CN110096770A - One kind being based on PCB HW High Way pad inspection method and device - Google Patents
One kind being based on PCB HW High Way pad inspection method and device Download PDFInfo
- Publication number
- CN110096770A CN110096770A CN201910304294.XA CN201910304294A CN110096770A CN 110096770 A CN110096770 A CN 110096770A CN 201910304294 A CN201910304294 A CN 201910304294A CN 110096770 A CN110096770 A CN 110096770A
- Authority
- CN
- China
- Prior art keywords
- high way
- segment signal
- pcb
- signal line
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Present invention innovation proposes a kind of based on PCB HW High Way pad inspection method, by obtaining HW High Way to be checked and therewith at the information of the pin of the HW High Way head and the tail connection of difference, judge by the symmetry of the pin signal wire drawn, wire length, angle between line width and signal wire, whether Edge Distance meets pre-provisioning request, the invention also provides one kind to be based on PCB HW High Way pad check device, compared with traditional-handwork test mode, the a large amount of time can be reduced, shorten the development cycle of PCB design, avoid the occurrence of missing inspection situation, save human cost, improve the efficiency and quality of inspection.
Description
Technical field
The present invention relates to boards to check field, is based on PCB HW High Way pad inspection method and dress more particularly, to one kind
It sets.
Background technique
It is inner in cloud operation product (server, memory etc.), as (Printed Circuit Board, that is, print PCB
Circuit board) on differential signal line rate it is higher and higher, the requirement to signal integrity is increasingly stringenter, then in wiring installation teacher
After completing wiring, wiring installation teacher and signal integrity engineer understand the part PCB pad of close inspection HW High Way, however
Existing wiring tool, which not can be carried out, to be automaticly inspected, and needs to be checked one by one manually, not only time-consuming and laborious in this way, has been also easy to
Missing inspection situation occurs, and extends the development cycle of PCB design, is unfavorable for saving human cost, reduces the efficiency and matter of inspection
Amount.
Summary of the invention
In order to solve the problems, such as that existing PCB HW High Way pad is checked, innovation proposes one kind and is based on the present invention
The method and device that PCB HW High Way pad is checked, it is possible to reduce a large amount of working hour shortens the development cycle, avoids the occurrence of missing inspection
Situation.
First aspect present invention provides one kind based on PCB HW High Way pad inspection method, and the method includes following
Step:
The first HW High Way to be checked is determined according to user's demands on examination；
Obtain the id information (location information) with the first HW High Way at the second HW High Way of difference, inquiry first
The information for the pin that HW High Way is connect with the second HW High Way head and the tail judges that the first HW High Way and the second high speed are believed
Whether number line is symmetrical in the signal wire drawn by pin, if symmetrically, PCB HW High Way pad is undesirable；
If asymmetric, the signal wire drawn by pin is divided into five sections according to direction of routing, and check third segment signal line
Line width d3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, folder between third segment signal line and the 4th segment signal line
Angle α, first segment signal wire edge and the 5th segment signal line edge distance h1Whether pre-provisioning request is met；
If the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal
Angle α between line and the 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge distance h1There is one
Pre-provisioning request is not met, then PCB HW High Way pad is undesirable.
With reference to first aspect, in a first possible implementation of that first aspect, described true according to user's demands on examination
Fixed first HW High Way to be checked is specifically:
According to user demand, determined by input keyword to be checked or complete HW High Way name to be checked
The first HW High Way.
With reference to first aspect, in a second possible implementation of that first aspect, the line width of the third segment signal line
d3, wire length l3It is required that specifically:
l3=1.5*d3。
With reference to first aspect, in first aspect in the third possible implementation, the line width of the 4th segment signal line
d4, wire length l4It is required that specifically:
l4=1.5*d4。
With reference to first aspect, in the 4th kind of possible implementation of first aspect, the third segment signal line and the 4th
Angle α requirement between segment signal line specifically:
α≥135°。
With reference to first aspect, in the 5th kind of possible implementation of first aspect, the acquisition and the first high speed signal
Before id information of the line at the second HW High Way of difference further include: obtain every layer of letter of PCB HW High Way to be checked
Number floor and reference layer distance h2, and save in the database.
