CN110022133A - A kind of miniaturization inductive type variable band-pass filter and preparation method thereof - Google Patents
A kind of miniaturization inductive type variable band-pass filter and preparation method thereof Download PDFInfo
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- CN110022133A CN110022133A CN201910334810.3A CN201910334810A CN110022133A CN 110022133 A CN110022133 A CN 110022133A CN 201910334810 A CN201910334810 A CN 201910334810A CN 110022133 A CN110022133 A CN 110022133A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0153—Electrical filters; Controlling thereof
- H03H7/0161—Bandpass filters
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Abstract
The invention discloses a kind of miniaturization inductive type variable band-pass filters, belong to wave filter technology field.Structure mainly includes the capacitor of the inductance and surface of shell between shell, input pole, output stage, earthing pole, three layers of earth plate and earth plate different layers, using LTCC Technology, earth plate and inductance are sintered in ceramic substrate, capacitor is mounted on housing upper surface.The configuration of the present invention is simple, it is at low cost, it is prepared using LTCC Technology, small in size, batch consistency is good；Three layers of earth plate separate different induction, capacitor simultaneously, avoid unnecessary coupling bring parasitic and resonance, improve filtering accuracy and quality factor.
Description
Technical field
The invention belongs to wave filter technology fields, and in particular to a kind of miniaturization inductive type variable band-pass filter.
Background technique
In recent years, with mobile communication, satellite communication and Defensive Avionics System micromation rapid development, high-performance,
Low cost and miniaturization have become microwave current/RF application developing direction, to the performance of microwave filter, size, can
By property and cost, more stringent requirements are proposed.Communication countermeasure system needs to realize the place to signal under complicated information environment
Reason needs filter to realize the selection of signal.Filter is mainly used in separation signal, inhibits interference, this is that filter is most wide
General and most basic application.In this applications, the signal of frequency required for electrically tunable filter can make passes through, to not needing
Frequency generate inhibition.Current communication system is with actual needs, it is desirable that filter filter with low insertion loss, low passband fluctuation, Gao Xin
Number selectivity, while volume is as small as possible, to meet the requirement of sensitivity and dynamic range.Electrically tunable filter have it is small in size,
The wide advantage of working band can inhibit second order hybrid signal well, have broad application prospects.
Bandpass filter need of work bulky capacitor and big inductance under ultrashort wave frequency band constitute resonator.In order to meet device
Small form factor requirements, initial method is the high quality factor using high dielectric constant, and low-loss dielectric material reduces resonance
The size of device, and then reduce the volume of device.But traditional technology higher cost, complex manufacturing technology, batch are consistent
Property is poor.
Summary of the invention
It is an object of the invention to: a kind of miniaturization inductive type variable band-pass filter is provided, is solved small-sized
Technical costs is not higher for traditional handicraft in the case of change, complex manufacturing technology, the problem of batch consistency difference.
The technical solution adopted by the invention is as follows:
A kind of miniaturization inductive type variable band-pass filter, comprising: shell, positioned at the input pole at shell both ends and defeated
Pole, the earthing pole positioned at shell two sides and three layers of earth plate positioned at enclosure interior out；
Contact bridge is equipped between the earthing pole of shell two sides, three layers of earth plate is contacted with earthing pole；First layer connects
Be equipped with inductance La, inductance Lb and inductance Ld between floor and second layer earth plate, second layer earth plate and third layer earth plate it
Between be equipped with inductance Lc and inductance Le, close to third layer earth plate housing exterior walls surface be equipped with the first welded disc and second welding
Disk；
Input pole, inductance La, inductance Lb, inductance Ld, output stage are sequentially connected in series；Tie point, the electricity of inductance La and inductance Lb
Feel one end of Lc, the first welded disc one end between be equipped with the first conductive column, the tie point of inductance Lb and inductance Ld, inductance Le
One end, the second welded disc one end between be equipped with the second conductive column；The other end of the other end of inductance Lc and inductance Le respectively with
Earthing pole connects, and connects earthing pole after the other end connection capacitor Ca of the first welded disc, the other end of the second welded disc connects
Earthing pole is connected after meeting capacitor Cb；
The relief hole passed through for conductive column is equipped on the second layer earth plate, third layer earth plate.
