CN109971030A - 一种高电磁屏蔽性能的复合材料及其制备方法 - Google Patents

一种高电磁屏蔽性能的复合材料及其制备方法 Download PDF

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CN109971030A
CN109971030A CN201910289949.0A CN201910289949A CN109971030A CN 109971030 A CN109971030 A CN 109971030A CN 201910289949 A CN201910289949 A CN 201910289949A CN 109971030 A CN109971030 A CN 109971030A
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composite material
electromagnetic shielding
shielding performance
high electromagnetic
nickel plating
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王艳
王胜法
赵建
冯钠
刘俊龙
张森
张鸿
郭静
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Dalian Polytechnic University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/20—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/36—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/04—Polyesters derived from hydroxy carboxylic acids, e.g. lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes

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Abstract

本发明涉及一种高电磁屏蔽性能的复合材料及其制备方法，属于电磁屏蔽材料技术领域。所述复合材料为添加导电材料的热塑性材料，且所述复合材料的表层镀镍；所述复合材料的结构为通过模型三周期极小曲面偏置构造的全连通多孔结构。本发明制备的高电磁屏蔽性能复合材料的弯曲强度最高可达120MPa，弯曲模量可达3.9GPa，同时，电磁屏蔽性能均在38dB以上，最高可达65dB。

Description

一种高电磁屏蔽性能的复合材料及其制备方法
技术领域
本发明涉及一种高电磁屏蔽性能的复合材料及其制备方法，属于电磁屏蔽材料技术领域。
背景技术
电磁屏蔽材料近年来在国防建设等领域有着广泛需求，越来越受到各领域研究者重视。高分子材料本身拥有易加工、成比低、重量轻等诸多优点，基于高分子材料的电磁屏蔽材料研究日益増多。另外，碳材料由于其低密度、高电导率、耐腐蚀、易加工等优点，是十分理想的电磁屏蔽材料之一。其中，碳纳米管(CNT)和石墨烯基相关的电磁屏蔽聚合物复合材料的研究最为活跃。
但是，目前相关研究存在着两方面的问题：一方面，单纯的CNT或石墨烯为填料，利用复合材料通过简单交替叠加等方法来衰减电磁波，但是，该种方法制造的电磁屏蔽材料往往有电磁屏蔽方向性限制，另外，不同材料层间表面粘结性不强，力学性能方面具有一定的局限性；另一方面，CNT和石墨烯与聚合物相互混合，随机地分散在复合材料中，由于CNT和石墨烯易团聚难分散的特点，使得复合材料虽然可通过添加高含量的CNT或石墨烯来获得优异的电磁屏蔽性能，但力学性能会随着CNT或石墨烯含量增加迅速衰减。
发明内容
本发明利用3D打印技术提供具有较好力学性能的导电基体，再采用化学镀镍的方式进一步增强材料的力学性能和电磁屏蔽性能，该方式可以使得制备的电磁屏蔽材料具有电磁屏蔽频率宽、力学性能好等优点，解决了上述问题。
本发明提供了一种高电磁屏蔽性能的复合材料，所述复合材料为添加导电材料的热塑性材料，且所述复合材料的表层镀镍；所述复合材料的结构为通过模型三周期极小曲面偏置构造的全连通多孔结构，其结构表达式如下：
或
或
或
其中：X＝2Tπx，Y＝2Tπy，Z＝2Tπz，T为多孔周期控制参数，C为孔洞形状控制参数。
本发明优选为所述导电材料为碳纳米管、石墨烯或炭黑。
本发明优选为所述热塑性材料为聚乳酸、ABS塑料或热塑性聚氨酯弹性体橡胶。
本发明优选为所述导电材料占热塑性材料重量的1-10wt％。
本发明优选为所述多孔周期控制参数T为[0.1,10]。
本发明优选为所述孔洞形状控制参数C为[-0.9,0.9]。
本发明优选为所述偏置厚度为[0.1cm,5cm]。
本发明优选为所述镀镍的厚度为0.05-0.3mm。
本发明另一目的为提供一种上述高电磁屏蔽性能复合材料的制备方法，所述制备方法包括如下步骤：将复合材料利用3D打印成多孔结构基体；对多孔结构基体进行镀镍，得到高电磁屏蔽性能复合材料。
本发明优选为所述镀镍为化学镀镍。
本发明有益效果为：
本发明以实施例1为例，弯曲强度最高可达120MPa，弯曲模量可达3.9GPa，同时，电磁屏蔽性能均在38dB以上，最高可达65dB。
本发明所述制备方法中没有有机溶剂的使用，益于环境保护。
附图说明
本发明附图1幅，
图1为实施例1制备的高电磁屏蔽性能复合材料的结构示意图。
具体实施方式
下述非限制性实施例可以使本领域的普通技术人员更全面地理解本发明，但不以任何方式限制本发明。
实施例1
一种高电磁屏蔽性能复合材料的制备方法，所述制备方法包括如下步骤：
多孔结构基体的制备：
将复合材料利用3D打印成多孔结构基体，复合材料为添加碳纳米管的聚乳酸，碳纳米管占聚乳酸重量的5wt％，复合材料的结构为通过模型三周期极小曲面偏置构造的全连通多孔结构，其结构表达式如下：
其中：X＝2Tπx，Y＝2Tπy，Z＝2Tπz，多孔周期控制参数T为4，孔洞形状控制参数C为0，偏置厚度为0.18cm，尺寸(长*宽*高)为14mm*14mm*4mm；
多孔结构基体镀镍：
利用化学镀镍对多孔结构基体表层进行镀镍，镀镍的厚度为0.2mm，得到高电磁屏蔽性能的复合材料。

