CN110039190A - A kind of laser cutting control method, device and computer readable storage medium - Google Patents
A kind of laser cutting control method, device and computer readable storage medium Download PDFInfo
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- CN110039190A CN110039190A CN201910266907.5A CN201910266907A CN110039190A CN 110039190 A CN110039190 A CN 110039190A CN 201910266907 A CN201910266907 A CN 201910266907A CN 110039190 A CN110039190 A CN 110039190A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The embodiment of the invention discloses a kind of laser cutting control method, device and computer readable storage mediums, during cutting to workpiece, obtain the actual voltage value U that sensor is fed back based on the height of cutting head distance from bottom workpiece surfaceACT；Calculate UACTWith target voltage values USETBetween voltage difference UDIF；According to UDIFCutting head movement is controlled, the height to cutting head apart from workpiece surface is adjusted, until based on the U obtained in real timeACTDetermine UDIFIt is zero.Implementation through the invention, in laser cutting process, it only needs using the pressure difference of voltage corresponding to the Real-time Feedback voltage of sensor and object height as control amount, carry out the height to cutting head apart from workpiece surface and carries out servo antrol, algorithm complexity is lower, and do not need to depend on the homologous thread of voltage value and distance, it is influenced without being degenerated by calibration curve, control stability and safety are higher.
Description
Technical field
The present invention relates to field of laser processing more particularly to a kind of laser cutting control methods, device and computer-readable
Storage medium.
Background technique
Laser cutting is a kind of noncontact procession, be cut by laser head by laser focus to workpiece surface carry out heat plus
Work, in this course, laser cutting head are an important control amount at a distance from workpiece surface.For workpiece to be processed
For, surface usually will not be substantially flat, and during cutting, and workpiece is easy to produce deformation, leads to workpiece surface
Height rises and falls.And focused to guarantee that laser spot is maintained at workpiece surface, then it needs to allow laser cutting head entire processed
Cheng Zhongyu plate surface is kept for one specifically apart from constant, and therefore, it is necessary to according to laser cutting head and workpiece surface distance
Feedback to carry out servo antrol in Z axis to laser cutting head.
Currently, when Z axis carries out servo antrol, being usually associated with by capacitance sensor acquisition to laser cutting head
The voltage value of distance is then based on the corresponding relationship of voltage value and distance to determine current distance, so based on determined by away from
From being adjusted to the height of workpiece surface with a distance from laser cutting head.In the related art, usually using pid algorithm to away from
From error carry out dynamic compensation, however the parameter for needing to do complicated speed planning in algorithm realization and being related to compares
More, algorithm complexity is high；In addition, the control based on pid algorithm belongs to a kind of control of forecasting type, need strictly to rely on voltage value and
The homologous thread of distance determines current distance, however in practical applications, which can be because sensor be heated, blow
The generations such as gas, spray slag are degenerated, although the distance and voltage relationship after degenerating are still directly proportional, slope of a curve has changed
Become, is as shown in Figure 1 calibration curve schematic diagram under normal circumstances, the calibration curve schematic diagram being illustrated in figure 2 after degenerating, if
Calibration curve is degenerated, according to the calibration curve after degeneration as control reference, it will usually cause overshoot and laser cutting head
Situations such as colliding with workpiece surface, control stability and safety are lower.
Summary of the invention
The main purpose of the embodiment of the present invention is to provide a kind of laser cutting control method, device and computer-readable deposits
Storage media is at least able to solve and is cut in the related technology based on pid algorithm and voltage value and the homologous thread of distance to laser
When cutting height of the head apart from workpiece surface and carrying out servo antrol, caused algorithm complexity is higher, control stability and safety
The lower problem of property.
To achieve the above object, first aspect of the embodiment of the present invention provides a kind of laser cutting control method, this method
Include:
Treat cutting workpiece cut during, obtain capacitance sensor be based on laser cutting head distance from bottom institute
State the actual voltage value U that the height of workpiece surface to be cut is fed backACT；
Calculate the UACTWith target voltage values USETBetween voltage difference UDIF；The USETFor the laser cutting head bottom
When height of the portion apart from the workpiece surface to be cut is preset object height, corresponding voltage value；
According to the UDIFThe laser cutting head movement is controlled, to the laser cutting head apart from the workpiece to be cut
The height on surface is adjusted, until based on the U obtained in real timeACTDetermine the UDIFIt is zero.
To achieve the above object, second aspect of the embodiment of the present invention provides a kind of laser cutting control apparatus, the device
Include:
Obtain module, for treat cutting workpiece cut during, obtain capacitance sensor cut based on laser
Cut the actual voltage value U that the height of workpiece surface to be cut described in a distance from bottom is fed backACT；
Computing module, for calculating the UACTWith target voltage values USETBetween voltage difference UDIF；The USETFor institute
When the height for stating workpiece surface to be cut described in laser cutting head distance from bottom is preset object height, corresponding voltage
Value；
Control module, for according to the UDIFThe laser cutting head movement is controlled, to the laser cutting head apart from institute
The height for stating workpiece surface to be cut is adjusted, until based on the U obtained in real timeACTDetermine the UDIFIt is zero.
