CN110095491A - A kind of defect detecting system, detection method and electron beam scanning machine - Google Patents
A kind of defect detecting system, detection method and electron beam scanning machine Download PDFInfo
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- CN110095491A CN110095491A CN201910386157.5A CN201910386157A CN110095491A CN 110095491 A CN110095491 A CN 110095491A CN 201910386157 A CN201910386157 A CN 201910386157A CN 110095491 A CN110095491 A CN 110095491A
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- hot spot
- light
- digital picture
- defect
- hole
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
Abstract
The present invention provides a kind of defect detecting system, detection method and electron beam scanning machine, which includes light source part；Detection part, including hot spot option board, hot spot option board is equipped with through-hole, and the width of through-hole is gradually incremented by along first direction or gradually successively decreases, hot spot option board can be moved along first direction, and light is vertical with first direction and at least part of light can pass through through-hole；Driving part, for driving detection part to move in a second direction, second direction is vertical with first direction；Receiving part, for receiving the light across through-hole and converting hot spot digital picture for received light；And processor, it is used for light spot received digital picture, and height dimension corresponding with hot spot digital picture to be determined according to hot spot digital picture.Defect detecting system structure provided by the invention is simple and convenient to operate, and is corresponded to different height dimensions using different hot spot digital pictures, is fast implemented the detection to the height or depth of sample surfaces defect.
Description
Technical field
The present invention relates to semi-conductor device technology field, in particular to a kind of defect detecting system, detection method and electronics
Beam scanning board.
Background technique
In recent years, with the rapid development of semiconductor integrated circuit and critical size scale smaller, manufacturing process also becomes
It obtains more complicated.Currently advanced integrated circuit fabrication process generally all includes several hundred a processing steps, one of step
Go wrong the problem of will causing entire semiconductor integrated circuit chip, the serious failure for being also possible to lead to entire chip.
So in the manufacturing process of semiconductor integrated circuit, it is just aobvious that product manufacture the problem of carries out discovery in time
It obtains particularly important.Based on above-mentioned consideration, industry generally carries out defects detection to chip by using Defect Scanning board to control
The defects of manufacturing process problem.
After Defect Scanning board is to defect location, electron beam scanning machine is responsible for shooting SEM (scanning electron microscope)
Photo, what confirmation defect is, such as surface particles defect (surface PD), the grain defect buried (buried PD) or is scraped
Hurt (scratch) etc.；By EDS (energy disperse spectroscopy) analyzing defect constituent, it is confirmed whether containing special elements；It can also pass through
The size of the judgement defect of scale just slightly, but for the height or depth of defect, can not also pass through electron beam scanning machine at present
Platform directly judges.
Summary of the invention
The purpose of the present invention is to provide a kind of defect detecting system, detection method and electron beam scanning machines, can solve
The problem of certainly existing electron beam scanning machine can not directly judge the height or depth of defect.
In order to solve the above technical problems, the present invention provides a kind of defect detecting system, the defect detecting system includes light
Source block, for emitting light；Detection part, including the hot spot option board being arranged along first direction, on the hot spot option board
Equipped with through-hole, the width of the through-hole is gradually incremented by along the first direction or gradually successively decreases, and the hot spot option board being capable of edge
The first direction is mobile, and at least part of the light light vertical and described with the first direction can pass through described
Through-hole；Driving part is connected with the detection part, for driving the detection part to move in a second direction, described second
Direction is vertical with the first direction；Receiving part, for receiving light across the through-hole and by the received light
It is converted into hot spot digital picture；And processor, for receiving the hot spot digital picture, and according to the hot spot digital picture
It determines height dimension corresponding with the hot spot digital picture, and then determines the height or depth of sample surfaces defect.
Optionally, the light source part is laser emitter, and the receiving part is laser pickoff.
Optionally, the processor is determining digital with the hot spot from presetting database according to the hot spot digital picture
The corresponding height dimension of image, wherein the presetting database is previously stored with different hot spot digital pictures and height dimension
Corresponding relationship.
Optionally, the detection part further includes the first spring, one end of first spring and the hot spot option board
It is connected, the other end is connected with the driving part, and first spring is able to drive the hot spot option board along the first party
To movement.
Optionally, the detection part further includes the probe being connected with the hot spot option board, and the probe is along described
The setting of one direction.
Optionally, the detection part further includes second spring, one end of the second spring and the hot spot option board
It is connected, the other end is connected with the probe.
Optionally, the through-hole is trapezoidal or triangle along the cross sectional shape of the first direction.
In order to solve the above technical problems, the present invention also provides a kind of electron beam scanning machine, the electron beam scanning machine
Platform includes above-mentioned defect detecting system.
