CN110095491B - Defect detection system, defect detection method and electron beam scanning machine - Google Patents
Defect detection system, defect detection method and electron beam scanning machine Download PDFInfo
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- CN110095491B CN110095491B CN201910386157.5A CN201910386157A CN110095491B CN 110095491 B CN110095491 B CN 110095491B CN 201910386157 A CN201910386157 A CN 201910386157A CN 110095491 B CN110095491 B CN 110095491B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
Abstract
The invention provides a defect detection system, a defect detection method and an electron beam scanning machine, wherein the defect detection system comprises a light source part; the detection part comprises a light spot selection plate, the light spot selection plate is provided with a through hole, the width of the through hole is gradually increased or gradually decreased along a first direction, the light spot selection plate can move along the first direction, light rays are perpendicular to the first direction, and at least one part of the light rays can penetrate through the through hole; the driving component is used for driving the detection component to move along a second direction, and the second direction is perpendicular to the first direction; the receiving component is used for receiving the light rays passing through the through hole and converting the received light rays into light spot digital images; and the processor is used for receiving the light spot digital image and determining the height size corresponding to the light spot digital image according to the light spot digital image. The defect detection system provided by the invention has a simple structure and is convenient to operate, and the height or depth of the surface defect of the sample can be quickly detected by utilizing different light spot digital images corresponding to different height sizes.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a defect detection system, a defect detection method and an electron beam scanning machine.
Background
In recent years, as semiconductor integrated circuits are rapidly developed and the critical dimension scale is reduced, the manufacturing process thereof becomes more complicated. Current advanced integrated circuit fabrication processes typically involve hundreds of process steps, one of which can cause problems throughout the semiconductor integrated circuit chip and, in serious cases, can lead to failure of the entire chip. Therefore, it is important to find problems in the manufacturing process of semiconductor integrated circuits in time. In view of the above, the industry generally controls the defect problem in the manufacturing process by using a defect scanner to detect the defects of the chip.
After the defect scanning machine locates the defect, the electron beam scanning machine is responsible for taking an SEM (scanning electron microscope) picture to confirm what the defect is, such as surface particle defect (surface PD), buried particle defect (buried PD), scratch (scratch), and the like; analyzing the components of the defect through an EDS (energy dispersive spectrometer) to determine whether the defect contains special elements; the size of the defect can also be judged primarily through a scale, but the height or the depth of the defect cannot be judged directly through an electron beam scanning machine at present.
Disclosure of Invention
The invention aims to provide a defect detection system, a defect detection method and an electron beam scanning machine, which can solve the problem that the height or the depth of a defect cannot be directly judged by the conventional electron beam scanning machine.
In order to solve the above technical problem, the present invention provides a defect detecting system, which includes a light source part for emitting light; the detection component comprises a light spot selection plate arranged along a first direction, a through hole is arranged on the light spot selection plate, the width of the through hole is gradually increased or gradually decreased along the first direction, the light spot selection plate can move along the first direction, the light rays are perpendicular to the first direction, and at least one part of the light rays can pass through the through hole; the driving component is connected with the detection component and used for driving the detection component to move along a second direction, and the second direction is perpendicular to the first direction; the receiving component is used for receiving the light rays passing through the through hole and converting the received light rays into a light spot digital image; and the processor is used for receiving the light spot digital image, determining the height size corresponding to the light spot digital image according to the light spot digital image, and further determining the height or depth of the surface defect of the sample.
Optionally, the light source component is a laser transmitter, and the receiving component is a laser receiver.
Optionally, the processor determines a height size corresponding to the light spot digital image from a preset database according to the light spot digital image, wherein the preset database stores corresponding relations between different light spot digital images and the height sizes in advance.
Optionally, the detection component further includes a first spring, one end of the first spring is connected to the light spot selection plate, the other end of the first spring is connected to the driving component, and the first spring can drive the light spot selection plate to move along the first direction.
Optionally, the detection component further includes a probe connected to the light spot selection plate, and the probe is disposed along the first direction.
