CN110027339A - A kind of sheet printing technology without spraying forced fluid - Google Patents
A kind of sheet printing technology without spraying forced fluid Download PDFInfo
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- CN110027339A CN110027339A CN201910390071.XA CN201910390071A CN110027339A CN 110027339 A CN110027339 A CN 110027339A CN 201910390071 A CN201910390071 A CN 201910390071A CN 110027339 A CN110027339 A CN 110027339A
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- forced fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0045—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or film forming compositions cured by mechanical wave energy, e.g. ultrasonics, cured by electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams, or cured by magnetic or electric fields, e.g. electric discharge, plasma
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention relates to plate printing technologies, include the following steps: that PC, PMMA are carried out co-extrusion by (1) more particularly to a kind of sheet printing technology without spraying forced fluid, composite board is made, one layer of UV glue is coated in the upper surface of composite board, and solidified using UV lamp, form semi-solid preparation UV glue-line；(2) LOGO layers are printed；(3) it is electroplated；(4) base ink is printed；(5) HIGH PRESSURE TREATMENT；(6) UV solidifies.The present invention is before HIGH PRESSURE TREATMENT molding, just in the upper surface of composite board, coating UV glue forms it into semi-solid preparation layer, the processes such as subsequent LOGO layers of transfer, plating, HIGH PRESSURE TREATMENT can smoothly be tided over, finally carry out UV solidification, thus the upper surface of composite board forms coverage rate height and the strengthening layer with high rigidity, it without the spray process of forced fluid, reduces costs, improves production efficiency significantly.
Description
Technical field
The present invention relates to plate printing technologies, and in particular to a kind of sheet printing technology without spraying forced fluid.
Background technique
Existing 3D plate, which needs to spray, just can achieve our required hardness after forced fluid is strengthened, this process is time-consuming
Effort, very waste of resource, because demand is too big.And for 3D plate, arc side is the severely afflicated area of collision easy to scratch, but
It is that forced fluid is very difficult in the spray of its arc side.
Summary of the invention
In order to overcome shortcoming and defect existing in the prior art, it is strong without spray that the purpose of the present invention is to provide one kind
Changing liquid just can reach the sheet printing technology of the hardness needed for us.
The purpose of the invention is achieved by the following technical solution:
A kind of sheet printing technology without spraying forced fluid, includes the following steps:
(1) PC, PMMA are subjected to co-extrusion, composite board is made, coat one layer of UV glue in the upper surface of composite board, and use UV
Lamp solidification, forms semi-solid preparation UV glue-line；
(2) LOGO layers are printed in the lower surface of composite board by transfer technique；
(3) it is electroplated on LOGO layers described, forms electroplated layer；
(4) base ink is printed on the electroplated layer, forms base layer；
(5) composite board is subjected to HIGH PRESSURE TREATMENT；
(6) composite board after HIGH PRESSURE TREATMENT is sent into UV machine and carries out UV solidification, semi-solid preparation UV glue-line is made to be fully cured to be formed
Strengthening layer.
Wherein, in step (2), the transfer technique is UV transfer.
Wherein, the successively plating sequence of the electroplated layer is indium layer, silicon dioxide layer and titanium dioxide layer.
Wherein, the surface dynes value of the electroplated layer is less than 36, hundred lattice test of adhesive force >=4B, and the overall thickness of electroplated layer is
4-6μm。
Wherein, the mode being electroplated in step (4) is to be electroplated using electron gun.
Wherein, the specific steps in step (5) are as follows: composite board is placed in high-pressure forming machine and carries out high-pressure molding, is formed
Arc side, wherein the pressure of high-pressure molding is 14-20kg/cm3, the time of high-pressure molding is 20-30s.
Wherein, hundred lattice test of adhesive force >=5B of the strengthening layer, hardness >=3H.