In order to solve the above technical problems, the present invention also provides a kind of defect inspection method, the defect inspection method includes
Following steps:
Driving part driving detection part is moved to the non-defective area of sample to be tested；
At least part in the light of light source part transmitting passes through the through-hole on the detection part；
Receiving part receives the light across through-hole and converts the first hot spot digital picture for the light；
Driving part drives the detection part to be moved to the defect area of sample to be tested；
At least part in the light of light source part transmitting passes through the through-hole on the detection part；
Receiving part receives the light across through-hole and converts the second hot spot digital picture for the light；
Processor receives the first hot spot digital picture and the second hot spot digital picture and respectively according to described
One hot spot digital picture determines the first height dimension, determines the second height dimension according to the second hot spot digital picture, and
Difference operation is carried out to first height dimension and second height dimension, with the height or depth of the determination defect area
Degree.
Optionally, the processor determines and described first from presetting database according to the first hot spot digital picture
Corresponding first height dimension of hot spot digital picture, and determined from presetting database according to the second hot spot digital picture
The second height dimension corresponding with the second hot spot digital picture, wherein the presetting database is previously stored with different hot spots
The corresponding relationship of digital picture and height dimension.
Compared with prior art, defect detecting system provided by the invention, detection method and electron beam scanning machine have
Following advantages:
(1) defect detecting system structure provided by the invention is simple and convenient to operate, and utilizes different hot spot digital pictures pair
Different height dimensions is answered, the detection to the height or depth of sample surfaces defect can be fast implemented, by proposing the present invention
The defect detecting system of confession is installed on electron beam scanning machine, can directly judge defect by electron beam scanning machine
Height or depth.
(2) defect inspection method provided by the invention is easily operated, is respectively moved to sample to be tested by will test component
Non-defective area and defect area, obtain respectively and the corresponding first hot spot digital picture of non-defective area and corresponding with defect area
Second hot spot digital picture determines the first height dimension and second by the first hot spot digital picture and the second hot spot digital picture
The absolute value of the difference of height dimension, the first height dimension and the second height dimension is the height or depth of defect.
(3) since electron beam scanning machine provided by the invention has above-mentioned defect detecting system, so that
Electron beam scanning machine can also judge the height or depth of defect while judging defect type, size, ingredient.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the defect detecting system of an embodiment of the present invention；
Fig. 2 is the side view of the hot spot option board of an embodiment of the present invention；
Fig. 3 is the side view of the hot spot option board of another embodiment of the present invention；
Fig. 4 is the defect detecting system of an embodiment of the present invention when the non-defective area to sample to be tested detects
Structural schematic diagram；
Fig. 5 is the defect detecting system of an embodiment of the present invention when defect area raises upward relative to non-defective area
Structural schematic diagram when the defect area to sample to be tested detects；
The position Fig. 6 when defect area relative to non-defective area to lower recess when, the defect detecting system of an embodiment of the present invention
Structural schematic diagram when the defect area to sample to be tested detects；
Fig. 7 is the flow chart of the defect inspection method of an embodiment of the present invention.
Wherein, appended drawing reference is as follows:
Light source part -100；Detection part -200；Hot spot option board -210；Probe -220；First spring -230；Second bullet
Spring -240；Through-hole -211；Shell -250；Driving part -300；Receiving part -400；Processor -500；Presetting database -600；
Sample to be tested -700；Non-defective area -710；Defect area -720；Light -800.
Specific embodiment
In order to keep objects, features and advantages of the present invention more obvious and easy to understand, attached drawing 1 to 7 is please referred to.It should be clear that this
Specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate the revealed content of specification, for ripe
The personage for knowing this technology understands and reads, and is not intended to limit the invention the qualifications of implementation, therefore does not have technical essence
Meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, do not influence the effect of present invention can be generated and
Under the purpose that can reach, should all still it fall in the range of disclosed technology contents can cover.
As used in the specification and the appended claims, term "or" is usually to include containing for "and/or"
Justice and carry out using, in addition in addition non-content explicitly points out.
Core of the invention thought is to provide a kind of defect detecting system, detection method and electron beam scanning machine, with
Solve the problems, such as that existing electron beam scanning machine can not directly judge the height or depth of defect.
To realize that above-mentioned thought, the present invention provide a kind of defect detecting system, it is real that Fig. 1 shows schematically the present invention one
The overall structure diagram of the defect detecting system of mode is applied, as shown in Figure 1, the defect detecting system includes light source part
100, detection part 200, driving part 300, receiving part 400 and processor 500.
