-12-22 CA CA3046878A patent/CA3046878A1/en active Pending
- 2017-12-22 ES ES17835801T patent/ES2844428T3/es active Active
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- 2017-12-22 CN CN201780080347.3A patent/CN110139722B/zh active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6465542B1 (en) * | 1999-06-01 | 2002-10-15 | Hüttenes-Albertus Chemische Werke GmbH | Binder system for moulding mixtures for the production of moulds and cores |
DE102006037288A1 (de) * | 2006-08-09 | 2008-02-14 | Ashland-Südchemie-Kernfest GmbH | Verwendung von Cashew-Nutshell Derivaten in Gießereibindemitteln aus Polyurethanbasis |
CN103080179A (zh) * | 2010-07-30 | 2013-05-01 | Ask化学品股份有限公司 | 利用环甲缩醛的用于制造型芯和铸模的基于聚氨酯的粘合剂体系、模制材料混合物和方法 |
CN102717024A (zh) * | 2012-06-29 | 2012-10-10 | 济南圣泉集团股份有限公司 | 冷芯盒法环氧树脂双组份粘结剂、铸造混合物、铸造成型体 |
CN104162625A (zh) * | 2014-08-14 | 2014-11-26 | 济南圣泉集团股份有限公司 | 一种铸造用粘结剂及其制备方法 |
CN105907077A (zh) * | 2016-04-05 | 2016-08-31 | 济南圣泉集团股份有限公司 | 无芳烃冷芯盒树脂粘结剂 |
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ES2844428T3 (es) | 2021-07-22 |
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