CN109974335A - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN109974335A CN109974335A CN201711448403.2A CN201711448403A CN109974335A CN 109974335 A CN109974335 A CN 109974335A CN 201711448403 A CN201711448403 A CN 201711448403A CN 109974335 A CN109974335 A CN 109974335A
- Authority
- CN
- China
- Prior art keywords
- heat
- thermally conductive
- cooling device
- fin
- conductive skeleton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000001816 cooling Methods 0.000 title claims abstract description 29
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000002627 tracheal intubation Methods 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 235000012149 noodles Nutrition 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor cooling devices, including heat-sink unit, heat absorbing units and the semiconductor chilling plate between heat-sink unit and heat absorbing units, it is characterized by: the heat absorbing units include the heat absorption matrix being made from a material that be thermally conductive and the heat absorbing fins component for being threaded through heat absorption matrix side, fin that the heat absorbing fins component of every side includes multiple sheets, being set side by side.The heat exchange of heat-sink unit and heat absorbing units is used for by using superposition, sheet fin, the all lesser heat exchanger components of wall thickness and spacing can be made, to obtain preferable heat exchange efficiency, be also beneficial to cooperate with blower and realize actively heat exchange, air flowing is complied with, conducive to the heat convection of air；It is exchanged heat using fin, improves the space utilization rate of device, be conducive to Miniaturization Design.
Description
Technical field
The present invention relates to refrigerating plant, especially a kind of semiconductor cooling device.
Background technique
Semiconductor refrigerating technology refers to: when one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple pair
When, after connecting DC current in this circuit, the transfer of energy can be generated, electric current flows to connecing for p-type element by N-type element
Head absorbs heat, becomes cold end；Heat is discharged by the connector that p-type element flows to N-type element, becomes hot end.Energy transfer size
It is to be determined by the element logarithm of the size of electric current and semiconductor material N, P.
Since there are resistance for semiconductor itself, heat will be generated when electric current passes through semiconductor, to will affect hot biography
It passs.Hot face heat is efficiently dissipated in time only, can just obtain the efficient refrigerating capacity of huyashi-chuuka (cold chinese-style noodles).Common Wind-cooling type semiconductor
Refrigerating plant, a kind of air-cooled electronics system of naphthaometer as disclosed in the Chinese patent application No. is 200820063836.6
Cooler, the metal heat sink including semiconductor electronic refrigerating module, the fever end face for being close to semiconductor electronic refrigerating module, and
It is mounted on the fan of metal heat sink another side, fan carries out wind-cooling heat dissipating to metal heat sink, and metal heat sink can be aluminium
The gilled radiator of system；A kind of for another example high-precision Wind-cooling type disclosed in the Chinese patent application No. is 201610173776.2
Semiconductor refrigerating thermostatic equipment, including heat exchanger, cooling piece component, the first speed-regulating fan, the second speed-regulating fan, the first plate-fin
Radiator, the second plate fin type radiator, heat exchanger, cooling piece component and the first plate fin type radiator, the second plate fin type radiator
Between be fixedly connected, the first speed-regulating fan, the second speed-regulating fan are installed in the first plate fin type radiator, the second plate fin type radiator
Outside, when first and second speed-regulating fan operating when, form forced convection heat transfer in plate fin type radiator, take away by freezing
The heat that piece component generates, the first plate fin type radiator and the second plate fin type radiator include bottom plate and are fixedly connected on bottom plate
Radiating fin.
Above-mentioned existing semiconductor cooling device, radiator mostly use the flat aluminum plate with fin to be pasted onto
Hot end, then add blower to radiate in aluminum plate.This currently used manufacture of radiator is stretched using aluminium
Form, because processing technology etc. limits, spacing, wall thickness of fin etc. are all larger, influence radiating efficiency；And since aluminum plate combines
This form of fin, after blower is arranged, the relationship of aluminum plate and wind direction can hinder the flowing of air, influence to radiate.
Summary of the invention
The technical problem to be solved by the present invention is in view of the above-mentioned problems of the prior art, providing a kind of raising refrigeration
Efficiency, the semiconductor cooling device conducive to miniaturization.
The technical scheme of the invention to solve the technical problem is: a kind of semiconductor cooling device, including heat dissipation
Unit, heat absorbing units and the semiconductor chilling plate between heat-sink unit and heat absorbing units, it is characterised in that: the heat absorption
Unit includes the heat absorption matrix being made from a material that be thermally conductive and the heat absorbing fins component for being threaded through heat absorption matrix side, the heat absorption of every side
Fin that fin component includes multiple sheets, being set side by side.