Optionally, the detection component further includes a second spring, one end of the second spring is connected to the spot selection plate, and the other end of the second spring is connected to the probe.
Optionally, the cross-sectional shape of the through hole along the first direction is a trapezoid or a triangle.
In order to solve the technical problem, the invention further provides an electron beam scanning machine, which comprises the defect detection system.
In order to solve the above technical problem, the present invention further provides a defect detection method, including the steps of:
the driving part drives the detection part to move to a non-defect area of the sample to be detected;
at least one part of the light emitted by the light source part passes through the through hole on the detection part;
the receiving component receives the light rays passing through the through hole and converts the light rays into a first light spot digital image;
the driving part drives the detection part to move to a defect area of the sample to be detected;
at least one part of the light emitted by the light source part passes through the through hole on the detection part;
the receiving component receives the light rays passing through the through hole and converts the light rays into a second light spot digital image;
and the processor respectively receives the first light spot digital image and the second light spot digital image, determines a first height size according to the first light spot digital image, determines a second height size according to the second light spot digital image, and performs difference operation on the first height size and the second height size to determine the height or the depth of the defect area.
Optionally, the processor determines a first height size corresponding to the first light spot digital image from a preset database according to the first light spot digital image, and determines a second height size corresponding to the second light spot digital image from a preset database according to the second light spot digital image, where the preset database stores corresponding relationships between different light spot digital images and height sizes in advance.
Compared with the prior art, the defect detection system, the defect detection method and the electron beam scanning machine have the following advantages:
(1) the defect detection system provided by the invention has a simple structure and is convenient to operate, the height or depth of the surface defect of the sample can be quickly detected by utilizing different light spot digital images corresponding to different height sizes, and the height or depth of the defect can be directly judged by the electron beam scanning machine platform by installing the defect detection system provided by the invention on the electron beam scanning machine platform.
(2) The defect detection method provided by the invention is easy to operate, the detection part is respectively moved to the non-defect area and the defect area of the sample to be detected, the first light spot digital image corresponding to the non-defect area and the second light spot digital image corresponding to the defect area are respectively obtained, the first height size and the second height size are determined through the first light spot digital image and the second light spot digital image, and the absolute value of the difference value between the first height size and the second height size is the height or depth of the defect.
(3) The electron beam scanning machine provided by the invention is provided with the defect detection system, so that the electron beam scanning machine can judge the type, size and composition of the defect and can also judge the height or depth of the defect.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a defect detection system according to an embodiment of the present invention;
FIG. 2 is a side view of a spot selection plate according to one embodiment of the present invention;
FIG. 3 is a side view of a spot selection plate according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a defect detection system for detecting a non-defective area of a sample to be detected according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a defect detection system according to an embodiment of the present invention when a defect area protrudes upward relative to a non-defect area, and detects the defect area of a sample to be tested;
FIG. 6 is a schematic structural diagram of a defect detection system according to an embodiment of the present invention when a defective area is recessed downward relative to a non-defective area;
FIG. 7 is a flowchart illustrating a defect detection method according to an embodiment of the invention.
Wherein the reference numbers are as follows:
light source section-100; a detection part-200; a light spot selection plate-210; probe-220; a first spring-230; a second spring-240; a through-hole-211; -a housing-250; a drive member-300; a receiving component-400; a processor-500; presetting a database-600; sample to be tested-700; non-defective area-710; a defective area-720; ray-800.
Detailed Description
In order to make the objects, features and advantages of the present invention comprehensible, please refer to fig. 1 to 7. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
The core idea of the invention is to provide a defect detection system, a defect detection method and an electron beam scanning machine to solve the problem that the existing electron beam scanning machine cannot directly judge the height or depth of a defect.
To achieve the above-mentioned idea, the present invention provides a defect detecting system, and fig. 1 schematically shows an overall structural diagram of the defect detecting system according to an embodiment of the present invention, and as shown in fig. 1, the defect detecting system includes a light source unit 100, a detecting unit 200, a driving unit 300, a receiving unit 400, and a processor 500.