To achieve the above object, the third aspect of the embodiment of the present invention provides a kind of electronic device, which includes:
Processor, memory and communication bus；
The communication bus is for realizing the connection communication between the processor and memory；
The processor is above-mentioned any one to realize for executing one or more program stored in the memory
The step of kind laser cutting control method.
To achieve the above object, fourth aspect of the embodiment of the present invention provides a kind of computer readable storage medium, the meter
Calculation machine readable storage medium storing program for executing is stored with one or more program, and one or more of programs can be by one or more
It manages device to execute, the step of to realize any one of the above laser cutting control method.
Laser cutting control method, device and the computer readable storage medium provided according to embodiments of the present invention, right
During workpiece to be cut is cut, obtains capacitance sensor and be based on laser cutting head distance from bottom workpiece surface to be cut
The actual voltage value U that is fed back of heightACT；Calculate UACTWith the target voltage values U of settingSETBetween voltage difference UDIF；Root
According to UDIFLaser cutting head movement is controlled, the height to laser cutting head apart from workpiece surface to be cut is adjusted, until being based on
The U obtained in real timeACTDetermine UDIFIt is zero.Implementation through the invention, in laser cutting process, it is only necessary to by capacitance sensor
Real-time Feedback voltage and object height corresponding to voltage pressure difference as control amount, to laser cutting head apart from workpiece table
The height in face carries out servo antrol, and algorithm complexity is lower, and does not need the homologous thread dependent on voltage value and distance, and
The influence of calibration curve degeneration is not will receive, control stability and safety are higher.
Other features of the invention and corresponding effect are described in the aft section of specification, and should be appreciated that
At least partly effect is apparent from from the record in description of the invention.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those skilled in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the calibration curve schematic diagram of voltage value and distance under normal circumstances in the related technology；
Fig. 2 is the calibration curve schematic diagram of voltage value and distance after curve degeneration in the related technology
Fig. 3 is the basic procedure schematic diagram for the laser cutting control method that first embodiment of the invention provides；
Fig. 4 is the laser cutting schematic diagram that first embodiment of the invention provides；
Fig. 5, which is that the Z axis position curve for the laser cutting head that first embodiment of the invention provides is corresponding with rate curve, to close
It is schematic diagram；
Fig. 6 is the structural schematic diagram for the laser cutting control apparatus that second embodiment of the invention provides；
Fig. 7 is the structural schematic diagram for the electronic device that third embodiment of the invention provides.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, and not all embodiments.Based on the embodiments of the present invention, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
First embodiment:
In order to solve in the related technology based on pid algorithm and voltage value and the homologous thread of distance come to laser cutting head
When height apart from workpiece surface carries out servo antrol, caused algorithm complexity is higher, control stability and safety compared with
Low technical problem, the present embodiment propose a kind of laser cutting control method, are illustrated in figure 3 laser provided in this embodiment
The basic procedure schematic diagram of cut-sytle pollination method, the laser cutting control method that the present embodiment proposes include the following steps:
Step 301, treat cutting workpiece cut during, obtain capacitance sensor be based on laser cutting head bottom
The actual voltage value U that height of the portion apart from workpiece surface to be cut is fed backACT。
It is illustrated in figure 4 laser cutting schematic diagram provided in this embodiment, the focal spot height in the present embodiment is that laser is burnt
Point workpiece surface to be cut between vertical range, setting height be keep the focal spot height when laser cutting head bottom with to
The vertical range between workpiece surface is cut, which is the object height for meeting laser cutting parameter demand.In this reality
It applies in a kind of embodiment of example, realizing for capacitance sensor can be for using laser cutting head bottom specific region as capacitor
Anode, cathode of the workpiece to be cut as capacitor, so that composition one is used to measure the capacitance sensor of distance, in practical application
In, the measurement range of the capacitance sensor can be 0-20mm, and the voltage value for feeding back control system then corresponds to 0-10V,
Wherein, distance is positively correlated with voltage value.In addition, it is to be understood that the actual voltage value in the present embodiment is capacitance sensing
The real-time collected voltage value of device institute, the real-time height corresponding to present laser cutting head distance from bottom workpiece surface to be cut.
Optionally, height institute of the capacitance sensor based on laser cutting head distance from bottom workpiece surface to be cut is being obtained instead
The actual voltage value U of feedbackACTBefore, further includes: when laser cutting is opened and aligned to laser cutting head, contraposition is adjusted
Journey sequential program(me) is had suffered to accelerate adjusting stage, at the uniform velocity adjusting stage and slowing down the adjusting stage, and determines the at the uniform velocity adjusting stage
Starting point P2 and terminating point P4；Accelerating the adjusting stage, the height of laser cutting head distance from bottom workpiece surface to be cut is big
In the range ability of capacitance sensor；Control laser cutting head carries out acceleration tune between the starting point P1 and P2 of contraposition adjustment
It is whole, and control laser cutting head and at the uniform velocity adjusted between P2 and P4, it then controls laser cutting head and is subtracted since P4
Velocity modulation is whole, until based on the U obtained in real timeACTDetermine UDIFIt is zero, reaches the terminating point P5 for adjusting stage of slowing down, terminate contraposition
Adjustment, so that laser cutting head reaches object height.