Preferably, for preferable heating conduction and convenient for manufacture, each fin is aluminium foil.
Preferably, to obtain higher heat exchange efficiency, the wall thickness of each fin is up to 0.05mm, two adjacent fins
Between spacing be not more than 0.5mm.
Further, for convenient for from semiconductor chilling plate conduction cooling, the heat absorption matrix includes the first thermally conductive skeleton, described the
The huyashi-chuuka (cold chinese-style noodles) of one thermally conductive skeleton and semiconductor chilling plate is affixed, and the fin is from the position close to the first thermally conductive skeleton to far from first
The position of thermally conductive skeleton is formed by stacking heat absorbing fins component.
For the positioning convenient for fin and heat absorption matrix, the heat absorption matrix further includes positioning intubation, the positioning intubation point
The two sides of first thermally conductive skeleton are not set, the positioning jack with positioning intubation cooperation is offered on each fin.
For convenient for keeping the interval between adjacent fins, with flange so that two adjacent wings on the positioning jack
Piece keeps certain spacing.
Preferably, the heat-sink unit includes heat dissipation base and the heat pipe that is arranged in heat dissipation base.
To maximize heat dissipation area, the heat dissipation base includes the second thermally conductive skeleton being made from a material that be thermally conductive, institute
The hot face for stating the second thermally conductive skeleton and semiconductor chilling plate is affixed；It is offered in the second thermally conductive skeleton and multiple run through second and lead
The through-hole of hot two ends of skeleton, the heat pipe are inserted in through-hole, two ends of the heat pipe be pierced by respectively from through-hole and
It is provided with water inlet pipe and outlet pipe, to constitute cooling line.
Preferably, to increase pipeline area, the heat pipe is in the pipeline to flow back in parallel.
Preferably, for make the second thermally conductive skeleton direction-adapting medium flow direction, where the both ends of the through-hole
Face be adjacently positioned with the second thermally conductive skeleton with the face that semiconductor chilling plate is affixed.
Compared with the prior art, the advantages of the present invention are as follows: heat-sink unit is used for by using superposition, sheet fin
With the heat exchange of heat absorbing units, all lesser heat exchanger components of wall thickness and spacing can be made, so that preferable heat exchange efficiency is obtained,
Be conducive to cooperate with blower and realize actively heat exchange, air flowing is complied with, conducive to the heat convection of air；It is exchanged heat, is mentioned using fin
The space utilization rate of high device is conducive to Miniaturization Design；Heat transfer efficiency can be improved by skeleton in conjunction with heat pipe；It is dissipated with water circulation
Hot systems match, and heat exchange efficiency is high, and it is small to be conducive to the higher refrigerating efficiency of acquisition, noise.
Detailed description of the invention
Fig. 1 is the schematic diagram of the refrigerating plant of the embodiment of the present invention；
Fig. 2 is the decomposition texture schematic diagram of the refrigerating plant of the embodiment of the present invention；
Fig. 3 is the cross-sectional view of the heat absorbing units of the refrigerating plant of the embodiment of the present invention；
I enlarged diagram of part that Fig. 4 is Fig. 3.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
Referring to Fig. 1 and Fig. 2, a kind of semiconductor cooling device, including semiconductor chilling plate 1, heat-sink unit 2 and heat absorbing units
3。
Heat-sink unit 2 includes heat dissipation base 21 and heat pipe 22, wherein and heat dissipation base 21 includes the second thermally conductive skeleton 211, the
Two thermally conductive skeletons 211 are in tabular, and the hot face of the second thermally conductive skeleton 211 and semiconductor chilling plate 1 is affixed.Second thermally conductive skeleton
211, which can be aluminium, copper or the good material of other heating conductions, is made.Heat pipe 22 is arranged on the second thermally conductive skeleton 211.
Multiple second thermally conductive 211 opposite ends of skeleton that run through are offered on second thermally conductive skeleton 211 (in the present embodiment, is
Both ends on second thermally conductive 211 length direction of skeleton) through-hole 212.Preferably, above-mentioned 212 uniform intervals of through-hole arrangement.Heat pipe
22, in the pipeline to flow back in parallel, are inserted into through-hole 212.Two ends of heat pipe 22 are pierced by from through-hole 212 respectively and are provided with
Water inlet pipe 221 and outlet pipe 222, to form cooling line.Face and the second thermally conductive skeleton 211 where the both ends of through-hole 212
The face being affixed with semiconductor chilling plate 1 is adjacently positioned
In conjunction with Fig. 3 and Fig. 4, heat absorbing units 3 include heat absorption matrix 31 and heat absorbing fins component 32, wherein heat absorption matrix 31
It can be aluminium, copper or the good material of other heating conductions to be made.The matrix 31 that absorbs heat includes the first thermally conductive skeleton 311 and positioning
Intubation 312, wherein the first thermally conductive skeleton 311 is in tabular, the huyashi-chuuka (cold chinese-style noodles) phase of the first thermally conductive skeleton 311 and semiconductor chilling plate 1
Patch.Positioning intubation 312 be separately positioned on the first thermally conductive skeleton 311 two sides, it can be achieved that heat transmitting.