Wherein, the UV glue includes the raw material of following parts by weight:
40-60 parts of aliphatic polyurethane methacrylate
10-14 parts of methyl acrylate
10-12 parts of ethyl propylene acid esters of 2- methane oxygroup
6-10 parts of isoborneol methacrylate
Particle 30-40 parts of hardening
1-3 parts of initiator
100 parts of solvent；
Wherein, the preparation method of the hardening particle includes the following steps:
A, it takes 4, the 4- methyl diphenylene diisocyanate of 100 parts by weight to be warming up to 50-60 DEG C, receiving for 20-40 parts by weight is added
Rice silica, carries out ultrasonic disperse, obtains cured with isocyanates group；
B, toward the cured with isocyanates group be added 100-120 parts by weight polytetrahydrofuran ether glycol, 20-30 parts by weight lactic acid and
0.1-1 part by weight of catalyst, is warming up to 90-100 DEG C, and insulation reaction 1-3h obtains prepolymer；
C, the nano silica of 10-20 parts by weight is blended into the prepolymer, the melting mixing in screw extruder is squeezed
It is granulated out, physical crushing arrives the hardening particle to 6-10 μm.
The present invention carries out coating modification processing to nano silica using polyurethane elastomer, due to polyurethane elastomer
There is similar property with aliphatic polyurethane methacrylate, therefore compatibility is preferable, can have in UV glue preferably
Suspending stabilized sex expression；Furthermore nano silica-polyurethane elastomer has the property of buffer structure, can effectively improve
The toughness of strengthening layer, the especially performance of impact strength；And hardening the nano silica in particle then can significantly improve by force
Change the performance of the intensity and wearability of layer.
The present invention first passes through isocyanates and is modified processing to silica during particle is hardened in preparation, solves
Certainly nano silica problem easy to reunite, and in the synthesis process of polyurethane, polyurethane can be improved in the participation of polylactic acid
The hardness of elastomer shell, and riveting point of more carboxyls as nano silica is provided, thus polymerization process
The middle high dispersion for keeping nano silica；Then, a small amount of silica and prepolymer is added and carries out physical dispersion, point
Batch chemically mixes the content that silica in hardening particle can be improved with physical mixing, reduces cost needs, most
The hardening particle obtained eventually can be obviously improved the intensity and wearability of strengthening layer.
The specific monomer used in UV glue of the invention can be crosslinked with hardening particle produced by the present invention reacts, from
Prepared by strengthening layer have excellent comprehensive performance.
Further, the partial size of the nano silica is 60-80nm, is conducive to dispersion and graft modification processing, system
The hardening particle uniformity obtained is higher.
Further, the photoinitiator is photoinitiator 184, and the organic solvent is ethyl acetate.
Using the special UV glue of the present invention, the mercury arc light irradiation 8-12s that 15-20W can be used forms semi-solid preparation UV glue-line, after
It is continuous to continue that strengthening layer is formed using mercury arc light irradiation 10-20s.
The beneficial effects of the present invention are: the present invention is just applied in the upper surface of composite board before HIGH PRESSURE TREATMENT molding
It covers UV glue and forms it into semi-solid preparation layer, can smoothly tide over the processes such as subsequent LOGO layers of transfer, plating, HIGH PRESSURE TREATMENT, finally
UV solidification is carried out, thus the upper surface of composite board forms coverage rate height and the strengthening layer with high rigidity, is not necessarily to forced fluid
Spray process, reduce costs, improve production efficiency significantly.
Specific embodiment
For the ease of the understanding of those skilled in the art, below with reference to embodiment, the present invention is further illustrated, real
The content that the mode of applying refers to not is limitation of the invention.
Embodiment 1
A kind of sheet printing technology without spraying forced fluid, includes the following steps:
(1) PC, PMMA are subjected to co-extrusion, composite board is made, coat one layer of UV glue in the upper surface of composite board, and use UV
Lamp solidification, forms semi-solid preparation UV glue-line；
(2) LOGO layers are printed in the lower surface of composite board by transfer technique；
(3) it is electroplated on LOGO layers described, forms electroplated layer；
(4) base ink is printed on the electroplated layer, forms base layer；
(5) composite board is subjected to HIGH PRESSURE TREATMENT；
(6) composite board after HIGH PRESSURE TREATMENT is sent into UV machine and carries out UV solidification, semi-solid preparation UV glue-line is made to be fully cured to be formed
Strengthening layer.
Wherein, in step (2), the transfer technique is UV transfer.
Wherein, the successively plating sequence of the electroplated layer is indium layer, silicon dioxide layer and titanium dioxide layer.
Wherein, the surface dynes value of the electroplated layer is less than 36, hundred lattice test of adhesive force >=4B, and the overall thickness of electroplated layer is
5μm。
Wherein, the mode being electroplated in step (4) is to be electroplated using electron gun.