Further, the inductance La, inductance Lb, inductance Lc, inductance Ld and inductance Le are spiral inductance, spiral inductance
Each layer be all the rectangle or 3/4 rectangle turned to by metal conduction band, capacitor Ca and capacitor Cb are tunable capacitor；
The inductance La is consistent with inductance Ld structure, and inductance Lc and inductance Le are full symmetric about Z axis, intercouples.
Further, the shell is made of low-temperature co-fired ceramics, and inductance and earth plate are sintered in ceramic substrate；Including
Element including shell, the first welded disc, the second welded disc, capacitor Ca and capacitor Cb is all made of FV1206 encapsulation, earthing pole, defeated
Enter pole and output stage is exposed.
Further, the shell is rectangular figure modelling, first layer earth plate, second layer earth plate and third layer earth plate
It is parallel with housing bottom surface；The input pole and output stage are the port of 50 Ω impedances.
A kind of preparation method minimizing inductive type variable band-pass filter, filter preparation step are as follows:
Ingredient: selection ceramic raw materials formulation configures ceramic material；
Curtain coating: casting slurry is made in prepared ceramic material, is cast out ceramic substrate；
Punching and filling perforation: punching part ceramic substrate, obtains conductive column relief hole and inductance connection hole, then with golden
Belong to slurry and carries out filling perforation；
Conductor printing: conductor printing is carried out with the ceramic substrate after filling perforation, the metal that preparation is used to form spiral inductance is led
Band passes through the inductance connection hole connection after filling perforation between same spiral inductance difference ceramic substrate layer；It is stepped down with conductive column
The ceramic substrate in hole carries out conductor printing, forms the earth plate metal layer not contacted with conductive column；
Lamination: the ceramic substrate of the ceramic substrate for producing conductor and non-printed conductor is folded according to design structure
Piece forms the spiral inductance and earth plate of storied placement；
Equal static pressure: putting carry out in water Deng static pressure for the module for completing lamination, so as to by different layers green substrate tightly
Compression moulding is to form complete filter device；
Dumping and sintering: the module after equal static pressure is placed in sintering furnace and carries out dumping and sintering；
The connection of surface layer component: capacitor is attached on surface layer with the sintered module of dumping, is made low temperature co-fired
The variable band-pass filter of ceramics.
Further, the raw material of the metal paste and metal conduction band is silver paste, and the conductor thickness of printing is 10 ± 1
Micron.
Further, when carrying out dumping and sintering in the dumping and sintering step, in sintering furnace, sintering furnace temperature 50
℃。
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
1. the present invention uses low-temperature co-fired ceramics, each component is sintered on ceramic substrate, due to low-temperature co-fired ceramics skill
Art can make the very high circuit substrate of the number of plies, and multiple passive elements can be embedded to the assembling for being wherein conducive to improve circuit
Density reduces device volume and weight.
2. the configuration of the present invention is simple, using LTCC Technology, manufacture craft is simple, batch consistency is good, cost
It is lower.
3. three layers of earth plate are arranged inside ceramic shell of the present invention, inductance element and capacity cell layering are placed, avoided
The inductance of different layers and other layers of inductance, the coupled interference of inductance and capacitor, reduce unnecessary coupling between component
Bring parasitism and resonance, ensure that the accuracy of filter while reducing device volume.
4. the characteristic that ceramic material has excellent high frequency, high-speed transfer and broad passband.According to the difference of ingredient, ceramics
The dielectric constant of material can change in very large range, with the use of high conductivity metal material as conductor material, have
Conducive to the quality factor for improving circuit system.
5. low-temperature co-fired ceramics is sintered at a temperature of 900 DEG C or so, it is adapted to high current and high-temperature stability is wanted
It asks, and has the heat conductivity more excellent than common PCB circuit substrate, greatly optimize the heat dissipation design of electronic equipment, it can
By property height, it can be applied to adverse circumstances, extend its service life.
