CN109979641A - Ultra-thin strong and weak conducting structures of one kind and preparation method thereof - Google Patents
Ultra-thin strong and weak conducting structures of one kind and preparation method thereof Download PDFInfo
- Publication number
- CN109979641A CN109979641A CN201910339372.XA CN201910339372A CN109979641A CN 109979641 A CN109979641 A CN 109979641A CN 201910339372 A CN201910339372 A CN 201910339372A CN 109979641 A CN109979641 A CN 109979641A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- weak
- cloth
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/30—Drying; Impregnating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Woven Fabrics (AREA)
Abstract
The present invention provides a kind of ultra-thin strong and weak conducting structures, including be stacked the first release layer, glue conductive layer, conductive weaving layer of cloth, weak viscous conductive layer and the second release layer by force, wherein, the conductive weaving layer of cloth is located between the conductive layer viscous by force, weak viscous conductive layer, the conductive layer viscous by force is located between first release layer, conductive weaving layer of cloth, and the weak viscous conductive layer is located between the conductive weaving layer of cloth, the second release layer.The present invention also provides a kind of preparation methods of ultra-thin strong and weak conducting structures.The beneficial effects of the present invention are: providing a kind of ultra-thin strong and weak conducting structures, there is fabulous caking property and high conductivity, thinner thickness, material is soft, and it is easily operated, short circuit is overcome, defect that is dead, being not easily stripped processing was bonded.
Description
Technical field
The present invention relates to conducting structures, more particularly to a kind of ultra-thin strong and weak conducting structures and preparation method thereof.
Background technique
In printed wiring board, in FPC operation processing, because its material and mounting process is special, plus designing
Space is limited, therefore the material requirements bonded to it has the features such as fabulous caking property, electric conductivity, Yi Chonggong, thin thickness,
Existing common conductive tape is unable to satisfy this application requirement in viscosity and electric conductivity, and it is bad, silver-colored electric conductivity usually occur
Transport phenomena generates short circuit, bonded it is dead, be not easily stripped processing.
Summary of the invention
In order to solve the problems in the prior art, the present invention provides a kind of ultra-thin strong and weak conducting structures and its preparation sides
Method.
The present invention provides a kind of ultra-thin strong and weak conducting structures, including be stacked the first release layer, strong viscous conduction
Layer, conductive weaving layer of cloth, weak viscous conductive layer and the second release layer, wherein the conductive weaving layer of cloth is located at the strong viscous conduction
Between layer, weak viscous conductive layer, the conductive layer viscous by force is located between first release layer, conductive weaving layer of cloth, described weak viscous
Conductive layer is located between the conductive weaving layer of cloth, the second release layer.
As a further improvement of the present invention, the conductive weaving layer of cloth includes fiber cloth, the positive and negative table of the fiber cloth
Face is plated with conductive metal layer.
As a further improvement of the present invention, the formula composition of the strong viscous conductive layer mainly includes high molecular polymer
50-100 parts, LE5-20 parts of conductive agent, 1-5 parts of expanded graphite, 0.5-2 parts of curing agent, 0.5-2 parts of modifying agent, levelling agent 1-5
Part, 0.5-2 parts of defoaming agent.
As a further improvement of the present invention, the formula composition of the weak viscous conductive layer mainly includes high molecular polymer
50-100 parts, 5-20 parts of conductive agent LB, 0.5-2 parts of curing agent, 0.5-2 parts of modifying agent, 1-5 parts of levelling agent, defoaming agent 0.5-2
Part.
As a further improvement of the present invention, the high molecular polymer is mainly that vinyl polysiloxane, polyisobutene are poly-
Close object, organic silicon rubber, polyurethane, methyl methacrylate, organopolysiloxane, epoxy resin, acrylate and polyamide
In resin any one or any combination thereof；The conductive agent be mainly bronze, silver powder, aluminium powder, copper powder, nickel powder, golden contracted payment,
Wicker copper, carbon nanotube, graphite, graphene, carbon fiber, in carbon black any one or any combination thereof；The modifying agent master
It to be any one in silane coupling agent, titante coupling agent, aluminate coupling agent or any combination thereof；The levelling
Agent be mainly organic silicon, in esters of acrylic acid any one or any combination thereof；The defoaming agent predominantly has mineral oil
Class, organic silicon, in polyethers any one or any combination thereof；The curing agent is mainly epoxies, amine, isocyanic acid
In esters any one or any combination thereof.