Wherein the light source part 100 is used for emitting light 800. The light source part 100 is preferably a laser emitter, and since laser has the advantages of good monochromaticity, high brightness and good directivity, by using the laser emitter as the light source part 100 in the present invention, the laser ray 800 can be emitted by the laser emitter, so that the detection accuracy of the defect detection system provided by the present invention can be improved.
As shown in fig. 1, the detecting part 200 is located at a light emitting side of the light source 100, and the detecting part 200 includes a spot selecting plate 210 disposed in a first direction. As shown in fig. 1, in the present embodiment, the first direction is a vertical direction.
Fig. 2 schematically shows a side view of an embodiment of the spot selection plate in the defect detection system provided by the present invention, and fig. 3 schematically shows a side view of another embodiment of the spot selection plate in the defect detection system provided by the present invention. As shown in fig. 1 to 3, a through hole 211 is formed in the light spot selection plate, one end of the through hole 211 opens toward the light source part 100, and the other end opens toward the receiving part 400, and the width of the through hole 211 gradually increases or gradually decreases along the first direction. As shown in fig. 2 and 3, the width of the through hole 211 is represented by a, and the value of a gradually increases from the top end to the bottom end of the through hole.
The light spot selection plate 200 can move along the first direction, the light ray 800 is perpendicular to the first direction, and at least a part of the light ray 800 can pass through the through hole 211. As shown in fig. 1, in the present embodiment, the light beam 800 is emitted in the horizontal direction, and the spot selection plate 200 can reciprocate in the vertical direction. Since the light spot selection plate 200 can move in the first direction, the through holes 211 can move in the first direction, so that the hole body portions of different widths of the through holes 211 on the light spot selection plate 200 can move to the positions corresponding to the emission ports of the light source parts 100, respectively, so that at least a part of the light rays 800 pass through the hole body portions of corresponding widths of the through holes 211.
Preferably, the total width of the light 800 emitted from the light source unit 100 is greater than or equal to the maximum width of the through hole 211, and the minimum width of the spot selection plate 210 is greater than the total width of the light 800 emitted from the light source unit 100. Therefore, the arrangement can improve the detection precision of the defect detection system provided by the invention.
Preferably, a cross-sectional shape of the through hole 211 along the first direction is a trapezoid or a triangle. As shown in fig. 2, the cross-sectional shape of the through-hole 211 along the first direction is trapezoidal. As shown in fig. 3, the cross-sectional shape of the through-hole 211 along the first direction is triangular. Thus, by this arrangement, the structure of the spot selection plate 210 can be simplified.
Preferably, a cross-sectional shape of the spot selection plate 210 in the first direction is the same as a cross-sectional shape of the through hole 211 in the first direction, and as shown in fig. 3, a cross-sectional shape of the spot selection plate 210 in the first direction is a trapezoid. As shown in fig. 4, the cross-sectional shape of the spot selection plate 210 in the first direction is a triangle. Therefore, by designing the cross-sectional shape of the spot selection plate 210 to be trapezoidal or triangular, the volume and weight of the spot selection plate 210 can be reduced, and the detection component 200 can be prevented from damaging the sample 700 to be detected.
As shown in fig. 1, the driving unit 300 is connected to the detecting unit 200, and the driving unit 300 is configured to drive the detecting unit 200 to move along a second direction, which is perpendicular to the first direction. As shown in fig. 1, in the present embodiment, the second direction is a horizontal direction.
Fig. 4 to 6 are schematic diagrams of the defect detection system provided by the present invention when detecting a sample to be detected, and as shown in fig. 4 to 6, when the sample 700 to be detected needs to be detected for defect detection, the sample 700 to be detected is placed below the detection component 200, and the surface to be detected of the sample 700 to be detected is located in the second direction. As shown in fig. 4 to 6, in the present embodiment, a sample 700 to be measured is horizontally placed below the detection member 200, and the bottom of the detection member 200 is in contact with a surface to be measured of the sample 700 to be measured. Thereby, the detection unit 200 can be driven by the driving unit 300 to reciprocate along the surface to be measured of the sample 700 to be measured.