6. the present invention is encapsulated using FV1206, guarantee to be convenient for being integrated into system in the case that device volume is small, it is convenient
Welding.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings, in which:
Fig. 1 is whole strabismus structure chart of the invention；
Fig. 2 is inductance, capacitor and conductive column strabismus structure chart of the present invention；
Fig. 3 is inductance capacitance and conductive column facing structure figure of the present invention；
Fig. 4 is that inductance of the present invention and earthing pole squint structure chart；
Fig. 5 is that capacitor of the present invention and earthing pole squint structure chart；
Fig. 6 is that earth plate of the present invention and earthing pole squint structure chart；
Fig. 7 is inductance of the present invention, conductive column, earth plate and input pole, output stage facing structure figure；
Fig. 8 is filter equivalent circuit schematic of the present invention；
Fig. 9 is filter preparation flow figure of the present invention；
Figure 10 is a kind of simulation result diagram of the present invention；
Marked in the figure: the first welded disc of 1- inductance La, 2- inductance Lb, 3- inductance Lc, 4- inductance Ld, 5- inductance Le, 6-, 7-
Second welded disc, the first conductive column of 8-, the second conductive column of 9-, 10- earthing pole, 11- contact bridge, 12- capacitor Ca, 13- first layer
Earth plate, 14- second layer earth plate, 15- third layer earth plate, 16- relief hole, 17- input pole, 18- output stage, 19- shell,
20- capacitor Cb, 21- inductance connection hole.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention, i.e., described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is logical
The component for the embodiment of the present invention being often described and illustrated herein in the accompanying drawings can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that the relational terms of term " first " and " second " or the like be used merely to an entity or
Operation is distinguished with another entity or operation, and without necessarily requiring or implying between these entities or operation, there are any
This actual relationship or sequence.Moreover, the terms "include", "comprise" or its any other variant be intended to it is non-exclusive
Property include so that include a series of elements process, method, article or equipment not only include those elements, but also
Further include other elements that are not explicitly listed, or further include for this process, method, article or equipment it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including described
There is also other identical elements in the process, method, article or equipment of element.
As shown in FIG. 1 to FIG. 7, wherein Fig. 2~Fig. 7 is the detail figure of Fig. 1；
A kind of miniaturization inductive type variable band-pass filter, comprising: shell 19, positioned at the input pole at 19 both ends of shell
17 and output stage 18, three layers of earth plate positioned at the earthing pole 10 of 19 two sides of shell and inside shell 19；
Specifically, the shell 19 is sintered using low-temperature co-fired ceramics, and whole is in rectangular shape, wide and high composition
Face is respectively 19 both ends of the surface of shell, and long and high composition face is respectively 19 two sides of shell；It is respectively set in the both ends of the surface of shell 19
The input pole 17 of filter and output stage 18, input pole 17 and output stage 18 is wrapped in the both ends of the surface of shell 19；In shell 19
Two earthing poles 10 are respectively set in two sides, and the shape of earthing pole 10 is door type structure, and internal diameter is consistent with the height of shell 19, described
Two earthing poles 10 are detained respectively embedded in the two sides middle position of shell 19；Three layers be sintered in ceramic substrate inside shell 19 connect
Floor is respectively first layer earth plate 13, second layer earth plate 14 and third layer earth plate 15, and three layers of earth plate are and cuboid
The bottom surface of shell 19 is parallel, and 19 inner space of shell is divided into two parts by three layers of earth plate.
It is understood that low-temperature co-fired ceramics (Low Temperature Co-fired Ceramic LTCC) technology
It is that low-temperature sintered ceramics powder is made to the accurate and fine and close green band of thickness, is infused on green band using laser boring, micropore
The techniques such as slurry, the printing of accurate conductor paste produce required circuitous pattern, and by multiple passive components (such as low capacitance capacitor,
Resistance, filter, impedance transducer, coupler etc.) it is embedded in multilayer ceramic substrate, it then overlaps together, internal and external electrode can
Respectively using metals such as silver, copper, gold, it is sintered at 900 DEG C, the non-interfering high-density circuit of three-dimensional space is made, can also make
At the three-dimensional circuit substrate of built-in passive element, IC and active device can be mounted on its surface, is made passive/active integrated
Functional module, can be further by circuit miniaturization and densification.
