CN104476882A - Ultrathin PI cover film and preparation method thereof - Google Patents
Ultrathin PI cover film and preparation method thereof Download PDFInfo
- Publication number
- CN104476882A CN104476882A CN201410788690.1A CN201410788690A CN104476882A CN 104476882 A CN104476882 A CN 104476882A CN 201410788690 A CN201410788690 A CN 201410788690A CN 104476882 A CN104476882 A CN 104476882A
- Authority
- CN
- China
- Prior art keywords
- film
- low
- cover layer
- pet
- low adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an ultrathin PI cover film and a preparation method thereof. The ultrathin PI cover film comprises a PI film, release paper arranged at one side of the PI film and an adhesive layer arranged between the PI film and the release paper, wherein the thickness of the PI film is 3-10mu m; the other side of the PI film is also provided with a low-adhesive PET carrier film comprising a PET film with the thickness of 10-50mu m and a low adhesive for adhering the PI film and the PET film; and the release force between the low adhesive and the PET film is larger than that between the low adhesive and the PI film. By using the ultrathin PI cover film and the preparation method thereof, the straightness of the PI film is improved through arranging the low-adhesive PET carrier film under the condition of unchanged substrate thickness when the thickness of the PI film is reduced to be smaller than 12mu m, the ultrathin PI cover film cannot deform after being coated by an adhesive, the operation is easy, the aligning efficiency of the cover film and a circuit board is increased, the automatic alignment is conveniently realized, and the qualified rate of products and the production efficiency in the wet-process production process of a substrate are increased.
Description
Technical field
The present invention relates to cover layer technical field, particularly, relate to a kind of ultra-thin PI cover layer and preparation method thereof.
Background technology
In recent years, along with developing rapidly of smart mobile phone, it is lightening that user pursues mobile electronic product, and display surface is large, and function is more.This impels the functional integration of manufacturer's requirement product higher, and wiring board material is thinner, thinner and more multi-layered, thus realizes the designing requirement of final products.But material is more and more thinner increases production difficulty, particularly the thinning base material that makes of flexibility circuit plate substrate more easily breaks, and production process yields declines, and production efficiency reduces.Therefore, have only and keep base material thickness inconvenience, and reduce the thickness of cover layer.
Cover layer thickness is determined by PI film thickness and bondline thickness.Bondline thickness is determined jointly by the thickness of Copper Foil and the type that covers of cover layer.If reduction bondline thickness, bubble can be produced because glue is filled not when production wiring board covers epiphragma.Therefore bondline thickness arbitrarily to reduce.If reduce the thickness of PI, not only can make cover layer lower thickness, and can improve cover layer cover type, thus reduce the thickness of glue-line.
The production method of traditional cover layer, is be coated with one deck glue on PI film, then becomes cover layer with release liners compound.When PI thickness is more than 12 μm, when PI film has certain very levelling, thereon gluing and with release liners compound etc. operate comparatively easy; But when PI film thickness is lower than 12 μm, when being even reduced to 7 μm or 5 μm, PI film is very soft, be easy to fold, PI film is almost difficult to keep smooth, and gluing is easy to distortion thereon, also easily occur with release liners compound tense the situation that contraposition is bad, operation easier is large, and production efficiency is low.
Therefore, the operational problem when PI thickness of cover layer is reduced to 7 μm or 5 μm is manufacturer's technical barrier urgently to be resolved hurrily.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of ultra-thin PI cover layer and preparation method thereof, solving PI film thickness lower than 12 μm, being even reduced to operational problem when 7 μm or 5 μm.
Technical scheme of the present invention is as follows: a kind of ultra-thin PI cover layer, comprises PI film and the release liners being located at its side, and viscose glue oxidant layer therebetween, and it is characterized in that, described PI film thickness is 3-10 μm; The opposite side of described PI film is also provided with low viscose glue pet vector film, and it is the PET film of 10-50 μm and the low adhesive of the described PI film of bonding and described PET film that this low viscose glue pet vector film comprises thickness; The off-type force of described low adhesive and described PET film is greater than the off-type force of described low adhesive and described PI film.
Described low adhesive thickness is 2-20 μm, and the off-type force of described low adhesive and described PI film is 2-30 gram/25mm.
Preferably, described low adhesive thickness is 5-15 μm, and the off-type force of described low adhesive and described PI film is 10-25 gram/25mm.
