CN110085541B - Manufacturing method of shaft type diode - Google Patents
Manufacturing method of shaft type diode Download PDFInfo
- Publication number
- CN110085541B CN110085541B CN201910402162.0A CN201910402162A CN110085541B CN 110085541 B CN110085541 B CN 110085541B CN 201910402162 A CN201910402162 A CN 201910402162A CN 110085541 B CN110085541 B CN 110085541B
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- welding
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- laser printing
- boat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
Abstract
The invention discloses a manufacturing method of a shaft type diode, which comprises the following steps: 1. wafer cutting → 2, welding assembly → 3, high temperature welding → 4, plastic molding → 5, lead-free electroplating → 6, electrical test braid → 7, laser printing → 8, packaging. Because the laser printing mode is adopted for printing, the boiling 5H operation which is needed before the lead-free electroplating is avoided, and meanwhile, the ink for printing ink and printing type matrixes and other consumable items do not need to be purchased, so that the product cost can be reduced; the appearance qualification rate of the product is improved, the appearance quality level of the product is improved, the appearance production qualification rate of the product is improved by more than 1%, the product cost is reduced, the appearance quality of the product is greatly improved, and the product quality is improved.
Description
Technical Field
The invention relates to a manufacturing method of a shaft type diode, and belongs to the technical field of electronic components.
Background
The diode is also called a crystal diode, which is called a diode for short; it is an electronic device with unidirectional conduction of current. The electronic device has a PN junction and two lead terminals inside a semiconductor diode, and has conductivity of unidirectional current according to the direction of applied voltage. The shaft type diode is a form of diode, and is formed from cylindrical main body and circular conducting wire extended from two ends of said main body, and the interior of said main body is equipped with diode chip, and its functions are rectification, voltage-stabilizing, voltage-suppressing and light-emitting diode.
The existing axial diode manufacturing method generally adopts the following process:
wafer cutting → welding assembly → high temperature welding → plastic molding → boiling 5H → leadless electroplating → test + printing ink + braiding → packaging.
The production process adopts ink printing to perform material body printing operation, but because the material body is epoxy resin molding glue, wax is contained in the material body, 5H operation is needed to be performed before lead-free electroplating, the wax contained in the material body is removed, and the ink printing can be printed on the material body, and the 5H operation not only increases the manufacturing procedure, but also causes the problems that the ink characters printed during subsequent ink printing are easy to fall off, the appearance qualification rate is low, the printing of the appearance of a client is complained, and the like, because the material body is easy to cook and discolor or the wax is not completely cooked; meanwhile, consumable articles such as ink for ink printing, printing matrix and the like also need to be purchased regularly, and the product cost is increased.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a manufacturing process method of a shaft type diode, which can reduce the production cost of products, improve the qualification rate of the appearance of the products and improve the appearance quality of the products.
The invention adopts the following technical scheme:
a method for manufacturing a shaft diode comprises the following steps:
1. wafer cutting → 2, welding assembly → 3, high temperature welding → 4, plastic molding → 5, lead-free electroplating → 6, electrical test braid → 7, laser printing → 8, packaging.
Has the advantages that: because the laser printing mode is adopted for printing, the invention avoids the boiling operation of 5H which is needed before the lead-free electroplating, and meanwhile, the ink for printing ink and printing type matrix and other consumable items do not need to be purchased, thus reducing the product cost; the product appearance qualification rate is improved, and the product appearance quality level is improved; the prior art boils 5H + printing ink and prints characters and easily leads to the bad problem of material appearance, and the new technology can promote the product appearance production qualification rate by more than 1%, reduces the product cost, in addition has improved product appearance quality by a wide margin to promote product quality.
Detailed Description
The following describes in detail embodiments of the present invention.