With reference to first aspect, in the 5th kind of possible implementation of first aspect, first segment signal wire edge with
The distance h at the 5th segment signal line edge1Specific requirement are as follows:
h1≥3*h2。
Second aspect of the present invention provides a kind of based on PCB HW High Way pad check device, comprising:
Determining module determines the first HW High Way to be checked according to user's demands on examination；
First obtains module, obtains the id information with the first HW High Way at the second HW High Way of difference, inquiry
The information for the pin that first HW High Way and the second HW High Way head and the tail are connect judges the first HW High Way and second high
Whether velocity signal line is symmetrical in the signal wire drawn by pin, if symmetrically, PCB HW High Way pad is undesirable；
It divides and checks that the signal wire drawn by pin is divided into five sections according to direction of routing, and examine if asymmetric by module
Look into the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal line and the 4th section
Angle α between signal wire, first segment signal wire edge and the 5th segment signal line edge distance h1Whether predetermined want is met
It asks；
Logging modle, if the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4,
Angle α between third segment signal line and the 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge away from
From h1There is one not meet pre-provisioning request, then it is undesirable to record the PCB HW High Way pad.
With reference to first aspect, in the 5th kind of possible implementation of first aspect, further includes: second obtains module, obtains
Take every layer signal layer of PCB HW High Way to be checked and reference layer distance h2, and save in the database.
The technical solution adopted by the present invention includes following technical effect:
Present invention innovation proposes one kind based on PCB HW High Way pad inspection method and device, with traditional-handwork inspection
Mode is compared, it is possible to reduce a large amount of time shortens the development cycle of PCB design, avoids the occurrence of missing inspection situation, save manpower at
This, improves the efficiency and quality of inspection.
General description and following detailed description more than it should be understood that be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
Illustrate the embodiment of the present invention or technical solution in the prior art to become apparent from, it below will be to embodiment or existing
Attached drawing needed in technical description is briefly described, it is clear that, for those of ordinary skills,
Under the premise of not making the creative labor, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of process signal based on PCB HW High Way pad inspection method embodiment one in the present invention program
Figure；
Fig. 2 is that one kind is based on being drawn in PCB HW High Way pad inspection method embodiment one by pin in the present invention program
Five segment signal line schematic diagrames；
Fig. 3 is a kind of process signal based on PCB HW High Way pad inspection method embodiment two in the present invention program
Figure；
Fig. 4 is a kind of structural representation based on PCB HW High Way pad check device embodiment three in the present invention program
Figure；
Fig. 5 is a kind of structural representation based on PCB HW High Way pad check device example IV in the present invention program
Figure.
Specific embodiment
In order to clarify the technical characteristics of the invention, below by specific embodiment, and its attached drawing is combined, to this hair
It is bright to be described in detail.Following disclosure provides many different embodiments or example is used to realize different knots of the invention
Structure.In order to simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.In addition, the present invention can be with
Repeat reference numerals and/or letter in different examples.This repetition is that for purposes of simplicity and clarity, itself is not indicated
Relationship between various embodiments and/or setting is discussed.It should be noted that illustrated component is not necessarily to scale in the accompanying drawings
It draws.Present invention omits the descriptions to known assemblies and treatment technology and process to avoid the present invention is unnecessarily limiting.
Embodiment one
As shown in Figure 1, the embodiment of the present invention provides one kind based on PCB HW High Way pad inspection method, including following step
It is rapid:
S1 determines the first HW High Way to be checked according to user's demands on examination；
S2, obtains the id information with the first HW High Way at the second HW High Way of difference, and the first high speed of inquiry is believed
The information for the pin that number line is connect with the second HW High Way head and the tail, judges that the first HW High Way and the second HW High Way exist
By pin draw signal wire it is whether symmetrical, if it is judged that be it is yes, then follow the steps S3, if it is judged that be it is no, then hold
Row step S4；
It is undesirable to record PCB HW High Way pad by S3；
The signal wire drawn by pin is divided into five sections according to direction of routing, and checks the line width of third segment signal line by S4
d3, wire length l3Whether meet pre-provisioning request, if inspection result be it is yes, then follow the steps S5, if inspection result be it is no, hold
Row step S3；
S5 checks the line width d of the 4th segment signal line4, wire length l4Whether meet pre-provisioning request, if inspection result be it is yes,
Execute step S6, if inspection result be it is no, then follow the steps S3；
S6, checks whether the angle α between third segment signal line and the 4th segment signal line meets pre-provisioning request, if checked
Result is to be, thens follow the steps S7, if inspection result be it is no, then follow the steps S3；
S7 checks first segment signal wire edge and the 5th segment signal line edge distance h1Whether pre-provisioning request is met, such as
Fruit inspection result is to be, thens follow the steps S8, if inspection result be it is no, then follow the steps S3；
S8 records PCB HW High Way pad and meets the requirements.
In step 1, determine that the first HW High Way to be checked is specifically according to user's demands on examination: according to user's need
It asks, determines the first HW High Way to be checked by inputting keyword to be checked or complete HW High Way name.