Described low adhesive comprises following each component by weight:
End carboxyl nitrile rubber 25-35 weight portion; Bisphenol-A 1001 epoxy resin 90-105 part, wherein solids content 60%; Dicyandiamide 15-20 part, is dissolved in DMF solution, and wherein DICY dicyandiamide concentration is 10%; 2-ethylmethylimidazolium 0.03-0.06 part; Butanone 50-120 part.
The off-type force of described low adhesive and described PI film is 2-30 gram/25mm, and glue amount of overflowing is less than 0.12mm.
Described low viscose glue pet vector film is Taiwan get Wan Li company commodity TWL-33.
Described low adhesive is containing acrylic resin or polyurethane resin, and the cohesive force of described low adhesive and described PI film is 2-30 gram/25mm, and glue amount of overflowing is less than 0.12mm.
The preparation method of described ultra-thin PI cover layer, comprises the steps:
(1) preparation of low viscose glue pet vector film: prepare low adhesive, gets 10-50 μm of PET film and carries out sided corona treatment, be then coated in the PET film of sided corona treatment by low adhesive, through drying, and solidification; The off-type force controlling described low adhesive and described PET film in this process is greater than the off-type force of described low adhesive and described PI film, the low viscose glue pet vector film obtained;
(2) preparation of carrier PI composite membrane: the ultra-thin PI of above-mentioned low viscose glue pet vector film and 5-15 μm is carried out compound, combined temp, lower than the softening point of low viscose glue, obtains carrier PI composite membrane;
(3) carrier PI composite membrane and release liners compound: apply modified epoxy or acrylate glue on carrier PI compound face, dry, then with release liners compound, obtain ultra-thin PI cover layer.
PET film through sided corona treatment applies the solution of low adhesive, and the dry glue thickness controlling low viscose is 2-20 micron; Passing through oven dry, after solidification, the cohesive force controlling low viscose glue and PI film is 2-30 gram/25mm.
When preparing wiring board with ultra-thin PI cover layer of the present invention, described ultra-thin PI cover layer is attached in etching copper-clad plate through contraposition vacation, after fast pressure, removes described low viscose glue pet vector film, only increase " removing described low viscose glue pet vector film " this procedure, other is undertaken by normal procedure.
Ultra-thin PI cover layer of the present invention and preparation method thereof is when base material thickness is constant, when PI film thickness is reduced to below 12 μm, the very levelling of PI film is increased by arranging low viscose glue pet vector film, gluing is indeformable thereon, be easy to operation, promote the contraposition efficiency between cover layer and wiring board, be convenient to realize automatic aligning, improve product percent of pass and the production efficiency of base material wet production process.
Accompanying drawing explanation
Fig. 1 is the structural representation of ultra-thin PI cover layer of the present invention.
Detailed description of the invention
Below by detailed description of the invention to further illustrating the present invention, to help better to understand content of the present invention, but the protection domain that these detailed description of the invention do not limit the present invention in any way.
With reference to Fig. 1, a kind of ultra-thin PI cover layer, comprises PI film 10 and the release liners 11 being located at its side, and viscose glue oxidant layer 12 therebetween.The opposite side of described PI film 10 is also provided with low viscose glue pet vector film 20.It is the PET film 21 of 10-50 μm and the low adhesive 22 of the described PI film 10 of bonding and described PET film 21 that this low viscose glue pet vector film 20 comprises thickness.Described low adhesive 22 and the off-type force of described PET film 21 are greater than the off-type force of described low adhesive 22 and described PI film 10.
Described PI film 10 thickness is 3-10 μm.
Described low adhesive 22 thickness is 2-20 μm, and described low adhesive 22 is 2-30 gram/25mm with the off-type force of described PI film 10.
Preferably, described low adhesive 22 thickness is 5-15 μm, and described low adhesive 22 is 10-25 gram/25mm with the off-type force of described PI film 10.