As a further improvement of the present invention, first release layer, the second release layer are that lamination release paper, PET are release
Any one in film, the thickness of the conductive weaving layer of cloth is between 0.025-0.030mm, the thickness of the strong viscous conductive layer
Degree is between 0.02-0.025mm, and the thickness of the weak viscous conductive layer is between 0.013-0.015mm.
The present invention also provides a kind of preparation methods of ultra-thin strong and weak conducting structures, are used to prepare as any one of above-mentioned
The described ultra-thin strong and weak conducting structures, wherein the preparation methods of ultra-thin power conducting structures the following steps are included:
S1, the conductive weaving layer of cloth of preparation, are electroplated respectively in the obverse and reverse of fiber cloth, form conductive metal layer；
S2, the strong viscous conductive layer of front preparation in conductive weaving layer of cloth, prepare weak viscous conductive layer in the reverse side of conductive weaving layer of cloth；
S3, lateral surface the first release layer of preparation in strong viscous conductive layer, prepare the second release layer in the lateral surface of weak viscous conductive layer.
As a further improvement of the present invention, in step s 2, the strong viscous conductive layer packet of the front preparation of conductive weaving layer of cloth
Include following steps:
S210, expanded graphite be added portionwise dispersion inside organic solvent, form uniform graphite dispersing solution；
S211,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 250 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S212, it the modification nickel powder of 250 mesh is charged first in macromolecule matrix stirs evenly, add graphite dispersing solution, stir
Uniformly, levelling agent, defoaming agent stirring 0.5-2h is added, obtains the first conductive mixture；
S213, the front that the first conductive mixture is coated in conductive weaving layer of cloth, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying winding obtain gluing conductive layer by force, and the viscosity of strong viscous conductive layer is between 800-1500g/inch.
As a further improvement of the present invention, the organic solvent in step S210 is mainly ethyl acetate, toluene, hexamethylene
Ketone, butanone, hexylene glycol, in propylene glycol any one or any combination thereof.
As a further improvement of the present invention, in step s 2, weak viscous conductive layer is prepared in the reverse side of conductive weaving layer of cloth
The following steps are included:
S220,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 300 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S221, the modification nickel powder of 300 mesh is added in macromolecule matrix, is stirred, add levelling agent, defoaming agent stirring 0.5-
1h obtains the second conductive mixture；
S222, the reverse side that the second conductive mixture is coated in conductive weaving layer of cloth, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying obtain weak viscous conductive layer, and the viscosity of weak viscous conductive layer is between 200-500g/inch.
The beneficial effects of the present invention are: through the above scheme, providing a kind of ultra-thin strong and weak conducting structures, having fabulous
Caking property and high conductivity, thinner thickness, material is soft, easily operated, overcomes short circuit, bonded it is dead, be not easily stripped plus
The defect of work.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of ultra-thin strong and weak conducting structures of the invention.
Specific embodiment
The invention will be further described for explanation and specific embodiment with reference to the accompanying drawing.
As shown in Figure 1, a kind of ultra-thin strong and weak conducting structures (claim conducting structures), including be stacked first from
Type layer 4, by force viscous conductive layer 2, conductive weaving layer of cloth 1, weak viscous conductive layer 3 and the second release layer 5, wherein the conduction textile cloth
Layer 1 is located between the conductive layer 2 viscous by force, weak viscous conductive layer 3, and the conductive layer 2 viscous by force is located at first release layer 4, leads
Between electrospinning nonwoven fabric layer 1, the weak viscous conductive layer 3 is located between the conductive weaving layer of cloth 1, the second release layer 5, conduction weaving
Layer of cloth 1, viscous conductive layer 2, weak viscous conductive layer 3, the first release layer 4, the second release layer 5 are arranged from the inside to the outside by force, conductive textile cloth
Layer 1 is middle layer, and strong viscous conductive layer 2, weak viscous conductive layer 3 are located at the outer layer of conductive weaving layer of cloth 1, and the first release layer 4 then position
In the outer layer of strong viscous conductive layer 2, the second release layer 5 is then located at the outer layer of weak viscous conductive layer 3, due to the first release layer 4, second from
The presence of type layer 5 can easily peel away structural body.
