CN110066514A - 一种导热膏及其制备方法 - Google Patents
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Abstract
一种导热膏及其制备方法。本发明公开了一种导热膏，由基体、偶联剂和导热粉体制备得到；采用高含量的偶联剂处理工艺，所制备的导热膏的耐老化性能有较大提高，100℃条件下露置500小时不变干，且对各种金属、树脂及塑料均无腐蚀作用。
Description
技术领域
本发明涉及一种导热膏及其制备方法，属于散热材料领域领域。
背景技术
随着电子产品的小型化及性能的不断提高，电子产品中功率电子元器件的发热量随之不断提高，如何有效地将产生的大量热量快速传导至产品外部，已成为电子产品设计的一个重要课题。为解决电子产品的发热问题，可安装散热装置对热源进行散热。由于现有制造水平的限制，在电子器件表面和散热器之间存在极细微的凹凸不平的空隙，如果将他们直接安装在一起，它们间的实际接触面积大约只有散热器底座面积的10％，其余均为空气间隙。由于空气是热的不良导体，将在电子元件与散热器间形成接触热阻，降低散热器的效能。
发明内容
有鉴于此，本发明旨在提高热传导效率，减小热阻抗，提供了一种低热阻、高导热系数的导热膏及其制备方法。
为了实现上述目的，本发明采用如下技术方案：
一种导热膏，其特征在于，由以下质量百分比的原料制备得到：基体：5％～10％，偶联剂：5％～10％，余量为导热粉体。
本发明导热粉体采用高含量的偶联剂处理工艺，导热膏的耐老化性能有较大提高，100℃条件下露置500小时不变干，且对各种金属、树脂及塑料均无腐蚀作用。
导热粉体为氧化铝、氧化锌、铝粉、氮化硅、氮化铝、氮化硼中的任一种或几种的混合物。
上述进一步的有益效果在于，能给导热膏提供导热通道，获得较好的导热性能。
基体为二甲基硅油、氨基硅油、苯基硅油中的任一种或几种的混合物。
上述进一步的有益效果在于，能给导热膏提供导热粉体的粘合性能，使电子元件与散热器间接触热阻变小，并使导热膏保持润湿状态。
偶联剂为硅烷偶联剂、硅烷交联剂、钛酸酯偶联剂、铝酸酯偶联剂中的至少一种，优选的，硅烷偶联剂为KH550。
上述进一步的有益效果在于，有利于导热粉体在基体中的均匀分散，同时与基体协同作用保持导热膏润湿状态。
本发明还提供了上述导热膏的制备方法，其特征在于，包括以下步骤：
1)按上述导热膏的质量百分比称取各原料；
2)将基体、偶联剂与导热粉体混合搅拌后研磨分散，即得上述的导热膏。
本发明导热膏的制备方法步骤简单，速度快，生产效率高，制作成本低，有利于本发明导热膏的大范围推广应用
进一步，搅拌的转速为100～200转/分，搅拌时间为0.5～1小时；研磨的操作为研磨至粒径为50μm～60μm。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
导热膏，由以下物质制备得到：85g氧化铝粉、5g二甲基硅油、10g硅烷偶联剂KH550；
将氧化铝与二甲基硅油、KH550加入捏合机中150转/分搅拌1小时至均匀后，再使用研磨机进行研磨至粒径为60μm后分散即得。
实施例2
导热膏，由以下物质制备得到：85g氧化锌、10g氨基硅油、5g硅烷偶联剂KH550；
将氧化锌与氨基硅油、KH550加入捏合机中100转/分搅拌0.5小时至均匀后，再使用研磨机进行研磨至粒径为50μm后分散即得。
实施例3
导热膏，由以下物质制备得到：85g铝粉、7g苯基硅油、8g硅烷偶联剂KH550；
将铝粉与苯基硅油、KH550加入捏合机中200转/分搅拌1小时至均匀后，再使用研磨机进行研磨至粒径为60μm后分散即得。
实施例4
导热膏，由以下物质制备得到：87g氮化硅，5g苯基硅油，5g二甲基硅油，7g硅烷偶联剂KH550；
将氮化硅、苯基硅油、二甲基硅油、KH550加入捏合机中170转/分搅拌0.8小时至均匀后，再使用研磨机进行研磨至粒径为55μm后分散即得。
实施例5
导热膏，由以下物质制备得到：60g氮化铝、27g氮化硼、6g苯基硅油、7g硅烷偶联剂KH550；
将氮化铝、氮化硼、苯基硅油、KH550加入捏合机中100转/分搅拌0.7小时至均匀后，再使用研磨机进行研磨至粒径为60μm后分散即得。
性能测试
1)导热性能测试：
按照标准为MIL-I-49456A中所述的测试方法，测试导热膏的导热性能，实验结果见表1，表明具有高的导热系数，适用于对散热要求较高的场合。
2)黏度测试
将实施例1～5制得的导热膏用旋转粘度计(RVDVII、Brookfield)在用07#转子10RPM的转速下测量粘度，结果如表1所示，表明粘度不大，有利于涂敷操作。
3)老化试验：
将制备实施例1～5制得的导热膏均匀涂抹在金属板面上，厚度控制为1mm，在100℃烘烤500小时后用旋转粘度计在用07#转子10RPM的转速下测量粘度，实验结果见表1。
表1实施例1～5导热膏性能测试结果
由上表1可知，本发明所制备的导热膏具有较高的导热系数、较低的年度和优良的耐老化性能。
Claims (8)
1.一种导热膏，其特征在于，由以下质量百分比的原料制备得到：基体：5％～10％，偶联剂：5％～10％，余量为导热粉体。
2.根据权利要求1所述的一种导热膏，其特征在于，所述导热粉体为氧化铝、氧化锌、铝粉、氮化硅、氮化铝、氮化硼中的任一种或几种的混合物。
3.根据权利要求1所述的一种导热膏，其特征在于，所述基体为二甲基硅油、氨基硅油、苯基硅油中的任一种或几种的混合物。
4.根据权利要求1所述的一种导热膏，其特征在于，所述偶联剂为硅烷偶联剂、硅烷交联剂、钛酸酯偶联剂、铝酸酯偶联剂中的至少一种。
5.根据权利要求4所述的一种导热膏，其特征在于，所述硅烷偶联剂为KH550。
6.一种导热膏的制备方法，其特征在于，包括以下步骤：
1)按权利要求1～5任一项所述导热膏的质量百分比称取各原料；
2)将基体、偶联剂与导热粉体混合搅拌后研磨分散，即得所述导热膏。
7.根据权利要求6所述的一种导热膏的制备方法，其特征在于，步骤2)中所述搅拌的转速为100～200转/分，搅拌时间为0.5～1小时。
8.根据权利要求6所述的一种导热膏的制备方法，其特征在于，步骤2)中所述研磨的操作为研磨至粒径为50μm～60μm。
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| CN113861455A (zh) * | 2021-10-18 | 2021-12-31 | 南京宁智高新材料研究院有限公司 | 一种采用分步投料制备导热膏的方法 |
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