A method for manufacturing a shaft diode comprises the following steps:
firstly, cutting a wafer, namely placing the wafer into a cutting machine table, and cutting the wafer into single chips in a diamond cutter or other modes;
and secondly, welding and assembling, namely filling the wires into welding boats by using a wire filling machine, wherein an upper welding boat and a lower welding boat are required to be filled for connecting leading-out ends of the P, N ends of the crystal grains. Adopting a soldering lug rocking disc, filling a lower soldering lug with the grain size corresponding to each hole of a welding boat of the existing lower lead, placing the soldering lug on the lead, and connecting the N end of the grain with the lead by using a welding flux; placing the crystal grain on the lower soldering lug through a jig such as a crystal grain sucker, and adopting a soldering lug rocking disc on the lower soldering lug, filling the upper soldering lug corresponding to the crystal grain in each hole of the welding boat, and placing the upper soldering lug on the crystal grain for connecting the P end of the crystal grain with a lead by welding; placing the welding boat filled with the crystal grains and the upper and lower welding sheets, covering the finished upper lead welding boat in another tray, covering a flat thin steel sheet on the upper lead welding boat, then reversing the upper lead welding boat by 180 degrees and placing the upper lead welding boat on the finished lower welding boat, and withdrawing the steel sheet, thus completing the tray combination of the upper and lower welding boats, and completing the welding assembly of the shaft type diode at the moment;
and thirdly, high-temperature welding, welding the assembled finished product, and welding in a high-temperature welding furnace. The soldering lug is welded and solidified at high temperature in a welding furnace, and the lead, the chip and the lead are welded and combined into a whole, so that the soldering lug has the function of a diode;
fourthly, plastic packaging molding, and after welding, using epoxy resin molding glue to package the semi-finished product into a shaft type diode shape so as to enable the shaft type diode shape to have certain mechanical strength;
fifthly, lead-free electroplating is carried out, wherein pins of the shaft type diode product after plastic package forming are subjected to lead-free electroplating, so that welding use of a client side is facilitated;
sixthly, electrically testing the braid, testing the electrical parameter performance of the shaft type diode, and uniformly braiding qualified products by using a red and white adhesive tape to facilitate subsequent laser printing operation;
and seventhly, performing laser printing, namely putting the taped good electrical property test product into a laser printing mechanism. The plastic gears which rotate at a constant speed are arranged below the mechanism, the space between the gears is the same as the space between the braids, the width of the gears is the same as that of the shaft type diode body, and thus the shaft type diode is fixed between the gears and cannot shake; when the shaft type diode material rotates to the top end of the gear along with the plastic gear, the laser printing mechanism above the plastic gear performs laser printing operation. Although the shaft diode is in a cylindrical shape, the product below the laser printing mechanism is in an arc-shaped surface, but the height of the arc surface is not large relative to the fall height, so that the arc-shaped surface can be approximately regarded as a plane, the laser focal length is set by the plane, then the laser printing operation is carried out, and the printing of the upper half part of the material can be completed. After the part of operations is finished, the material can be transferred to another laser printing mechanism with the same function, the braid material is turned over, the part which is not printed is upward, the laser printing operation is carried out again, and then the lower half part of the material can be printed. Thus, laser printing of the material is completed, the upper half part and the lower half part of the material have laser printing contents, and the use of a client is guaranteed to be free of problems;
and eighthly, packaging, namely packaging the shaft type diode which is subjected to the test printing and taping into an inner box and an outer box, printing a label and the like, placing the diode into a finished product bin, and delivering the diode for a customer to use.