Specifically, in the present embodiment before starting to treat cutting workpiece and being cut by laser, it is necessary first to be cut to laser
The position for cutting head is initialized, and is also aligned laser cutting head to the height for meeting process requirements, is then just started subsequent
Laser cutting.The efficiency and accuracy for guaranteeing laser cutting head contraposition in the present embodiment, align laser cutting head and adjust
Movement velocity during whole planned, be illustrated in figure 5 the Z axis position curve of laser cutting head provided in this embodiment with
The entire contraposition adjusting stage of laser cutting head is divided into adding for P1-P2 by the correspondence diagram of rate curve, the present embodiment
Velocity modulation has suffered journey, the at the uniform velocity adjustment process of P2-P4 and the at the uniform velocity adjustment process of P4-P5, respectively corresponds speed VzOr pressure difference
UDIFP1 '-P2 ', P2 '-P4 ', the P4 '-P5 ' three phases of curve, servo-actuated starting altitude in diagram namely to laser cutting
Before head carries out contraposition adjustment, the height of the distance from bottom of laser cutting head workpiece to be cut, servo-actuated starting altitude subtracts contraposition and adjusts
The height that laser cutting head is moved during whole, as preset object height (setting height).It should be noted that
Based on laser cutting head, maximum speed to be achieved is determined during the adjustment for the position of P2 point in the present embodiment.
Optionally, it determines that the P4 of at the uniform velocity adjusting stage is comprised determining that and slows down deceleration distance corresponding to the adjusting stage most
Small value (DDCC)min；To (DDCC) min carries out obtaining target deceleration distance D after allowance reservation processDCC, allowance reservation process public affairs
Formula can indicate are as follows: DDCC=(DDCC) min/ α, α is greater than 0 and less than 1；Based on DDCCDetermine the P4 of at the uniform velocity adjusting stage.
Specifically, the position of the P4 point in the present embodiment determines the effect for determining the decelerating phase, if this position phase
Excessively high will appear pre-decelerating the case where fixed for setting height, it will affect regulated efficiency.If what is be arranged is too low, can make
Speed does not reduce to 0m/min yet when reaching object height, to cause to overshoot.As for the accurate location of P4 point, can will slow down away from
From DDCC(the distance between P5 point to P4 point) is used as a parameter, is arranged by commissioning staff.DDCCThe size of value can add with Z axis
The factors such as speed, Z axis lagged value, the interpolation cycle of digital control system and capacitance sensor sensitivity are related, can pass through test
Method, be first arranged it is big a bit, reduced as long as appropriate not the case where overshoot as long as, up to a determining minimum value (DDCC)
Min, then to (DDCC) min progress allowance reservation process, namely in (DDCC) suitably weighted on the basis of min and obtain most
Whole DDCC, in practical applications, the value of α can be 0.8, namely with DDCC=(DDCC) min/0.8 be deceleration distance, stop
20% allowance guarantees stability.
Optionally, control laser cutting head carries out accelerating adjustment between the starting point P1 and P2 of contraposition adjustment including: base
In the movement velocity D for being associated with laser cutting headIPOThe continuous derivatived functions with monotonic increase section, control laser cutting
Head carries out acceleration adjustment between the starting point P1 and P2 of contraposition adjustment；DIPOAccording to UDIFAnd preset Dynamic gene K multiplies
Product determines；K is UDIFWhen equal to 1V, distance that laser cutting head is moved in an interpolation cycle.
Boost phase P1-P2 refers to the range ability for being greater than capacitance sensor with a distance from plate surface when nozzle bottom surface
When maximum (if the range of capacitance sensor is 0-20mm), that is, the feedback voltage of capacitance sensor always remains as most
Big value, accepts afore-mentioned distance, also as 10V.The laser cutting head starting altitude for adjusting unlatching at this time is higher, if with practical anti-
The voltage max of feedback subtracts the corresponding voltage value U of actual set heightSETAs UDIF, will certainly reduce and regulate the speed, therefore
U is assumed at this stageSETIt is 0, U at this timeDIFFor maximum value 10V.Then adjust the downthrow of Z axis in first interpolation cycle of unlatching
From for DIPO=KUDIF=10K, it is assumed that the interpolation of CNC (Computerized Numerical Control, computer numerical control)
Period is 2ms, and the value of K takes 100, then the distance namely speed of the time for being equivalent to 2ms mobile 1mm can be suddenly from 0m/min
It is increased to 30m/min, Z axis is made instantaneously to generate excess acceleration, so that servo-drive be caused overload-alarm or Z axis shake occur
It is dynamic.Based on this, D is associated with using one in boost phase in the present embodimentIPOThe continuous derivatived functions with monotonic increase section
To control laser cutting head in the acceleration continuously smooth transition for accelerating the adjusting stage.