The driving part 300 is preferably a micro stepping motor, and thus, by using the micro stepping motor as the driving part 300 in the present invention, the movement of the sensing part 200 can be precisely controlled. In the present invention, the driving part 300 drives the detecting part 200 to move along the second direction through the prior art, and therefore, the working principle of the driving part 300 is not described herein again.
Fig. 4 schematically shows a structural schematic diagram of the defect detection system provided in the present invention when detecting a non-defect area of a sample to be detected, where, as shown in fig. 4, when the detection part 200 moves to the non-defect area 710 of the sample to be detected 700, a hole body portion with a certain width of the through hole 211 corresponds to an emission port of the light source part 100. Fig. 5 schematically shows a structural schematic diagram of the defect detecting system provided by the present invention when the defect region protrudes upward relative to the non-defect region, and as shown in fig. 5, if the defect region 720 protrudes upward relative to the non-defect region 710, when the detecting part 200 is moved from the non-defect region 710 of the sample 700 to be detected to the defect region 720 of the sample 700 to be detected, the light spot selecting plate 210 moves upward a distance relative to the original position, so that the hole body part with the other width of the through hole 211 moves upward to a position corresponding to the emission port of the light source part 100. Fig. 6 is a schematic structural diagram of the defect inspection system according to the present invention when the defect region is recessed downward with respect to the non-defect region, and as shown in fig. 6, if the defect region 720 is recessed downward with respect to the non-defect region 710, when the inspection part 200 is moved from the non-defect region 710 of the sample 700 to be inspected to the defect region 720 of the sample 700 to be inspected, the light spot selection plate 210 is moved downward with respect to the original position by a distance, so that the hole body portion with the further width of the through hole is moved downward to a position corresponding to the emission port of the light source part 100.
The receiving part 400 is located on the side of the detecting part 200 far away from the light source part 100, that is, the detecting part 200 is located between the light source part 100 and the receiving part 400, and the positional relationship among the light source part 100, the detecting part 200 and the receiving part 400 satisfies: the emitting port of the light source unit 100 is opposite to the receiving port of the receiving unit 400 and forms a straight line, and the detecting unit 200 is located on the straight line. The receiving part 400 is used for receiving the light 800 passing through the through hole 211 and converting the received light 800 into a light spot digital image. Thus, when the detecting part 200 is in contact with the non-defect region 710 of the sample 700 to be detected, at least a portion of the light 800 emitted from the light source part 100 can pass through the hole body part with a width of the through hole 211, and the light 800 passing through the hole body part with a width of the through hole 211 is received by the receiving part 400 and converted into a light spot digital image, which is set as a first light spot digital image. When the detecting part 200 contacts the defect region 720 of the sample 700 to be detected, at least a portion of the light 800 emitted from the light source part 100 can pass through the hole body part with another width of the through hole 211, and the light 800 passing through the hole body part with another width of the through hole 211 is received by the receiving part 400 and converted into a light spot digital image, which is set as a second light spot digital image. Since the width dimension of the hole body portion of the through hole 211, through which at least a portion of the light 800 passes when the inspection part 200 is in contact with the non-defective region 710 of the sample 700 to be tested, is different from the width dimension of the hole body portion of the through hole 211, through which at least a portion of the light 800 passes when the inspection part 200 is in contact with the defective region 720 of the sample 700 to be tested, the first light spot digital image and the second light spot digital image obtained thereby are also different.