As shown in Figure 1, the conductive weaving layer of cloth 1 includes fiber cloth (i.e. non-woven fabrics), the positive and negative surface of the fiber cloth
It is plated with conductive metal layer, increases electric conductivity.
As shown in Figure 1, the formula composition of the strong viscous conductive layer 2 mainly includes 50-100 parts of high molecular polymer, it is conductive
LE5-20 parts of agent, 1-5 parts of expanded graphite, 0.5-2 parts of curing agent, 0.5-2 parts of modifying agent, 1-5 parts of levelling agent, defoaming agent 0.5-2
Part.
As shown in Figure 1, the formula composition of the weak viscous conductive layer 3 mainly includes 50-100 parts of high molecular polymer, it is conductive
5-20 parts of agent LB, 0.5-2 parts of curing agent, 0.5-2 parts of modifying agent, 1-5 parts of levelling agent, 0.5-2 parts of defoaming agent.
As shown in Figure 1, the high molecular polymer is mainly vinyl polysiloxane, polyisobutylene polymer, organosilicon rubber
It is any one in glue, polyurethane, methyl methacrylate, organopolysiloxane, epoxy resin, acrylate and polyamide
Kind or any combination thereof；The conductive agent is mainly bronze, silver powder, aluminium powder, copper powder, nickel powder, golden contracted payment, wicker copper, carbon nanometer
Pipe, graphite, graphene, carbon fiber, in carbon black any one or any combination thereof；The modifying agent is predominantly silane coupled
Agent, titante coupling agent, in aluminate coupling agent any one or any combination thereof；The levelling agent is predominantly organic
In silicon class, esters of acrylic acid any one or any combination thereof；The defoaming agent predominantly have mineral oils, organic silicon,
In polyethers any one or any combination thereof；The curing agent is mainly epoxies, amine, any in isocyanates
One kind or any combination thereof.
As shown in Figure 1, first release layer 4, the second release layer 5 are lamination release paper, any one in PET release film
Kind, the thickness of the conductive weaving layer of cloth 1 between 0.025-0.030mm, the thickness of the strong viscous conductive layer 2 between
Between 0.02-0.025mm, the thickness of the weak viscous conductive layer 3 is between 0.013-0.015mm.
The present invention also provides a kind of preparation methods of ultra-thin strong and weak conducting structures, are used to prepare as any one of above-mentioned
The described ultra-thin strong and weak conducting structures, wherein the preparation methods of ultra-thin power conducting structures the following steps are included:
S1, the conductive weaving layer of cloth 1 of preparation, are electroplated respectively in the obverse and reverse of fiber cloth, form conductive metal layer；
S2, the strong viscous conductive layer 2 of front preparation in conductive weaving layer of cloth 1, prepare weak viscous conduction in the reverse side of conductive weaving layer of cloth 1
Layer 3；
S3, lateral surface the first release layer 4 of preparation in strong viscous conductive layer 2, it is release in the lateral surface preparation second of weak viscous conductive layer 3
Layer 5.
In step s 2, the front preparation of conductive weaving layer of cloth 1 by force viscous conductive layer 2 the following steps are included:
S210, expanded graphite be added portionwise dispersion inside organic solvent, form uniform graphite dispersing solution；
S211,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 250 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S212, it the modification nickel powder of 250 mesh is charged first in macromolecule matrix stirs evenly, add graphite dispersing solution, stir
Uniformly, levelling agent, defoaming agent stirring 0.5-2h is added, obtains the first conductive mixture；
S213, the front that the first conductive mixture is coated in conductive weaving layer of cloth 1, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying winding obtain gluing conductive layer 2 by force, and the viscosity of strong viscous conductive layer 2 is between 800-1500g/inch.
Organic solvent in step S210 be mainly ethyl acetate, toluene, cyclohexanone, butanone, hexylene glycol, in propylene glycol
Any one or any combination thereof.
In step s 2, the reverse side in conductive weaving layer of cloth 1 prepare weak viscous conductive layer 3 the following steps are included:
S220,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 300 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S221, the modification nickel powder of 300 mesh is added in macromolecule matrix, is stirred, add levelling agent, defoaming agent stirring 0.5-
1h obtains the second conductive mixture；
S222, the reverse side that the second conductive mixture is coated in conductive weaving layer of cloth 2, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying obtain weak viscous conductive layer 3, and the viscosity of weak viscous conductive layer 3 is between 200-500g/inch.