As an embodiment of the present embodiment, accelerates the adjusting stage in such a way that sine accelerates to carry out, then close
It is coupled to the movement velocity D of laser cutting headIPOContinuous derivatived functions with monotonic increase section indicate are as follows:
Wherein, n be accelerate the adjusting stage interpolation cycle total number of cycles, namely accelerate periodicity, can be according to lathe
Performance setting, under normal conditions value be 5；Which period of accelerator when i is period serial number namely current period.
Therefore, in the n-th period, namely as i=n, DIPO=KUDIF=10K, speed increase to maximum, accelerate adjustment
Terminate.
Optionally, it includes: to be based on being associated with D that control laser cutting head carries out deceleration adjustment since P4IPOHave dullness
Successively decrease the continuous derivatived functions in section, and control laser cutting head carries out deceleration adjustment since P4.
Specifically, into after the braking section of P4-P5, it is ensured that the smooth transition regulated the speed, i.e., guarantee pressure difference is smooth
Variation.Maximum value is thought in the pressure difference of the beginning in P4-P5 stage, i.e. P4 point, continues to accept afore-mentioned distance namely UDIF=10V,
And then the D that regulates the speedIPO=KUDIF=10K, in order to achieve the purpose that smooth transition, the present embodiment is associated with D using oneIPO's
Continuous derivatived functions with monotone decreasing section come control laser cutting head slow down the adjusting stage acceleration continuously smooth
Transition.It should be understood that at the end of accelerating the adjusting stage, U at this timeACTWith USETIt is equal.
As an embodiment of the present embodiment, the adjusting stage of slowing down carries out in such a way that sine slows down, then closes
It is coupled to DIPOContinuous derivatived functions with monotone decreasing section indicate are as follows:
Wherein, m be slow down the adjusting stage interpolation cycle total number of cycles, namely the sinusoidal lasting periodicity that slows down can
It is arranged according to the performance of lathe, under normal conditions m=5；J is period serial number, indicates that current period is the of sinusoidal moderating process
Several periods.
Therefore, in the m period, namely as j=m, UACTWith USETEqual, regulating the speed is 0, and laser cutting head is adjusted to
Position can start to execute the process that cutting workpiece is cut by laser for the treatment of.
Specifically, it includes: to control laser cutting head from P2 that control laser cutting head carries out at the uniform velocity adjustment between P2 and P4
It at the uniform velocity adjusts to the sensor between P2 and P4 and perceives point P3；P3 is that laser cutting head moves to the capacitance sensor amount of initially entering
The point of journey range；The dynamic adjustment U since P3SET, so that UDIFThe constant maximum feedback voltage value for capacitance sensor, and control
Laser cutting head is at the uniform velocity adjusted from P3 continuation to P4.
Please continue to refer to Fig. 5, it should be noted that in the at the uniform velocity adjusting stage, laser cutting head at the uniform velocity falls along Z axis
In the process, maximum speed is kept, until the perception starting point of capacitance sensor can be passed through first before reaching deceleration point P4, it should
Region after point is then the Perception Area of capacitance sensor, and capacitance sensor, which enters, at this time starts feedback voltage level in range ability
Variation.As can be seen from Figure 5, into after the region, with the decline of laser cutting head, nozzle bottom with a distance from plate increasingly
Closely, the feedback voltage U of capacitance sensorACTAlso can be smaller and smaller, as constant (the i.e. U of setting heightSETIt is constant), pressure difference UDIF=
UACT-USETAlso become smaller therewith.If be not processed, falling speed can start to reduce in P3 point, pre-decelerating is equivalent to, thus shadow
Ring regulated efficiency.It, can be in the target voltage of P3-P4 stage dynamic adjustment setting in order not to the problem occur in the present embodiment
Value USET, so that voltage difference UDIFThe constant maximum feedback voltage value for the capacitance sensor, so that laser is cut
Head is cut to continue to keep the speed in P2-P3 stage along Z axis uniform descent in the P3-P4 stage.
Step 302 calculates UACTWith target voltage values USETBetween voltage difference UDIF；USETFor laser cutting head bottom away from
When height from workpiece surface to be cut is preset object height, corresponding voltage value.
Specifically, with the corresponding target electricity of the Real-time Feedback voltage of capacitance sensor and object height place in the present embodiment
Pressure difference (U between pressureDIF=UACT-USET) it is used as practical control amount, and do not need Real-time Feedback voltage mapping to laser and cut
It cuts the height between distance from bottom workpiece surface to be cut and then carries out laser cutting control, even if being moved back in curve
In the case of change, it will not cause to overshoot, hit plate.