The processor 500 is in signal connection with the receiving component 400, and the processor 500 is configured to receive the light spot digital image, and determine a height dimension corresponding to the light spot digital image according to the light spot digital image, so as to determine a height or a depth of the surface defect of the sample 700 to be measured. When the detecting part 200 contacts the non-defect area 710 of the sample 700 to be detected, the receiving part 400 transmits a first light spot digital image to the processor 500, and the processor 500 determines a height size corresponding to the first light spot digital image according to the first light spot digital image, and sets the height size as a first height size. Similarly, when the detecting component 200 contacts the defect area 720 of the sample 700 to be detected, the receiving component 400 transmits a second light spot digital image to the processor 500, and the processor 500 determines a height dimension corresponding to the second light spot digital image according to the second light spot digital image, and sets the height dimension as a second height dimension. After the first height size and the second height size are determined, the processor 500 calculates a difference between the first height size and the second height size, and when the difference between the first height size and the second height size is greater than 0, it indicates that the defective area 720 is recessed downward relative to the non-defective area 710, and the difference is the depth of the defect; when the difference between the first height dimension and the second height dimension is less than 0, it indicates that the defect region 720 is upwardly convex with respect to the non-defect region 710, and the absolute value of the difference is the height of the defect.
As shown in fig. 1 and fig. 4 to 6, preferably, the processor 500 is specifically configured to determine a height size corresponding to the light spot digital image from a preset database 600 according to the light spot digital image, where the preset database 600 stores corresponding relations between different light spot digital images and the height sizes in advance. Thus, when the processor 500 receives a first light spot digital image, the processor 500 may compare the first light spot digital image with the light spot digital images stored in the preset database 600, so as to determine a first height dimension corresponding to the first light spot digital image. Similarly, when the processor 500 receives a second light spot digital image, the processor 500 may compare the second light spot digital image with the light spot digital image stored in the preset database 600, so as to determine a second height size corresponding to the second light spot digital image. The correspondence between the different light spot digital images and the height dimensions stored in the preset database 600 can be obtained by testing the standard samples with different heights, and the light spot digital images formed by the light rays 800 passing through the hole body parts with different widths of the through hole 211 can be collected by moving the detection part 200 to the standard samples with different heights and by the receiving part 400, so that the correspondence between the different light spot digital images and the heights of the standard samples, that is, the correspondence between the different light spot digital images and the height dimensions, is formed.
Preferably, as shown in fig. 1, 4 to 6, the detecting part 200 may further include a probe 220 connected to the spot selecting plate 210, the probe being disposed along the first direction. The probe 220 is a sensitive contact probe 220, whereby the probe 220 is in contact with a non-defective location of the sample 700 when the inspection unit 200 is moved to the non-defective area 710 of the sample 700. When the inspection unit 200 is moved to the defect area 720 of the sample 700 to be inspected, the probe 220 contacts the defect position of the sample 700 to be inspected, and if the defect area 720 is disposed to protrude upward relative to the non-defect area 710, the spot selection plate 210 moves upward, and the through hole 211 moves upward together with the spot selection plate 210. If the defective region 720 is depressed downward with respect to the non-defective region 710, the spot selection plate 210 moves downward at this time, and the through hole 211 moves downward together with the spot selection plate 210.
Preferably, as shown in fig. 1 and 4 to 6, the detecting part 200 may further include a first spring 230, one end of the first spring 230 is connected to the spot selection plate 210, and the other end of the first spring 230 is connected to the driving part 300, and the first spring 230 can drive the spot selection plate 210 to move back and forth along the axial direction thereof, i.e., the first direction. Therefore, when the detecting part 200 moves from the non-defective area 710 to the defective area 720, if the defective area 720 is upwardly convex relative to the non-defective area 710, at this time, the probe 220 moves upwardly, the first spring 230 is compressed, and the spot selecting plate 210 is further driven to move upwardly; if the defective area 720 is recessed downward relative to the non-defective area 710, the probe 220 moves downward, the first spring 230 is stretched downward, and the spot selection plate 210 is moved downward. Thus, by providing the first spring 230, it is possible to further facilitate the reciprocating movement of the spot selection plate 210 in the axial direction thereof, i.e., in the first direction.