Ultra-thin strong and weak conducting structures of one kind provided by the invention and preparation method thereof, have the advantage that
1, using metal nickel powder and expanded graphite, effective conductive path is constructed, improves the high conductivity of adhesive layer.
2, modified nickel powder can be preferably dispersed in compound system, while play connection conductive filler and enhancing colloid rigidity
Effect.
3, nickel powder and graphite powder are arranged using special technique by the direction perpendicular to structural body, is built completeer
Kind conductive system, to obtain better electric conductivity
4, intermediate conductive base selects soft conductive textile cloth, can achieve ultra-thin thickness, material is soft, easily operated.
Ultra-thin strong and weak conducting structures of one kind provided by the invention and preparation method thereof, are mainly used in consumer electronics production
Product, especially printed wiring board FPC component etc..
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (10)
1. a kind of ultra-thin strong and weak conducting structures, it is characterised in that: including be stacked the first release layer, by force glue conductive layer,
Conduction weaving layer of cloth, weak viscous conductive layer and the second release layer, wherein the conductive weaving layer of cloth be located at the conductive layer viscous by force,
Between weak viscous conductive layer, the conductive layer viscous by force is located between first release layer, conductive weaving layer of cloth, the weak viscous conduction
Layer is located between the conductive weaving layer of cloth, the second release layer.
2. ultra-thin strong and weak conducting structures according to claim 1, it is characterised in that: the conductive weaving layer of cloth includes fibre
The positive and negative surface of Wei Bu, the fiber cloth are plated with conductive metal layer.
3. ultra-thin strong and weak conducting structures according to claim 1, it is characterised in that: the formula group of the strong viscous conductive layer
At main including high molecular polymer 50-100 parts, LE5-20 parts of conductive agent, 1-5 parts of expanded graphite, 0.5-2 parts of curing agent, change
0.5-2 parts of agent, 1-5 parts of levelling agent, 0.5-2 parts of defoaming agent of property.
4. ultra-thin strong and weak conducting structures according to claim 1, it is characterised in that: the formula group of the weak viscous conductive layer
At main including high molecular polymer 50-100 parts, 5-20 parts of conductive agent LB, 0.5-2 parts of curing agent, 0.5-2 parts of modifying agent,
1-5 parts of levelling agent, 0.5-2 parts of defoaming agent.
5. the ultra-thin power conducting structures according to claim 3 or 4, it is characterised in that: the high molecular polymer
Predominantly vinyl polysiloxane, polyisobutylene polymer, organic silicon rubber, polyurethane, methyl methacrylate, organic poly- silicon oxygen
In alkane, epoxy resin, acrylate and polyamide any one or any combination thereof；The conductive agent is mainly gold
It is powder, silver powder, aluminium powder, copper powder, nickel powder, golden contracted payment, wicker copper, carbon nanotube, graphite, graphene, carbon fiber, any in carbon black
One kind or any combination thereof；The modifying agent is mainly silane coupling agent, titante coupling agent, in aluminate coupling agent
Any one or any combination thereof；The levelling agent is mainly that organic silicon, any one or its in esters of acrylic acid are any
Combination；The defoaming agent be mainly have mineral oils, organic silicon, in polyethers any one or any combination thereof；It is described
Curing agent be mainly epoxies, amine, in isocyanates any one or any combination thereof.
6. ultra-thin strong and weak conducting structures according to claim 1, it is characterised in that: first release layer, second from
Type layer is lamination release paper, any one in PET release film, and the thickness of the conductive weaving layer of cloth is between 0.025-
Between 0.030mm, the thickness of the strong viscous conductive layer between 0.02-0.025mm, the thickness of the weak viscous conductive layer between
Between 0.013-0.015mm.
