CN110096770B - PCB-based high-speed signal line pad inspection method and device - Google Patents
PCB-based high-speed signal line pad inspection method and device Download PDFInfo
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Abstract
The invention innovatively provides a PCB-based high-speed signal line pad inspection method, which judges whether the symmetry, line length, line width, included angle between signal lines and edge distance of the signal lines led out by pins meet preset requirements or not by acquiring information of the high-speed signal line to be inspected and the pins connected end to end with the high-speed signal line in difference.
Description
Technical Field
The invention relates to the field of board card inspection, in particular to a PCB-based high-speed signal line pad inspection method and device.
Background
In cloud computing products (server, memory, etc.), along with on PCB (Printed Circuit Board) difference signal line speed is higher and higher, requirement to signal integrality is more and more strict, so after wiring engineer accomplishes the wiring, wiring engineer and signal integrality engineer can strictly inspect the PCB pad part of high-speed signal line, however current wiring instrument can not carry out automatic check, need manual check one by one, not only waste time and energy like this, still there is the undetected condition to appear easily, the development cycle of extension PCB design, be unfavorable for practicing thrift the human cost, the efficiency and the quality of inspection have been reduced.
Disclosure of Invention
The invention aims to solve the problems in the existing PCB high-speed signal line pad inspection, and innovatively provides a PCB high-speed signal line pad inspection-based method and a PCB high-speed signal line pad inspection-based device, which can reduce a large amount of working hours, shorten the development period and avoid the condition of missing inspection.
The invention provides a PCB-based high-speed signal line pad inspection method, which comprises the following steps:
determining a first high-speed signal wire to be inspected according to the inspection requirement of a user;
acquiring ID information (position information) of a second high-speed signal wire which is differential with the first high-speed signal wire, inquiring information of pins which are connected with the first high-speed signal wire and the second high-speed signal wire end to end, judging whether the first high-speed signal wire and the second high-speed signal wire are symmetrical on a signal wire led out from the pins or not, and if the first high-speed signal wire and the second high-speed signal wire are symmetrical, judging that the PCB high-speed signal wire pad does not meet the requirement;
if not symmetricalDividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 Whether all meet the preset requirements;
if the line width d of the third signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 If one signal does not meet the preset requirement, the PCB high-speed signal line pad does not meet the requirement.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the determining, according to a user inspection requirement, a first high-speed signal line to be inspected specifically is:
according to the requirement of a user, a first high-speed signal line to be checked is determined by inputting a keyword to be checked or the name of the complete high-speed signal line.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the line width d of the third segment signal line 3 Length of wire l 3 The requirements are specifically as follows:
l 3 ＝1.5*d 3 。
with reference to the first aspect, in a third possible implementation manner of the first aspect, the line width d of the fourth segment of signal line 4 Length of wire l 4 The requirements are as follows:
l 4 ＝1.5*d 4 。
with reference to the first aspect, in a fourth possible implementation manner of the first aspect, an included angle α between the third segment of signal line and the fourth segment of signal line is specifically required to be:
α≥135°。
with reference to the first aspect, in a fifth possible implementation manner of the first aspect, the obtaining of the second high-speed signal line which is differential to the first high-speed signal lineBefore the ID information, further comprising: obtaining the distance h between each layer of signal layer and reference layer of the PCB high-speed signal line to be inspected 2 And stored in a database.
With reference to the first aspect, in a fifth possible implementation manner of the first aspect, a distance h between an edge of the first segment of the signal line and an edge of the fifth segment of the signal line 1 The concrete requirements are as follows:
h 1 ≥3*h 2 。
the invention provides a PCB-based high-speed signal line pad inspection device in a second aspect, which comprises:
the determining module is used for determining a first high-speed signal wire to be checked according to the checking requirement of a user;
the first acquisition module is used for acquiring ID information of a second high-speed signal line which is differential with the first high-speed signal line, inquiring information of pins which are connected with the first high-speed signal line and the second high-speed signal line end to end, judging whether the first high-speed signal line and the second high-speed signal line are symmetrical or not in a signal line led out by the pins, and if the first high-speed signal line and the second high-speed signal line are symmetrical, the PCB high-speed signal line pad does not meet the requirement;
dividing the inspection module, if the inspection module is not symmetrical, dividing the signal wire led out by the pin into five sections according to the wiring direction, and inspecting the line width d of the third section of signal wire 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 An included angle alpha between the third section of signal line and the fourth section of signal line, and a distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 Whether all the requirements are met;
recording module if the line width d of the third segment signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 If one signal line does not meet the preset requirement, the PCB high-speed signal line pad is recorded to be not met with the requirement.