Step 303, according to UDIFControl laser cutting head movement, the height to laser cutting head apart from workpiece surface to be cut
Degree is adjusted, until based on the U obtained in real timeACTDetermine UDIFIt is zero.
Specifically, the present embodiment carries out servo antrol after getting pressure difference, to laser cutting head, and in control laser
During cutting head moves, continue acquisition actual voltage value in real time, and is 0 in actual voltage value and the pressure difference of target voltage values
When, laser cutting head is adjusted in place.This method can be during plate cutting, and real-time control laser cutting head distance from bottom waits for
The height of cutting workpiece surface is kept constant, and laser spot height will not be caused to become because workpiece surface to be cut is rough and uneven in surface
Change, width of slit variation, workpiece bottom finally caused to cut bad problem with slag etc., moreover it is possible to prevent capacitance sensor distance and
Voltage homologous thread causes situations such as overshooting, hitting plate when degenerating.
Optionally, according to UDIFControlling laser cutting head movement includes: according to UDIFDetermine the direction of motion of laser cutting head,
And according to UDIFAnd the product of preset Dynamic gene K determines the movement velocity D of laser cutting headIPO；K is UDIFWhen equal to 1V,
The distance that laser cutting head is moved in an interpolation cycle；Laser cutting head is controlled according to the direction of motion and DIPOMovement.
Specifically, calculating the corresponding voltage value U of setting height in real timeSETThe actual height acquired in real time with capacitance sensor
Corresponding voltage value UACTDifference UDIF, with the difference multiplied by regulatory factor K (the pressure difference U setDIFOne interpolation when for 1V
The distance of period movement), it is exactly adjustable range D of the interpolation cycle internal cutting head along Z axisIPO(sign represents direction,
Unit is micron), it indicates are as follows: DIPO=KUDIF.It can be seen that in K value according to the formula (by mechanical and servo motor itself
Performance it is related, the too small adjustment speed that will lead to is excessively slow, will lead to very much overshoot or vibration greatly, it is necessary to pass through calculating and setting one
Suitable value, sets in cutting process that no longer dynamic is set in lathe parameter) it is certain in the case where, pressure difference UDIFSize determine
It sets the tone the speed of section, it is possible to which the method control by controlling pressure difference is regulated the speed.
The laser cutting control method provided according to embodiments of the present invention is treating the process cutting workpiece and being cut
In, obtain the actual voltage value that capacitance sensor is fed back based on the height of laser cutting head distance from bottom workpiece surface to be cut
UACT；Calculate UACTWith the target voltage values U of settingSETBetween voltage difference UDIF；According to UDIFLaser cutting head movement is controlled,
Height to laser cutting head apart from workpiece to be cut is adjusted, until based on the U obtained in real timeACTDetermine UDIFIt is zero.
Implementation through the invention, in laser cutting process, it is only necessary to by the Real-time Feedback voltage of capacitance sensor and object height institute
For the pressure difference of corresponding voltage as control amount, the height to laser cutting head apart from workpiece surface carries out servo antrol, algorithm
Complexity is lower, and does not need the homologous thread dependent on voltage value and distance, is influenced without being degenerated by calibration curve, controls
Stability processed and safety are higher.
Second embodiment:
In order to solve in the related technology based on pid algorithm and voltage value and the homologous thread of distance come to laser cutting head
When height apart from workpiece surface carries out servo antrol, caused algorithm complexity is higher, control stability and safety compared with
Low technical problem, present embodiment illustrates a kind of laser cutting control apparatus, specifically refer to Fig. 6, the laser of the present embodiment
Cutting control device includes:
Obtain module 601, for treat cutting workpiece cut during, obtain capacitance sensor be based on laser
The actual voltage value U that the height of cutting head distance from bottom workpiece surface to be cut is fed backACT；
Computing module 602, for calculating UACTWith target voltage values USETBetween voltage difference UDIF；USETFor laser cutting
When the height of head distance from bottom workpiece surface to be cut is preset object height, corresponding voltage value；
Control module 603, for according to UDIFLaser cutting head movement is controlled, to laser cutting head apart from workpiece to be cut
The height on surface is adjusted, until based on the U obtained in real timeACTDetermine UDIFIt is zero.
Specifically, vertical range of the focal spot height between laser spot and workpiece surface to be cut in the present embodiment,
Setting height is vertical range when keeping the focal spot height between laser cutting head bottom and workpiece surface to be cut, the setting
Height is the object height for meeting laser cutting parameter demand.With the Real-time Feedback voltage and mesh of capacitance sensor in the present embodiment
Pressure difference (U between the corresponding target voltage in absolute altitude degree placeDIF=UACT-USET) be used as practical control amount, get pressure difference it
Afterwards, servo antrol is carried out to laser cutting head, and during controlling laser cutting head movement, continues the practical electricity of acquisition in real time
Pressure value, and when actual voltage value and the pressure difference of target voltage values are 0, laser cutting head is adjusted in place.This method does not need
Real-time Feedback voltage is mapped to the height and then progress laser between laser cutting head distance from bottom workpiece surface to be cut
Cut-sytle pollination will not cause laser spot height change because workpiece surface to be cut is rough and uneven in surface, finally cause joint-cutting wide
Degree variation, workpiece bottom cut bad problem with slag etc., moreover it is possible to prevent capacitance sensor distance and voltage homologous thread occurs
Situations such as overshooting, hitting plate is caused when degeneration.