Claims (1)
1. A method for manufacturing a shaft diode is characterized by comprising the following steps:
firstly, cutting a wafer;
secondly, welding and assembling; loading a lead into a welding boat by adopting a lead loading machine, wherein an upper welding boat and a lower welding boat need to be loaded for connecting leading-out ends of P, N ends of the grains, loading a lower welding sheet corresponding to the size of the grains into each hole of the welding boat of the existing lower lead by adopting a welding sheet rocking disc, and placing the welding sheet on the lead for connecting a N end of the grains with the lead by welding flux; placing the crystal grains on the lower soldering lug through a crystal grain sucker jig, adopting a soldering lug rocking disc on the lower soldering lug, filling the upper soldering lug corresponding to the crystal grains in each hole of the welding boat, placing the upper soldering lug on the crystal grains, and performing connection welding of the P end of the crystal grains and a lead; placing the welding boat filled with the crystal grains and the upper and lower welding sheets, covering the finished upper lead welding boat in another tray, covering a flat thin steel sheet on the upper lead welding boat, then reversing the upper lead welding boat by 180 degrees and placing the upper lead welding boat on the finished lower welding boat, and withdrawing the steel sheet, thus completing the tray combination of the upper and lower welding boats and completing the welding assembly of the shaft type diode;
thirdly, high-temperature welding;
fourthly, plastic package molding;
fifthly, lead-free electroplating; sixthly, testing the braid electrically;
seventhly, laser printing is carried out; placing the good electrical property test product in a laser printing mechanism, under which a plastic gear rotating at a constant speed is arranged, the space between the gears is the same as the space between the braids, the width of the gears is the same as the width of the shaft type diode body, when the shaft type diode material rotates to the topmost end of the gears along with the plastic gear, a laser printing mechanism above the plastic gear performs laser printing operation, a product below the laser printing mechanism presents an arc-shaped surface, setting laser focal length on the surface, then performing laser printing operation to complete the printing of the upper half part of the material, after the part of the operation is finished, the material is transferred to another laser printing mechanism with the same function, the braid material is turned over, the part which is not printed is upward, the laser printing operation is carried out again, the lower half part of the material can be printed, so that laser printing of the material is finished, and the upper half part and the lower half part of the material both have laser printing contents;
and eighthly, packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910402162.0A CN110085541B (en) | 2019-05-15 | 2019-05-15 | Manufacturing method of shaft type diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910402162.0A CN110085541B (en) | 2019-05-15 | 2019-05-15 | Manufacturing method of shaft type diode |
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| Publication Number | Publication Date |
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| CN110085541A CN110085541A (en) | 2019-08-02 |
| CN110085541B true CN110085541B (en) | 2021-11-02 |
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| CN201910402162.0A Active CN110085541B (en) | 2019-05-15 | 2019-05-15 | Manufacturing method of shaft type diode |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328517A (en) * | 2016-10-29 | 2017-01-11 | 揭阳市先捷电子有限公司 | Diode packaging process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6570600B2 (en) * | 2001-01-19 | 2003-05-27 | Impress Systems | Method and apparatus for direct cylinder printer |
| TWI228804B (en) * | 2003-07-02 | 2005-03-01 | Lite On Semiconductor Corp | Chip package substrate having flexible printed circuit board and method for fabricating the same |
| CN201438454U (en) * | 2009-08-05 | 2010-04-14 | 深圳市远望工业自动化设备有限公司 | Testing, sorting, marking and braiding integrative machine of semiconductor device |
| CN201623155U (en) * | 2010-01-20 | 2010-11-03 | 常州市武进昌达电子元件厂 | Veneer SMA diode |
| CN108010841B (en) * | 2017-12-01 | 2019-09-03 | 山东理工大学 | A kind of manufacturing method of diode and thus obtained diode |
| CN108155105B (en) * | 2017-12-28 | 2020-07-03 | 重庆平伟伏特集成电路封测应用产业研究院有限公司 | High-frequency high-voltage diode and manufacturing method thereof |
| CN108461459A (en) * | 2018-04-02 | 2018-08-28 | 日照鲁光电子科技有限公司 | A kind of cathode docking biphase rectification diode and its manufacturing process |
| CN208127189U (en) * | 2018-04-02 | 2018-11-20 | 日照鲁光电子科技有限公司 | A kind of cathode docking biphase rectification diode |
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- 2019-05-15 CN CN201910402162.0A patent/CN110085541B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328517A (en) * | 2016-10-29 | 2017-01-11 | 揭阳市先捷电子有限公司 | Diode packaging process |
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