CN110021542B - Container door plate supporting structure - Google Patents
Container door plate supporting structure Download PDFInfo
- Publication number
- CN110021542B CN110021542B CN201810274351.XA CN201810274351A CN110021542B CN 110021542 B CN110021542 B CN 110021542B CN 201810274351 A CN201810274351 A CN 201810274351A CN 110021542 B CN110021542 B CN 110021542B
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- Prior art keywords
- container
- gasket
- door panel
- container door
- angle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a container door plate supporting structure, which comprises a container with an opening; a door plate which is covered with the opening; the supporting piece is arranged on the door plate; and a plurality of holding units closely arranged on the holding member, each holding unit comprising: a spacer; at least one convex angle arranged on the gasket; at least one reentrant angle arranged on the pad; and at least two elastic arms connected with the left and right sides of the gasket.
Description
Technical Field
The invention relates to a container door plate supporting structure technology, in particular to a container door plate supporting structure which is formed into a star-shaped structure through a round angle petal-shaped part, at least one convex angle, at least one concave angle and a gasket.
Background
In the conventional semiconductor industry, storage and transportation of Guan Bao plate-like articles such as wafers, masks and substrates play an important role. The yield of the whole semiconductor process is affected by the adhesion of micro particles to components such as wafers, masks or substrates or the occurrence of collisions and defects due to storage and transportation.
For these reasons, a number of containers are currently designed specifically for such containers requiring high precision dust-free handling for storing or carrying the associated wafer, reticle or substrate, etc. Guan Bao plate-like articles. Referring to fig. 1, fig. 1 is a schematic view of a conventional container door panel supporting structure.
In the conventional container, such as the front opening unified pod (Front Opening Unified Pod, FOUP) as illustrated in fig. 1, the structure includes a container 10, one side of the container 10 has an opening 12 for wafer input and output, and a plurality of slots 11 are provided in the container for receiving a plurality of wafers. A door 20, which covers the opening 12 of the container 10, is used to protect a plurality of wafers inside the container 10.
The door panel 20 has an outer surface 24 and an inner surface 22, and the outer surface 24 of the door panel 20 may be provided with at least one latch structure (not shown) for opening or closing the container 10.
In the prior art, the inner surface 22 of the door 20 is generally provided with a supporting member 30 disposed on the inner surface 22 of the door 20 near the center line of the door 20, and a plurality of supporting units 32 are closely arranged on the supporting member 30 to prevent the wafer from being displaced or moving toward the center of the opening 12 due to vibration.
In the technique of fig. 1, the plurality of supporting units 32 are disposed to clamp two symmetrical points on the wafer in a double-arm manner so as to limit breakage caused by vibration of the wafer. However, the existing mechanism design has many disadvantages, including complex mechanism of double-arm design and high die opening cost, no matter what the clamping or supporting design is.
In addition, the dual arm design increases the area of contact with the plurality of holding units 32 when they hold or clamp the wafer. This may result in increased risk of particles being generated or, in the case of uneven stress, the wafer being broken or falling into the gap between the plurality of holding units 32.
Disclosure of Invention
The invention provides a container door plate supporting structure, which aims to solve the problems that a wafer limiting piece of a wafer box in the prior art is complex in structure, and wafers are easy to sink into gaps among the limiting pieces to cause damage to the wafers. In order to achieve the above-mentioned object, the present invention provides a container door panel supporting structure, which includes a container having an opening; a door plate which is covered with the opening; the supporting piece is arranged on the door plate; and a plurality of holding units closely arranged on the holding member, each holding unit comprising: a spacer; at least one convex angle arranged on the gasket; at least one reentrant angle arranged on the pad; and at least two elastic arms connected with the left and right sides of the gasket.
The plurality of abutting units closely adjacent to each other closely approach each other through the at least one convex angle and the at least one concave angle, and the at least one convex angle and the at least one concave angle on each gasket are equal in number. The gaskets comprise at least one convex corner and at least one concave corner, so that gaps among the gaskets are irregular, and the phenomenon that the thin plate-shaped articles such as wafers or substrates are damaged due to the fact that the thin plate-shaped articles are suddenly vibrated in the transportation process are avoided. In addition, reducing the contact area between the wafer, the substrate and other articles and the plurality of supporting units is one of the effects of the invention.