Wherein, the light source part 100 is for emitting light 800.Light source part 100 is preferably laser emitter, due to
Laser has the advantages that monochromaticjty is good, brightness is high, good directionality, by using laser emitter as the light source portion in the present invention
Part 100, can be by laser transmitter projects laser rays 800, so as to improve defect detecting system provided by the invention
Detection accuracy.
As shown in Figure 1, the detection part 200 is located at the emission side of the light source 100, the detection part 200 includes
Along the hot spot option board 210 of first direction setting.As shown in Figure 1, in the present embodiment, the first direction is vertical side
To.
Fig. 2 shows schematically an embodiment of the hot spot option board in defect detecting system provided by the invention
Side view, Fig. 3 show schematically another embodiment of the hot spot option board in defect detecting system provided by the invention
Side view.As shown in Figure 1 to Figure 3, the hot spot option board is equipped with through-hole 211, the direction open at one end of the through-hole 211
The light source part 100, another end opening is towards the receiving part 400, and the width of the through-hole 211 is along the first direction
Gradually it is incremented by or gradually successively decreases.As shown in Figures 2 and 3, the width of the through-hole 211 is indicated with a, from the top of the through-hole to
The value of bottom end, a becomes larger.
The hot spot option board 200 can be moved along the first direction, and the light 800 is vertical with the first direction
And at least part of the light 800 can pass through the through-hole 211.As shown in Figure 1, in the present embodiment, the light
Line 800 projects in the horizontal direction, and the hot spot option board 200 can move back and forth along the vertical direction.Since the hot spot selects
Plate 200 can be moved along first direction, so that through-hole 211 is moved along first direction, so that hot spot option board
The hole body portion of the different in width of through-hole 211 on 200 can be respectively moved to the emission port with the light source part 100
Corresponding position, so that at least part in the light 800 passes through the hole body of the correspondence width of the through-hole 211
Part.
Preferably, the overall width for the light 800 that the light source part 100 emits is greater than or equal to the through-hole 211 most
Big width, the minimum widith of the hot spot option board 210 are greater than the overall width of the light 800 of the light source part 100 transmitting.By
This, it is such that the detection accuracy that defect detecting system provided by the invention can be improved is set.
Preferably, the through-hole 211 is trapezoidal or triangle along the cross sectional shape of the first direction.As shown in Fig. 2, institute
It is trapezoidal that through-hole 211, which is stated, along the cross sectional shape of the first direction.As shown in figure 3, the through-hole 211 is along the first direction
Cross sectional shape is triangle.As a result, by time such setting, the structure of the hot spot option board 210 can simplify.
Preferably, the hot spot option board 210 is along the cross sectional shape of the first direction and the through-hole 211 along described the
The cross sectional shape in one direction is identical, as shown in figure 3, the hot spot option board 210 is ladder along the cross sectional shape of the first direction
Shape.As shown in figure 4, the hot spot option board 210 is triangle along the cross sectional shape of the first direction.Pass through as a result, by light
The cross sectional shape of spot option board 210 is designed as trapezoidal or triangle, can reduce the volume and weight of hot spot option board 210, from
And it can prevent detection part 200 from causing to damage to sample to be tested 700.
As shown in Figure 1, the driving part 300 is connected with the detection part 200, the driving part 300 is for driving
It moves the detection part 200 to move in a second direction, the second direction is vertical with the first direction.As shown in Figure 1, at this
In embodiment, the second direction is horizontal direction.
Fig. 4 to fig. 6 gives schematic diagram of the defect detecting system provided by the invention when detecting to sample to be tested,
As shown in Figures 4 to 6, when needing to carry out defects detection to sample to be tested 700, sample to be tested 700 is placed in the detection
The surface to be measured of the lower section of component 200, the sample to be tested 700 is located in the second direction.As shown in Figures 4 to 6, at this
In embodiment, sample to be tested 700 is placed horizontally at the lower section of the detection part 200, the bottom of the detection part 200 with
The surface to be measured of the sample to be tested 700 is in contact.The detection part can be driven by the driving part 300 as a result,
200 move back and forth along the surface to be measured of the sample to be tested 700.
The driving part 300 is preferably micron stepper motor, as a result, by using micron stepper motor as the present invention
In driving part 300, can accurately control walking for detection part 200.Heretofore described driving part 300 passes through existing
Detection part 200 described in technology humanized is moved along the second direction, therefore no longer former to the work of the driving part 300 herein
Reason is repeated.