Keyword query mode may be implemented quickly to filter, and complete name query mode may be implemented precisely to search, this mode in two,
It can according to circumstances be selected in practical application.
For the five segment signal lines and corresponding wire length, line of clearer description PCB HW High Way drawn by pin
Relationship between wide and angle, as shown in Fig. 2, the signal wire of PCB HW High Way pad101 drawn by pin is according to cabling side
To five sections, i.e. first segment signal wire A are divided into, second segment signal wire B, third segment signal line C, the 4th segment signal line D, the 5th section is believed
The line width of number line F, third segment signal line C are d3, wire length l3, the line width d of third segment signal line C3, wire length l3It is required that specifically:
l3=1.5*d3。
The line width of 4th segment signal line D is d4, wire length l4, the line width d of the 4th segment signal line D4, wire length l4It is required that specific
Are as follows:
l4=1.5*d4。
Wherein, the wire length l of signal wire3、l4To choose among signal line transmission direction according to signal wire direction of routing
Wire length of the partial-length as this segment signal line.
Angle between third segment signal line C and the 4th segment signal line D is α, it is required that specifically:
α≥135°。
The first segment edge signal wire A and the 5th segment signal line edge F distance h1, specific requirement are as follows:
h1Not less than 3 times of PCB HW High Way every layer signal layer at a distance from reference layer.
In step s 8, the HW High Way information for being unsatisfactory for requiring can will can be shown in result unit,
Inspection result can be stored into text document, be convenient for subsequent access.
Embodiment two
As shown in Fig. 2, the embodiment of the present invention provides one kind based on PCB HW High Way pad inspection method, including following step
It is rapid:
S1 determines the first HW High Way to be checked according to user's demands on examination；
S2 obtains the every layer signal layer and reference layer distance h of PCB HW High Way to be checked2, and it is stored in data
In library；
S3, obtains the id information with the first HW High Way at the second HW High Way of difference, and the first high speed of inquiry is believed
The information for the pin that number line is connect with the second HW High Way head and the tail, judges that the first HW High Way and the second HW High Way exist
By pin draw signal wire it is whether symmetrical, if it is judged that be it is yes, then follow the steps S4, if it is judged that be it is no, then hold
Row step S5；
It is undesirable to record PCB HW High Way pad by S4；
The signal wire drawn by pin is divided into five sections according to direction of routing, and checks the line width of third segment signal line by S5
d3, wire length l3Whether meet pre-provisioning request, if inspection result be it is yes, then follow the steps S6, if inspection result be it is no, hold
Row step S4；
S6 checks the line width d of the 4th segment signal line4, wire length l4Whether meet pre-provisioning request, if inspection result be it is yes,
Execute step S7, if inspection result be it is no, then follow the steps S4；
S7, checks whether the angle α between third segment signal line and the 4th segment signal line meets pre-provisioning request, if checked
Result is to be, thens follow the steps S8, if inspection result be it is no, then follow the steps S4；
S8 checks first segment signal wire edge and the 5th segment signal line edge distance h1Whether pre-provisioning request is met, such as
Fruit inspection result is to be, thens follow the steps S9, if inspection result be it is no, then follow the steps S4；
S9 records PCB HW High Way pad and meets the requirements.
Technical solution of the present invention embodiment is what is different from the first embodiment is that increase step S2 extracts PCB in step s 2
Laminated information, arrange the every layer signal layer and reference layer distance h for obtaining PCB HW High Way to be checked2, and be stored in
In database, for checking first segment signal wire edge and the 5th segment signal line edge distance h in step S81It is to conform to
It asks, specific requirement are as follows:
h1≥3*h2。
The embodiment one and embodiment two provided through the invention, can according to use Cadence SKILL language compile
Realistic existing, Cadence SKILL language provides the SKILL language of secondary development for Cadence company for user, and user can lead to
SKILL language is crossed to access, and the tool based on Cadence platform of oneself can be developed, with traditional-handwork test mode
It compares, it is possible to reduce a large amount of time shortens the development cycle of PCB design, avoids the occurrence of missing inspection situation, saves human cost,
The efficiency and quality for improving inspection ensure that HW High Way has good signal integrity.
