CN110021534B - Wafer surface flatness detection device capable of avoiding false flaws - Google Patents
Wafer surface flatness detection device capable of avoiding false flaws Download PDFInfo
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- CN110021534B CN110021534B CN201910165714.0A CN201910165714A CN110021534B CN 110021534 B CN110021534 B CN 110021534B CN 201910165714 A CN201910165714 A CN 201910165714A CN 110021534 B CN110021534 B CN 110021534B
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- 238000001514 detection method Methods 0.000 title claims abstract description 19
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 24
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 230000007547 defect Effects 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 51
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a wafer flow sheet surface flatness detection device capable of avoiding false flaws, which structurally comprises a test rack, a scanning plate and a conveying table, wherein the test rack is connected with a scanning plate rail, a threaded rod is in threaded connection with the scanning plate, the threaded rod is installed on the test rack, the test rack is locked with the conveying table, the conveying table consists of a surrounding frame, a lock hole, a lock plate and an internal device, the surrounding frame is provided with the lock hole and the lock plate, and the internal device is installed on the surrounding frame. The secondary maintenance of qualified products is avoided, the processing cost is reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a wafer flow sheet surface flatness detection device capable of avoiding false flaws.
Background
The detection of the flatness of the surface of the wafer is required by photoetching and is considered for the performance of integrated circuit manufacturing; tape-out refers to the fabrication of chips through a series of process steps like a flow line; in the field of integrated circuit design, "tape-out" refers to "test production", that is, after a circuit is designed, dozens of chips are produced for testing, and if the test is passed, the mass production is started as it is.
In the prior art, when a wafer is processed, dust falls or fine parts fall on the wafer frequently, so that the data of equipment during processing and scanning the wafer is inaccurate, the wafer with qualified quality is judged to be a defective product, the qualified product is subjected to secondary maintenance, the processing cost is increased, and the production efficiency is reduced.
Disclosure of Invention
The invention mainly aims to overcome the defects of the prior art and provide a wafer flow sheet surface flatness detection device capable of avoiding false flaws, so as to solve the problems that during wafer processing, dust often falls off or fine parts fall on a wafer, so that data is inaccurate during wafer processing and scanning by equipment, wafers with qualified quality are judged to be defective products, qualified products are subjected to secondary maintenance, the processing cost is increased, and the production efficiency is reduced.
The invention is realized by adopting the following technical scheme: the utility model provides an avoid wafer class piece surface smoothness detection device of false flaw, its structure includes test jig, scanning board, carries the platform, test jig and scanning board left and right sides rail coupling, the screw hole of scanning board and the external screw thread connection of threaded rod, the test jig is installed at both ends about the threaded rod, the test jig with carry the locking of platform bottom, carry the platform to constitute by enclosing frame, lockhole, jam plate, internal device, enclose the frame side and installed lockhole, jam plate, internal device installs and encloses inside the frame.
Further preferably, the internal device comprises an internal frame, a lifting device, an internal scanning device and a storage bin, wherein the inner side surface of the internal frame is welded with the lifting device, the internal scanning device is installed at the upper right corner of the internal frame, and the storage bin is arranged at the lower right corner of the internal frame.
Preferably, the lifting device comprises a lifting fixing rod, a welding ball and a lifting moving rod, the left end and the right end of the welding rod are welded with the welding ball, the lifting fixing rod and the lifting moving rod penetrate through a through hole of the welding ball, and an elastic buckling circle is locked on the front side surface of the lifting fixing rod.
Further preferably, the internal scanning device comprises a side scanning frame and a moving driver, and the lower surface of the side scanning frame is attached to the upper end face of the moving driver.
Further preferably, the side scanning frame comprises a sickle frame, a sickle scanner and a cross frame, the sickle scanner is installed on the arc surface on the left side of the sickle frame, and the sickle frame is locked with the left end of the cross frame.
Further preferably, the mobile transmission device comprises a fixed rail welding frame, a bonding pad, a transmission belt and a transmission belt pulley, the bonding pad is welded to the bottom of the fixed rail welding frame, the ring end of the bonding pad is welded to the transmission belt pulley, and the transmission belt is attached to the inner side face of the transmission belt pulley.
Further preferably, the sickle frame and the sickle scanner are of arc structures, the sickle scanner is movably connected to the arc surface on the left side of the sickle frame, the cross frame is of an L-shaped structure, and the right side face of the cross frame is attached to the inner side face of the inner frame and is in track connection with the inner side face of the inner frame.
