CN110024112A - 功率模块和用于制造功率模块的方法 - Google Patents
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Abstract
功率模块和用于制造功率模块的方法。该功率模块具有冷却体和借助于增材制造布置在其上的电绝缘结构和/或电导体结构,在用于制造这种功率模块的方法中,至少一个印制导线结构被增材制造而且至少一个布置在印制导线结构上的绝缘部被增材制造。
Description
技术领域
本发明涉及一种功率模块和一种用于制造功率模块的方法。
背景技术
功率电子模块(在本申请的范围内始终被称作功率模块)、尤其是用于变流器的功率电子模块需要卓越的电特性、热机械特性和高的电磁兼容性。也对鲁棒性和使用寿命提出了越来越高的要求。
发明内容
因而,本发明的任务是提供一种相对于现有技术经改善的功率模块。尤其应该可能的是更高的功率密度、经改善的使用寿命、紧凑的结构和被减小的电感。本发明的任务还是提供一种用于制造经改善的功率模块的方法。
本发明的该任务利用具有在权利要求1中所说明的特征的功率模块以及利用具有在权利要求12中所说明的特征的方法来解决。本发明的优选的扩展方案在附属的从属权利要求、随后的描述以及附图中予以说明。
按照本发明的功率模块具有增材制造的印制导线结构和至少一个至少布置在该印制导线结构上的、增材制造的绝缘部。
适宜地,按照本发明的功率模块包括至少一个功率构件,印制导线结构与该至少一个功率构件电接触。
由于经改善的可制造性并且基于功率模块的由于增材制造引起的可能的新式几何关系,按照本发明的功率模块具有随后说明的优点:
一方面,由于借助于按照本发明存在的增材制造的印制导线结构的经改善的电接触,按照本发明的功率模块可具有更高的功率密度。还可以轻易地实现按照本发明的功率模块的长使用寿命。
还有利地,按照本发明的功率模块可以以微小的体积、也就是说结构空间来制造。按照本发明的功率模块尤其可以关于其外形方面与比如通过更大的设备的其它组成部分预先给定的几何尺寸适配。
由于能增材制造的部件非常丰富,按照本发明的功率模块可具有多个同样能增材制造的其它组件、比如无源或者有源电器件。因此,在按照本发明的功率模块中能轻易地实现高集成度。
按照本发明的功率模块由于尤其是在功率模块的情况下的增材制造能针对特殊的任务并且因此件数少地成本极其低廉地来制造。
该功率模块还可具有多功能外壳,由于更高的集成度,在该多功能外壳中能实现其它功能性。尤其是,在按照本发明的功率模块中,能有利地省去硅树脂浇铸。
此外,借助于增材制造可以使用很多新的高度绝缘并且有高温能力以及同时可打印的材料。
优选地,在按照本发明的功率模块中,至少一个印制导线结构包括平坦的印制导线,也就是说印制导线结构包括具有平面的延伸和沿厚度方向的延伸的扁平部分,其中最大和/或最小的平面延伸是沿厚度方向的延伸的至少3倍那么大,尤其是至少10倍那么大,优选地至少30倍那么大而且理想地至少100倍那么大。在此,适宜地,印制导线构造出该扁平部分的至少一部分。
在按照本发明的功率模块中,适宜地,该扁平部分构成印制导线结构的体积的至少50%、优选地至少80%而且理想地至少90%。
由于平坦的印制导线结构,在运行时出现的电感可以轻易地被降低。
尤其是,在按照本发明的功率模块的情况下,由于借助于按照本发明规定的平坦的印制导线结构的经改善的电接触,器件在超过200℃的温度下的运行是可能的。因此,能使用Si和/或SiC和/或GaN芯片技术。按照本发明,经改善的导电性能和经改善的热机械和机电可靠性能轻易地被实现。
有利的,按照本发明的功率模块能在没有如在现有技术中公开的那样的焊接连接和/或铝键合连接的情况下来构造。有利地,按照本发明的功率模块没有必要具有这种可能容易折断而且还尺寸大的电连接。更确切地说,按照本发明的功率模块能鲁棒地并且紧凑地来构造。