Claims (10)

1.一种高电磁屏蔽性能的复合材料，其特征在于：所述复合材料为添加导电材料的热塑性材料，且所述复合材料的表层镀镍；
所述复合材料的结构为通过模型三周期极小曲面偏置构造的全连通多孔结构，其结构表达式如下：
或
或
或
其中：X＝2Tπx，Y＝2Tπy，Z＝2Tπz，T为多孔周期控制参数，C为孔洞形状控制参数。
2.根据权利要求1所述高电磁屏蔽性能的复合材料，其特征在于：所述导电材料为碳纳米管、石墨烯或炭黑。
3.根据权利要求2所述高电磁屏蔽性能的复合材料，其特征在于：所述热塑性材料为聚乳酸、ABS塑料或热塑性聚氨酯弹性体橡胶。
4.根据权利要求3所述高电磁屏蔽性能的复合材料，其特征在于：所述导电材料占热塑性材料重量的1-10wt％。
5.根据权利要求4所述高电磁屏蔽性能的复合材料，其特征在于：所述多孔周期控制参数T为[0.1,10]。
6.根据权利要求5所述高电磁屏蔽性能的复合材料，其特征在于：所述孔洞形状控制参数C为[-0.9,0.9]。
7.根据权利要求6所述高电磁屏蔽性能的复合材料，其特征在于：所述偏置厚度为[0.1cm,5cm]。
8.根据权利要求7所述高电磁屏蔽性能的复合材料，其特征在于：所述镀镍的厚度为0.05-0.3mm。
9.权利要求1、2、3、4、5、6、7或8所述高电磁屏蔽性能复合材料的制备方法，其特征在于：所述制备方法包括如下步骤：
将复合材料利用3D打印成多孔结构基体；
对多孔结构基体进行镀镍，得到高电磁屏蔽性能复合材料。
10.根据权利要求9所述的制备方法，其特征在于：所述镀镍为化学镀镍。
CN201910289949.0A 2019-04-11 2019-04-11 一种高电磁屏蔽性能的复合材料及其制备方法 Pending CN109971030A (zh)

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CN110918980A (zh) * 2019-12-16 2020-03-27 北京工商大学 一种电磁屏蔽复合材料及其制备方法
CN111574824A (zh) * 2019-11-25 2020-08-25 江苏集萃先进高分子材料研究所有限公司 一种用于选择性激光烧结3d打印的具有电磁屏蔽功能的聚氨酯粉体材料

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CN111574824A (zh) * 2019-11-25 2020-08-25 江苏集萃先进高分子材料研究所有限公司 一种用于选择性激光烧结3d打印的具有电磁屏蔽功能的聚氨酯粉体材料
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CN110918980B (zh) * 2019-12-16 2021-09-24 北京工商大学 一种电磁屏蔽复合材料及其制备方法

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Application publication date: 20190705