The defect area 720 of the sample to be tested 700 is positioned by Defect Scanning board in advance, and Fig. 4 is schematic
Give structural schematic diagram of the defect detecting system provided by the invention when the non-defective area to sample to be tested detects,
As shown in figure 4, when the detection part 200 is moved to the non-defective area 710 of the sample to be tested 700, the through-hole 211
The hole body portion of a certain width is corresponding with the emission port of the light source part 100.Fig. 5 is shown schematically when defect area phase
When raising upward for non-defective area, defect detecting system provided by the invention is when the defect area to sample to be tested detects
Structural schematic diagram, as shown in figure 5, if defect area 720 raises upward relative to non-defective area 710, when by the inspection
When survey component 200 is moved to the defect area 720 of the sample to be tested 700 from the non-defective area 710 of the sample to be tested 700, institute
It states hot spot option board 210 and has moved up a distance relative to original position, so that another width of the through-hole 211
The hole body portion of degree is moved upward to position corresponding with the emission port of the light source part 100.Fig. 6 is schematically provided
When defect area relative to non-defective area to lower recess when, defect detecting system provided by the invention is in the defect to sample to be tested
Structural schematic diagram when area is detected, as shown in fig. 6, if defect area 720 relative to non-defective area 710 be to lower recess,
Then when by the detection part 200 from the non-defective area 710 of the sample to be tested 700 be moved to the sample to be tested 700 lack
When falling into area 720, the hot spot option board 210 is moved downwardly a distance relative to original position, so that described logical
The hole body portion of the another width in hole is moved downward to position corresponding with the emission port of light source part 100.
The receiving part 400 is located at side of the detection part 200 far from the light source part 100, i.e., the described inspection
Component 200 is surveyed between the light source part 100 and the receiving part 400, the light source part 100, the test section
Positional relationship between 400 three of part 200 and the receiving part meets: the emission port of the light source part 100 with it is described
The receiving port of receiving part 400 is opposite, and simultaneously line, the detection part 200 are located on the straight line line shape in line.
The receiving part 400 is for receiving the light 800 across the through-hole 211 and converting light for the received light 800
Spot digital picture.It is described as a result, when the detection part 200 is in contact with the non-defective area 710 of the sample to be tested 700
At least part for the light 800 that light source part 100 emits can pass through the hole body portion of a width of the through-hole 211, wear
The light 800 for crossing the hole body portion of a width of the through-hole 211 is received by the receiving part 400 and is converted into hot spot number
Image is set as the first hot spot digital picture.When the detection part 200 is in contact with the defect area 720 of the sample to be tested 700
When, at least part for the light 800 that the light source part 100 emits can pass through the hole of another width of the through-hole 211
Body portion, the light 800 across the hole body portion of another width of the through-hole 211 are received and are turned by the receiving part 400
For hot spot digital picture, it is set as the second hot spot digital picture.Due to working as the detection part 200 and the sample to be tested when described
When 700 non-defective area 710 is in contact, so that the hole body for the through-hole 211 that at least part in the light 800 passes through
Partial width dimensions, and when the detection part 200 is in contact with the defect area 720 of the sample to be tested 700, so that institute
State the width dimensions of the hole body portion for the through-hole 211 that at least part in light 800 passes through be it is different, thus
To the first hot spot digital picture be also different with the second hot spot digital picture.
The processor 500 is connect with 400 signal of receiving part, and the processor 500 is for receiving the hot spot
Digital picture, and corresponding height dimension is determined according to the hot spot digital picture, and then determine the sample to be tested 700
The height or depth of surface defect.When the detection part 200 is in contact with the non-defective area 710 of the sample to be tested 700,
The receiving part 400 gives the first hot spot Digital Image Transmission to the processor 500, and the processor 500 is according to described the
One hot spot digital picture determines height dimension corresponding with the first hot spot digital picture, is set as the first height dimension.Together
Reason, when the detection part 200 is in contact with the defect area 720 of the sample to be tested 700, the receiving part 400 is by the
Two hot spot Digital Image Transmissions give the processor 500, and the processor 500 is determined according to the second hot spot digital picture
Height dimension corresponding with the second hot spot digital picture out, is set as the second height dimension.Determine the first height dimension and
After second height dimension, processor 500 is by carrying out difference calculating to the first height dimension and the second height dimension, when described the
When the difference of one height dimension and second height dimension is greater than 0, illustrate that the defect area 720 is relative to non-defective area 710
To lower recess, the difference of size is the depth of the defect；When first height dimension and second height dimension
When difference is less than 0, illustrate that the defect area 720 is raised upward relative to the non-defective area 710, the difference of size it is absolute
Value is the height of the defect.
As shown in Fig. 1 and fig. 4 to fig. 6, it is preferred that the processor 500 is specifically used for according to the hot spot digital picture
Height dimension corresponding with the hot spot digital picture is determined from presetting database 600, wherein the presetting database 600
It is previously stored with the corresponding relationship of different hot spot digital pictures and height dimension.As a result, when the processor 500 receives first
When hot spot digital picture, the processor 500 can will be deposited in the first hot spot digital picture and the presetting database 600
The hot spot digital picture of storage is compared, so that it is determined that going out the first height dimension corresponding with the first hot spot digital picture.