With reference to the first aspect, in a fifth possible implementation manner of the first aspect, the method further includes: a second acquisition module for acquiring each high-speed signal line of the PCB to be inspectedDistance h between layer signal layer and reference layer 2 And stored in a database.
The technical scheme adopted by the invention comprises the following technical effects:
compared with the traditional manual inspection mode, the method and the device for inspecting the pad based on the PCB high-speed signal line can reduce a large amount of time, shorten the development period of PCB design, avoid the condition of missing inspection, save the labor cost and improve the inspection efficiency and quality.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without any creative effort.
Fig. 1 is a schematic flow chart of a first embodiment of a high-speed signal line pad inspection method based on a PCB in the solution of the present invention;
fig. 2 is a schematic diagram of five signal lines led out by pins in a first embodiment of a high-speed signal line pad inspection method based on a PCB in the solution of the present invention;
fig. 3 is a schematic flow chart of a second embodiment of a PCB-based high-speed signal line pad inspection method according to the present invention;
fig. 4 is a schematic structural diagram of a third embodiment of a high-speed signal line pad inspection device based on a PCB in the solution of the present invention;
fig. 5 is a schematic structural diagram of a fourth embodiment of a high-speed signal line pad inspection apparatus based on a PCB in the solution of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
Example one
As shown in fig. 1, an embodiment of the present invention provides a method for inspecting a pad based on a PCB high-speed signal line, including the following steps:
s1, determining a first high-speed signal wire to be checked according to the checking requirement of a user;
s2, acquiring ID information of the second high-speed signal line that is differential to the first high-speed signal line, querying information of pins connected end to end of the first high-speed signal line and the second high-speed signal line, determining whether the first high-speed signal line and the second high-speed signal line are symmetric with respect to the signal line drawn from the pins, if yes, performing step S3, and if no, performing step S4;
s3, recording that the PCB high-speed signal line pad does not meet the requirement;
s4, dividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section of signal line 3 Length of wire l 3 Whether the predetermined requirement is met, if the check result is yes, performing step S5, if the check result is no, performing step S3;
s5, checking the line width d of the fourth signal line 4 Length of wire l 4 Whether the predetermined requirement is met, if the check result is yes, executing step S6, if the check result is no, executing step S3;
s6, checking whether the included angle alpha between the third section of signal wire and the fourth section of signal wire meets the preset requirement, if yes, executing a step S7, and if not, executing a step S3;
s7, checkingThe distance h between the edge of the first signal line and the edge of the fifth signal line 1 Whether the predetermined requirement is met, if yes, executing step S8, if no, executing step S3;
and S8, recording that the PCB high-speed signal line pad meets the requirement.
In step 1, the first high-speed signal line to be checked is determined according to the user check requirement, specifically: according to the requirement of a user, a first high-speed signal line to be checked is determined by inputting a keyword to be checked or the name of the complete high-speed signal line. The keyword query mode can realize rapid filtering, the complete name query mode can realize accurate searching, and the two modes can be selected according to the situation in practical application.
In order to more clearly describe the relationship between the five signal lines of the PCB high-speed signal line led out by the pin and the corresponding line length, line width and included angle, as shown in fig. 2, the signal line of the PCB high-speed signal line pad101 led out by the pin is divided into five sections according to the routing direction, that is, the line width of the first signal line a, the second signal line B, the third signal line C, the fourth signal line D, the fifth signal line F and the third signal line C is D 3 The length of the wire is l 3 Line width d of the third signal line C 3 Length of wire l 3 The requirements are as follows:
l 3 ＝1.5*d 3 。
the line width of the fourth segment signal line D is D 4 The length of the wire is l 4 Line width D of the fourth signal line segment D 4 Length of wire l 4 The requirements are specifically as follows:
l 4 ＝1.5*d 4 。
wherein, the line length l of the signal line 3 、l 4 The length of the middle part of the signal transmission direction of the signal wire is selected as the wire length of the signal wire according to the wire routing direction of the signal wire.
The included angle between the third section of signal line C and the fourth section of signal line D is α, and the requirements are specifically as follows:
α≥135°。
of the edge of the first signal line A and the edge of the fifth signal line FDistance h 1 The concrete requirements are as follows:
h 1 and the distance between each signal layer and the reference layer of the PCB high-speed signal line is not less than 3 times.
In step S8, the high-speed signal line information that does not satisfy the requirement may be displayed in the result unit, and the inspection result may be stored in the text document for subsequent review.