适当地,按照本发明的功率模块具有冷却体,该冷却体至少部分地增材制造。
按照本发明,尤其能轻易实现两侧的冷却,也就是说,按照本发明的功率模块优选地具有至少两个冷却体,或者功率构件在两个彼此背离的侧面上与至少一个冷却体热接触。
在本发明的一个有利的扩展方案中,该功率模块具有至少一个衬底、尤其是用陶瓷来形成的衬底。
适宜地,在按照本发明的功率模块中,可能存在的冷却体附着到至少一个衬底上和/或冷却体形成该衬底。
有利地,很多广泛用于功率模块的衬底也适合作为用于增材制造的衬底。这样,尤其是电路载体、优选地经金属喷镀的陶瓷、如DCB和/或AMB和/或印刷电路板可以用作用于增材制造的衬底。
此外,按照本发明的功率模块的沿平面延伸以及沿厚度方向的电印制导线结构能针对集成电路和各种不同的应用情况来适配。
特别有利地,按照本发明的功率模块的其它组成部分借助于增材制造、尤其是借助于3D打印来制造:适宜地,这种组成部分是随后列出的组件中的一个或多个组件:无源和/或无线传感器和/或天线和/或电阻和/或电容和/或电感。
尤其是,有源和无源电器件及其馈电线可以借助于增材制造、尤其是借助于3D打印轻易地集成到按照本发明的功率模块中。
借助于增材制造、尤其是借助于3D打印,按照本发明的功率模块的绝缘部和/或印制导线结构可以高度精细地并且极其精确地来构造。
适宜地,在按照本发明的功率模块中,增材制造的组成部分借助于3D打印、优选地立体光刻和/或选择性激光烧结和/或等离子打印和/或喷墨打印来制造。
有利地,在按照本发明的功率模块中,可能存在的冷却体和/或可能存在的衬底和/或印制导线结构用或者由金属、尤其是用铝和/或铜和/或镍和/或锡和/或金和/或银和/或钛和/或钯和/或钢和/或钴和/或用或者由利用之前提到的金属中的一种或多种金属形成的合金和/或借助于增材制造形成。
优选地,在按照本发明的功率模块中,可能存在的冷却体用石墨铝来形成或者由石墨铝形成。
在按照发明的功率模块的一个优选的扩展方案中,冷却体具有冷却通道,这些冷却通道被构造用于冷却流体流经、尤其是用于空气流经。
优选地,按照本发明的功率模块具有至少一个功率构件,该功率构件优选地用硅和/或碳化硅和/或氮化镓或者由硅和/或碳化硅和/或氮化镓形成。
优选地,在按照本发明的功率模块中,该至少一个功率构件被烧结到印制导线结构和/或衬底和/或冷却体上。
适宜地,按照本发明的功率模块构成变流器、尤其是逆变器或整流器。
尤其是在变流器的情况下,热特性和电特性的明显的改善是可能的。还可以简单地改善电磁兼容性。
在用于制造按照本发明的功率模块的按照本发明的方法中,至少一个印制导线结构被增材制造和/或至少一个布置在印制导线结构上的绝缘部被增材制造。
借助于按照本发明的制造方法,不仅迅速的产品研发和投入市场而且对与产品相关的技术演示器的制造都是轻易地可能的。
优选地,按照本发明的方法包括随后列出的方法步骤中的一个或多个方法步骤:
- 使用衬底处理器/墨盒用于有和没有冷却器的衬底、尤其是用于DCB衬底;
- 以经适配的体积来打印烧结膏和/或焊膏;
- 配备、尤其是三维精确地配备器件、尤其是半导体器件;
- 通过Ag烧结或焊接工艺来连接器件;
- 结构化地3D打印有机和/或无机绝缘材料;
- 结构化地3D打印结构化的金属材料、尤其是一个或多个印制导线结构;以及
- 对所制造的功率模块或其组成部分进行电测试和/或光学测试。
有利地,借助于增材制造、尤其是借助于3D打印,系统组件、尤其是传感器和/或逻辑单元和/或控制单元和/或调节单元和/或被设立和构造用于状态监视(ConditionMonitoring)的单元的有利的多层结构以及简单的集成是简单地可能的。