Preferably, as shown in fig. 1 and 4 to 6, the detecting member 200 further includes a second spring 240, and one end of the second spring 240 is connected to the spot selecting plate 210, and the other end is connected to the probe 220. Therefore, by arranging the second spring 240, on one hand, the light spot selection plate 210 can be supported, and on the other hand, the buffer effect can be achieved, so that the probe 220 is prevented from damaging the sample 700 to be detected. The second spring 240 is hardly deformed during the ascent and descent of the spot selection plate 210, whereby the accuracy of defect height or depth detection can be secured.
In order to further improve the structural stability of the detecting member 200, as shown in fig. 1 and 4 to 6, a housing 250 may be covered outside the detecting member 200, the probe 220 protrudes out of the housing 250, the first spring 230, the spot selecting plate 210 and the second spring 240 are all located in the housing 250, the spot selecting plate 210, the second spring 240 and the probe 220 can move back and forth along the axial direction of the housing 250, the top of the housing 250 is connected to the driving member 300, one end of the first spring 230 is connected to an inner wall of the top of the housing 250, the other end is connected to one end of the spot selecting plate 210, one end of the second spring 240 is connected to the probe 220, the other end is connected to the other end of the spot selecting plate 210, openings are provided on a side of the housing 250 opposite to the light source member 100 and a side opposite to the receiving member 400, therefore, the housing 250 does not shield the through hole 211 on the spot selection plate 210, so that at least a part of the light 800 emitted from the light source unit 100 can smoothly pass through the through hole 211 on the spot selection plate 210 to be received by the receiving unit 400.
In order to realize the idea, the invention further provides an electron beam scanning machine, which comprises the defect detection system. Therefore, the defect detection system is arranged on the electron beam scanning machine, so that the electron beam scanning machine can judge the type, the size and the composition of the defect and can also judge the height or the depth of the defect.
In order to realize the above idea, the present invention further provides a defect detection method, as shown in fig. 7, the defect detection method includes the following steps:
s100: the driving part drives the detection part to move to a non-defect area of the sample to be detected.
S200: at least a part of the light emitted from the light source part passes through the through hole of the detection part.
S300: the receiving component receives the light rays passing through the through hole and converts the light rays into a first light spot digital image.
S400: a processor receives the first digital image of spots and determines a first height dimension from the first digital image of spots.
S500: the driving part drives the detection part to move to the defect area of the sample to be detected.
S600: at least a part of the light emitted from the light source part passes through the through hole of the detection part.
S700: the receiving component receives the light rays passing through the through hole and converts the light rays into a second light spot digital image.
S800: a processor receives the second digital image of spots and determines a second height dimension from the second digital image of spots.
S900: the processor performs a difference operation on the first height dimension and the second height dimension to determine a height or a depth of the defect area.
In order to improve the detection accuracy, steps S500-S900 may be repeated multiple times, that is, different positions of the defect area of the sample are detected multiple times, and the size difference with the largest absolute value is taken as the height or depth of the defect, for example, the height of the defect is determined to be 0.420 μm by detecting the defect area for the first time; determining the height of the defect to be 0.400 microns by detecting the defect area for the second time; detecting the defect area for the third time to determine that the height of the defect is 0.415 microns; by detecting the defect area for the fourth time, it is determined that the height of the defect is 0.412 micrometers, and the height of the defect is 0.420 micrometers.
In the actual detection process, the sequence of the steps is adjustable, for example, the detection of the defect area of the sample to be detected can be performed first, and then the detection of the non-defect area of the sample to be detected can be performed.
The driving means, the detecting means, the light source means, the receiving means and the processor in the method are the same as in the defect detecting system described above.
Preferably, for step S400 and step S800, the processor may specifically determine a first height size corresponding to the first light spot digital image from a preset database according to the first light spot digital image, and determine a second height size corresponding to the second light spot digital image from the preset database according to the second light spot digital image, where the preset database stores corresponding relationships between different light spot digital images and height sizes in advance.
In summary, the defect detecting system, the defect detecting method and the electron beam scanning apparatus provided by the invention have the following advantages:
(1) the defect detection system provided by the invention has a simple structure and is convenient to operate, the height or depth of the surface defect of the sample can be quickly detected by utilizing different light spot digital images corresponding to different height sizes, and the height or depth of the defect can be directly judged by the electron beam scanning machine platform by installing the defect detection system provided by the invention on the electron beam scanning machine platform.