Example two
As shown in fig. 2, an embodiment of the present invention provides a method for inspecting a pad based on a PCB high-speed signal line, including the following steps:
s1, determining a first high-speed signal wire to be checked according to the checking requirement of a user;
s2, obtaining the distance h between each signal layer and the reference layer of the PCB high-speed signal line to be checked 2 And storing in a database;
s3, acquiring ID information of the second high-speed signal line that is differential to the first high-speed signal line, querying information of pins connected end to end of the first high-speed signal line and the second high-speed signal line, determining whether the first high-speed signal line and the second high-speed signal line are symmetric with respect to the signal line drawn from the pins, if yes, performing step S4, and if no, performing step S5;
s4, recording that the PCB high-speed signal line pad does not meet the requirement;
s5, dividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section of signal line 3 Length of wire l 3 Whether the predetermined requirement is met, if the check result is yes, executing step S6, if the check result is no, executing step S4;
s6, checking the line width d of the fourth signal line 4 Length of wire l 4 Whether the predetermined requirement is met, if the check result is yes, performing step S7, if the check result is no, performing step S4;
s7, checking whether the included angle alpha between the third section of signal wire and the fourth section of signal wire meets the preset requirement, if yes, executing a step S8, and if no, executing a step S4;
s8, checking the distance h between the edge of the first segment signal line and the edge of the fifth segment signal line 1 Whether the preset requirements are met, if yes, executing step S9, and if no, executing step S4;
and S9, recording that the PCB high-speed signal line pad meets the requirement.
The difference between the embodiment of the technical solution of the present invention and the first embodiment is that step S2 is added, and in step S2, the lamination information of the PCB is extracted, and the distance h between each signal layer and the reference layer of the PCB high speed signal line to be inspected is obtained by sorting 2 And stored in the database for checking the distance h between the edge of the first segment signal line and the edge of the fifth segment signal line in step S8 1 The method meets the requirements, and the specific requirements are as follows:
h 1 ≥3*h 2 。
according to the first embodiment and the second embodiment, the high-speed signal line can be compiled and realized by using the Cadence SKILL language, the Cadence SKILL language provides a secondary development SKILL language for users for Cadence companies, the users can access the secondary development SKILL language through the SKILL language, and own tools based on the Cadence platform can be developed.
EXAMPLE III
As shown in fig. 4, the technical solution of the present invention further provides a high-speed signal line pad inspection apparatus based on a PCB, including:
the determining module 201 is used for determining a first high-speed signal wire to be checked according to the checking requirement of a user;
the first obtaining module 202 is configured to obtain ID information of the second high-speed signal line which is differential with the first high-speed signal line, query information of pins which are connected end to end between the first high-speed signal line and the second high-speed signal line, and determine whether the first high-speed signal line and the second high-speed signal line are symmetrical with respect to a signal line led out by the pins, and if the first high-speed signal line and the second high-speed signal line are symmetrical with respect to the signal line led out by the pins, the PCB high-speed signal line pad does not meet requirements;
dividing the checking module 203, if not symmetrical, dividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 Whether all meet the preset requirements;
recording the module 204 if the line width d of the third segment signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 If one signal line does not meet the preset requirement, the PCB high-speed signal line pad is recorded to be not met with the requirement.
Example four
As shown in fig. 5, the technical solution of the present invention further provides a high-speed signal line pad inspection apparatus based on a PCB, including:
the determining module 301 determines a first high-speed signal line to be checked according to a user checking requirement;
a second obtaining module 302 for obtaining the distance h between each signal layer and the reference layer of the PCB high-speed signal line to be inspected 2 And storing in a database;
a first obtaining module 303, configured to obtain ID information of a second high-speed signal line that is differential to the first high-speed signal line, query information of pins that are connected end to end between the first high-speed signal line and the second high-speed signal line, and determine whether the first high-speed signal line and the second high-speed signal line are symmetric with respect to a signal line led out from the pins, where if the first high-speed signal line and the second high-speed signal line are symmetric with respect to the signal line, the PCB high-speed signal line pad does not meet requirements;
dividing the checking module 304, if not symmetrical, dividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 Between the third and fourth signal linesAngle alpha, distance h between the edge of the first segment signal line and the edge of the fifth segment signal line 1 Whether all meet the preset requirements;
The third embodiment and the fourth embodiment of the present invention are both devices corresponding to the method, and therefore, the details are not described herein.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (9)
1. A pad inspection method based on PCB high-speed signal lines is characterized by comprising the following steps:
determining a first high-speed signal line to be checked according to a user checking requirement;
the method comprises the steps of acquiring ID information of a second high-speed signal wire which is differential with a first high-speed signal wire, inquiring information of a pin which is connected with the first high-speed signal wire and the second high-speed signal wire end to end, judging whether the first high-speed signal wire and the second high-speed signal wire are symmetrical on a signal wire led out by the pin or not, and if the first high-speed signal wire and the second high-speed signal wire are symmetrical, judging that a PCB high-speed signal wire pad does not meet the requirement;
if not, dividing the signal line led out by the pin into five sections according to the wiring direction, and checking the line width d of the third section of the signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 Whether all conform to the pre-conditionDetermining the requirements;
if the line width d of the third signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 If one signal does not meet the preset requirement, the PCB high-speed signal line pad does not meet the requirement.