Similarly, when the processor 500 receives the second hot spot digital picture, the processor 500 can be by second hot spot
The hot spot digital picture stored in digital picture and the presetting database 600 is compared, so that it is determined that going out and described second
Corresponding second height dimension of hot spot digital picture.The different hot spot digital pictures and height stored in the presetting database 600
The corresponding relationship for spending size, can be tested by the standard sample to different height, by will test component 200
It is moved on the standard sample of different height, it can be to the hole for each width for passing through the through-hole 211 by receiving part 400
The light 800 of body portion is formed by hot spot digital picture and is acquired, to form different hot spot digital pictures and standard sample
The corresponding relationship of the height of product, i.e., the corresponding relationship of different hot spot digital pictures and height dimension.
Preferably, as shown in Fig. 1, fig. 4 to fig. 6, the detection part 200 may also include to be connected with hot spot option board 210
Probe 220, the probe is arranged along the first direction.The probe 220 is active touch probe 220, as a result, when described
When detection part 200 is moved to the non-defective area 710 of the sample to be tested 700, the probe 220 and the sample to be tested 700
Non-defective position be in contact.It is described when the detection part 200 to be moved to the defect area 720 of the sample to be tested 700
Probe 220 is in contact with the defective locations of the sample to be tested 700, if defect area 720 is protruding upward relative to non-defective area 710
Setting, then hot spot option board 210 moves up at this time, and the through-hole 211 follows hot spot option board 210 to move up together.If defect
Area 720 is to lower recess relative to non-defective area 710, then the hot spot option board 210 moves down at this time, the through-hole
211 follow hot spot option board 210 to move down together.
Preferably, as shown in Fig. 1, fig. 4 to fig. 6, the detection part 200 may also include the first spring 230, and described first
One end of spring 230 is connected with the hot spot option board 210, and the other end is connected with the driving part 300, first spring
230 are able to drive the hot spot option board 210 moves back and forth along its axial i.e. described first direction.As a result, when the test section
When part 200 is moved to defect area 720 by non-defective area 710, if defect area 720 raises upward relative to non-defective area 710,
Then at this point, probe 220 moves up, the first spring 230 is compressed, and then hot spot option board 210 is driven to move up；If defect
Area 720 is to lower recess relative to non-defective area 710, then probe 220 moves down at this time, and the first spring 230 is pulled downwardly
It stretches, and then hot spot option board 210 is driven to move down.As a result, by the first spring 230 of setting, hot spot choosing can be easily facilitated
It selects plate 210 to move along its axial reciprocating, i.e., is moved along the first direction.
Preferably, as shown in Fig. 1, fig. 4 to fig. 6, the detection part 200 further includes second spring 240, second bullet
One end of spring 240 is connected with the hot spot option board 210, and the other end is connected with the probe 220.Pass through setting second as a result,
On the one hand spring 240 can play the role of supporting hot spot option board 210, on the other hand can also play buffer function, prevent
Probe 220 causes to damage to sample to be tested 700.Mistake of the second spring 240 in 210 raising and lowering of hot spot option board
Deformation is hardly happened in journey, it is possible thereby to guarantee the accuracy of flaw height or depth detection.
In order to further increase the structural stability of the detection part 200, as shown in Fig. 1, fig. 4 to fig. 6, the detection
The outside of component 200 can be covered with shell 250, and the probe 220 is pierced by the shell 250, first spring 230, hot spot
Option board 210 and the second spring 240 are respectively positioned in the shell 250, the hot spot option board 210, the second spring
240 and the probe 220 can be moved along the axial reciprocating of the shell 250, the top of the shell 250 and the driving portion
Part 300 is connected, and one end of first spring 230 is connected with the inner wall at the top of the shell 250, the other end and the hot spot
One end of option board 210 is connected, and one end of the second spring 240 is connected with the probe 220, and the other end and the hot spot select
Select plate 210 the other end be connected, the shell 250 side opposite with the light source part 100 and with the receiving part
It is equipped with opening on 400 opposite sides, thus shell 250 will not cause to block to the through-hole 211 on hot spot option board 210,
So that at least part for the light 800 that the light source part 100 emits can pass through on hot spot option board 210
Through-hole 211 by the receiving part 400 to be received.
To realize above-mentioned thought, the present invention also provides a kind of electron beam scanning machine, the electron beam scanning machine packet
Include above-mentioned defect detecting system.As a result, by installing above-mentioned defect detecting system on electron beam scanning machine, can make
Electron beam scanning machine can also judge the height or depth of defect while judging defect type, size, ingredient.