Contact bridge 11 is equipped between two earthing poles 10 of 19 two sides of shell, three layers of earth plate is and earthing pole
10 contacts；Between first layer earth plate 13 and second layer earth plate 14 be equipped with inductance La 1, inductance Lb 2 and inductance Ld 4, second
Inductance Lc 3 and inductance Le 5 is equipped between layer earth plate 14 and third layer earth plate 15, close to the shell of third layer earth plate 15
19 outer wall surfaces are equipped with the first welded disc 6 and the second welded disc 7；
Specifically, the contact bridge 11 is rectangular metal plate, the door pillar equivalent width of width and gate earthing pole 10, length
It is consistent with the spacing of two 10 door pillars of earthing pole, between the door pillar that the upper surface of shell 19 is placed in two earthing poles 10, connection
Two earthing poles 10 make an integral ground；Three layers of earth plate substantially moulding is slightly compared to 19 bottom surface of shell
The rectangular metal plate of diminution, be different from regular rectangle is the place protrusion that earth plate two sides correspond to earthing pole 10, protrusion
Divide and is connected together with the earthing pole 10 of 19 two sides of shell；The inductance is spiral inductance, is sintered in ceramic substrate,
Each layer of spiral inductance is all the rectangle or 3/4 rectangle turned to by the metal conduction band of 0.1mm width, inductance La 7 and electricity
The structure for feeling Ld 10 is consistent, and inductance Lc 9 and inductance Le 11 are full symmetric about Z axis, intercouple；12 He of capacitor Ca
Capacitor Cb 20 is all made of tunable capacitor.
Input pole 17, inductance La 1, inductance Lb 2, inductance Ld 4, output stage 18 are sequentially connected in series；Inductance La 1 and inductance Lb
2 tie point, one end of inductance Lc 3 are equipped with the first conductive column 8, inductance Lb 2 and inductance between one end of the first welded disc 6
The tie point of Ld4, one end of inductance Le 5, the second welded disc 7 one end between be equipped with the second conductive column 9；Inductance Lc's 3 is another
The other end of one end and inductance Le 5 are connected with earthing pole 10 respectively, and the other end of the first welded disc 6 connects capacitor Ca 12
Earthing pole 10 is connected afterwards, connects earthing pole 10 after the other end connection capacitor Cb 20 of the second welded disc 7；
Specifically, casing of filter 19 is made of low-temperature co-fired ceramics, and the inductance and earth plate are ceramic substrate
Upper to be formed by the metal conduction band coiling of conductor printing, inductance La 1, inductance Lb 2 and inductance Ld 4 are in conductor printing, successively
It is connected in series, and metal conduction band and the first conductive column 8 contact connectio between inductance La 1 and inductance Lb 2,2 He of inductance Lb
Metal conduction band and the second conductive column 9 between inductance Ld 4 connect；1 metal conduction band origin or beginning of inductance La and input pole simultaneously
17 connect, and 4 metal conduction band terminal of inductance Ld and output stage 18 connect；3 metal conduction band origin or beginning of inductance Lc is set as
Annulus row is covered contacts connection on the first conductive column 8, and 3 metal conduction band terminal of inductance Lc and earthing pole 10 connect, electricity
Sense 5 metal conduction band origin or beginning of Le is set as annulus row and covers to contact connection on the second conductive column 9,5 metal conduction band of inductance Le
Terminal and earthing pole 10 connect；The connection both ends of first welded disc 6 and the second welded disc 7 are respectively upper end under
End, wherein the lower end of the first welded disc 6 is connect with the first conductive column 8, the lower end of the second welded disc 7 is connect with the second conductive column 9,
Capacitor Ca 12 is welded in the upper end of first welded disc 6, and capacitor Cb 20, capacitor Ca 12 and capacitor are welded in the upper end of the second welded disc 7
20 other end of Cb is connect with earthing pole 10.