2. The PCB-based high-speed signal line pad inspection method as claimed in claim 1, wherein the determining of the first high-speed signal line to be inspected according to the inspection requirement of the user specifically comprises:
according to the requirement of a user, a first high-speed signal line to be checked is determined by inputting a keyword to be checked or a complete high-speed signal line name.
3. The PCB-based high-speed signal line pad inspection method as claimed in claim 1, wherein the line width d of the third segment signal line 3 Length of wire l 3 The requirements are as follows:
l 3 =1.5*d 3 。
4. the PCB-based high-speed signal line pad inspection method as claimed in claim 1, wherein the line width d of the fourth segment signal line 4 Length of wire l 4 The requirements are specifically as follows:
l 4 =1.5*d 4 。
5. the PCB-based high-speed signal line pad inspection method as claimed in claim 1, wherein an included angle α between the third section of signal line and the fourth section of signal line is specifically required to be as follows:
α≥135°。
6. the PCB-based high-speed signal line pad inspection method as claimed in claim 1, wherein before the obtaining of the ID information of the second high-speed signal line which is differential with the first high-speed signal line, the method further comprises: obtaining a to-be-inspectedDistance h between each signal layer and reference layer of PCB high-speed signal line 2 And stored in a database.
7. The PCB-based high-speed signal line pad inspection method as claimed in claim 6, wherein the distance h between the edge of the first segment of signal line and the edge of the fifth segment of signal line 1 The concrete requirements are as follows:
h 1 ≥3*h 2 。
8. a high-speed signal line pad inspection device based on a PCB is characterized by comprising:
the determining module is used for determining a first high-speed signal wire to be checked according to the checking requirement of a user;
the first acquisition module is used for acquiring ID information of a second high-speed signal wire which is differential with the first high-speed signal wire, inquiring information of pins which are connected with the first high-speed signal wire and the second high-speed signal wire end to end, judging whether the first high-speed signal wire and the second high-speed signal wire are symmetrical on a signal wire led out by the pins or not, and if the first high-speed signal wire and the second high-speed signal wire are symmetrical, judging that the PCB high-speed signal wire pad does not meet the requirement;
dividing the inspection module, if the inspection module is not symmetrical, dividing the signal wire led out by the pin into five sections according to the wiring direction, and inspecting the line width d of the third section of signal wire 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 Whether all the requirements are met;
recording module if the line width d of the third segment signal line 3 Length of wire l 3 Line width d of the fourth signal line 4 Length of wire l 4 The included angle alpha between the third section of signal line and the fourth section of signal line, and the distance h between the edge of the first section of signal line and the edge of the fifth section of signal line 1 If one signal line does not meet the preset requirement, the PCB high-speed signal line pad is recorded to be not met with the requirement.
9. The PCB-based high speed of claim 8The signal line pad inspection device is characterized by further comprising: a second obtaining module for obtaining the distance h between each signal layer and the reference layer of the PCB high-speed signal line to be inspected 2 And stored in a database.
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| CN201910304294.XA CN110096770B (en) | 2019-04-16 | 2019-04-16 | PCB-based high-speed signal line pad inspection method and device |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346786A (en) * | 2010-07-29 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Signal line inspection system and method |
| CN102855337A (en) * | 2011-06-27 | 2013-01-02 | 鸿富锦精密工业（深圳）有限公司 | Automated wiring inspection system and automated wiring inspection method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346786A (en) * | 2010-07-29 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Signal line inspection system and method |
| CN102855337A (en) * | 2011-06-27 | 2013-01-02 | 鸿富锦精密工业（深圳）有限公司 | Automated wiring inspection system and automated wiring inspection method |
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