(2) The defect detection method provided by the invention is easy to operate, the detection part is respectively moved to the non-defect area and the defect area of the sample to be detected, the first light spot digital image corresponding to the non-defect area and the second light spot digital image corresponding to the defect area are respectively obtained, the first height size and the second height size are determined through the first light spot digital image and the second light spot digital image, and the absolute value of the difference value between the first height size and the second height size is the height or depth of the defect.
(3) The electron beam scanning machine provided by the invention is provided with the defect detection system, so that the electron beam scanning machine can judge the type, size and composition of the defect and can also judge the height or depth of the defect.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A defect detection system, comprising:
a light source part for emitting light;
the detection component comprises a light spot selection plate arranged along a first direction, a through hole is arranged on the light spot selection plate, the width of the through hole is gradually increased or gradually decreased along the first direction, the light spot selection plate can move along the first direction, the light rays are perpendicular to the first direction, and at least one part of the light rays can pass through the through hole;
the driving component is connected with the detection component and used for driving the detection component to move along a second direction, and the second direction is perpendicular to the first direction;
the receiving component is used for receiving the light rays passing through the through hole and converting the received light rays into a light spot digital image; and
and the processor is used for receiving the light spot digital image, determining the height size corresponding to the light spot digital image according to the light spot digital image, and further determining the height or depth of the surface defect of the sample.
2. The defect detection system of claim 1, wherein said light source component is a laser transmitter and said receiving component is a laser receiver.
3. The defect detection system of claim 1, wherein the processor determines a height dimension corresponding to the digital image of the light spot from a preset database according to the digital image of the light spot, wherein the preset database stores corresponding relations between different digital images of the light spot and the height dimension in advance.
4. The defect detection system of claim 1, wherein said detection component further comprises a first spring, one end of said first spring is connected to said spot selection plate, and the other end of said first spring is connected to said driving component, said first spring being capable of driving said spot selection plate to move along said first direction.
5. The defect detection system of claim 1, wherein said inspection assembly further comprises a probe associated with said spot selection board, said probe being disposed along said first direction.
6. The defect detection system of claim 5, wherein said detection component further comprises a second spring, one end of said second spring being connected to said spot selection plate and the other end of said second spring being connected to said probe.
7. The defect detection system of claim 1, wherein a cross-sectional shape of the through-hole along the first direction is trapezoidal or triangular.
8. A method of defect detection, the method comprising the steps of:
the driving part drives the detection part to move to a non-defect area of the sample to be detected;
at least one part of the light emitted by the light source part passes through the through hole on the detection part;
the receiving component receives the light rays passing through the through hole and converts the light rays into a first light spot digital image;
the driving part drives the detection part to move to a defect area of the sample to be detected;
at least one part of the light emitted by the light source part passes through the through hole on the detection part;
the receiving component receives the light rays passing through the through hole and converts the light rays into a second light spot digital image;
a processor respectively receives the first light spot digital image and the second light spot digital image, determines a first height size according to the first light spot digital image, determines a second height size according to the second light spot digital image, and performs difference operation on the first height size and the second height size to determine the height or the depth of the defect area;
the detection part comprises a light spot selection plate arranged along a first direction, a through hole is formed in the light spot selection plate, the width of the through hole gradually increases or gradually decreases along the first direction, the light spot selection plate can move along the first direction, and the light rays are perpendicular to the first direction.
9. The defect detection method of claim 8, wherein the processor determines a first height dimension corresponding to the first digital image of the light spot from a preset database according to the first digital image of the light spot, and determines a second height dimension corresponding to the second digital image of the light spot from a preset database according to the second digital image of the light spot, wherein the preset database stores corresponding relations between different digital images of the light spot and the height dimensions in advance.
10. An electron beam scanner comprising the defect detection system of any one of claims 1 to 7.
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