Its equivalent circuit is as shown in Figure 8, comprising: input terminal Pin, output end Pout, inductance La 1, inductance Lb 2, inductance
Lc 3, inductance Ld 4, inductance Le 5, capacitor Ca 12, capacitor Cb 20 and signal ground GND；
Specific connection relationship is as follows:
Input terminal Pin, inductance La 7, inductance Lb 8, inductance Ld 10 and output end Pout are sequentially connected in series, 7 He of inductance La
The tie point of inductance Lb 8 meets signal ground GND, inductance Lb 8 and inductance Ld 10 by inductance Lc 9 and connects letter by inductance Le 11
Number ground GND, capacitor Ca 12 is in parallel with inductance Lc 9, and capacitor Cb 20 is in parallel with inductance Le 11.
The relief hole 16 passed through for conductive column is equipped on the second layer earth plate 14, third layer earth plate 15；
Specifically, the diameter of conductive column is slightly less than the internal diameter of relief hole 16, and conductive column runs through the second layer by relief hole 16
The space that earth plate 14 and third layer earth plate 15 separate, convenient for the inductance between different layers, capacitance connection.
It is understood that earth plate, inductance, conductive column are sintered in shell since shell 19 uses low-temperature co-fired ceramics
In ceramic substrate inside body 19, capacitor is mounted on the upper surface of shell 19, and three layers of earth plate are isolated by inductance and capacitor layering,
Avoid the inductance of different layers and other layers of inductance, inductance and capacitor occur it is unnecessary couple, it is dry to generate parasitic or resonance
It disturbs, improves the filtering accuracy and Q value of filter.Meanwhile the configuration of the present invention is simple, it is mainly made of, adopts inductance and capacitor
It is sintered with LTCC Technology, easy to make, batch consistency is good, and cost is relatively low.
Ceramic material has the characteristic of excellent high frequency, high-speed transfer and broad passband, according to the difference of ingredient, ceramic material
The dielectric constant of material can change in very large range, with the use of high conductivity metal material as conductor material, favorably
In the quality factor for improving circuit system, the flexibility of circuit design is increased；
And it is possible to adapt to high current and high-temperature stability requirement, and has the heat more excellent than common PCB circuit substrate
Conductibility greatly optimizes the heat dissipation design of electronic equipment, and high reliablity can be applied to adverse circumstances, extends its use
Service life.
Further, including shell 19, the first welded disc 6, the second welded disc 7, capacitor Ca 12 and capacitor Cb 20
Element is all made of FV1206 encapsulation technology, and only earthing pole 10, input pole 17 and output stage 18 are exposed；
Specific package dimension is 3.2*1.6*0.94mm, ensure that the small size and ease for use of device, facilitates this filter
Welding is integrated in system；The earthing pole 10, input pole 17 and output stage 18 are made of copper material.
First layer earth plate 13, second layer earth plate 14 and third layer earth plate 15 are parallel with 19 bottom surface of shell, constitute
Multilayered structure is conducive to the layout of inductance element.
The input pole 17 and output stage 18 are the port of 50 Ω impedances, facilitate test.
The preparation flow of filter of the present invention as shown in figure 9, it is specific the preparation method is as follows:
Ingredient: selection ceramic raw materials formulation configures ceramic material；
Curtain coating: casting slurry is made in prepared ceramic material, is cast out ceramic substrate；
Punching and filling perforation: punching part ceramic substrate, obtains conductive column relief hole 16 and inductance connection hole 21, then
Filling perforation is carried out with metal paste；
Conductor printing: conductor printing is carried out with the ceramic substrate after filling perforation, the metal that preparation is used to form spiral inductance is led
Band is connected by the inductance connection hole 21 after filling perforation between same spiral inductance difference ceramic substrate layer；It is allowed with conductive column
The ceramic substrate in position hole 16 carries out conductor printing, forms the earth plate metal layer not contacted with conductive column；
Lamination: the ceramic substrate of the ceramic substrate for producing conductor and non-printed conductor is folded according to design structure
Piece forms the spiral inductance and earth plate of storied placement；
Equal static pressure: putting carry out in water Deng static pressure for the module for completing lamination, so as to by different layers green substrate tightly
Compression moulding is to form complete filter device；
Dumping and sintering: the module after equal static pressure is placed in sintering furnace and carries out dumping and sintering；
The connection of surface layer component: capacitor is attached on surface layer with the sintered module of dumping, is made low temperature co-fired
The variable band-pass filter of ceramics.