Wherein, the specific steps in step (5) are as follows: composite board is placed in high-pressure forming machine and carries out high-pressure molding, is formed
Arc side, wherein the pressure of high-pressure molding is 17kg/cm3, the time of high-pressure molding is 25s.
Wherein, hundred lattice test of adhesive force >=5B of the strengthening layer, hardness >=3H.
Embodiment 2
A kind of sheet printing technology without spraying forced fluid, includes the following steps:
(1) PC, PMMA are subjected to co-extrusion, composite board is made, coat one layer of UV glue in the upper surface of composite board, and use UV
Lamp solidification, forms semi-solid preparation UV glue-line；
(2) LOGO layers are printed in the lower surface of composite board by transfer technique；
(3) it is electroplated on LOGO layers described, forms electroplated layer；
(4) base ink is printed on the electroplated layer, forms base layer；
(5) composite board is subjected to HIGH PRESSURE TREATMENT；
(6) composite board after HIGH PRESSURE TREATMENT is sent into UV machine and carries out UV solidification, semi-solid preparation UV glue-line is made to be fully cured to be formed
Strengthening layer.
Wherein, in step (2), the transfer technique is UV transfer.
Wherein, the successively plating sequence of the electroplated layer is indium layer, silicon dioxide layer and titanium dioxide layer.
Wherein, the surface dynes value of the electroplated layer is less than 36, hundred lattice test of adhesive force >=4B, and the overall thickness of electroplated layer is
4μm。
Wherein, the mode being electroplated in step (4) is to be electroplated using electron gun.
Wherein, the specific steps in step (5) are as follows: composite board is placed in high-pressure forming machine and carries out high-pressure molding, is formed
Arc side, wherein the pressure of high-pressure molding is 14kg/cm3, the time of high-pressure molding is 30s.
Wherein, hundred lattice test of adhesive force >=5B of the strengthening layer, hardness >=3H.
Embodiment 3
A kind of sheet printing technology without spraying forced fluid, includes the following steps:
(1) PC, PMMA are subjected to co-extrusion, composite board is made, coat one layer of UV glue in the upper surface of composite board, and use UV
Lamp solidification, forms semi-solid preparation UV glue-line；
(2) LOGO layers are printed in the lower surface of composite board by transfer technique；
(3) it is electroplated on LOGO layers described, forms electroplated layer；
(4) base ink is printed on the electroplated layer, forms base layer；
(5) composite board is subjected to HIGH PRESSURE TREATMENT；
(6) composite board after HIGH PRESSURE TREATMENT is sent into UV machine and carries out UV solidification, semi-solid preparation UV glue-line is made to be fully cured to be formed
Strengthening layer.
Wherein, in step (2), the transfer technique is UV transfer.
Wherein, the successively plating sequence of the electroplated layer is indium layer, silicon dioxide layer and titanium dioxide layer.
Wherein, the surface dynes value of the electroplated layer is less than 36, hundred lattice test of adhesive force >=4B, and the overall thickness of electroplated layer is
6μm。
Wherein, the mode being electroplated in step (4) is to be electroplated using electron gun.
Wherein, the specific steps in step (5) are as follows: composite board is placed in high-pressure forming machine and carries out high-pressure molding, is formed
Arc side, wherein the pressure of high-pressure molding is 20kg/cm3, the time of high-pressure molding is 20s.
Wherein, hundred lattice test of adhesive force >=5B of the strengthening layer, hardness >=3H.
Embodiment 4
The present embodiment the difference from embodiment 1 is that:
The UV glue includes the raw material of following parts by weight:
50 parts of aliphatic polyurethane methacrylate
12 parts of methyl acrylate
11 parts of acid esters of 2- methane oxygroup ethyl propylene
8 parts of isoborneol methacrylate
35 parts of particle of hardening
2 parts of initiator
100 parts of solvent；
Wherein, the preparation method of the hardening particle includes the following steps:
A, it takes 4, the 4- methyl diphenylene diisocyanate of 100 parts by weight to be warming up to 5 DEG C, the nanometer titanium dioxide of 30 parts by weight is added
Silicon carries out ultrasonic disperse, obtains cured with isocyanates group；
B, 110 parts by weight polytetrahydrofuran ether glycol, 25 parts by weight lactic acid and 0.2 weight is added toward the cured with isocyanates group
Part catalyst, is warming up to 95 DEG C, insulation reaction 2h obtains prepolymer；
C, the nano silica of 15 parts by weight is blended into the prepolymer, the melting mixing in screw extruder squeezes out
It is granulated, physical crushing arrives the hardening particle to 8 μm.