优选地,借助于随后列出的材料中的一个或多个材料来进行增材制造:金属(铜和/或镍和/或锡和/或金和/或银和/或铝和/或钛和/或铂和/或钯和/或钢和/或钴和/或具有上文列举的金属中的一种或多种金属的合金)和/或能导电和/或导热的热固性塑料和/或能导热并且能导电的墨水和/或能导电的软膏和/或能导电的感光树脂和/或高度电绝缘并且导热的绝缘材料和/或电镀材料和/或高温稳定并且高度绝缘的3D材料(尤其是PI和/或PAI和/或聚醚醚酮(Peek))。尤其是,刚刚提到的3D材料可以关于热膨胀系数方面轻易地被适配,使得按照本发明的功率模块的热机械应力可以被降低而且可靠性被改善。
特别优选地,在按照本发明的方法中,借助于多喷嘴(Multi-Nozzle)方法来进行增材制造、尤其是进行3D打印。
在本发明的该扩展方案中,有利地,用唯一的建造技术、尤其是借助于多喷嘴3D打印就可以增材制造按照本发明的功率模块的多个材料不同的组成部分、尤其是聚合物组成部分和金属组成部分。有利地,多喷嘴打印(Multi-Nozzel-Print)生产线允许成本降低潜力大的批量生产过程。
优选地,在按照本发明的方法中,使用借助于之前执行的仿真来获得的结果并且修正可能存在的偏差。
附图说明
随后,本发明依据在附图中所示出的实施例进一步予以阐述。其中:
图1以纵剖面示意性地示出了借助于按照本发明的方法来制造的按照本发明的功率模块;以及
图2以流程图示意性地示出了按照本发明的方法。
具体实施方式
为了制造在图1中示出的功率模块10,首先将冷却体20 3D打印为由石墨铝构成的扁平部分。在3D打印冷却体20的情况下,同时在冷却体20中设置冷却通道30,这些冷却通道以绝缘套管的形式彼此平行地并且等距地沿着冷却体20的纵向中心平面穿过冷却体20。冷却通道30被构造用于输送冷却液。原则上,冷却通道30也适合于对功率模块的空气冷却。替选于冷却通道30或者也包括除了冷却通道30之外,在冷却体20的空着的扁平侧上印上散热片50,这些散热片从冷却体20的扁平侧40垂直地继续伸展。在所制造的3D打印件中,散热片50以本身公知的方式来确定尺寸和成型,用于对冷却体20的空气冷却。
替选地,在其它未特意示出的实施例中,冷却体20不是被3D打印,而是借助于其它制造方法来制造,而且被用于进一步制造按照本发明的功率模块10,如随后描述的那样。
与冷却体20的空着的扁平侧40背离的扁平侧60构造为平坦的平面。在该扁平侧60上整面地印上绝缘层70。在所示出的实施例中,绝缘层70由无机陶瓷、这里是氮化铝来打印。在其余部分对应于所示出的实施例的其它未示出的实施例中,作为替代,绝缘层由其它材料形成,比如由其它无机陶瓷、如氮化硅或者由有机电绝缘体形成。绝缘层是非导电体,但是具有高导热能力。在所示出的实施例中,绝缘层70作为薄层被印到冷却体20上。在其余部分对应于所示出的实施例的其它未特意示出的实施例中,作为替代,绝缘层70被喷镀或者粘贴到冷却体20上。相对应地,冷却体20形成衬底。替选地或附加地,替代冷却体20,可能存在如下衬底,在该衬底上,冷却体附着在该衬底的远离功率器件90的一侧。
扁平地结构化的铜层80作为金属喷镀被印到绝缘层70上,使得绝缘层70与冷却体20一起形成类似于印刷电路板的衬底。结构化的铜层80以本身公知的方式借助于银烧结技术来配备被构造为扁平部分的功率器件90、这里是IGBT。为此,结构化的铜层80用烧结膏通过印刷来涂层,功率器件90被烧结在该铜层上。结构化的铜层80的各个结构元件以及分别附着在其上的功率器件90连同分别将功率器件90和铜层80连接的烧结膏94分别沿平面延伸通过其它绝缘层96来彼此电绝缘,该其它绝缘层96以3D打印来涂覆。在其余部分对应于所示出的实施例的其它未特意示出的实施例中,替代IGBT,布置碳化硅芯片和氮化镓芯片、即基于化合物半导体的集成开关电路。
在这些集成开关电路的背离冷却体20的扁平侧100上,功率器件90同样被金属喷镀而且与功率模块10的其它部件通过铜印制导线110电接触。