Embodiment three
As shown in figure 4, technical solution of the present invention additionally provides one kind based on PCB HW High Way pad check device, packet
It includes:
Determining module 201 determines the first HW High Way to be checked according to user's demands on examination；
First obtains module 202, obtains with the first HW High Way into the id information of the second HW High Way of difference, looks into
The information for asking the pin that the first HW High Way is connect with the second HW High Way head and the tail, judges the first HW High Way and second
Whether HW High Way is symmetrical in the signal wire drawn by pin, if symmetrically, PCB HW High Way pad is undesirable；
It divides and checks module 203, if asymmetric, the signal wire drawn by pin is divided into five sections according to direction of routing, and
Check the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal line and the 4th
Angle α between segment signal line, first segment signal wire edge and the 5th segment signal line edge distance h1Whether meet predetermined
It is required that；
Logging modle 204, if the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length
l4, angle α between third segment signal line and the 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge
Distance h1There is one not meet pre-provisioning request, then it is undesirable to record the PCB HW High Way pad.
Example IV
As shown in figure 5, technical solution of the present invention additionally provides one kind based on PCB HW High Way pad check device, packet
It includes:
Determining module 301 determines the first HW High Way to be checked according to user's demands on examination；
Second obtains module 302, obtains every layer signal layer of PCB HW High Way to be checked at a distance from reference layer
h2, and save in the database；
First obtains module 303, obtains with the first HW High Way into the id information of the second HW High Way of difference, looks into
The information for asking the pin that the first HW High Way is connect with the second HW High Way head and the tail, judges the first HW High Way and second
Whether HW High Way is symmetrical in the signal wire drawn by pin, if symmetrically, PCB HW High Way pad is undesirable；
It divides and checks module 304, if asymmetric, the signal wire drawn by pin is divided into five sections according to direction of routing, and
Check the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal line and the 4th
Angle α between segment signal line, first segment signal wire edge and the 5th segment signal line edge distance h1Whether meet predetermined
It is required that；
Logging modle 305, if the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length
l4, angle α between third segment signal line and the 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge
Distance h1There is one not meet pre-provisioning request, then it is undesirable to record the PCB HW High Way pad.
The embodiment of the present invention three, example IV are device corresponding with method, therefore this will not be repeated here.
Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not protects model to the present invention
The limitation enclosed, those skilled in the art should understand that, based on the technical solutions of the present invention, those skilled in the art are not
Need to make the creative labor the various modifications or changes that can be made still within protection scope of the present invention.
Claims (9)
1. one kind is based on PCB HW High Way pad inspection method, characterized in that the described method comprises the following steps:
The first HW High Way to be checked is determined according to user's demands on examination；
The id information with the first HW High Way at the second HW High Way of difference is obtained, the first HW High Way and the are inquired
The information of the pin of two HW High Ways head and the tail connection, judges that the first HW High Way is drawn with the second HW High Way by pin
Signal wire it is whether symmetrical, if symmetrically, PCB HW High Way pad is undesirable；
If asymmetric, the signal wire drawn by pin is divided into five sections according to direction of routing, and check the line of third segment signal line
Wide d3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, angle α between third segment signal line and the 4th segment signal line,
First segment signal wire edge and the 5th segment signal line edge distance h1Whether pre-provisioning request is met；
If the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal line with
Angle α between 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge distance h1There is a Xiang Bufu
Pre-provisioning request is closed, then PCB HW High Way pad is undesirable.
2. according to claim 1 be based on PCB HW High Way pad inspection method, characterized in that described to be examined according to user
The demand of looking into determines that the first HW High Way to be checked is specifically:
According to user demand, by inputting keyword to be checked or complete HW High Way name determines to be checked the
One HW High Way.
3. according to claim 1 be based on PCB HW High Way pad inspection method, characterized in that the third segment signal
The line width d of line3, wire length l3It is required that specifically:
l3=1.5*d3。
4. according to claim 1 be based on PCB HW High Way pad inspection method, characterized in that the 4th segment signal
The line width d of line4, wire length l4It is required that specifically:
l4=1.5*d4。
5. according to claim 1 be based on PCB HW High Way pad inspection method, characterized in that the third segment signal
Angle α requirement between line and the 4th segment signal line specifically:
α≥135°。
6. according to claim 1 be based on PCB HW High Way pad inspection method, characterized in that the acquisition and first
Before id information of the HW High Way at the second HW High Way of difference further include: obtain PCB HW High Way to be checked
Every layer signal layer and reference layer distance h2, and save in the database.