Further, the partial size of the nano silica is 70nm.
Further, the photoinitiator is photoinitiator 184, and the organic solvent is ethyl acetate.
In the present embodiment, semi-solid preparation UV glue-line is formed using the mercury arc light irradiation 10s of 20W, it is subsequent to continue using the mercury arc
Light irradiation 15s can form strengthening layer.
Embodiment 5
The present embodiment the difference from embodiment 1 is that:
The UV glue includes the raw material of following parts by weight:
40 parts of aliphatic polyurethane methacrylate
10 parts of methyl acrylate
10 parts of acid esters of 2- methane oxygroup ethyl propylene
6 parts of isoborneol methacrylate
30 parts of particle of hardening
1 part of initiator
100 parts of solvent；
Wherein, the preparation method of the hardening particle includes the following steps:
A, it takes 4, the 4- methyl diphenylene diisocyanate of 100 parts by weight to be warming up to 50 DEG C, the nano-silica of 20 parts by weight is added
SiClx carries out ultrasonic disperse, obtains cured with isocyanates group；
B, 100 parts by weight polytetrahydrofuran ether glycol, 20 parts by weight lactic acid and 0.1 weight is added toward the cured with isocyanates group
Part catalyst, is warming up to 90 DEG C, insulation reaction 1h obtains prepolymer；
C, the nano silica of 10 parts by weight is blended into the prepolymer, the melting mixing in screw extruder squeezes out
It is granulated, physical crushing arrives the hardening particle to 6 μm.
Further, the partial size of the nano silica is 60nm.
Further, the photoinitiator is photoinitiator 184, and the organic solvent is ethyl acetate.
In the present embodiment, semi-solid preparation UV glue-line is formed using the mercury arc light irradiation 10s of 20W, it is subsequent to continue using the mercury arc
Light irradiation 15s can form strengthening layer.
Embodiment 6
The present embodiment the difference from embodiment 1 is that:
The UV glue includes the raw material of following parts by weight:
60 parts of aliphatic polyurethane methacrylate
14 parts of methyl acrylate
12 parts of acid esters of 2- methane oxygroup ethyl propylene
10 parts of isoborneol methacrylate
40 parts of particle of hardening
3 parts of initiator
100 parts of solvent；
Wherein, the preparation method of the hardening particle includes the following steps:
A, it takes 4, the 4- methyl diphenylene diisocyanate of 100 parts by weight to be warming up to 60 DEG C, the nano-silica of 40 parts by weight is added
SiClx carries out ultrasonic disperse, obtains cured with isocyanates group；
B, 120 parts by weight polytetrahydrofuran ether glycol, 30 parts by weight lactic acid and 0.4 weight is added toward the cured with isocyanates group
Part catalyst, is warming up to 100 DEG C, insulation reaction 3h obtains prepolymer；
C, the nano silica of 20 parts by weight is blended into the prepolymer, the melting mixing in screw extruder squeezes out
It is granulated, physical crushing arrives the hardening particle to 10 μm.
Further, the partial size of the nano silica is 80nm.
Further, the photoinitiator is photoinitiator 184, and the organic solvent is ethyl acetate.
In the present embodiment, semi-solid preparation UV glue-line is formed using the mercury arc light irradiation 10s of 20W, it is subsequent to continue using the mercury arc
Light irradiation 15s can form strengthening layer.
Comparative example 1
The difference of this comparative example and embodiment 4 is:
Wherein, the preparation method of the hardening particle includes the following steps:
A, it takes 4, the 4- methyl diphenylene diisocyanate of 100 parts by weight to be warming up to 5 DEG C, the nanometer titanium dioxide of 30 parts by weight is added
Silicon carries out ultrasonic disperse, obtains cured with isocyanates group；
B, 110 parts by weight polytetrahydrofuran ether glycol and 0.2 part by weight of catalyst, heating is added toward the cured with isocyanates group
To 95 DEG C, insulation reaction 2h obtains prepolymer；
C, the nano silica of 15 parts by weight is blended into the prepolymer, the melting mixing in screw extruder squeezes out
It is granulated, physical crushing arrives the hardening particle to 8 μm.