Embodiment 1:
A preparation method for ultra-thin PI cover layer, comprises the steps:
(1) preparation of low viscose glue pet vector film:
Prepare low adhesive, described low adhesive comprises following each component by weight: end carboxyl nitrile rubber 30 weight portion; Bisphenol A epoxide resin 1,001 100 parts, wherein solids content 60%; Dicyandiamide 18 parts, is dissolved in DMF solution, and wherein DICY dicyandiamide concentration is 10%; 2-ethylmethylimidazolium 0.05 part; Butanone 120 parts.Be dissolved in butanone by end carboxyl nitrile rubber, add bisphenol A epoxide resin 1001, dicyandiamide 1,2 ethylmethylimidazolium mixings, obtain low adhesive;
Get 25 μm of PET film and carry out sided corona treatment, then low adhesive is coated in the PET film of sided corona treatment, controlling the dried thickness of low adhesive is 5 μm, 5min is dried through 150 DEG C, again through 160-170 DEG C of solidification 1-2 hour, the low viscose glue pet vector film obtained, this low viscose glue pet vector film and PI film cohesive force are 10 grams/25mm;
(2) preparation of carrier PI composite membrane: by the north machine compound of ultra-thin PI film of above-mentioned low viscose glue pet vector film and 5 μm, combined temp 80-120 DEG C, obtained carrier PI composite membrane;
(3) carrier PI composite membrane and release liners compound: apply modified epoxy glue on carrier PI compound face, coating dry thickness controls at 10 μm, dry, then with release liners compound, obtain ultra-thin PI cover layer.
By above-mentioned ultra-thin PI cover layer again through 50 DEG C of slakings 10 hours, glue amount of overflowing controls at below 0.12mm; Get the double side flexible copper coated board that base material TPI thickness is 20 μm, be etched into special flex circuit application, two-sidedly cover the ultra-thin PI cover layer protection circuit after slaking, after fast pressure, remove described low viscose glue pet vector film, solidification, prepares wiring board through traditional handicraft.This wiring board finished product base material thickness is 15*2+20=50 μm.
Embodiment 2:
A preparation method for ultra-thin PI cover layer, comprises the steps:
(1) preparation of low viscose glue pet vector film: buy from get Wan Li science and technology the PET film that PR-SS50N-01-1CM101 is coated with low viscose glue, off-type force is 5 grams/25mm, removes diaphragm, obtains low viscose glue pet vector film;
(2) preparation of carrier PI composite membrane: by the north machine compound of ultra-thin PI film of above-mentioned low viscose glue pet vector film and 5 μm, combined temp 80-120 DEG C, obtained carrier PI composite membrane;
(3) carrier PI composite membrane and release liners compound: apply modified epoxy glue on carrier PI compound face, coating dry thickness controls at 15 μm, dry, then with release liners compound, obtain ultra-thin PI cover layer.
By above-mentioned ultra-thin PI cover layer again through 50 DEG C of slakings 13 hours, glue amount of overflowing controls at below 0.12mm; Get the double side flexible copper coated board that base material TPI thickness is 20 μm, be etched into special flex circuit application, two-sidedly cover the ultra-thin PI cover layer protection circuit after slaking, after fast pressure, remove described low viscose glue pet vector film, solidification, prepares wiring board through traditional handicraft.This wiring board finished product base material thickness is 10*2+20=60 μm.
Embodiment 3:
A preparation method for ultra-thin PI cover layer, comprises the steps:
(1) preparation of low viscose glue pet vector film:
Prepare low adhesive, described low adhesive comprises following each component by weight: end carboxyl nitrile rubber 30 weight portion; Bisphenol A epoxide resin 1,001 100 parts, wherein solids content 60%; Dicyandiamide 18 parts, is dissolved in DMF solution, and wherein DICY dicyandiamide concentration is 10%; 2-ethylmethylimidazolium 0.05 part; Butanone 120 parts.Be dissolved in butanone by end carboxyl nitrile rubber, add bisphenol A epoxide resin 1001, dicyandiamide 1,2 ethylmethylimidazolium mixings, obtain low adhesive;
Get 18 μm of PET film and carry out sided corona treatment, then low adhesive is coated in the PET film of sided corona treatment, controlling the dried thickness of low adhesive is 5 μm, 5min is dried through 150 DEG C, again through 160-170 DEG C of solidification 1-2 hour, the low viscose glue pet vector film obtained, this low viscose glue pet vector film and PI film cohesive force are 10 grams/25mm;
(2) preparation of carrier PI composite membrane: by the north machine compound of ultra-thin PI film of above-mentioned low viscose glue pet vector film and 8 μm, combined temp 80-120 DEG C, obtained carrier PI composite membrane;
(3) carrier PI composite membrane and release liners compound: apply modified epoxy glue on carrier PI compound face, coating dry thickness controls at 12 μm, dry, then with release liners compound, obtain ultra-thin PI cover layer.