The foregoing has outlined rather broadly the several features of the present invention in order that the detailed description of the invention may be better understood. The summary of the invention is not an extensive overview of the invention, and is intended to neither identify key or critical elements of the invention nor delineate the scope of the invention, but merely to present several concepts of the invention in a simplified manner.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a prior art container door panel retaining structure;
FIG. 2 is a schematic view of the inner surface of a door panel according to a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a holding unit according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view of the inner surface of a door panel according to another preferred embodiment of the present invention;
fig. 5 is a schematic view of a holding unit according to another embodiment of the invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The container 10 according to the embodiment of the present invention can refer to the container illustrated in fig. 1, and mainly comprises a container 10, wherein an opening 12 is provided on one side of the container 10 for wafer input and output, and a plurality of slots 11 are provided inside the container for accommodating a plurality of wafers; a door 20, which covers the opening 12 of the container 10 to protect a plurality of wafers inside the container 10, the door 20 has an outer surface 24 and an inner surface 22, and the outer surface 24 of the door 20 may be provided with at least one latch structure (not shown) for opening or closing the container 10.
Referring to fig. 2, fig. 2 is a schematic view of the inner surface of a door panel according to a preferred embodiment of the invention. Based on the structure of the container 10 provided in fig. 1, fig. 2 of the present invention discloses an abutment 30 according to an embodiment of the present invention, which is disposed on the inner surface 22 of the door panel 20 near the center line of the door panel 20; and a plurality of holding units 32 closely arranged on the holding member 30 for preventing the wafer from being displaced or moving toward the center of the opening 12 due to vibration.
In this embodiment, the container 10 is a front opening unified pod (Front Opening Unified Pod, FOUP), while in other possible embodiments, the container 10 may also be a standard pod (Standard Mechanical Interface, SMIF) or a front opening unified pod (Front Opening Shipping Box, FOSB), or the like. Any sheet container 10 or carrier to which the structure of the present invention can be applied should be included in the scope of the present invention, and the present invention is not limited to the kind of container 10.
As shown in the embodiment, the container 10 for storing wafers is a front opening unified pod (Front Opening Unified Pod, FOUP), the number of slots 11 provided therein is 13, and the number of holding units 32 arranged on the holding member 30 is also 13.
In the present embodiment, the number of wafers that can be accommodated in the container 10 is 13 (13 Slots), and in other possible embodiments, the number of Slots 11, the number of holding units 32, and the number of wafers that can be accommodated in the container 10 may be greater than or less than 13, which should not be limited to the present invention.
Referring to fig. 2 and 3, fig. 3 is a schematic diagram of a holding unit according to a preferred embodiment of the invention. In this embodiment, the inner surface 22 of the door 20 is further provided with a groove 26 near the center line for engaging the supporting member 30, and the groove 26 is mainly used for buffering a plurality of wafers inside the container 10, and reducing the front-rear diameter of the whole container 10.
In the present embodiment, each of the holding units 32 closely arranged on the holding member 30 includes a spacer 32a; at least one lobe 32b is disposed on the spacer 32a, and each of the at least one lobes 32b projects from the spacer 32a by a distance of about 7-9 millimeters (mm), preferably 9 millimeters (mm).
At least one reentrant corner 32c disposed on the gasket 32a, and each of the at least one reentrant corner 32c is recessed into the gasket 32a by a distance of about 7-9 millimeters (mm), preferably 9 mm; and two elastic arms 32d respectively connected to the left and right sides of the pad 32 a.
In this embodiment, the elastic arm 32d is configured to be arc-shaped, so as to support the spacer 32a, such that the spacer 32a is spaced from the door panel 20 by a distance of about 9 millimeters (mm).
Therefore, when the door 20 and the container 10 are covered in the present embodiment, the wafer abutting against the pad 32a can be buffered by the two elastic arms 32d on the left and right sides of the pad 32 a. Wherein the plurality of abutting units 32 are closely adjacent to each other, the spacers 32a are closely adjacent to each other through the at least one convex corner 32b and the at least one concave corner 32c, and the at least one convex corner 32b and the at least one concave corner 32c on each spacer 32a are equal in number; more precisely, since each shim 32a must be assembled end-to-end, the at least one lobe 32b between two adjacent shims 32a must be in a consistent amount with the at least one valley 32c so that they are in consistent engagement.
When the door 20 and the container 10 are ready to be covered, the wafers accommodated in the container 10 are firstly contacted with the gasket 32a of the supporting unit 32, and meanwhile, the two elastic arms 32d are driven to deform, so that the two elastic arms 32d are recessed inwards towards the groove 26 of the inner surface 22 of the door 20, and when each wafer accommodated in the container 10 is completely covered by the door 20 and the container 10, the wafers can be firmly supported on the gasket 32a and limited to move towards the opening 12.
In addition, by the structure of the at least one convex corner 32b and the at least one concave corner 32c on the spacer 32a, and the at least one convex corner 32b and the at least one concave corner 32c enable the spacers 32a to be closely adjacent to each other, the wafer can be prevented from being damaged or broken due to the fact that the wafer is suddenly vibrated to generate the dislocation in the transportation process and falls into the gap between the spacers 32 a.
Referring to fig. 4, an inner surface of a door panel according to another embodiment of the invention is shown. In the present embodiment, each of the holding units 32 closely arranged on the holding member 30 includes: a spacer 32a; at least one lobe 32b provided on said spacer 32a, and each of said at least one lobe 32b projects from said spacer by a distance of about 7-9 millimeters (mm), preferably by a distance of 9 millimeters (mm); at least one reentrant corner 32c disposed on the pad 32a, and each of the at least one reentrant corner 32c is recessed into the pad 32a by a distance of about 7-9 millimeters (mm), preferably 9 millimeters (mm); and four elastic arms 32d ', wherein the elastic arms 32d ' are connected to the left and right sides of the gasket 32a, and each elastic arm 32d ' is arc-shaped to support the gasket 32a, so that the gasket 32a is spaced from the door panel 20 by a distance of about 9 millimeters (mm).
Similar to the embodiment of fig. 2 and 3, the single spring arm 32d' design of the embodiment of fig. 4 is a nearly continuous S-shaped mechanism design. Referring to fig. 5, fig. 5 is a schematic view of a holding unit according to another embodiment of the invention. The description of the embodiment of fig. 5 for a single spring arm 32d' is also applicable to the embodiments of fig. 2 and 3, and is not intended to be limiting. In the embodiment of fig. 5, the spring arm 32d 'is supported by the spring arm 32d' a first distance d1 through the first bend 41 having the opposite direction, and then the spacer 32a is supported by a second distance d2 through the second bend 42. In these embodiments, the sum of the first distance d1 and the second distance d2 is 9 millimeters (mm) from the spacer 32a to the door panel 20.
Therefore, when the door 20 and the container 10 are covered, the wafer abutting against the gasket 32a can be buffered by the four elastic arms 32d' on the left and right sides of the gasket 32 a. The abutting units 32 closely adjacent to each other pass through the at least one convex corner 32b and the at least one concave corner 32c to enable the gaskets 32a to be closely adjacent to each other, and the at least one convex corner 32b and the at least one concave corner 32c on each gasket 32a are equal in number.
The embodiment of fig. 4 employs four elastic arms 32d' connected to the left and right sides of the pad 32a, which can effectively and further prevent the seesaw movement generated by the pad 32a; thereby preventing the risk of rubbing or damage to the wafer even further. In addition, considering the possibility of bearing the spacer 32a, in the embodiment of fig. 2 to 3, the elastic arms 32d (32 d ') thereof may further include a support portion 32f disposed on a side of each elastic arm 32d' adjacent to the inner surface 22 of the door panel 20 as in the embodiment of fig. 5.
In the embodiment of fig. 5, the support portion 32f may be rounded triangle. Of course, the shape of the supporting portion 32f may be a geometric figure such as a circle or a rectangle, which is not limited by the present invention. The support portion 32f can provide additional support force applied to the elastic arm 32d' when the pad 32a is heavy in load bearing, so as to achieve better supporting effect.
In other possible embodiments, if the load-bearing capacity of the spacer 32a is further increased, a cross-shaped or isosceles cross rib may be disposed on the back surface of the spacer 32a (i.e., the side near the inner surface 22 of the door panel 20) with the center of gravity thereof as the intersection point. The structural thickness provided by the cross ribs further greatly enhances the load bearing capacity of the spacer 32a and its structural stability, and the present invention is not limited thereto.
Therefore, when the door 20 and the container 10 are ready to be covered, the wafers received in the container 10 are firstly contacted with the gasket 32a of the supporting unit 32, and the four elastic arms 32d 'are driven to deform, so that the four elastic arms 32d' are recessed inwards towards the groove 26 of the inner surface 22 of the door 20, and each wafer received in the container 10 can be stably supported on the gasket 32a and limited to move towards the opening 12 when the door 20 and the container 10 are completely covered.
The elastic arms 32d ' are respectively added to the left and right sides of the spacer 32a, so that the four elastic arms 32d ' deform and the process of driving the elastic arms 32d ' by the lever can be more stable. In addition, by the structure of the at least one convex corner 32b and the at least one concave corner 32c on the spacer 32a, and the at least one convex corner 32b and the at least one concave corner 32c enable the spacers 32a to be closely adjacent to each other, the wafer can be prevented from being damaged or broken due to the fact that the wafer is suddenly vibrated to generate the dislocation in the transportation process and falls into the gap between the spacers 32 a.
In addition, in the case of a wafer having a circular shape, the small particles generated by friction can be effectively reduced by the design of single-point contact with the pad 32a and further reduction of the contact area.
In the above embodiments, the spacer 32a may further include four rounded lobes 32e, which are disposed around the spacer 32a in pairs, and the rounded lobes 32e on both sides of the at least one lobe 32b are symmetrical to each other; the rounded lobes 32e on both sides of the at least one reentrant corner 32c are symmetrical to each other, and the four rounded lobes 32e, the at least one lobe 32b, the at least one reentrant corner 32c and the gasket 32a together form a starburst structure.
The star-shaped structure in this embodiment refers to a rounded lobe 32e, at least one lobe 32b, at least one concave angle 32c, and a spacer 32a, wherein the distances between the center of gravity of the spacer 32a and each rounded lobe 32e and the at least one lobe 32b are approximately equal, so as to reduce the moment variation when uneven stress is applied, and further reduce the risk of damage to the supporting unit 32.
In other possible embodiments, the pads 32a may also be triangular, pentagonal or other irregular shapes having at least one convex corner 32b and at least one concave corner 32c, which should not be limited by the present invention, and the purpose of the present invention is to avoid the wafer from being damaged due to the gap between the pads 32a caused by the sudden vibration of the wafer during transportation.
In the embodiment of fig. 2 to 5, the plurality of supporting units 32 may be integrally formed elastic structures, such as thermoplastic elastic structures, which can achieve the deformation of at least two elastic arms 32d (32 d') so that the wafer can be stably supported on the pad 32a, and the elastic structures also have the function of shock absorption, so as to prevent the wafer from being ectopic or moving toward the opening 12 of the container 10 due to sudden shock. The plurality of holding units 32 are closely arranged on the holding member 30, and the holding member 30 is engaged with the groove 26 on the inner surface 22 of the door panel 20. In other embodiments possible in accordance with the concepts of the present invention, the abutment 30 may be integrally formed directly with the inner surface 22 of the door panel 20.
In other possible embodiments, the pad 32a may be coated with a wear-resistant consumable material, such as Polyetheretherketone (PEEK), to reduce friction and particulate dust generation. The height and width of the spacers 32a may be greater than the thickness of the wafer to avoid the wafer moving up and down and sinking into the gaps between the spacers 32 a.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (12)
1. The utility model provides a container door plant supports and holds structure which characterized in that, container door plant supports and holds the structure includes:
a container having an opening;
a door plate which is covered with the opening;
the supporting piece is arranged on the door plate;
and a plurality of holding units closely arranged on the holding member, each holding unit comprising: a spacer;
at least one convex angle arranged on the gasket;
at least one reentrant angle arranged on the pad;
at least two elastic arms connected with the left and right sides of the pad;
the plurality of abutting units closely adjacent to each other closely approach each other through the at least one convex angle and the at least one concave angle, and the at least one convex angle and the at least one concave angle on each gasket are equal in number.
2. The container door panel retaining structure of claim 1, wherein the container is a front opening standard wafer cassette.
3. The container door panel retaining structure of claim 1, wherein the door panel further comprises a groove, and the groove engages the retaining member.
4. The container door panel abutment structure of claim 1, wherein each of said at least one lobe projects a distance of 7-9 millimeters from said spacer.
5. The container door panel abutment structure of claim 1, wherein each of said at least one reentrant angle is recessed a distance of 7-9 millimeters into said gasket.
6. The container door panel abutment structure of claim 1, wherein the abutment member has a thickness of 9 millimeters.
7. The container door panel supporting structure of claim 1, wherein the at least two elastic arms are arc-shaped, and the at least two elastic arms support the gasket to a distance of 9 mm from the door panel.
8. The container door panel retaining structure of claim 1, wherein the gasket further comprises four rounded lobes, each pair being disposed about the periphery of the gasket.
9. The container door panel abutment structure of claim 8, wherein said rounded lobes on either side of said at least one lobe are symmetrical to one another and said rounded lobes on either side of said at least one recess are symmetrical to one another.
10. The container door abutment structure of claim 8, wherein said gasket further comprises a star-shaped structure, said star-shaped structure being defined by said four rounded lobes, at least one convex corner, at least one concave corner, and said gasket.
11. The container door panel supporting structure according to claim 1, wherein the bottom surface of each of the at least two elastic arms is further provided with at least one supporting portion.
12. The container door abutment structure of claim 1, wherein the back surface of the gasket is further provided with a cross rib.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107100691A TWI641071B (en) | 2018-01-08 | 2018-01-08 | Container door retaining structure |
| TW107100691 | 2018-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110021542A CN110021542A (en) | 2019-07-16 |
| CN110021542B true CN110021542B (en) | 2023-10-03 |
Family
ID=65034286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810274351.XA Active CN110021542B (en) | 2018-01-08 | 2018-03-29 | Container door plate supporting structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110021542B (en) |
| TW (1) | TWI641071B (en) |
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| JPH09107026A (en) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | Wafer cassette for wafer receiving container |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110021542A (en) | 2019-07-16 |
| TWI641071B (en) | 2018-11-11 |
| TW201931503A (en) | 2019-08-01 |
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