Comparative example 2
The difference of this comparative example and embodiment 4 is:
The hardening particle of 35 parts by weight is melted with the polyurethane of the nano silica of 17.5 parts by weight and 17.5 parts by weight
Melt the mixture replacing of extrusion.
By the strengthening layer of embodiment 4-6 and comparative example 1-2 according to GB/T6739-2006, GB/T1720-1979, GB/
T1731-1993 and GB/T1732-1993 carries out hardness of paint film, paint film adhesion, paint film flexibility, paint film impact resistance respectively
It is tested, test result is as follows table:
| Hardness | Adhesive force | Flexibility | Impact resistance (square impact) | Impact resistance (recoil) | |
| Embodiment 4 | 5H | 0 grade | 1mm | 47cm | 42cm |
| Embodiment 5 | 5H | 0 grade | 2mm | 43cm | 40cm |
| Embodiment 6 | 5H | 0 grade | 2mm | 40cm | 37cm |
| Comparative example 1 | 3H | 0 grade | 2mm | 33cm | 28cm |
| Comparative example 2 | 4H | 1 grade | 4mm | 28cm | 24cm |
As seen from the above table, strengthening layer of the invention has the performance of good hardness, adhesive force, impact resistance, special hardening
The contribution that particle plays is very big, if not having the participation of lactic acid during preparation hardening particle, paint film still be can have preferably
Adhesion, but hardness just decreases drastically, and flexibility and impact resistance have lesser degree of decline；And if only
Nano silica and polyurethane are only subjected to simple melting extrusion, then the dispersibility of nano silica is poor, causes hard
The flexibility and impact resistance for changing layer significantly decline, and hardness and adhesive force also have lesser degree of decline.
Above-described embodiment is the preferable implementation of the present invention, and in addition to this, the present invention can be realized with other way,
Do not depart under the premise of present inventive concept it is any obviously replace it is within the scope of the present invention.
Claims (7)
1. a kind of sheet printing technology without spraying forced fluid, characterized by the following steps:
(1) PC, PMMA are subjected to co-extrusion, composite board is made, coat one layer of UV glue in the upper surface of composite board, and use UV
Lamp solidification, forms semi-solid preparation UV glue-line；
(2) LOGO layers are printed in the lower surface of composite board by transfer technique；
(3) it is electroplated on LOGO layers described, forms electroplated layer；
(4) base ink is printed on the electroplated layer, forms base layer；
(5) composite board is subjected to HIGH PRESSURE TREATMENT；
(6) composite board after HIGH PRESSURE TREATMENT is sent into UV machine and carries out UV solidification, semi-solid preparation UV glue-line is made to be fully cured to be formed
Strengthening layer.
2. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: step (2)
In, the transfer technique is UV transfer.
3. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: the plating
The successively plating sequence of layer is indium layer, silicon dioxide layer and titanium dioxide layer.
4. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: the plating
The surface dynes value of layer is less than 36, hundred lattice test of adhesive force >=4B, and the overall thickness of electroplated layer is 4-6 μm.
5. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: step (4)
The mode of middle plating is to be electroplated using electron gun.
6. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: step (5)
In specific steps are as follows: composite board is placed in high-pressure forming machine and carries out high-pressure molding, forms arc side, the wherein pressure of high-pressure molding
Power is 14-20kg/cm3, the time of high-pressure molding is 20-30s.
7. a kind of sheet printing technology without spraying forced fluid according to claim 1, it is characterised in that: the reinforcing
Hundred lattice test of adhesive force >=5B of layer, hardness >=3H.
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| CN201910390071.XA CN110027339A (en) | 2019-05-10 | 2019-05-10 | A kind of sheet printing technology without spraying forced fluid |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910390071.XA CN110027339A (en) | 2019-05-10 | 2019-05-10 | A kind of sheet printing technology without spraying forced fluid |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571904A (en) * | 2020-12-02 | 2022-06-03 | Oppo广东移动通信有限公司 | Sheet material, method for preparing sheet material, shell and electronic equipment |
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| CN114571904A (en) * | 2020-12-02 | 2022-06-03 | Oppo广东移动通信有限公司 | Sheet material, method for preparing sheet material, shell and electronic equipment |
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Application publication date: 20190719 |