By above-mentioned ultra-thin PI cover layer again through 50 DEG C of slakings 10 hours, glue amount of overflowing controls at below 0.12mm; Get the double side flexible copper coated board that base material TPI thickness is 20 μm, be etched into special flex circuit application, two-sidedly cover the ultra-thin PI cover layer protection circuit after slaking, after fast pressure, remove described low viscose glue pet vector film, solidification, prepares wiring board through traditional handicraft.This wiring board finished product base material thickness is 20*2+20=60 μm.
Comparative example 1
Do not have PT carrier film to contrast for slim PI, by the slim PI of traditional mode of production mode, get the PI film that thickness is 5 μm, PI face is coated with cover layer modified epoxy glue, coating is done and is thickly controlled at 10 μm, after oven dry, obtains cover layer with release liners compound.
By cover layer at 50 DEG C through 50 DEG C of slakings 10 hours, overflow glue amount control at 0.10mm.
Get the double side flexible copper coated board that base material TPI thickness is 20 μm, be etched into special flex circuit application, two-sidedly cover the ultra-thin PI cover layer protection circuit after slaking, after fast pressure, solidification, prepares wiring board through traditional handicraft.This wiring board finished product base material thickness is 15X2+20=50 μm.
Comparative example 2
Take cover layer SF05C 0515 specification market being purchased the Shengyi Science and Technology Co., Ltd, Guangdong obtained, its PI film thickness is 12.5 μm, and glue is thick is 15, and glue amount of overflowing controls as 0.12mm, as a comparison.
Get the double side flexible copper coated board that base material TPI thickness is 12.5 μm, be etched into special flex circuit application, two-sided coated with cover layer protection circuit, after fast pressure, solidification, prepares wiring board through traditional handicraft.This wiring board finished product base material thickness is 27.5X2+12.5=67.5 μm.
The present inventor tests the performance of the double side flexible copper coated board of embodiment 1-3 and comparative example 1-2, method of testing and project as follows:
Cover layer operability is evaluated: cover layer is bored four locating holes, and after release liners being torn off, the mobile PI containing carrier film or carrier-less film is with glue-line contraposition in the circuit board, contrast contraposition difficulty, easy contraposition be excellent, good, in, difference evaluates.
Cover layer covers type evaluation: after the release liners of cover layer being torn away, is pressed on specific line pattern, through precompressed in 180 DEG C/60 seconds, then applies 100Mpa, and after pressing in 180 DEG C/120 seconds, if inspection circuit whether compacting bubble-free, bubble-free, is qualified.
PET release and the no evaluation of cull: after test cover layer being covered type evaluation completes, after PET is torn off, whether easily tear off, after tearing, whether have cull to stay above PI film.
Testing result record is as table 1.
The performance test results of the double side flexible copper coated board of table 1 embodiment 1-3 and comparative example 1-3 compares
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, its framework form can be flexible and changeable, can subseries product.Just make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by submitted to claims.
Claims (6)
1. a ultra-thin PI cover layer, comprises PI film and the release liners being located at its side, and viscose glue oxidant layer therebetween, and it is characterized in that, described PI film thickness is 3-10 μm; The opposite side of described PI film is also provided with low viscose glue pet vector film, and it is the PET film of 10-50 μm and the low adhesive of the described PI film of bonding and described PET film that this low viscose glue pet vector film comprises thickness; The off-type force of described low adhesive and described PET film is greater than the off-type force of described low adhesive and described PI film.
2. ultra-thin PI cover layer as claimed in claim 1, it is characterized in that, described low adhesive thickness is 2-20 μm, the off-type force of described low adhesive and described PI film is 2-30 gram/25mm, best described low adhesive thickness is 5-15 μm, the off-type force of best described low adhesive and described PI film is 10-25 gram/25mm, and glue amount of overflowing is less than 0.12mm.
3. ultra-thin PI cover layer as claimed in claim 1, is characterized in that, described low adhesive is containing acrylic resin or polyurethane resin, and the cohesive force of described low adhesive and described PI film is 2-30 gram/25mm, and glue amount of overflowing is less than 0.12mm.