Heat absorbing units 3 include heat absorption matrix 31 and heat absorbing fins component 32, wherein heat absorption matrix 31 can be aluminium, copper or
The good material of other heating conductions of person is made.The matrix 31 that absorbs heat includes the first thermally conductive skeleton 311 and positioning intubation 312, wherein
First thermally conductive skeleton 311 is in tabular, and the huyashi-chuuka (cold chinese-style noodles) of the first thermally conductive skeleton 311 and semiconductor chilling plate 1 is affixed.Positioning intubation 312
Be separately positioned on the two sides of the first thermally conductive skeleton 311, it can be achieved that heat transmitting.
In conjunction with Fig. 3 and Fig. 4, fin 321 that heat absorbing fins component 32 includes multiple sheets, being set side by side is respectively set
In the two sides of the second thermally conductive skeleton 211.In every side of the first thermally conductive skeleton 311, fin 321 is from close to the first thermally conductive skeleton
311 position is formed by stacking heat absorbing fins component 32 to the position far from the first thermally conductive skeleton 311.Preferably, fin 321 can be
Aluminium foil, heat absorbing fins component 32 are formed by stacking one by one by multiple fins 321.Using this structure, fin 321 can be cooked
It is only 0.05mm to wall thickness maximum.
Each fin 321 offers positioning jack 322, to cooperate with positioning intubation 312.Have on positioning jack 322
Flange, the flange can make two adjacent fins 321 keep certain spacing, mutual to avoid two adjacent fins 321
It fits.According to the present embodiment, it is preferred that the spacing between two adjacent fins 321 can be not more than 0.5mm, when heat absorption is single
When member 3 cooperates blower actively to exchange heat, higher heat exchange efficiency can get.
312 ends far from the first thermally conductive skeleton 311 of positioning intubation have end 313, and the size of end 313 is greater than positioning
Intubation 312 is inserted in positioning jack 322 to position intubation 312, then can be by heat absorption matrix 31 and heat absorption by end 313
The position of fin component 32 is relatively fixed.
Semiconductor chilling plate 1 is arranged between heat-sink unit 2 and heat absorbing units 3, wherein the second of heat-sink unit 2 is thermally conductive
Skeleton 211 and the hot face of semiconductor chilling plate 1 are affixed, the thermally conductive skeleton 312 of the second of heat absorbing units 3 and semiconductor chilling plate 1
Huyashi-chuuka (cold chinese-style noodles) is affixed.Heat on semiconductor chilling plate 1 is transmitted on radiating fin component 22 through the second thermally conductive skeleton 211 and and air
It swaps, the cooling capacity on semiconductor chilling plate 1 is transmitted on heat absorbing fins 22 through the first thermally conductive skeleton 311 and carries out with air
Exchange.
Refrigerating plant using the above structure is exchanged heat using the fin of superposition, considerably increases heat exchange area, is improved
Refrigerating efficiency, when actively exchanging heat in conjunction with blower, conducive to the flowing of air, can get preferable heat exchange efficiency；Using fin
Heat exchange, improves the space utilization rate of device, is conducive to Miniaturization Design；Heat transfer efficiency can be improved by skeleton in conjunction with heat pipe；With water
Cycle cooling system matches, and heat exchange efficiency is high, and it is small to be conducive to the higher refrigerating efficiency of acquisition, noise.
Claims (10)
1. a kind of semiconductor cooling device, including heat-sink unit (2), heat absorbing units (3) and it is located at heat-sink unit (2) and absorbs heat
Semiconductor chilling plate (1) between unit (3), it is characterised in that: the heat absorbing units (3) include the suction being made from a material that be thermally conductive
Hot basal body (31) and the heat absorbing fins component (32) for being threaded through heat absorption matrix (31) side, heat absorbing fins component (31) packet of every side
Fin (321) including multiple sheets, being set side by side.