这些铜印制导线110共同构造出扁平部分,也就是说铜印制导线110垂直于功率器件90的扁平侧100的延伸比铜印制导线110沿扁平侧100的平面延伸方向的最小延伸小一个量级、优选地两个量级。
不仅功率器件90而且铜印制导线110都在其与冷却体20背离的一侧配备其它以3D打印来涂覆的绝缘层120,使得功率器件90完全嵌入到功率模块10中。在该绝缘层120的与冷却体20背离的一侧,通孔敷镀130借助于3D打印(比如在多喷嘴技术中与绝缘层120共同)来实施,这些通孔敷镀通向借助于3D打印来制造的表面接触部140并且因此在嵌入的铜印制导线110中与这些表面接触部导电接触。因此,在这些表面接触部140上连接有其它未嵌入的组件150。原则上,其它组件150也可以借助于3D打印来制造。例如,这种组件150可以是无源和/或无线传感器和/或天线和/或电阻和/或电容和/或电感。此外,3D打印的馈电线可以连接到组件150上。
原则上,在其它未特意示出的实施例中,其它绝缘层也可以被印到功率器件90上,其它借助于3D打印来制造的冷却体附着到该其它绝缘层上。附加地,在其它实施例中,在绝缘层与冷却体之间可以打印导体结构和绝缘层的其它序列。
借助于按照本发明的方法制造的按照本发明的功率模块10构成变流器、尤其是逆变器或整流器。
按照本发明的方法不仅仅可以依据上文重现的具体的实施例来说明。更确切地说,按照本发明的方法随后也应该一般性地如在图2中示出的那样来示意性地说明:
在按照本发明的方法开始时,借助于衬底更换器H来选择衬底并且将该衬底转入进一步的制造过程。为此,首先将衬底交给打印机PR,该打印机给该衬底配备银膏。随后,将该衬底交给装配装置PP,该装配装置给该衬底配备半导体芯片,其方式是将半导体芯片铺到银膏上。半导体芯片借助于银膏利用银烧结方法(AS)附着到该衬底上。为此,将半导体芯片以低压和低温压到衬底上,然后进行固化(Curing)。
随后,借助于3D打印机PC以相对应的喷嘴将结构化的3D绝缘部(也就是3D打印的绝缘部)涂覆到半导体芯片上,然后紧接着是另一固化步骤。随后,借助于3D打印机的另一喷嘴DDD将结构化的3D金属层(也就是说3D打印的金属层)涂覆到3D绝缘部上。
在3D打印之后,制造到这种程度的功率模块首先非接触式地、也就是说在当前情况下以光学方式被测试,比如借助于光学显微镜OT来被测试。在光学测试成功之后,紧接着是在电测试台(ET)上的电测试。
在图2中示出的制造过程结束时,在包装站PS中进行包装并且将功率模块进一步发货。
当然,在按照本发明的方法中,借助于3D打印机PC来3D打印3D绝缘部以及借助于另一喷嘴DDD来3D打印结构化的金属层的方法步骤也可以彼此调换或者连续多次交替地进行。除了最后的包装和发货之外的全部方法步骤还可以借助于包装站PS借助于环路L多次被实施。
Claims (13)
1.一种功率模块,所述功率模块具有增材制造的印制导线结构(110)而且具有至少一个至少布置在所述印制导线结构上的、增材制造的绝缘部(120)。
2.根据上述权利要求之一所述的功率模块,其中至少一个印制导线结构(110)包括平坦的印制导线。
3.根据上述权利要求之一所述的功率模块,其中扁平部分构成所述印制导线结构(110)的体积的至少50%、优选地至少80%而且理想地至少90%。
4.根据上述权利要求之一所述的功率模块,所述功率模块具有冷却体(20),所述冷却体至少部分地增材制造。
5.根据上述权利要求之一所述的功率模块,其中一个或多个组成部分借助于3D打印、优选地立体光刻和/或选择性激光烧结和/或等离子打印和/或喷墨打印来增材制造。
6.根据上述权利要求之一所述的功率模块,所述功率模块具有至少一个衬底、尤其是用陶瓷形成的衬底。
7.根据上述权利要求之一所述的功率模块,其中冷却体(20)附着到至少一个衬底上和/或形成所述衬底。