Specifically, relief hole 16 forms conductive column after filling silver paste, for connecting the device between different layers；Filling perforation
The raw material of metal conduction band used in metal paste and conductor printing used are all made of silver paste, the metal conduction band thickness of printing
It is 10 ± 1 microns；
It is to be understood that the thickness of metal conduction band is carried out by corresponding to the figure of printed conductor to each layer of ceramic substrate
Place's thickness reduction processing is formed, i.e., the thickness thinning of ceramic substrate is conductor printing thickness, corresponds to metal conduction band thickness；
When dumping and sintering, sintering furnace temperature control is 50 DEG C.
Casing of filter 19 is formed by stacking by multilayer ceramic substrate, and every layer of ceramic substrate passes through punching, filling perforation and conductor print
Brush forms the stacking arrangement of spiral inductance, earth plate and conductive column；
If spiral inductance includes multilayered structure, each layer of structure passes through for the metal conduction band of rectangle or 3/4 rectangular shape
Conductor is printed on ceramic substrate, and then multilayer ceramic substrate is superimposed, and the rectangular metal conduction band between this each layer structure is logical
The connection of inductance connection hole 21 is crossed, a unified spiral inductance is formed；The conductor printing of earth plate is to print entire ceramic substrate
, there is the place of conductive column and relief hole 16 on surface, and printed conductor is printed along 16 edge of relief hole, do not contacted with conductive column, but connect
Floor printing conductor extends out in 19 two sides of shell and contacts with earthing pole 10.
Feature and performance of the invention are described in further detail below with reference to embodiment.
A kind of miniaturization coupled mode variable band-pass filter that present pre-ferred embodiments provide is as shown in Figure 10 use
A kind of simulation result diagram of the invention may be implemented out of 250MHz~400MHz by changing the size of variable capacitance
The filtering at any point.And filtering accuracy is high, quality factor are good.
The foregoing is merely illustrative of the preferred embodiments of the present invention, the protection scope being not intended to limit the invention, any
Those skilled in the art within the spirit and principles in the present invention made by any modifications, equivalent replacements, and improvements etc.,
It should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of miniaturization inductive type variable band-pass filter characterized by comprising shell (19) is located at shell
(19) the input pole (17) at both ends and output stage (18), be located at the earthing pole (10) of shell (19) two sides and be located at shell (19)
Three layers of internal earth plate；
Contact bridge (11) are equipped between the earthing pole (10) of shell (19) two sides, three layers of earth plate connects with earthing pole (10)
Touching；Inductance La (1), inductance Lb (2) and inductance Ld (4) are equipped between first layer earth plate (13) and second layer earth plate (14),
It is equipped with inductance Lc (3) and inductance Le (5) between second layer earth plate (14) and third layer earth plate (15), is grounded close to third layer
Shell (19) outer wall surface of plate (15) is equipped with the first welded disc (6) and the second welded disc (7)；
Input pole (17), inductance La (1), inductance Lb (2), inductance Ld (4), output stage (18) are sequentially connected in series；Inductance La (1) and electricity
Feel the tie point of Lb (2), one end of inductance Lc (3), the first welded disc (6) one end between be equipped with the first conductive column (8), inductance
The tie point of Lb (2) and inductance Ld (4), one end of inductance Le (5), the second welded disc (7) one end between to be equipped with second conductive
Column (9)；The other end of inductance Lc (3) and the other end of inductance Le (5) are connected with earthing pole (10) respectively, the first welded disc
(6) other end connection capacitor Ca (12) connects earthing pole (10) afterwards, and the other end of the second welded disc (7) connects capacitor Cb (20)
Connect earthing pole (10) afterwards；
The relief hole (16) passed through for conductive column is equipped on the second layer earth plate (14), third layer earth plate (15).
2. a kind of miniaturization inductive type variable band-pass filter according to claim 1, it is characterised in that: the electricity
Feeling La (1), inductance Lb (2), inductance Lc (3), inductance Ld (4) and inductance Le (5) is spiral inductance, each layer of spiral inductance
It is all the rectangle or 3/4 rectangle turned to by metal conduction band, capacitor Ca (12) and capacitor Cb (20) are tunable capacitor；
The inductance La (1) is consistent with inductance Ld (4) structure, and inductance Lc (3) and inductance Le (5) are full symmetric about Z axis, mutually
Coupling.