2. semiconductor cooling device according to claim 1, it is characterised in that: each fin (321) is aluminium foil.
3. semiconductor cooling device according to claim 2, it is characterised in that: the wall thickness of each fin (321) is up to
0.05mm, the spacing between two adjacent fins (321) are not more than 0.5mm.
4. semiconductor cooling device described in any one of claim 1 to 3, it is characterised in that: the heat absorption matrix
It (31) include the first thermally conductive skeleton (311), the first thermally conductive skeleton (311) and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate (1) are affixed, institute
Fin (321) is stated to be formed by stacking from the position close to the first thermally conductive skeleton (311) to the position far from the first thermally conductive skeleton (311)
Heat absorbing fins component (32).
5. semiconductor cooling device according to claim 4, it is characterised in that: the heat absorption matrix (31) further includes positioning
It is intubated (312), the two sides for positioning intubation (312) and being separately positioned on the first thermally conductive skeleton (311), on each fin (321)
Offer the positioning jack (322) with positioning intubation (312) cooperation.
6. semiconductor cooling device according to claim 5, it is characterised in that: have on the positioning jack (322) and turn over
Side is so that two adjacent fins (321) keep certain spacing.
7. semiconductor cooling device described in any one of claim 1 to 3, it is characterised in that: the heat-sink unit (2)
Including heat dissipation base (21) and the heat pipe (22) being arranged in heat dissipation base (21).
8. semiconductor cooling device according to claim 7, it is characterised in that: the heat dissipation base (21) includes by thermally conductive
Second thermally conductive skeleton (211) made of material, the second thermally conductive skeleton (211) and the hot face of semiconductor chilling plate (1) are affixed；
Multiple through-holes (212) for running through second (211) two ends of thermally conductive skeleton, institute are offered in the second thermally conductive skeleton (211)
It states heat pipe (22) to be inserted in through-hole (212), two ends of the heat pipe (22) are pierced by from through-hole (212) respectively and are provided with
Water inlet pipe (221) and outlet pipe (222), to constitute cooling line.
9. semiconductor cooling device according to claim 8, it is characterised in that: the heat pipe (22) is in the pipe to flow back in parallel
Road.
10. semiconductor cooling device according to claim 8, it is characterised in that: where the both ends of the through-hole (212)
The face that face is affixed with the second thermally conductive skeleton (211) with semiconductor chilling plate (1) is adjacently positioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448403.2A CN109974335A (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711448403.2A CN109974335A (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109974335A true CN109974335A (en) | 2019-07-05 |
Family
ID=67072629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711448403.2A Withdrawn CN109974335A (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109974335A (en) |
-
2017
- 2017-12-27 CN CN201711448403.2A patent/CN109974335A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204535494U (en) | A kind of many pedestals position heat exchanger | |
| CN103167780A (en) | Combined type radiator for power module and combined type radiator assembly | |
| CN105916359B (en) | Electronic equipment spontaneous-heating type electric radiator and its optimization method | |
| CN212906119U (en) | Server | |
| CN110475466A (en) | A kind of air-cooled radiator and electrical equipment | |
| CN207674759U (en) | A kind of semiconductor cooling device | |
| CN208238294U (en) | A kind of semiconductor heat exchanger | |
| CN203133734U (en) | Completely-sealed chassis with radiating system | |
| CN209250984U (en) | Heat radiator and electric device | |
| CN207674758U (en) | A kind of water-cooling type semiconductor cooling device | |
| CN203775589U (en) | Novel fin cooling device | |
| CN207815774U (en) | A kind of semiconductor cooling device | |
| CN111026251A (en) | High-efficiency combined heat dissipation type CPU radiator | |
| CN109974335A (en) | A kind of semiconductor cooling device | |
| CN207674760U (en) | A kind of Wind-cooling type semiconductor cooling device | |
| CN110486853A (en) | A kind of outdoor machine of air-conditioner | |
| CN214206200U (en) | Novel heat dissipation device | |
| CN203083195U (en) | Sealed box body imperforated silencing heat dissipating device | |
| CN207815775U (en) | A kind of semiconductor cooling device | |
| CN109974333A (en) | A kind of semiconductor cooling device | |
| CN210745850U (en) | Heat sink device | |
| CN112437590A (en) | Novel heat dissipation device | |
| CN211785712U (en) | Bottom shell structure of electric energy meter | |
| CN109974334A (en) | A kind of Wind-cooling type semiconductor cooling device | |
| CN109974331B (en) | Semiconductor refrigerating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190705 |
|
| WW01 | Invention patent application withdrawn after publication |