Advantageous effects
The invention installs the detection device on the production line equipment, when the wafer is conveyed to the detection device, the scanning board scans the wafer, if the wafer is qualified, the wafer is conveyed to the next procedure on the conveying platform, if the defective product is detected, the internal device operates, the lifting moving rod moves downwards to drive the wafer to move downwards, the internal scanning device performs secondary scanning detection on the wafer, when the internal scanning device operates, the moving driver drives the side scanning frame to move, the scanning distance is shortened, the scanning accuracy is improved, when the wafer is scanned, the sickle-shaped scanner moves upwards and downwards along the left arc surface of the sickle frame, the scanning is more comprehensive, then the internal scanning device judges whether the wafer is false defect (the side scanning detection can more accurately judge whether the wafer and dust or fine parts are in a separation state, if the wafer and dust or fine parts are in a separation state, the wafer and the wafer are false defect), if the wafer and the lifting device lifts the wafer to return to the next procedure, if the non-false flaw (namely the defective product) is detected, the wafer is directly conveyed to the next procedure from the lower moving part for reworking, and after the conveying is finished, the lifting device integrally ascends to return, so that a new wafer can be conveniently processed and scanned.
Compared with the prior art, the invention has the beneficial effects that: the wafer carries out line processing and scans through the scanning board when detecting device and detects, if for the certified products then continue to carry to next process on carrying the bench, if detect out defective products, interior device moves, carries out secondary scanning through interior scanning device and detects, and interior scanning device's side scanning can be more accurate judgement whether for the false flaw, avoids causing and carries out secondary maintenance to the certified products, has reduced the processing cost, has improved production efficiency.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a wafer flow sheet surface flatness detecting apparatus for avoiding false defects according to the present invention.
Fig. 2 shows a schematic view of the structure of the internal device of the present invention.
Fig. 3 is a schematic structural diagram of the internal apparatus of the present invention, which is also a schematic structural diagram of the wafer being moved downward by the lifting/lowering moving rod.
Fig. 4 shows a schematic structural view of the lifting device of the present invention.
Fig. 5 shows a schematic view of the structure of the internal scanning device of the present invention.
Fig. 6 shows a schematic structural view of the side gantry of the present invention.
Fig. 7 shows a schematic view of the structure of the movement actuator of the invention.
Fig. 8 shows a schematic structural diagram of the side scanning frame and the orbit welding frame of the invention.
Fig. 9 is a schematic structural diagram of the detecting apparatus of the present invention, which is also a schematic structural diagram of the lifting moving rod moving downward to drive the wafer to move downward.
In the figure: the test apparatus comprises a test rack 1, a scan plate 2, a conveying table 3, a threaded rod 20, a frame 30, a lock hole 31, a lock plate 32, an internal device 33, an internal frame 330, a lifting device 331, an internal scan device 332, a storage 333, a lifting fixing rod 3310, a welding rod 3311, a welding ball 3312, a lifting moving rod 3313, an elastic buckling circle 33100, a side scan rack 3320, a moving driver 3321, a sickle rack 33200, a sickle scanner 33201, a cross rack 33202, a fixed rail weld rack 33210, a welding pad 33211, a driving belt 33212 and a driving belt wheel 33213.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides a wafer flow sheet surface flatness detecting apparatus for avoiding false defects, which comprises: the structure of the device comprises a test rack 1, a scanning plate 2 and a conveying table 3, wherein the test rack 1 is in orbital connection with the scanning plate 2, the scanning plate 2 is in threaded connection with a threaded rod 20, the threaded rod 20 is installed on the test rack 1, the scanning plate 2 can be lifted, the scanning plate 2 is close to the wafer, the scanning accuracy is improved, the test rack 1 is locked with the conveying table 3, the conveying table 3 is composed of an enclosing frame 30, a lock hole 31, a lock plate 32 and an internal device 33, the enclosing frame 30 is provided with the lock hole 31 and the lock plate 32, the internal device 33 is installed on the enclosing frame 30, the lock hole 31 and the lock plate 32 are used for realizing the connection and installation of a detection device and production equipment, the internal device 33 comprises an internal frame 330, a lifting device 331, an internal scanning device 332 and a storage bin 333, the internal frame 330 is welded with the lifting device 331, the internal scanning device 332 is installed on the internal frame 330, the internal frame 330 is provided with a storage bin 333, the lifting device 331 comprises a lifting fixing rod 3310, a welding rod 3311, a solder ball 3312 and a lifting moving rod 3313, the welding rod 3311 is welded with the solder ball 3312, the lifting fixing rod 3310 and the lifting moving rod 3313 pass through the solder ball 3312, the lifting fixing rod 3310 is locked with an elastic buckling circle 33100, the lifting moving rod 3313 drives the solder ball 3312 to move downwards, the elastic buckling circle 33100 fixes the solder ball 3312 after moving downwards through the elasticity and the buckling function of the elastic buckling circle 33100, the internal scanning device 332 comprises a side scanning frame 3320 and a moving actuator 3321, the side scanning frame 3320 is attached to the moving actuator 3321, the side scanning frame 3320 comprises a sickle frame 33200, a sickle-shaped scanner 33201 and a cross frame 33202, the sickle-shaped scanner 33201 is mounted on the sickle frame 33200, the sickle frame 33200 is locked with the cross frame 33202, the moving actuator 3321 comprises a fixed rail welding frame 33210, a welding pad 33211, a transmission belt 33212, The wafer side scanning device comprises a transmission belt pulley 33213, a welding pad 33211, a fixed rail welding frame 33210 and the transmission belt pulley 33213, wherein the transmission belt 33212 is attached to the transmission belt pulley 33213, the fixed rail welding frame 33210 conveys a cross frame 33202 in a clamping auxiliary mode, the stability is good, the cross frame 33200 and a sickle scanner 33201 are of arc-shaped structures, the wafer side can be scanned more comprehensively, the sickle scanner 33201 is movably connected to the cross frame 33200, the cross frame 33202 is of an L-shaped structure, the cross frame 3320 can extend for moving a longer distance, the cross frame 33202 is attached to an inner frame 330 and is in rail connection with the inner frame 330, the moving stability of the cross frame 33202 is improved, and the scanning accuracy of the side scanning frame 3320 is higher.
The detection device is installed on the production line equipment, when the wafer is conveyed to the detection device, the scanning plate 2 scans the wafer, if the wafer is qualified, the wafer is conveyed to the next procedure on the conveying table 3, if the defective product is detected, the internal device 33 operates, the lifting moving rod 3313 moves downwards to drive the wafer to move downwards, the internal scanning device 332 performs secondary scanning detection on the wafer, when the internal scanning device 332 operates, the moving driver 3321 drives the side scanning frame 3320 to move, the scanning distance is shortened, the scanning accuracy is improved, the sickle-shaped scanner 33201 moves upwards and downwards on the sickle-shaped frame 33200 along the left arc surface of the sickle-shaped frame 33200 during scanning, the scanning is more comprehensive, then the internal scanning device 332 judges whether the wafer is a false defect (the side scanning detection can more accurately judge whether the wafer is separated from dust or fine parts, if the wafer is the false defect), if the wafer is a false defect, the lifting device 331 will lift and return to the next process, and if the wafer is a non-false defect (i.e. a defective product), the wafer will be directly conveyed from the lower position to the next process for rework, and after the conveyance, the lifting device 331 will lift and return to the original position as a whole, so as to facilitate the processing and scanning of a new wafer.