3. a kind of miniaturization inductive type variable band-pass filter according to claim 1, it is characterised in that: the shell
Body (19) is made of low-temperature co-fired ceramics, and inductance and earth plate are sintered in ceramic substrate；Including shell (19), the first welded disc
(6), the element including the second welded disc (7), capacitor Ca (12) and capacitor Cb (20) is all made of FV1206 encapsulation, earthing pole
(10), pole (17) are inputted and output stage (18) is exposed.
4. a kind of miniaturization inductive type variable band-pass filter according to claim 1, it is characterised in that: the shell
Body (19) is rectangular figure modelling, and first layer earth plate (13), second layer earth plate (14) and third layer earth plate (15) are and shell
Body (19) bottom surface is parallel；
Input pole (17) and output stage (18) are the port of 50 Ω impedances.
5. a kind of preparation method for minimizing inductive type variable band-pass filter, which is characterized in that preparation step includes:
Ingredient: selection ceramic raw materials formulation configures ceramic material；
Curtain coating: casting slurry is made in prepared ceramic material, is cast out ceramic substrate；
Punching and filling perforation: punching part ceramic substrate, obtains conductive column relief hole (16) and inductance connection hole (21), then
Filling perforation is carried out with metal paste；
Conductor printing: conductor printing is carried out with the ceramic substrate after filling perforation, preparation is used to form the metal conduction band of spiral inductance, together
Pass through inductance connection hole (21) connection after filling perforation between one spiral inductance difference ceramic substrate layer；With with conductive column relief hole
(16) ceramic substrate carries out conductor printing, forms the earth plate metal layer not contacted with conductive column；
Lamination: the ceramic substrate of the ceramic substrate and non-printed conductor that produce conductor is subjected to lamination, shape according to design structure
At the spiral inductance and earth plate of storied placement；
Equal static pressure: the module for completing lamination is put into carry out in water Deng static pressure, tightly to suppress different layers green substrate
Molding is to form complete filter device；
Dumping and sintering: the module after equal static pressure is placed in sintering furnace and carries out dumping and sintering；
The connection of surface layer component: capacitor is attached on surface layer with the sintered module of dumping, and low-temperature co-fired ceramics is made
Variable band-pass filter.
6. a kind of preparation method for minimizing inductive type variable band-pass filter according to claim 5, feature
Be: the raw material of the metal paste and metal conduction band is silver paste, and the conductor thickness of printing is 10 ± 1 microns.
7. a kind of preparation method for minimizing inductive type variable band-pass filter according to claim 5, feature
Be: when carrying out dumping and sintering in the dumping and sintering step, in sintering furnace, sintering furnace temperature is 50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910334810.3A CN110022133B (en) | 2019-04-24 | 2019-04-24 | Small inductance coupling type adjustable band-pass filter and preparation method thereof |
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| CN111525219A (en) * | 2020-05-27 | 2020-08-11 | 电子科技大学 | Adjustable band-stop filter |
| CN113411069A (en) * | 2021-06-03 | 2021-09-17 | 成都频岢微电子有限公司 | Bulk acoustic wave filter device and method for improving out-of-band rejection |
| WO2024077964A1 (en) * | 2022-10-10 | 2024-04-18 | 深圳威迈斯新能源股份有限公司 | Multi-layer structure filter and vehicle onboard power supply dc/dc conversion apparatus |
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| CN111525219B (en) * | 2020-05-27 | 2021-04-20 | 电子科技大学 | Adjustable band-stop filter |
| CN113411069A (en) * | 2021-06-03 | 2021-09-17 | 成都频岢微电子有限公司 | Bulk acoustic wave filter device and method for improving out-of-band rejection |
| WO2024077964A1 (en) * | 2022-10-10 | 2024-04-18 | 深圳威迈斯新能源股份有限公司 | Multi-layer structure filter and vehicle onboard power supply dc/dc conversion apparatus |
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| CN110022133B (en) | 2022-07-15 |
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