To realize above-mentioned thought, the present invention also provides a kind of defect inspection methods, as shown in fig. 7, the detection method
Include the following steps:
S100: driving part driving detection part is moved to the non-defective area of sample to be tested.
S200: at least part in the light of light source part transmitting passes through the through-hole on the detection part.
S300: receiving part receives the light across the through-hole and converts the first hot spot digitized map for the light
Picture.
S400: processor receives the first hot spot digital picture and determines first according to the first hot spot digital picture
Height dimension.
S500: driving part drives the detection part to be moved to the defect area of sample to be tested.
S600: at least part in the light of light source part transmitting passes through the through-hole on the detection part.
S700: receiving part receives the light across the through-hole and converts the second hot spot digitized map for the light
Picture.
S800: processor receives the second hot spot digital picture and determines second according to the second hot spot digital picture
Height dimension.
S900: processor carries out difference operation to first height dimension and second height dimension, to determine
State the height or depth of defect area.
In order to improve detection accuracy, step S500-S900, the i.e. different location to the defect area of sample can be repeated several times
Carry out repeated detection, height or depth of the maximum dimension difference that takes absolute value as defect, for example, by for the first time to defect
Area is detected, and determines that the height of defect is 0.420 micron；Defect area is detected by second, determines defect
Height be 0.400 micron；Defect area is detected by third time, determines that the height of defect is 0.415 micron；Pass through
4th time defect area is detected, determines that the height of defect is 0.412 micron, then the height of the defect is 0.420 micron.
During atual detection, the sequence of above-mentioned steps is adjustable, such as can be first to the defect area of sample to be tested
It is detected, then the non-defective area of sample to be tested is detected.
Driving part, detection part, light source part, receiving part and processor in this method are detected with drawbacks described above
It is identical in system.
Preferably, for step S400 and step S800, the processing implement body can be according to the first hot spot digitized map
As the first height dimension corresponding with the first hot spot digital picture determining from presetting database, and according to described second
Hot spot digital picture determines the second height dimension corresponding with the second hot spot digital picture from presetting database, wherein institute
State the corresponding relationship that presetting database is previously stored with different hot spot digital pictures and height dimension.
In conclusion defect detecting system provided by the invention, detection method and electron beam scanning machine are with following excellent
Point:
(1) defect detecting system structure provided by the invention is simple and convenient to operate, and utilizes different hot spot digital pictures pair
Different height dimensions is answered, the detection to the height or depth of sample surfaces defect can be fast implemented, by proposing the present invention
The defect detecting system of confession is installed on electron beam scanning machine, can directly judge defect by electron beam scanning machine
Height or depth.
(2) defect inspection method provided by the invention is easily operated, is respectively moved to sample to be tested by will test component
Non-defective area and defect area, obtain respectively and the corresponding first hot spot digital picture of non-defective area and corresponding with defect area
Second hot spot digital picture determines the first height dimension and second by the first hot spot digital picture and the second hot spot digital picture
The absolute value of the difference of height dimension, the first height dimension and the second height dimension is the height or depth of defect.
(3) since electron beam scanning machine provided by the invention has above-mentioned defect detecting system, so that
Electron beam scanning machine can also judge the height or depth of defect while judging defect type, size, ingredient.
Herein, relational terms such as first and second and the like be used merely to by an entity or operation with it is another
One entity or operation distinguish, and without necessarily requiring or implying between these entities or operation, there are any this reality
Relationship or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to the packet of nonexcludability
Contain, so that the process, method, article or equipment for including a series of elements not only includes those elements, but also including
Other elements that are not explicitly listed, or further include for elements inherent to such a process, method, article, or device.
In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element
Process, method, article or equipment in there is also other identical elements.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of defect detecting system characterized by comprising
Light source part, for emitting light；
Detection part, including the hot spot option board being arranged along first direction, the hot spot option board is equipped with through-hole, the through-hole
Width be gradually incremented by along the first direction or gradually successively decrease, the hot spot option board can be moved along the first direction,
At least part of the light light vertical and described with the first direction can pass through the through-hole；
Driving part is connected with the detection part, for driving the detection part to move in a second direction, the second party
To vertical with the first direction；
Receiving part, for receiving the light across the through-hole and converting hot spot digital picture for the received light；
And
Processor, for receiving the hot spot digital picture, and it is determining digital with the hot spot according to the hot spot digital picture
The corresponding height dimension of image, and then determine the height or depth of sample surfaces defect.
2. defect detecting system as described in claim 1, which is characterized in that the light source part is laser emitter, described
Receiving part is laser pickoff.