Compared with the prior art, the invention has the technical progress that: the wafer carries out line processing and scans through scanning board 2 when detecting device and detects, if for the certified products then continue to carry to next process on carrying platform 3, if detect out defective products, interior device 33 moves, carries out secondary scanning through interior scanning device 332 and detects, and the side scanning of interior scanning device 332 can be more accurate judgement whether for the false flaw, avoids causing and carries out secondary maintenance to the certified products, has reduced the processing cost, has improved production efficiency.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (1)
1. The utility model provides an avoid wafer class piece surface smoothness detection device of false flaw, its structure includes test jig (1), scanning board (2), carries platform (3), test jig (1) and scanning board (2) rail connection, scanning board (2) threaded connection has threaded rod (20), threaded rod (20) are installed on test jig (1), test jig (1) and carry platform (3) locking, its characterized in that:
the conveying table (3) consists of an enclosing frame (30), a lock hole (31), a lock plate (32) and an internal device (33), the enclosing frame (30) is provided with the lock hole (31) and the lock plate (32), and the internal device (33) is arranged on the enclosing frame (30);
the internal device (33) comprises an internal frame (330), a lifting device (331), an internal scanning device (332) and a storage bin (333), the internal frame (330) is welded with the lifting device (331), the internal scanning device (332) is installed on the internal frame (330), the internal frame (330) is provided with the storage bin (333), the lifting device (331) comprises a lifting fixing rod (3310), a welding rod (3311), a welding ball (3312) and a lifting moving rod (3313), the welding rod (3311) is welded with the welding ball (3312), the lifting fixing rod (3310) and the lifting moving rod (3313) penetrate through the welding ball (3312), and the lifting fixing rod (3310) is locked with an elastic buckling circle (33100);
the internal scanning device (332) comprises a side scanning frame (3320), a mobile actuator (3321), the side scanning frame (3320) is attached to the mobile actuator (3321), the side scanning frame (3320) comprises a sickle (33200), a sickle scanner (33201) and a cross frame (33202), the sickle scanner (33201) is installed on the sickle (33200), the sickle (33200) is locked with the cross frame (33202), the mobile actuator (3321) comprises an orbit welding frame (33210), a pad (33211), a transmission belt (33212) and a transmission belt pulley (33213), the pad (33211) is welded with the orbit welding frame (33210) and the transmission belt pulley (33213), the transmission belt (33212) is attached to the transmission belt pulley (33213), the sickle (33200) and the sickle scanner (33201) are of an arc structure, the sickle scanner (33201) is movably connected to the sickle (33200), and the cross frame (33202) is of an L-shaped structure, the cross frame (33202) is attached to the inner frame (330) and connected with the rails;
the detection device is arranged on the production line equipment, when the wafer is conveyed to the detection device, the wafer is scanned by the scanning plate (2), if the wafer is qualified, the wafer is continuously conveyed to the next procedure on the conveying table (3), if the defective product is detected, the internal device (33) operates, the lifting moving rod (3313) moves downwards to drive the wafer to move downwards, the wafer is scanned and detected for the second time by the internal scanning device (332), when the internal scanning device (332) operates, the moving driver (3321) drives the side scanning frame (3320) to move, the scanning distance is shortened, the scanning accuracy is improved, the sickle-shaped scanner (33201) moves upwards and downwards on the sickle-shaped frame (33200) along the left arc surface of the sickle-shaped frame (33200) during scanning, the scanning is more comprehensive, then the internal scanning device 332 judges whether the wafer is a false defect or not, the side scanning judges that the wafer is separated from dust or fine parts, if the wafer is a false defect, the lifting device (331) lifts and returns to the next procedure to continue conveying the wafer to the next procedure, if the wafer is a false defect, the wafer is directly conveyed from the lower moving part to the next procedure to be reworked, and after the conveying is finished, the lifting device (331) integrally lifts and returns to facilitate the processing and scanning of a new wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910165714.0A CN110021534B (en) | 2019-03-06 | 2019-03-06 | Wafer surface flatness detection device capable of avoiding false flaws |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910165714.0A CN110021534B (en) | 2019-03-06 | 2019-03-06 | Wafer surface flatness detection device capable of avoiding false flaws |
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| CN110021534A CN110021534A (en) | 2019-07-16 |
| CN110021534B true CN110021534B (en) | 2021-05-18 |
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| CN114167335B (en) * | 2020-09-10 | 2022-10-18 | 长鑫存储技术有限公司 | Qualification inspection method and system for newly added detection tool |
| CN113035750B (en) * | 2021-03-02 | 2024-03-22 | 深圳鹏瑞智能科技股份有限公司 | Automatic loading and unloading wafer flaw measurement device and use method thereof |
| CN112893183B (en) * | 2021-03-02 | 2023-03-28 | 深圳鹏瑞智能科技有限公司 | Online continuous wafer flaw measurement method with abnormal data reminding function |
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| JP2007003459A (en) * | 2005-06-27 | 2007-01-11 | Tokyo Seimitsu Co Ltd | Flaw inspection device of image, visual examination device and flaw inspection method of image |
| US7371590B2 (en) * | 2005-11-21 | 2008-05-13 | General Electric Company | Integrated inspection system and defect correction method |
| JP4597155B2 (en) * | 2007-03-12 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | Data processing apparatus and data processing method |
| US9063097B2 (en) * | 2011-02-11 | 2015-06-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems and methods eliminating false defect detections |
| JP2016072335A (en) * | 2014-09-29 | 2016-05-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Process monitoring device and process monitoring method |
| CN109029335A (en) * | 2018-09-12 | 2018-12-18 | 江苏英锐半导体有限公司 | A kind of wafer flow surface smoothness detection device |
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