In some embodiments of the present embodiment, the laser cutting control apparatus further include: contraposition module is obtaining electricity
Hold the actual voltage value U that sensor is fed back based on the height of laser cutting head distance from bottom workpiece surface to be cutACTBefore,
Contraposition module is for when laser cutting opens and aligns laser cutting head, contraposition adjustment procedural order being planned to add
Fast adjusting stage, at the uniform velocity adjusting stage and deceleration adjusting stage, and determine the starting point P2 and terminating point of at the uniform velocity adjusting stage
P4；Accelerating the adjusting stage, the height of laser cutting head distance from bottom workpiece surface to be cut is greater than the range of capacitance sensor
Range；Control laser cutting head carries out acceleration adjustment between the starting point P1 and P2 of contraposition adjustment, and controls laser cutting head
It is at the uniform velocity adjusted between P2 and P4, then controls laser cutting head and carry out deceleration adjustment since P4, until real based on institute
When the U that obtainsACTDetermine UDIFIt is zero, reaches the terminating point P5 for adjusting stage of slowing down, terminates contraposition adjustment, so that laser cutting head
Reach object height.
Further, in some embodiments of the present embodiment, control laser cutting head is being executed in contraposition adjustment
When carrying out accelerating adjustment between starting point P1 and P2, contraposition module is specifically used for: based on the movement speed for being associated with laser cutting head
Spend DIPOThe continuous derivatived functions with monotonic increase section, control laser cutting head contraposition adjustment starting point P1 and P2
Between carry out acceleration adjustment；DIPOAccording to UDIFAnd the product of preset Dynamic gene K determines；K is UDIFWhen equal to 1V, laser
The distance that cutting head is moved in an interpolation cycle；And/or control laser cutting head carries out deceleration adjustment package since P4
It includes: based on being associated with DIPOThe continuous derivatived functions with monotone decreasing section, control laser cutting head subtracted since P4
Velocity modulation is whole.
Further, in some embodiments of the present embodiment, it is associated with the movement velocity D of laser cutting headIPOTool
Having the continuous derivatived functions in monotonic increase section indicates are as follows:
Wherein, n is the total number of cycles for accelerating the interpolation cycle of adjusting stage, and i is period serial number；
It is associated with DIPOContinuous derivatived functions with monotone decreasing section indicate are as follows:
Wherein, m is the total number of cycles of the interpolation cycle of deceleration adjusting stage, and j is period serial number.
Further, in some embodiments of the present embodiment, control laser cutting head is being executed between P2 and P4
When at the uniform velocity being adjusted, contraposition module is specifically used for control laser cutting head and is at the uniform velocity adjusted from P2 to the sensor between P2 and P4
Perceive point P3；P3 is that laser cutting head moves to the point that capacitance sensor initially enters range ability；Dynamic adjusts since P3
USET, so that UDIFThe constant maximum feedback voltage value for capacitance sensor, and control laser cutting head and at the uniform velocity adjusted from P3 continuation
To P4.
Further, in some embodiments of the present embodiment, when executing the determining at the uniform velocity P4 of adjusting stage, contraposition
Module is specifically used for determining the minimum value (D for the deceleration distance corresponding to the adjusting stage that slows downDCC)min；To (DDCC) min carry out it is abundant
Target deceleration distance D is obtained after amount reservation processDCC, allowance reservation process formula can indicate are as follows: DDCC=(DDCC) min/ α,
α is greater than 0 and less than 1；Based on DDCCDetermine the P4 of at the uniform velocity adjusting stage.
In some embodiments of the present embodiment, executing according to UDIFWhen controlling laser cutting head movement, control module
603 are specifically used for according to UDIFDetermine the direction of motion of laser cutting head, and according to UDIFAnd the product of preset Dynamic gene K
Determine the movement velocity D of laser cutting headIPO；K is UDIFWhen equal to 1V, laser cutting head an interpolation cycle moved away from
From；Laser cutting head is controlled according to the direction of motion and DIPOMovement.
It should be noted that the laser cutting control method in previous embodiment can be based on laser provided in this embodiment
Cutting control device realizes that those of ordinary skill in the art can be clearly understood that, for convenience and simplicity of description, this
The specific work process of laser cutting control apparatus described in embodiment, can be with reference to the correspondence in preceding method embodiment
Process, details are not described herein.
Using laser cutting control apparatus provided in this embodiment, during treating cutting workpiece and being cut, obtain
The actual voltage value U for taking capacitance sensor to be fed back based on the height of laser cutting head distance from bottom workpiece surface to be cutACT；
Calculate UACTWith the target voltage values U of settingSETBetween voltage difference UDIF；According to UDIFLaser cutting head movement is controlled, to sharp
Height of the light cutting head apart from workpiece surface to be cut is adjusted, until based on the U obtained in real timeACTDetermine UDIFIt is zero.
Implementation through the invention, in laser cutting process, it is only necessary to by the Real-time Feedback voltage of capacitance sensor and object height institute
For the pressure difference of corresponding voltage as control amount, the height to laser cutting head apart from workpiece surface carries out servo antrol, algorithm
Complexity is lower, and does not need the homologous thread dependent on voltage value and distance, is influenced without being degenerated by calibration curve, controls
Stability processed and safety are higher.
3rd embodiment:
A kind of electronic device is present embodiments provided, it is shown in Figure 7 comprising processor 701, memory 702 and logical
Believe bus 703, in which: communication bus 703 is for realizing the connection communication between processor 701 and memory 702；Processor
701 for executing one or more computer program stored in memory 702, to realize the laser in above-described embodiment one
At least one step in cut-sytle pollination method.
The present embodiment additionally provides a kind of computer readable storage medium, which, which is included in, is used for
Store any method or skill of information (such as computer readable instructions, data structure, computer program module or other data)
The volatibility implemented in art or non-volatile, removable or non-removable medium.Computer readable storage medium includes but not
It is limited to RAM (Random Access Memory, random access memory), ROM (Read-Only Memory, read-only storage
Device), EEPROM (Electrically Erasable Programmable read only memory, band electric erazable programmable
Read-only memory), flash memory or other memory technologies, (Compact Disc Read-Only Memory, CD is only by CD-ROM
Read memory), digital versatile disc (DVD) or other optical disc storages, magnetic holder, tape, disk storage or other magnetic memory apparatus,
Or any other medium that can be used for storing desired information and can be accessed by a computer.
Computer readable storage medium in the present embodiment can be used for storing one or more computer program, storage
One or more computer program can be executed by processor, with realize the method in above-described embodiment one at least one step
Suddenly.
The present embodiment additionally provides a kind of computer program, which can be distributed in computer-readable medium
On, by can computing device execute, to realize at least one step of the method in above-described embodiment one；And in certain situations
Under, at least one shown or described step can be executed using the described sequence of above-described embodiment is different from.
The present embodiment additionally provides a kind of computer program product, including computer readable device, the computer-readable dress
It sets and is stored with computer program as shown above.The computer readable device may include calculating as shown above in the present embodiment
Machine readable storage medium storing program for executing.
As it can be seen that those skilled in the art should be understood that whole or certain steps in method disclosed hereinabove, be
Functional module/unit in system, device may be implemented as the software (computer program code that can be can be performed with computing device
To realize), firmware, hardware and its combination appropriate.In hardware embodiment, the functional module that refers in the above description/
Division between unit not necessarily corresponds to the division of physical assemblies；For example, a physical assemblies can have multiple functions, or
One function of person or step can be executed by several physical assemblies cooperations.Certain physical assemblies or all physical assemblies can be by realities
It applies as by processor, such as the software that central processing unit, digital signal processor or microprocessor execute, or is implemented as hard
Part, or it is implemented as integrated circuit, such as specific integrated circuit.
In addition, known to a person of ordinary skill in the art be, communication media generally comprises computer-readable instruction, data knot
Other data in the modulated data signal of structure, computer program module or such as carrier wave or other transmission mechanisms etc, and
It and may include any information delivery media.So the present invention is not limited to any specific hardware and softwares to combine.
The above content is combining specific embodiment to be further described to made by the embodiment of the present invention, cannot recognize
Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention
Protection scope.
Claims (10)
1. a kind of laser cutting control method characterized by comprising
Treat cutting workpiece cut during, obtain capacitance sensor be based on laser cutting head distance from bottom described in
The actual voltage value U that the height of cutting workpiece surface is fed backACT；
Calculate the UACTWith target voltage values USETBetween voltage difference UDIF；The USETFor the laser cutting head bottom away from
When height from the workpiece surface to be cut is preset object height, corresponding voltage value；
According to the UDIFThe laser cutting head movement is controlled, to the laser cutting head apart from the workpiece surface to be cut
Height be adjusted, until based on the U obtained in real timeACTDetermine the UDIFIt is zero.
2. laser cutting control method as described in claim 1, which is characterized in that described according to the UDIFIt controls described sharp
Light cutting head moves
According to the UDIFDetermine the direction of motion of the laser cutting head, and according to the UDIFAnd preset Dynamic gene K
Product determine the movement velocity D of the laser cutting headIPO；The K is the UDIFWhen equal to 1V, the laser cutting head exists
The distance that one interpolation cycle is moved；
The laser cutting head is controlled according to the direction of motion and the DIPOMovement.
3. laser cutting control method as described in claim 1, which is characterized in that cut obtaining capacitance sensor based on laser
Cut the actual voltage value U that the height of workpiece surface to be cut described in a distance from bottom is fed backACTBefore, further includes:
When laser cutting opens and aligns the laser cutting head, contraposition adjustment procedural order is planned to accelerate to adjust
Whole stage, at the uniform velocity adjusting stage and deceleration adjusting stage, and determine the starting point P2 and terminating point of the at the uniform velocity adjusting stage
P4；In the acceleration adjusting stage, the height of workpiece surface to be cut described in the laser cutting head distance from bottom is greater than described
The range ability of capacitance sensor；
It controls the laser cutting head and carries out acceleration adjustment between the starting point P1 and the P2 of contraposition adjustment, and described in control
Laser cutting head is at the uniform velocity adjusted between the P2 and P4, is then controlled the laser cutting head and is carried out since the P4
Slow down and adjust, until based on the U obtained in real timeACTDetermine the UDIFIt is zero, reaches the end of the adjusting stage of slowing down
Stop P5 terminates contraposition adjustment, so that the laser cutting head reaches the object height.
4. laser cutting control method as claimed in claim 3, which is characterized in that the control laser cutting head is right
It carries out accelerating to adjust between the starting point P1 and the P2 of position adjustment and includes:
Based on the movement velocity D for being associated with the laser cutting headIPOThe continuous derivatived functions with monotonic increase section, control
It makes the laser cutting head and carries out acceleration adjustment between the starting point P1 and the P2 of contraposition adjustment；The DIPOAccording to described
UDIFAnd the product of preset Dynamic gene K determines；The K is the UDIFWhen equal to 1V, the laser cutting head is at one
The distance that interpolation cycle is moved；
And/or the control laser cutting head carries out slowing down adjusting since the P4 and includes:
Based on being associated with the DIPOThe continuous derivatived functions with monotone decreasing section, control the laser cutting head from institute
P4 is stated to start to carry out deceleration adjustment.
5. laser cutting control method as claimed in claim 4, which is characterized in that described to be associated with the laser cutting head
Movement velocity DIPOContinuous derivatived functions with monotonic increase section indicate are as follows:
Wherein, the n is the total number of cycles of the interpolation cycle for accelerating the adjusting stage, and the i is period serial number；
It is described to be associated with the DIPOContinuous derivatived functions with monotone decreasing section indicate are as follows:
Wherein, the m is the total number of cycles of the interpolation cycle of the adjusting stage of slowing down, and the j is period serial number.
6. laser cutting control method as claimed in claim 3, which is characterized in that the control laser cutting head is in institute
It states to carry out at the uniform velocity adjusting between P2 and P4 and includes:
The laser cutting head is controlled at the uniform velocity to adjust from the P2 to the sensor perception point P3 between the P2 and P4；The P3
The point that the capacitance sensor initially enters the range ability is moved to for the laser cutting head；
Dynamic adjusts the U since the P3SET, so that the UDIFThe constant maximum feedback voltage for the capacitance sensor
Value, and control the laser cutting head and at the uniform velocity adjust from P3 continuation to the P4.
7. laser cutting control method as claimed in claim 3, which is characterized in that at the uniform velocity adjusting stage described in the determination
P4 includes:
Determine the minimum value (D of deceleration distance corresponding to the deceleration adjusting stageDCC)min；
To (the DDCC) min carries out obtaining target deceleration distance D after allowance reservation processDCC, the allowance reservation process public affairs
Formula indicates are as follows: DDCC=(DDCC) min/ α, the α is greater than 0 and less than 1；
Based on the DDCCDetermine the P4 of the at the uniform velocity adjusting stage.
8. a kind of laser cutting control apparatus characterized by comprising
Obtain module, for treat cutting workpiece cut during, obtain capacitance sensor be based on laser cutting head
The actual voltage value U that the height of workpiece surface to be cut described in distance from bottom is fed backACT；
Computing module, for calculating the UACTWith target voltage values USETBetween voltage difference UDIF；The USETSwash to be described
When the height of workpiece surface to be cut described in light cutting head distance from bottom is preset object height, corresponding voltage value；
Control module, for according to the UDIFControl laser cutting head movement, it is described to the laser cutting head distance to
The height of cutting workpiece surface is adjusted, until based on the U obtained in real timeACTDetermine the UDIFIt is zero.
9. a kind of electronic device characterized by comprising processor, memory and communication bus；
The communication bus is for realizing the connection communication between the processor and memory；
The processor is for executing one or more program stored in the memory, to realize such as claim 1 to 7
Any one of described in laser cutting control method the step of.
10. a kind of computer readable storage medium, which is characterized in that the computer-readable recording medium storage have one or
Multiple programs, one or more of programs can be executed by one or more processor, to realize such as claim 1 to 7
Any one of described in laser cutting control method the step of.
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