7. a kind of preparation method of ultra-thin strong and weak conducting structures, it is characterised in that: be used to prepare as appointed in claim 1 to 6
Described in one it is ultra-thin power conducting structures, wherein it is ultra-thin power conducting structures preparation method the following steps are included:
S1, the conductive weaving layer of cloth of preparation, are electroplated respectively in the obverse and reverse of fiber cloth, form conductive metal layer；
S2, the strong viscous conductive layer of front preparation in conductive weaving layer of cloth, prepare weak viscous conductive layer in the reverse side of conductive weaving layer of cloth；
S3, lateral surface the first release layer of preparation in strong viscous conductive layer, prepare the second release layer in the lateral surface of weak viscous conductive layer.
8. the preparation method of ultra-thin strong and weak conducting structures according to claim 7, which is characterized in that in step s 2,
The front preparation of conduction weaving layer of cloth by force viscous conductive layer the following steps are included:
S210, expanded graphite be added portionwise dispersion inside organic solvent, form uniform graphite dispersing solution；
S211,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 250 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S212, it the modification nickel powder of 250 mesh is charged first in macromolecule matrix stirs evenly, add graphite dispersing solution, stir
Uniformly, levelling agent, defoaming agent stirring 0.5-2h is added, obtains the first conductive mixture；
S213, the front that the first conductive mixture is coated in conductive weaving layer of cloth, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying winding obtain gluing conductive layer by force, and the viscosity of strong viscous conductive layer is between 800-1500g/inch.
9. the preparation method of ultra-thin strong and weak conducting structures according to claim 8, it is characterised in that: in step S210
Organic solvent is mainly ethyl acetate, toluene, cyclohexanone, butanone, hexylene glycol, any one or its any group in propylene glycol
It closes.
10. the preparation method of ultra-thin strong and weak conducting structures according to claim 7, which is characterized in that in step s 2,
Weak viscous conductive layer is prepared in the reverse side of conductive weaving layer of cloth the following steps are included:
S220,0.2-5 parts of silane coupling agent is configured to mass concentration with the ethanol water that mass concentration is 95% is 3-
10% silane coupling agent alcoholic solution, stirring to silane coupling agent are all dissolved, and 300 mesh nickel powders are added to coupling agent alcoholic solution
In, it stirs, dry, obtaining modified nickel powder filler；
S221, the modification nickel powder of 300 mesh is added in macromolecule matrix, is stirred, add levelling agent, defoaming agent stirring 0.5-
1h obtains the second conductive mixture；
S222, the reverse side that the second conductive mixture is coated in conductive weaving layer of cloth, the drying tunnel air blast for being 90-150 DEG C in temperature
Dry 2-3min, drying obtain weak viscous conductive layer, and the viscosity of weak viscous conductive layer is between 200-500g/inch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910339372.XA CN109979641A (en) | 2019-04-25 | 2019-04-25 | Ultra-thin strong and weak conducting structures of one kind and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910339372.XA CN109979641A (en) | 2019-04-25 | 2019-04-25 | Ultra-thin strong and weak conducting structures of one kind and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109979641A true CN109979641A (en) | 2019-07-05 |
Family
ID=67086294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910339372.XA Pending CN109979641A (en) | 2019-04-25 | 2019-04-25 | Ultra-thin strong and weak conducting structures of one kind and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109979641A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110343454A (en) * | 2019-08-14 | 2019-10-18 | 苏州高泰电子技术股份有限公司 | Conductive black coating fluid and conductive film |
| CN111605226A (en) * | 2020-05-26 | 2020-09-01 | 宁波江丰复合材料科技有限公司 | Forming method of fiber material, fiber material prepared by forming method and application of fiber material |
| CN116130142A (en) * | 2022-12-28 | 2023-05-16 | 北京交通大学 | High-conductivity, anti-corrosion and anti-aging electric power composite grease and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106047242A (en) * | 2016-05-23 | 2016-10-26 | 安徽大学 | Epoxy-resin-based conductive adhesive and preparation method thereof |