3. defect detecting system as described in claim 1, which is characterized in that the processor is according to the hot spot digital picture
Height dimension corresponding with the hot spot digital picture is determined from presetting database, wherein the presetting database is deposited in advance
Contain the corresponding relationship of different hot spot digital pictures and height dimension.
4. defect detecting system as described in claim 1, which is characterized in that the detection part further includes the first spring, institute
The one end for stating the first spring is connected with the hot spot option board, and the other end is connected with the driving part, the first spring energy
The hot spot option board is enough driven to move along the first direction.
5. defect detecting system as described in claim 1, which is characterized in that the detection part further includes selecting with the hot spot
The connected probe of plate is selected, the probe is arranged along the first direction.
6. defect detecting system as claimed in claim 5, which is characterized in that the detection part further includes second spring, institute
The one end for stating second spring is connected with the hot spot option board, and the other end is connected with the probe.
7. defect detecting system as described in claim 1, which is characterized in that section shape of the through-hole along the first direction
Shape is trapezoidal or triangle.
8. a kind of defect inspection method, which is characterized in that the detection method includes the following steps:
Driving part driving detection part is moved to the non-defective area of sample to be tested；
At least part in the light of light source part transmitting passes through the through-hole on the detection part；
Receiving part receives the light across the through-hole and converts the first hot spot digital picture for the light；
Driving part drives the detection part to be moved to the defect area of sample to be tested；
At least part in the light of light source part transmitting passes through the through-hole on the detection part；
Receiving part receives the light across the through-hole and converts the second hot spot digital picture for the light；
Processor receives the first hot spot digital picture and the second hot spot digital picture and respectively according to first light
Spot digital picture determines the first height dimension, determines the second height dimension according to the second hot spot digital picture, and to institute
It states the first height dimension and second height dimension carries out difference operation, with the height or depth of the determination defect area.
9. defect inspection method as claimed in claim 8, which is characterized in that the processor is according to the first hot spot number
Image determines corresponding with the first hot spot digital picture the first height dimension from presetting database, and according to described the
Two hot spot digital pictures determine the second height dimension corresponding with the second hot spot digital picture from presetting database, wherein
The presetting database is previously stored with the corresponding relationship of different hot spot digital pictures and height dimension.
10. a kind of electron beam scanning machine, which is characterized in that including defects detection system described in any one of claims 1 to 7
System.
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Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5526406A (en) * | 1978-08-14 | 1980-02-25 | Hitachi Ltd | Light source part of atomic absorption analyzer |
| US20030048455A1 (en) * | 2001-03-19 | 2003-03-13 | Fleming Timothy J. | Goniometer |
| JP2003185597A (en) * | 2001-12-18 | 2003-07-03 | Mitsubishi Rayon Co Ltd | Inspection device for capillary array sheet and inspection method using the same |
| WO2003106923A1 (en) * | 2002-06-13 | 2003-12-24 | The Boeing Company | Method of measuring sol-gel coating thickness using infrared absorbance |
| US20040036856A1 (en) * | 2001-12-21 | 2004-02-26 | Georg Wittman | Apparatus and method for in-situ measurement of polymer quantities output from an extractor |
| US20050236589A1 (en) * | 2003-08-20 | 2005-10-27 | Xyratex Technology Limited | Resonator method and system for distinguishing characteristics of surface features or contaminants |
| CN2807194Y (en) * | 2005-06-30 | 2006-08-16 | 宝山钢铁股份有限公司 | Continuous metal pipe wall thickness measurer |
| JP2007114079A (en) * | 2005-10-21 | 2007-05-10 | Katsunobu Takeuchi | Subsidence measuring technique and device thereof |