4. the preparation method of ultra-thin PI cover layer as described in any one of claim 1-3, is characterized in that, comprise the steps:
(1) preparation of low viscose glue pet vector film: prepare low adhesive, gets 10-50 μm of PET film and carries out sided corona treatment, be then coated in the PET film of sided corona treatment by low adhesive, through drying, and solidification; The off-type force controlling described low adhesive and described PET film in this process is greater than the off-type force of described low adhesive and described PI film, the low viscose glue pet vector film obtained;
(2) preparation of carrier PI composite membrane: the ultra-thin PI of above-mentioned low viscose glue pet vector film and 5-15 μm is carried out compound, combined temp, lower than the softening point of low viscose glue, obtains carrier PI composite membrane;
(3) carrier PI composite membrane and release liners compound: apply modified epoxy or acrylate glue on carrier PI compound face, dry, then with release liners compound, obtain ultra-thin PI cover layer.
5. the preparation method of ultra-thin PI cover layer as claimed in claim 4, it is characterized in that, the PET film through sided corona treatment applies the solution of low adhesive, the dry glue thickness controlling low viscose is 2-20 micron; Passing through oven dry, after solidification, the cohesive force controlling low viscose glue and PI film is 2-30 gram/25mm.
6. prepare the method for wiring board with PI cover layer ultra-thin described in any one of claim 1-3, it is characterized in that, comprise the steps: described ultra-thin PI cover layer to be attached in etching copper-clad plate through contraposition vacation, after fast pressure, remove described low viscose glue pet vector film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410788690.1A CN104476882B (en) | 2014-12-17 | 2014-12-17 | A kind of ultra-thin PI cover layers and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410788690.1A CN104476882B (en) | 2014-12-17 | 2014-12-17 | A kind of ultra-thin PI cover layers and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104476882A true CN104476882A (en) | 2015-04-01 |
| CN104476882B CN104476882B (en) | 2017-07-11 |
Family
ID=52751550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410788690.1A Active CN104476882B (en) | 2014-12-17 | 2014-12-17 | A kind of ultra-thin PI cover layers and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104476882B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104829859A (en) * | 2015-05-06 | 2015-08-12 | 无锡顺铉新材料有限公司 | Application of porous low-dielectric polyimide film in PI cover film |
| CN104910409A (en) * | 2015-05-06 | 2015-09-16 | 杭州师范大学 | Preparation method of porous low-dielectric polyimide thin films |
| CN104927082A (en) * | 2015-05-06 | 2015-09-23 | 无锡顺铉新材料有限公司 | Porous low-dielectric-property polyimide film |
| CN105799289A (en) * | 2016-03-11 | 2016-07-27 | 广州美维电子有限公司 | Transferring film, manufacturing method thereof and method for using transferring film for pasting film |
| CN105856792A (en) * | 2015-04-09 | 2016-08-17 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN108102569A (en) * | 2017-12-31 | 2018-06-01 | 广州云普电子科技有限公司 | It is a kind of for ultra-thin cover film of flexible circuit board and preparation method thereof |
| CN109825212A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | Ultra-thin cover film of LED high reflectivity and preparation method thereof |
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN114633499A (en) * | 2020-12-15 | 2022-06-17 | 北京小米移动软件有限公司 | Preparation method of protective film |
| CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039838A (en) * | 1989-06-06 | 1991-01-17 | Nichiban Co Ltd | Covering film and method for glueing |
| CN102127291A (en) * | 2010-12-23 | 2011-07-20 | 广东生益科技股份有限公司 | Halogen-free epoxy resin composition and covering film prepared from same |
| CN202764317U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Colored protective film and cover film, composite film and stiffening plate with colored protective film |
| KR20140137748A (en) * | 2013-05-23 | 2014-12-03 | 주식회사 그랜드플랜 | A protecting film with excellent formability and shock absorbing, transparence |
-
2014
- 2014-12-17 CN CN201410788690.1A patent/CN104476882B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039838A (en) * | 1989-06-06 | 1991-01-17 | Nichiban Co Ltd | Covering film and method for glueing |
| CN102127291A (en) * | 2010-12-23 | 2011-07-20 | 广东生益科技股份有限公司 | Halogen-free epoxy resin composition and covering film prepared from same |
| CN202764317U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Colored protective film and cover film, composite film and stiffening plate with colored protective film |