8.根据上述权利要求之一所述的功率模块,其中冷却体(20)和/或衬底和/或所述印制导线结构(110)用或者由金属、尤其是用铝和/或铜和/或镍和/或锡和/或金和/或银和/或钛和/或钯和/或钢和/或钴和/或用或者由利用之前提到的金属中的一种或多种金属形成的合金和/或借助于增材制造形成。
9.根据上述权利要求之一所述的功率模块,所述功率模块包括至少一个功率构件(90),所述功率构件优选地烧结到所述印制导线结构(110)和/或衬底和/或冷却体(20)上。
10.根据上述权利要求之一所述的功率模块,所述功率模块具有一个或多个其它组成部分,所述一个或多个其它组成部分借助于增材制造、尤其是借助于3D打印来制造,尤其是随后列出的组件中的至少一个或多个组件借助于增材制造、尤其是借助于3D打印来制造:无源和/或无线传感器和/或天线和/或电阻和/或电容和/或电感和/或馈电线。
11.根据上述权利要求之一所述的功率模块,所述功率模块构成变流器、尤其是逆变器或整流器。
12.一种用于制造根据上述权利要求之一所述的功率模块的方法,其中至少一个印制导线结构(110)被增材制造而且至少一个布置在所述印制导线结构(110)上的绝缘部(120)被增材制造。
13.根据上述权利要求之一所述的方法,其中借助于多喷嘴方法来进行增材制造、尤其是进行3D打印。
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DE102021112861A1 (de) | 2021-05-18 | 2022-11-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Trägerstruktur, verfahren zur herstellung einer trägerstruktur und vorrichtung und druckkopf zum durchführen eines solchen verfahrens |
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US9613885B2 (en) * | 2015-03-03 | 2017-04-04 | Infineon Technologies Ag | Plastic cooler for semiconductor modules |
EP3261119A1 (en) * | 2016-06-21 | 2017-12-27 | Infineon Technologies AG | Power semiconductor module components and additive manufacturing thereof |
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CN105408095A (zh) * | 2013-06-24 | 2016-03-16 | 哈佛学院院长等 | 打印的三维(3d)功能部件及其制造方法 |
CN104867902A (zh) * | 2014-02-25 | 2015-08-26 | 西门子公司 | 具有两个能导电结构的电子模块 |
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US20190229030A1 (en) | 2019-07-25 |
WO2018060265A1 (de) | 2018-04-05 |
EP3504736A1 (de) | 2019-07-03 |
DE102016218968A1 (de) | 2018-04-05 |
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