7. according to claim 1 or 6 based on PCB HW High Way pad inspection method, characterized in that the first segment
Signal wire edge and the 5th segment signal line edge distance h1Specific requirement are as follows:
h1≥3*h2。
8. one kind is based on PCB HW High Way pad check device, characterized in that include:
Determining module determines the first HW High Way to be checked according to user's demands on examination；
First obtains module, obtains the id information with the first HW High Way at the second HW High Way of difference, inquiry first
The information for the pin that HW High Way is connect with the second HW High Way head and the tail judges that the first HW High Way and the second high speed are believed
Whether number line is symmetrical in the signal wire drawn by pin, if symmetrically, PCB HW High Way pad is undesirable；
It divides and checks module, if asymmetric, the signal wire drawn by pin is divided into five sections according to direction of routing, and check the
The line width d of three segment signal lines3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third segment signal line and the 4th segment signal
Angle α between line, first segment signal wire edge and the 5th segment signal line edge distance h1Whether pre-provisioning request is met；
Logging modle, if the line width d of third segment signal line3, wire length l3, the line width d of the 4th segment signal line4, wire length l4, third section
Angle α between signal wire and the 4th segment signal line, first segment signal wire edge and the 5th segment signal line edge distance h1Have
One does not meet pre-provisioning request, then it is undesirable to record the PCB HW High Way pad.
9. according to claim 8 be based on PCB HW High Way pad check device, characterized in that further include: second obtains
Modulus block obtains the every layer signal layer and reference layer distance h of PCB HW High Way to be checked2, and it is stored in database
In.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304294.XA CN110096770B (en) | 2019-04-16 | 2019-04-16 | PCB-based high-speed signal line pad inspection method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910304294.XA CN110096770B (en) | 2019-04-16 | 2019-04-16 | PCB-based high-speed signal line pad inspection method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110096770A true CN110096770A (en) | 2019-08-06 |
| CN110096770B CN110096770B (en) | 2022-08-19 |
Family
ID=67444857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910304294.XA Active CN110096770B (en) | 2019-04-16 | 2019-04-16 | PCB-based high-speed signal line pad inspection method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110096770B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346786A (en) * | 2010-07-29 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Signal line inspection system and method |
| CN102855337A (en) * | 2011-06-27 | 2013-01-02 | 鸿富锦精密工业（深圳）有限公司 | Automated wiring inspection system and automated wiring inspection method |
-
2019
- 2019-04-16 CN CN201910304294.XA patent/CN110096770B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346786A (en) * | 2010-07-29 | 2012-02-08 | 鸿富锦精密工业（深圳）有限公司 | Signal line inspection system and method |
| CN102855337A (en) * | 2011-06-27 | 2013-01-02 | 鸿富锦精密工业（深圳）有限公司 | Automated wiring inspection system and automated wiring inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110096770B (en) | 2022-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109086203A (en) | The detection method and device of the page | |
| CN106528400A (en) | MOCK testing method and device | |
| US4675832A (en) | Visual display logic simulation system | |
| CN106383859B (en) | Analysis processing method for test flight data | |
| CN107844417A (en) | Method for generating test case and device | |
| US7559045B2 (en) | Database-aided circuit design system and method therefor | |
| CN107332711A (en) | Vehicle diagnosis method and device | |
| CN109522228B (en) | Interface automation test data construction method, device, platform and storage medium | |
| CN105446864B (en) | Method and device for verifying influence of deletion of cache file and mobile terminal | |
| CN106980560A (en) | One kind is based on ICD database multibus protocol tests and emulation mode and platform | |
| DE102005025744A1 (en) | Test instrument setting method for field programmable gate array, involves configuring test instrument with output pins, and displaying list of output pins and input lines, to associate each pin with input line | |
| CN106371954A (en) | 10-bit slave address-based I2C bus verification method and system | |
| CN108833170A (en) | A kind of network level adaptation CAN bus method for diagnosing faults | |
| CN110321260B (en) | Uvm-based AXI bus interface read-write data comparison method and UVM verification platform | |
| CN108874665A (en) | A kind of test result method of calibration, device, equipment and medium | |
| CN113468070A (en) | Consistency test method for vehicle-mounted Ethernet | |
| CN105158571B (en) | PCB testing impedance bar automatic generation methods and device | |
| US6829749B2 (en) | Design support apparatus for circuit including directional coupler, design support tool, method of designing circuit, and circuit board | |
| CN107784069A (en) | A kind of method for intelligent diagnostics student knowledge ability | |
| CN109241594B (en) | Method, device and equipment for checking length of T-shaped topological structure wire and readable storage medium | |
| CN108776723B (en) | Test system self-checking adapter connection line generation method, device, equipment and storage medium | |
| CN110377566A (en) | Arrange the method and system of the S parameter test file of PCB | |
| CN115081389B (en) | Printed circuit board wiring inspection method, device, equipment and storage medium | |
| CN110096770A (en) | One kind being based on PCB HW High Way pad inspection method and device | |
| CN111045948A (en) | Method, apparatus and storage medium for checking interface signal between modules |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |