CN114535827A - Laser head motion control method, motion control system, and laser processing machine - Google Patents
Laser head motion control method, motion control system, and laser processing machine Download PDFInfo
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- CN114535827A CN114535827A CN202210143072.6A CN202210143072A CN114535827A CN 114535827 A CN114535827 A CN 114535827A CN 202210143072 A CN202210143072 A CN 202210143072A CN 114535827 A CN114535827 A CN 114535827A
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- 238000003754 machining Methods 0.000 claims abstract description 12
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- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 description 8
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- 238000004364 calculation method Methods 0.000 description 3
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- 238000003698 laser cutting Methods 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention relates to a motion control method and a motion control system of a laser head and a laser processing machine, wherein the motion control method comprises the following steps: the controller acquires a target following height of a machined workpiece, a machining path and an actual vertical distance between the laser head and the machined workpiece; determining the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path; the controller controls the laser head to perform vertical movement, horizontal movement and rotational movement based on the movement control amount. The same controller realizes the combined control of vertical motion, horizontal motion and rotary motion, and improves the control efficiency and accuracy.
Description
Technical Field
The present application relates generally to the field of electrical control. More particularly, the present application relates to a motion control method of a laser head, a motion control system, and a laser processing machine.
Background
When the laser is applied to laser cutting, the maximum power at a cut part needs to be ensured so as to ensure the cutting quality, and the cut plate/pipe cannot be horizontal generally, so that the situations of cambered surface, deformation and the like exist. Therefore, the position of the laser focus needs to be ensured in real time in the cutting process, namely, the distance between the cutting head and the plate is kept constant. In a conventional cutting head height adjustment method, an independent height adjuster controls an upper shaft and a lower shaft to ensure the height of the cutting head, and the other shafts are controlled by a motion control card or a numerical control system to control a cutting path.
In the method, two systems are separated to control different axes of the same machine tool, so that the problem of conflict of control rights exists; an operator needs to control the two control interfaces simultaneously to operate, and the operation is complicated and inconvenient; due to system separation, the expansibility and the universality are limited, data cannot be exchanged with a cutting system in real time, and the application of some advanced functions is limited; the traditional height adjuster cannot be used as an interpolation axis, and cannot use a fixed height mode, so that the traditional height adjuster cannot be applied to precise workpieces; in addition, in the process of cutting the pipe, the vertical change is large, and the traditional method is easy to cause the problem of frequent plate collision due to untimely following; the conventional pulse servo is used, the wiring is complicated, and the AD transmission speed signal is generally used for servo execution and is easy to interfere.
Disclosure of Invention
The application provides a motion control method and a motion control system of a laser head and a laser processing machine, which aim to solve the problems that the vertical control and the horizontal control of the conventional laser head are mutually separated and cannot be jointly planned and controlled.
In order to solve the above technical problem, the present invention provides a method for controlling the movement of a laser head, comprising: the controller acquires a target following height of the processed workpiece, a processing path and an actual vertical distance between the laser head and the processed workpiece; the controller determines the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path; the controller controls the laser heads to perform vertical movement, horizontal movement and rotary movement based on the movement control amount.
In one embodiment, the controller determines a motion control amount of the laser head according to the actual vertical distance, the target following height, and the processing path, including: performing speed planning based on the machining path to determine the current speed of the laser head, and calculating the following deviation of the actual vertical distance and the target following height; if the following deviation is smaller than or equal to a threshold value, determining the motion control quantity according to the following deviation and the current speed of the laser head; and if the following deviation is larger than a threshold value, performing speed planning according to the following deviation to determine the motion control quantity.
In one embodiment, the controller obtains an actual vertical distance of the laser head from a workpiece to be processed, including: the controller acquires an actual capacitance signal between the laser head and the processing workpiece through a sensor; and obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
In one embodiment, the motion control method further comprises: controlling the laser head to move to different calibration vertical distances to obtain calibration capacitance signals corresponding to the calibration vertical distances; and fitting the calibrated vertical distance and the calibrated capacitance signal to obtain the distance-capacitance calibration functional relation.
In one embodiment, the controller acquiring the actual capacitance signal between the laser head and the workpiece by the sensor comprises: the controller detects an actual capacitance signal through a sensor and obtains the actual capacitance signal by using bus transmission between the sensor and the controller.
In order to solve the above technical problem, the present invention provides a motion control system for a laser head, comprising: the controller is used for acquiring the target following height of the machined workpiece, the machining path and the actual vertical distance between the laser head and the machined workpiece; determining the motion control quantity of the laser head according to the actual vertical distance, the target following height and the machining path; and controlling the laser head to perform vertical motion, horizontal motion and rotary motion based on the motion control quantity.
In one embodiment, the motion control system further comprises: the sensor is connected with the controller and is used for detecting an actual capacitance signal between the laser head and the processed workpiece; and the controller is used for obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
In one embodiment, the controller and the sensor are connected by a bus.
In one embodiment, the motion control system further comprises: the transmitter is connected between the sensor and the controller and comprises an FPGA collector, a filter and an EtherCAT bus slave module; the controller comprises an EtherCAT bus main module; and the driver is connected with the controller and used for receiving the motion control quantity of the controller so as to drive the laser head to vertically move.
In order to solve the above technical problem, the present invention provides a laser processing machine, which includes a laser head and the above motion control system.
Different from the prior art, the motion control method of the application obtains the target following height of the processed workpiece, the processing path and the actual vertical distance between the laser head and the processed workpiece by the controller, and determines the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path; and simultaneously controlling the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control amount. Therefore, the vertical movement, the horizontal movement and the rotary movement of the laser head are simultaneously controlled and realized by one controller, the integral movement control planning is convenient, and the efficiency and the accuracy of the movement control are improved.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 is a schematic flow chart of a method for controlling the movement of a laser head according to an embodiment of the present application;
FIG. 2 is another schematic flow chart of a method for controlling the movement of a laser head according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a flow chart for obtaining a calibration function relationship in a motion control method of a laser head according to an embodiment of the present application;
FIG. 4 is a schematic diagram of the structure of a motion control system of a laser head according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a laser processing machine according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for controlling the movement of a laser head according to an embodiment of the present disclosure. The motion control method of the laser head is mainly used for controlling the laser head to move, in a laser process, the laser head relates to vertical motion and horizontal and rotary motion and the like between the laser head and a workpiece, the vertical motion corresponds to a laser focus, namely the processing power of laser, and the horizontal and rotary motion corresponds to a processing path of the laser. In this embodiment, the horizontal and vertical motion control of the laser head is controlled by the controller. The main process of motion control is as follows.
S11: and acquiring a processing path of the processed workpiece, a target following height and an actual vertical distance between the laser head and the processed workpiece.
The controller of the embodiment realizes linkage control of vertical, horizontal and rotation. Firstly, processing information is obtained, wherein the processing information comprises a processing path of a processing workpiece, the processing path relates to horizontal and rotary motion of a laser head, and a target following height represents a following height of the laser head relative to the processing workpiece along the processing path.
The motion control of the laser head includes control according to the machining path and control and adjustment of the vertical distance between the laser head and the workpiece to be machined, and the actual vertical distance between the laser head and the workpiece to be machined is also obtained in step S11. The specific acquisition method can utilize a distance sensor and can also utilize electric signal conversion calculation.
In the embodiment, an electric signal conversion calculation method is adopted, and specifically, the controller acquires an actual capacitance signal between the laser head and the workpiece to be processed through the sensor, and then acquires an actual vertical distance according to a distance capacitance calibration functional relation and the actual capacitance signal.
The distance capacitance calibration functional relationship can be preset in the controller, or can be obtained after calibration calculation is carried out on the same type of processing workpiece, and represents the relationship between capacitance and distance, so that in actual application, after an actual capacitance signal is obtained, the actual vertical distance can be determined by using the calibration functional relationship.
The sensor and the controller are connected through a bus, an EtherCAT bus is specifically utilized, and an EtherCAT communication mode is also adopted, so that stable and interference-free communication is realized.
S12: and determining the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path.
After the information in the vertical direction and the information in the horizontal direction are determined, the movement of the laser head can be controlled according to the information, the information in the vertical direction comprises an actual vertical height and a target following height, and the information in the horizontal direction comprises a processing path. In the embodiment, when the machining is performed, the corresponding target tracking height, namely the relative control height between the laser head and the machined workpiece, is set for the machined workpiece, and the laser head performs tracking machining on the machined workpiece by using the target tracking height, namely the control height of the laser head during process design.
In the control of the embodiment, the actual vertical distance is detected, and the motion control amount of the laser head is determined based on the target tracking height and considering the processing path, so that the laser head can track and process the processed workpiece according to the target tracking height as much as possible.
S13: and controlling the laser head to perform vertical motion, horizontal motion and rotary motion based on the motion control quantity.
After the motion control amount is determined, the laser head is controlled to move in the vertical direction and the horizontal direction based on the motion control amount.
In the motion control method, the controller acquires the actual vertical distance between the laser head and the workpiece to be processed, and the motion control quantity of the laser head is determined according to the actual vertical distance, the target following height and the processing path; and controlling the laser head to move vertically, horizontally, rotationally and the like based on the motion control quantity. The vertical movement, the horizontal movement, the rotation and other movements of the laser head are realized by one controller, so that the whole movement control planning is facilitated, and the efficiency and the accuracy of the movement control are improved. Moreover, the same controller can be used for conveniently completing the operations of configuration, zero returning, inching, calibration and the like for a user. In addition, the bus is adopted for signal transmission, so that the interference of analog quantity is avoided, and complicated wiring is omitted.
Referring to fig. 2, fig. 2 is another flow chart illustrating a method for controlling the movement of a laser head according to an embodiment of the present disclosure. The motion control method of the present embodiment is similar to the embodiment shown in fig. 1, in which the specific control process based on the motion control amount is further optimized.
S21: and acquiring a processing path of the processed workpiece, a target following height and an actual vertical distance between the laser head and the processed workpiece.
Step S21 of this embodiment is similar to step S11 of the embodiment shown in fig. 1, and detailed description thereof is omitted.
S22: and calculating the following deviation of the actual vertical distance and the target following height.
After the actual vertical distance is obtained, calculating the following deviation between the actual vertical distance and the target following height, namely the difference between the actual vertical distance and the target following height, and representing the difference between the current height of the laser head and the process design height. After the tracking deviation is determined, the laser head may be adjusted based on the tracking deviation.
S23: comparing whether the follow-up deviation is greater than a threshold.
If the following deviation obtained in the step S22 is large, it indicates that the height of the laser head that needs to be adjusted is large; if the following deviation is small, the height of the laser head required to be adjusted is small.
In this embodiment, the height adjustment may be performed in different manners, and if the height to be adjusted is larger, the interpolation mode may be used, and if the height to be adjusted is smaller, the following mode may be used. The interpolation mode means that interpolation points in the path are determined based on the current position and the adjusted position, and the interpolation motion speed is planned again. The follow mode indicates that motion continues at the current speed without re-programming.
On this basis, a threshold value is set in the present embodiment for the following deviation, which threshold value relates to the adjustment of the laser height, i.e. the adjustment of the laser focal length. The setting is 1mm in this embodiment, and when following deviation is greater than 1mm, if directly adopt the following mode, then the problem of overshoot appears easily, causes the shake, consequently carries out interpolation earlier, and interpolation targets in place after, switches into the following mode again, follows in real time.
If the following deviation is larger than the threshold value, the height to be adjusted is larger. The process proceeds to step S24 to perform interpolation speed planning.
If the follow deviation is less than or equal to the threshold, the process proceeds to step S25, where a deviation gain is calculated.
S24: and planning the interpolation speed.
In the step, speed planning and position interpolation of a variable target position are carried out according to the following deviation and the processing path, namely, the target position is periodically adjusted according to the following deviation, the speed planning is periodically carried out on the current position and the target position, and then the position interpolation is carried out to calculate the motion control quantity.
S25: a bias gain is calculated.
In the step, the deviation gain is calculated according to the following deviation and the current speed of the laser head, and then the motion control quantity is determined. The current speed of the laser head is obtained based on the machining path plan.
S26: the motion control amount is calculated.
In the mechanical processing, pulse servo control can be adopted, namely for a servo motor driving a laser head to move, pulse control is adopted. The process of calculating the motion control amount in the present embodiment is thus: after step S24, the pulse control amount is calculated from the interpolation point real-time speed. From the deviation gain after step S25, the amount of impulse control may be determined. Finally, the servo motor can be controlled to move by using the pulse control quantity, and then the laser head is driven to move vertically, horizontally and rotationally.
The embodiment discloses a motion control method for controlling a laser head to carry out a following control process of laser processing. The laser head can realize an interpolation mode and a following mode in the process, the adjustment precision of laser processing is improved, and the application range of laser cutting is widened.
The calibration functional relationship in the above embodiment can also be obtained by calibration when processing is started, specifically referring to fig. 3, fig. 3 is a schematic flow chart of obtaining the calibration functional relationship in the motion control method of the laser head according to the embodiment of the present application.
S31: and controlling the laser head to move upwards to a calibration vertical position, and periodically acquiring a calibration vertical distance and a calibration capacitance signal in the calibration vertical position process.
Firstly, the laser head can be manually moved to a preset distance above a processed workpiece by a user, and the position of the laser head is used as a calibration vertical position. The preset distance above the upper part can be specifically set to be 1 mm-10 mm.
And then the controller controls the laser head to move downwards slowly, and after the laser head collides with a machined workpiece, the controller controls the laser head to move upwards to a calibrated vertical position. Whether the laser head collides with the workpiece or not can be judged by taking the capacitance as 0 or the capacitance reaching the change threshold value as a judgment condition. In the process, the capacitance signal and the corresponding coordinate are periodically acquired, namely the calibrated vertical distance and the corresponding calibrated capacitance signal are periodically acquired.
S32: and fitting the calibrated vertical distance and the calibrated capacitance signal to obtain a distance-capacitance calibration function relation.
Many calibrated vertical distances and corresponding calibrated capacitance signals are acquired in step S31 and may be fitted to obtain a functional relationship. In the step, a least square method can be adopted for fitting a multi-section high-order polynomial fitting. A is0+a1x+...+akxkA can be calculated by using the least square method0,a1...akThe coefficient of (a). x is the nominal capacitance signal and y is the nominal vertical distance。
The calibration functional relation can be periodically calibrated by a user, and can also be calibrated again when the type of the processed workpiece is changed and the laser head is changed.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a motion control system of a laser head according to an embodiment of the present application. The motion control system of the present embodiment is a hardware structure for implementing the motion control method.
The motion control system 100 of the present embodiment includes a controller 11, a sensor 12, a transmitter 13, a driver 14, and an amplifier 15.
The controller 11 is used for acquiring the actual vertical distance between the laser head and a workpiece to be processed; determining the motion control quantity of the laser head according to the actual vertical distance, the target following height of the processed workpiece and the processing path; and controlling the laser head to move vertically, horizontally, rotationally and the like based on the motion control quantity.
The controller 11 specifically includes an EtherCAT bus master module 111 and a motion control unit 112. The frequency signal that the receipt etherCAT bus was come in, electric capacity signal promptly can obtain the distance of laser head and work piece surface according to electric capacity signal to follow in real time, according to the distance promptly, the controller can adjust the distance of upper and lower axle in order to keep laser head and work piece surface in real time.
The sensor 12 is connected to the controller 11 for detecting the actual capacitance signal between the laser head and the workpiece being processed. The controller 11 is configured to obtain an actual vertical distance according to the distance-capacitance calibration function relationship and the actual capacitance signal.
The transmitter 13 is used for acquiring a frequency signal, filtering the frequency signal, and transmitting the frequency signal to the controller 11 through an EtherCAT bus. The transmitter 13 specifically includes an FPGA collector 131, a filter 132, and an EtherCAT bus slave module 133, and further includes a signal receiving circuit 134.
The drive 14 is used to drive a transmission mechanism, for example, a servomotor. It can be arranged in the control system or on the transmission mechanism.
The amplifier 15 is used for converting the capacitance signal into a frequency signal, so that the anti-interference capability is enhanced.
The sensor 12 is a capacitive sensor and may be located on the laser head. The sensor 12 is connected with an amplifier 15; the signal is converted into a frequency signal by an amplifier 15, amplified and then accessed to a transmitter 13; the signal is received by a signal receiving circuit 134 in the transmitter 13, is collected at a high speed in real time by an FPGA collector 131, and is subjected to sliding mean filtering by a filter 132 and then is sent out by an EtherCAT bus slave module 133 in a PDO mode; when the controller 11 is connected, the controller 11 acquires the signal every 1ms through the EtherCAT bus master module 111. The controller 11 can perform fitting calibration on the signal by using a segmented least square method, establish the relation between the capacitance signal and the position, and obtain a real-time distance signal between the laser cutting head and the surface of the workpiece after calibration is completed. The motion control unit 112 of the controller 11 outputs a corresponding pulse to the driver 14 to implement servo execution according to the deviation between the real-time acquired distance signal and the set distance.
When the motion control system of the embodiment implements the functions thereof, basic configuration work is first performed. The method comprises the following steps: configuring an EtherCAT bus: the EtherCAT main module 111 of the controller 11 imports a bus description file of the signal processing and transmitting device (i.e., EtherCAT slave station description file). Connecting an EtherCAT bus: real-time communication of the controller 11 with the transmitter 13 is established.
Then, calibrating the capacitance signal and the vertical distance to determine the functional relation of the capacitance signal and the vertical distance. And finally, the current vertical distance between the laser head and the workpiece can be acquired in real time, and then tracking machining is realized.
Besides the beneficial effects of the control method, the application of the electronic element further improves the real-time performance, improves the control performance and improves the laser processing quality and the processing efficiency.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a laser processing machine according to an embodiment of the present application. The laser processing machine 200 includes a laser head 21, the motion control system 22, and a transmission mechanism 23.
The motion control system 22 of this embodiment is similar to the motion control system 100 described above, and detailed description thereof is omitted. The laser processing machine 200 of the present embodiment may be a machine that uses laser processing, such as a laser cutter or a laser printer. Which can realize high-quality and high-efficiency laser processing.
In the above description of the present specification, the terms "fixed," "mounted," "connected," or "connected," and the like, are to be construed broadly unless otherwise expressly specified or limited. For example, with the term "coupled", it can be fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship. Therefore, unless the specification explicitly defines otherwise, those skilled in the art can understand the specific meaning of the above terms in the present invention according to specific situations.
From the above description of the present specification, those skilled in the art will also understand the terms used below, terms indicating orientation or positional relationship such as "upper", "lower", "front", "rear", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "central", "longitudinal", "transverse", "clockwise" or "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings of the present specification, it is for the purpose of facilitating the explanation of the invention and simplifying the description, and it is not intended to state or imply that the devices or elements involved must be in the particular orientation described, constructed and operated, therefore, the above terms of orientation or positional relationship should not be construed or interpreted as limiting the present invention.
In addition, the terms "first" or "second", etc. used in this specification are used to refer to numbers or ordinal terms for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present specification, "a plurality" means at least two, for example, two, three or more, and the like, unless specifically defined otherwise.
While various embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous modifications, changes, and substitutions will occur to those skilled in the art without departing from the spirit and scope of the present invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that the module compositions, equivalents, or alternatives falling within the scope of these claims be covered thereby.
Claims (10)
1. A motion control method of a laser head, characterized in that the motion control method comprises:
the controller acquires a target following height of the processed workpiece, a processing path and an actual vertical distance between the laser head and the processed workpiece;
the controller determines the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path;
the controller controls the laser heads to perform vertical movement, horizontal movement and rotary movement based on the movement control amount.
2. The motion control method of claim 1, wherein the controller determines the motion control amount of the laser head according to the actual vertical distance, the target following height, and the processing path, including:
performing speed planning based on the machining path to determine the current speed of the laser head, and calculating the following deviation of the actual vertical distance and the target following height;
if the following deviation is smaller than or equal to a threshold value, determining the motion control quantity according to the following deviation and the current speed of the laser head;
and if the following deviation is larger than a threshold value, performing speed planning according to the following deviation to determine the motion control quantity.
3. The motion control method of claim 1 in which the controller obtains the actual vertical distance of the laser head from the workpiece being processed, including:
the controller acquires an actual capacitance signal between the laser head and the processing workpiece through a sensor;
and obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
4. The motion control method according to claim 3, characterized by further comprising:
controlling the laser head to move upwards to a calibration vertical position, and periodically acquiring a calibration vertical distance and a calibration capacitance signal in the process of calibrating the vertical position;
and fitting the calibrated vertical distance and the calibrated capacitance signal to obtain the distance-capacitance calibration functional relation.
5. The motion control method of claim 3 wherein the controller acquiring an actual capacitance signal between the laser head and the workpiece via a sensor comprises:
the controller detects an actual capacitance signal through a sensor and obtains the actual capacitance signal by using bus transmission between the sensor and the controller.
6. A motion control system of a laser head, the motion control system comprising:
the controller is used for acquiring the target following height of the machined workpiece, the machining path and the actual vertical distance between the laser head and the machined workpiece; determining the motion control quantity of the laser head according to the actual vertical distance, the target following height and the machining path; and controlling the laser head to perform vertical motion, horizontal motion and rotary motion based on the motion control quantity.
7. The motion control system of claim 6, further comprising:
the sensor is connected with the controller and is used for detecting an actual capacitance signal between the laser head and the processed workpiece;
and the controller is used for obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
8. The motion control system of claim 7, wherein the controller and the sensor are connected by a bus.
9. The motion control system of claim 7, further comprising:
the transmitter is connected between the sensor and the controller and comprises an FPGA collector, a filter and an EtherCAT bus slave module;
the controller comprises an EtherCAT bus main module;
and the driver is connected with the controller and used for receiving the motion control quantity of the controller so as to drive the laser head to perform vertical motion, horizontal motion and rotary motion.
10. A laser processing machine comprising a laser head and a motion control system according to any one of claims 6 to 9.
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| CN117620431A (en) * | 2024-01-26 | 2024-03-01 | 宁德时代新能源科技股份有限公司 | Welding track determining method and welding system |
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