| CN107254287A (en) * | 2017-07-25 | 2017-10-17 | 合肥欧仕嘉机电设备有限公司 | A kind of conducting resinl and preparation method |
| CN207362133U (en) * | 2017-03-27 | 2018-05-15 | 昆山雅森电子材料科技有限公司 | A kind of incorgruous type conductive fabric glue of multilayer |
| US20180273809A1 (en) * | 2017-03-27 | 2018-09-27 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
-
2019
- 2019-04-25 CN CN201910339372.XA patent/CN109979641A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106047242A (en) * | 2016-05-23 | 2016-10-26 | 安徽大学 | Epoxy-resin-based conductive adhesive and preparation method thereof |
| CN207362133U (en) * | 2017-03-27 | 2018-05-15 | 昆山雅森电子材料科技有限公司 | A kind of incorgruous type conductive fabric glue of multilayer |
| US20180273809A1 (en) * | 2017-03-27 | 2018-09-27 | Asia Electronic Material Co., Ltd. | Multi-layered anisotropic conductive adhesive having conductive fabric and preparation thereof |
| CN107254287A (en) * | 2017-07-25 | 2017-10-17 | 合肥欧仕嘉机电设备有限公司 | A kind of conducting resinl and preparation method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110343454A (en) * | 2019-08-14 | 2019-10-18 | 苏州高泰电子技术股份有限公司 | Conductive black coating fluid and conductive film |
| WO2021027246A1 (en) * | 2019-08-14 | 2021-02-18 | 苏州高泰电子技术股份有限公司 | Conductive carbon black coating liquid and conductive thin film |
| CN111605226A (en) * | 2020-05-26 | 2020-09-01 | 宁波江丰复合材料科技有限公司 | Forming method of fiber material, fiber material prepared by forming method and application of fiber material |
| CN116130142A (en) * | 2022-12-28 | 2023-05-16 | 北京交通大学 | High-conductivity, anti-corrosion and anti-aging electric power composite grease and preparation method thereof |
| CN116130142B (en) * | 2022-12-28 | 2023-09-22 | 北京交通大学 | Preparation method of high-conductivity, anti-corrosion and anti-aging electric power composite grease |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109979641A (en) | Ultra-thin strong and weak conducting structures of one kind and preparation method thereof | |
| JP6691961B2 (en) | Method for producing conductive spherical carbon nanotubes and method for producing conductive spherical carbon nanotube sealing agent | |
| CN107298901A (en) | A kind of carbon series conductive ink | |
| CN108913057A (en) | A kind of incorgruous type conductive fabric glue of multilayer and preparation method thereof | |
| JP2012211225A (en) | Resin composition, resin sheet, prepreg, laminated board, metal substrate, and printed wiring board | |
| CN113025125B (en) | Graphene conductive ink for RFID electronic tag and preparation method thereof | |
| CN104476882A (en) | Ultrathin PI cover film and preparation method thereof | |
| JP2015167106A (en) | Anisotropic conductive film, and connection structure | |
| CN105304161B (en) | Low-temperature environment-friendly conductive silver paste and preparation method and application | |
| CN109890124A (en) | The incorgruous penetration type conductive fabric glue of multilayer and the FPC reinforcement shielding construction for using it | |
| CN107022316A (en) | A kind of preparation method of ultra-thin light-shielding conductive metal composite membrane adhesive tape | |
| JP2011049186A (en) | Anisotropic conductive material, and manufacturing method thereof | |
| CN104212395B (en) | A kind of flexibility coat copper plate epoxy resin adhesive and preparation method thereof | |
| CN102459478A (en) | Ink jettable silver/silver chloride compositions | |
| CN110993149A (en) | Silver paste for metal grid capacitive flexible touch screen and preparation method and application thereof | |
| CN103814100B (en) | Adhesive composite, film-like adhesive, adhesive sheet, circuit connecting body, the connection method of circuit member, the use of adhesive composite, the use of film-like adhesive and the use of adhesive sheet | |
| US20220411667A1 (en) | Compositely structured insulation adhesive film and preparation method thereof | |
| CN208970771U (en) | A kind of weakly conducting connection structure | |
| CN111334233A (en) | Adhesive for conductive cloth adhesive tape, preparation method and application thereof | |
| CN108300360A (en) | Profiled metal particle conductive glued membrane and preparation method thereof | |
| CN109401648A (en) | Ultra-thin bond plies and its preparation process | |
| CN105188322A (en) | Ultrathin nano radiating film material and preparation method thereof | |
| CN109575831A (en) | Low bounce-back power cover film and preparation method thereof | |
| CN106634668B (en) | A kind of Nano type Multi-layer composite conductive glue film and preparation method thereof | |
| CN205522781U (en) | Insulating material layer structure of lazy flow copper -clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190705 |