| CN101520313A (en) * | 2009-03-24 | 2009-09-02 | 哈尔滨工业大学 | Sensing method and device for micro inner cavity size and three-dimensional coordinate based on two-dimensional micro-focus collimation |
| CN201917527U (en) * | 2010-10-14 | 2011-08-03 | 北方夜视技术股份有限公司 | Device for checking defects of optical fiber panel |
| CN103389044A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Manual single-measure-head contact-type measuring method for veneer board thickness |
| CN104321856A (en) * | 2012-03-27 | 2015-01-28 | 科磊股份有限公司 | Method and apparatus for detecting buried defects |
| CN104569358A (en) * | 2014-12-30 | 2015-04-29 | 南方寝饰科技有限公司 | Cloth inspecting machine with cloth surface hole detection function |
| CN105021142A (en) * | 2015-07-15 | 2015-11-04 | 中国科学院金属研究所 | Measuring method of laser lap joint welding seam width and device used by method |
| CN105159031A (en) * | 2015-08-31 | 2015-12-16 | 上海华力微电子有限公司 | Method for fabricating relation curve of thicknesses and critical sizes of photoresists |
| CN105241908A (en) * | 2015-08-28 | 2016-01-13 | 广州市本原纳米仪器有限公司 | Improved scanning method for scanning probe microscope |
| CN107192353A (en) * | 2017-06-08 | 2017-09-22 | 京东方科技集团股份有限公司 | Step instrument and probe detection device |
| CN107290935A (en) * | 2016-03-31 | 2017-10-24 | 上海微电子装备（集团）股份有限公司 | A kind of intensity modulation method |
| CN108747132A (en) * | 2018-07-24 | 2018-11-06 | 湖北书豪智能科技有限公司 | Autonomous welding robot vision control system |
| CN208254360U (en) * | 2018-05-22 | 2018-12-18 | 上海康耐特光学有限公司 | A kind of lens mold mistake high detection instrument |
-
2019
- 2019-05-09 CN CN201910386157.5A patent/CN110095491B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5526406A (en) * | 1978-08-14 | 1980-02-25 | Hitachi Ltd | Light source part of atomic absorption analyzer |
| US20030048455A1 (en) * | 2001-03-19 | 2003-03-13 | Fleming Timothy J. | Goniometer |
| JP2003185597A (en) * | 2001-12-18 | 2003-07-03 | Mitsubishi Rayon Co Ltd | Inspection device for capillary array sheet and inspection method using the same |
| US20040036856A1 (en) * | 2001-12-21 | 2004-02-26 | Georg Wittman | Apparatus and method for in-situ measurement of polymer quantities output from an extractor |
| WO2003106923A1 (en) * | 2002-06-13 | 2003-12-24 | The Boeing Company | Method of measuring sol-gel coating thickness using infrared absorbance |
| US20050236589A1 (en) * | 2003-08-20 | 2005-10-27 | Xyratex Technology Limited | Resonator method and system for distinguishing characteristics of surface features or contaminants |
| CN2807194Y (en) * | 2005-06-30 | 2006-08-16 | 宝山钢铁股份有限公司 | Continuous metal pipe wall thickness measurer |
| JP2007114079A (en) * | 2005-10-21 | 2007-05-10 | Katsunobu Takeuchi | Subsidence measuring technique and device thereof |
| CN101520313A (en) * | 2009-03-24 | 2009-09-02 | 哈尔滨工业大学 | Sensing method and device for micro inner cavity size and three-dimensional coordinate based on two-dimensional micro-focus collimation |
| CN201917527U (en) * | 2010-10-14 | 2011-08-03 | 北方夜视技术股份有限公司 | Device for checking defects of optical fiber panel |
| CN104321856A (en) * | 2012-03-27 | 2015-01-28 | 科磊股份有限公司 | Method and apparatus for detecting buried defects |
| CN103389044A (en) * | 2013-08-09 | 2013-11-13 | 昆山允可精密工业技术有限公司 | Manual single-measure-head contact-type measuring method for veneer board thickness |
| CN104569358A (en) * | 2014-12-30 | 2015-04-29 | 南方寝饰科技有限公司 | Cloth inspecting machine with cloth surface hole detection function |
| CN105021142A (en) * | 2015-07-15 | 2015-11-04 | 中国科学院金属研究所 | Measuring method of laser lap joint welding seam width and device used by method |
| CN105241908A (en) * | 2015-08-28 | 2016-01-13 | 广州市本原纳米仪器有限公司 | Improved scanning method for scanning probe microscope |
| CN105159031A (en) * | 2015-08-31 | 2015-12-16 | 上海华力微电子有限公司 | Method for fabricating relation curve of thicknesses and critical sizes of photoresists |
| CN107290935A (en) * | 2016-03-31 | 2017-10-24 | 上海微电子装备（集团）股份有限公司 | A kind of intensity modulation method |
| CN107192353A (en) * | 2017-06-08 | 2017-09-22 | 京东方科技集团股份有限公司 | Step instrument and probe detection device |
| CN208254360U (en) * | 2018-05-22 | 2018-12-18 | 上海康耐特光学有限公司 | A kind of lens mold mistake high detection instrument |
| CN108747132A (en) * | 2018-07-24 | 2018-11-06 | 湖北书豪智能科技有限公司 | Autonomous welding robot vision control system |
Non-Patent Citations (2)
| Title |
|---|
| ALAN OWENS: "Synchrotron light sources and radiation detector metrology", 《NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH SECTION A: ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT》 * |
| 郑健峰: "带钢表面缺陷检测方法研究", 《中国优秀博硕士学位论文全文数据库 (硕士) 工程科技Ⅰ辑》 * |
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