| KR20140137748A (en) * | 2013-05-23 | 2014-12-03 | 주식회사 그랜드플랜 | A protecting film with excellent formability and shock absorbing, transparence |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105856792B (en) * | 2015-04-09 | 2018-02-27 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN105856792A (en) * | 2015-04-09 | 2016-08-17 | 柏弥兰金属化研究股份有限公司 | Method for manufacturing single-sided thin metal substrate |
| CN104829859B (en) * | 2015-05-06 | 2017-10-24 | 无锡顺铉新材料有限公司 | A kind of application of porous low dielectric Kapton on PI cover layers |
| CN104910409B (en) * | 2015-05-06 | 2017-12-08 | 杭州师范大学 | A kind of preparation method of porous low dielectric Kapton |
| CN104927082A (en) * | 2015-05-06 | 2015-09-23 | 无锡顺铉新材料有限公司 | Porous low-dielectric-property polyimide film |
| CN104910409A (en) * | 2015-05-06 | 2015-09-16 | 杭州师范大学 | Preparation method of porous low-dielectric polyimide thin films |
| CN104927082B (en) * | 2015-05-06 | 2017-12-08 | 无锡顺铉新材料有限公司 | A kind of porous low dielectric Kapton |
| CN104829859A (en) * | 2015-05-06 | 2015-08-12 | 无锡顺铉新材料有限公司 | Application of porous low-dielectric polyimide film in PI cover film |
| CN105799289A (en) * | 2016-03-11 | 2016-07-27 | 广州美维电子有限公司 | Transferring film, manufacturing method thereof and method for using transferring film for pasting film |
| CN108102569A (en) * | 2017-12-31 | 2018-06-01 | 广州云普电子科技有限公司 | It is a kind of for ultra-thin cover film of flexible circuit board and preparation method thereof |
| CN108102569B (en) * | 2017-12-31 | 2020-11-24 | 广州云普电子科技有限公司 | Ultrathin covering film for flexible circuit board and preparation method thereof |
| CN109825212A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | Ultra-thin cover film of LED high reflectivity and preparation method thereof |
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN114633499A (en) * | 2020-12-15 | 2022-06-17 | 北京小米移动软件有限公司 | Preparation method of protective film |
| CN114633499B (en) * | 2020-12-15 | 2024-07-02 | 北京小米移动软件有限公司 | Method for preparing protective film |
| CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
| CN114786352B (en) * | 2022-03-16 | 2023-08-29 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104476882B (en) | 2017-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104476882A (en) | Ultrathin PI cover film and preparation method thereof | |
| CN107815259A (en) | Composite foam reworked adhesive tape and preparation method thereof | |
| JP4608422B2 (en) | Adhesive film | |
| CN106853704B (en) | Interior rupture pressure disc and preparation method thereof for more curved surface touch-control display modules | |
| CN101594993A (en) | Surface protection film | |
| TWI684392B (en) | Coverlay film, mobile phone and electronic device including the same | |
| CN107245304B (en) | OCA optical adhesive film and manufacturing process thereof | |
| CN103834320A (en) | Re-peel-off type special double-faced adhesive sheet for fixing flexible printed circuit board | |
| WO2019010871A1 (en) | Photosensitive cover film and preparation method therefor, and photosensitive cover film product | |
| CN109575826A (en) | A kind of easy-to-draw removable double faced adhesive tape of TPU substrate and its preparation and application | |
| CN103707565B (en) | The attaching of board structure and its flexible substrate and stripping means | |
| CN206133605U (en) | Fingerprint module and mobile terminal | |
| CN109795190A (en) | Optical component and have the production method of product of touch sensor, optical component | |
| KR20140022532A (en) | Laminate including optically clear adhesive layer and method of preparing the same | |
| CN107041068B (en) | Board structure of circuit and its manufacturing method | |
| CN108300353B (en) | TPU (thermoplastic polyurethane) protective film and preparation method thereof | |
| ATE352598T1 (en) | AQUEOUS LAMINATING ADHESIVES, SUBSTRATES AND CORRESPONDING PROCESSES THAT CAN BE PROCESSED UNDER VACUUM | |
| KR101173203B1 (en) | Manufacturing method of adhesive board and the adhesive board made by the method | |
| TW201330713A (en) | Glue-free single-sided copper-clad laminate with adhesion function and manufacturing method thereof | |
| TWI591142B (en) | Adhesive and applications thereof | |
| CN210415735U (en) | UV (ultraviolet) adhesive release film applied to PCB (printed circuit board) production | |
| CN1996113A (en) | Method for removing protective film of polarization plate | |
| KR20120111350A (en) | Attaching and detaching type liquid crystal cleaner | |
| CN110996536B (en) | Carrier copper foil and preparation method and application thereof | |
| CN208649198U (en) | A kind of screen protector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |