CN109963690B - Electrodeposited diamond dresser for molding threaded grinding tool for gear grinding and method for manufacturing same - Google Patents

Electrodeposited diamond dresser for molding threaded grinding tool for gear grinding and method for manufacturing same Download PDF

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Publication number
CN109963690B
CN109963690B CN201780070328.2A CN201780070328A CN109963690B CN 109963690 B CN109963690 B CN 109963690B CN 201780070328 A CN201780070328 A CN 201780070328A CN 109963690 B CN109963690 B CN 109963690B
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diamond abrasive
abrasive grains
outer peripheral
crystal
peripheral surface
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CN109963690A (en
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佐藤利浩
深见肇
榊原贞雄
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Toyoda Van Moppes Ltd
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Toyoda Van Moppes Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12Dressing tools; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/075Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels for workpieces having a grooved profile, e.g. gears, splined shafts, threads, worms

Abstract

The invention provides an electrodeposited diamond dresser for forming a threaded grinding tool for gear grinding, which can perform high-precision dressing and has a long service life. The disclosed device is provided with: a grinding wheel (2) formed in a disk shape having tapered surfaces (21) on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral surface; a diamond abrasive grain layer (3) which extends along the outer peripheral edge of the tapered surface and is plated with a plurality of small-diameter diamond abrasive grains through a plating layer; a plurality of mounting grooves (5) formed on the outer peripheral surface of the grinding wheel and having two in-groove wall surfaces forming a predetermined angle; and polyhedral single-crystal diamond abrasive grains (4) which are formed into a granular shape larger than the small-diameter diamond abrasive grains, have mounting crystal faces (M1, M2) equal to a predetermined angle, are crystals whose faces parallel to the outer peripheral surface of the grinding wheel do not become cleavage faces when the mounting crystal faces are mounted on both the inner wall surfaces (51a, 51b), and the mounting crystal faces of the polyhedral single-crystal diamond abrasive grains are plated on both the inner wall surfaces of the mounting groove of the grinding wheel through plating layers (32).

Description

Electrodeposited diamond dresser for molding threaded grinding tool for gear grinding and method for manufacturing same
Technical Field
The present invention relates to an electrodeposited diamond dresser for molding a threaded grinding tool for grinding a gear, and a method for manufacturing the same.
Background
A grinding tool for grinding a gear has a threaded (worm-type) member, and a dresser for performing threaded molding is particularly required to be accurate.
The dresser described in patent document 1 includes two tapered working surfaces for dressing a flank surface of a threaded grinding tool and an outer peripheral working surface for dressing a thread root portion of a thread of the threaded grinding tool. The active surface is provided with small-diameter diamond abrasive grains.
According to patent document 1, which is a conventional technique, a pair of dressers are disposed on a rotating shaft so as to be separated by a predetermined length, and each dresser is used so that two tapered working surfaces are brought into contact with different flank surfaces of a worm-type grinding wheel.
Patent document 1: international publication No. 2007/000831
However, in patent document 1, in order to improve dressing accuracy, the width of the outer peripheral working surface formed by the tapered surfaces on the front and back sides of each dresser is formed to be narrow. When the flank surface and the bottom of the thread of the worm-type grinding tool are dressed with the narrow outer peripheral working surface, there is a problem that the small-diameter diamond abrasive grains are detached by a large contact load and the life of the dresser is shortened.
Disclosure of Invention
The present invention has been made in view of the above-described conventional problems, and provides a long-life electrodeposited diamond dresser for molding a threaded grinding wheel for gear grinding, which enables highly precise dressing.
In order to solve the above problems, the invention according to claim 1 is a feature in a structure of an electrodeposited diamond dresser for molding a threaded grindstone for gear grinding, the dresser including: a grinding wheel made of hardened and tempered steel, which is formed into a disk shape having tapered surfaces on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral surface, and which is rotationally driven around a rotation axis; a diamond abrasive grain layer extending in a band-like shape with a predetermined width at an outer peripheral edge portion of the tapered surface, the diamond abrasive grain layer being coated with a plurality of small-diameter diamond abrasive grains by a plating layer; a plurality of mounting grooves formed on the outer peripheral surface of the grinding wheel in parallel with the rotation axis and having two in-groove wall surfaces forming a predetermined angle; and polyhedral single-crystal diamond abrasive grains which are formed into a granular shape larger than the small-particle-diameter diamond abrasive grains, have mounting crystal planes equal to the predetermined angle, and are crystals in which a plane parallel to the outer peripheral surface of the grindstone does not become a cleavage plane when the mounting crystal planes are mounted on both wall surfaces in the groove, and the mounting crystal planes of the respective polyhedral single-crystal diamond abrasive grains are plated on both wall surfaces in the groove of the mounting groove of the grindstone through the plating layer.
The outer peripheral surface of the grinding wheel is an outer peripheral surface of a disk-shaped grinding wheel in a case where the mounting groove is not formed. In addition, since the outer peripheral surface of the grinding wheel is a curved surface, it cannot be basically expressed as being parallel to a cleavage plane which is a plane. However, since the crystal plane of the polyhedral single-crystal diamond abrasive grain is minute with respect to the outer peripheral surface of the grinding wheel, the grinding wheel can be grasped as a substantially flat plane in comparison with the crystal plane of the polyhedral single-crystal diamond abrasive grain. Therefore, in this patent specification and specification, the expression "parallel" is used to describe the cleavage plane between the outer peripheral surface of the grinding wheel and the polyhedral single crystal diamond abrasive grains.
The surface parallel to the "virtual plane" in contact with the outer peripheral surface of the grinding wheel at the position opposed to the center of both wall surfaces in the groove is originally a crystal that does not become a cleavage plane of the polyhedral single crystal diamond abrasive grain.
Conventionally, in a grinding wheel having a thinner outer peripheral surface, the outer peripheral surface is narrowed by tapered surfaces provided on both sides of the outer peripheral portion, and the number of small-diameter diamond abrasive grains per unit area is small. Therefore, a dressing load is applied to the small-diameter diamond abrasive grains arranged on the outer peripheral surface. However, a plurality of large-grained polyhedral single crystalline diamond abrasive grains are plated along the circumferential direction on the outer circumferential surface of the grinding wheel, and dressing is mainly performed by the polyhedral single crystalline diamond abrasive grains at the time of dressing. Therefore, the load applied to the diamond abrasive grain layer formed of the polyhedral single-crystal diamond abrasive grains including the small-diameter diamond abrasive grains can be reduced, the small-diameter diamond abrasive grains can be prevented from dropping, the grinding wheel itself can be prevented from being damaged, and the service life of the dresser can be extended.
Further, a plurality of mounting grooves having both wall surfaces in the groove forming a predetermined angle are formed in the outer peripheral surface of the grindstone so as to be parallel to the rotation axis, and the polyhedral single-crystal diamond abrasive grains are plated on both wall surfaces in the groove so that the surface parallel to the outer peripheral surface of the grindstone does not form a cleavage plane by using mounting crystal planes having the same predetermined angle as the both wall surfaces in the groove. Therefore, the polyhedral single crystal diamond abrasive grains are difficult to break and can be firmly fixed to the grinding wheel, and the life as a dresser can be extended.
Drawings
Fig. 1 is a view showing an electrodeposited diamond dresser for molding according to an embodiment of the present invention, as viewed from the back side.
Fig. 2 is a view showing a section II-II of the electrodeposited diamond conditioner for molding of fig. 1.
Fig. 3 is an enlarged cross-sectional view of the tapered surface of fig. 2.
Fig. 4 is an enlarged view of the outer periphery of fig. 3.
Fig. 5 is a partially enlarged view showing the outer peripheral surface of the electrodeposited diamond conditioner for molding as viewed from the front side.
Fig. 6 is a partially enlarged view showing an outer peripheral surface of the electrodeposited diamond conditioner for molding viewed from the side.
Fig. 7 is a diagram showing a model of an octahedral single crystal diamond abrasive grain.
Fig. 8 is a flowchart showing a manufacturing procedure of the electrodeposited diamond conditioner for molding.
Fig. 9 is a partially enlarged view showing a step of forming the mounting groove.
Fig. 10 is a view showing a step of applying an adhesive to the mounting groove.
Fig. 11 is a view showing a process of bonding the octahedral single crystal diamond abrasive grains to the mounting groove.
FIG. 12 is a view showing a plating bath for forming a plating layer on the grinding wheel.
Fig. 13 is a view showing a step of bringing small-diameter diamond abrasive grains into contact with a grinding wheel.
Fig. 14 is a view showing a step of forming a plating layer and removing excess diamond abrasive grains having a small particle diameter.
FIG. 15 is a view showing a step of growing a plating layer.
Fig. 16 is a view illustrating a state in which the threaded grinding tool is dressed.
Fig. 17 is a graph comparing durability of dressing times of a conventional dresser and a dresser of the present application.
Fig. 18 is a diagram showing the type of crystal shape of the polyhedral single-crystal diamond abrasive grains.
Fig. 19 is a view showing a state in which hexahedral single crystal diamond abrasive grains are attached to the attachment groove of the grindstone.
Fig. 20 is a view showing a state in which the rhombic dodecahedron single crystal diamond abrasive grains are attached to the mounting groove of the grinding wheel.
Fig. 21 is a view showing a state in which single crystal diamond abrasive grains having octahedral crystal planes and hexahedral crystal planes are attached to the attachment groove of the grindstone.
Fig. 22 is a view showing a state in which single crystal diamond abrasive grains represented by a crystal plane of a rhombic dodecahedron, a crystal plane of an octahedron, and a crystal plane of a hexahedron are attached to a mounting groove of a grindstone.
Fig. 23 is a view showing a state in which single crystal diamond abrasive grains having crystal planes of a rhombic dodecahedron and octahedron are attached to a mounting groove of a grindstone.
Detailed Description
(embodiment mode)
Embodiments of an electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding according to the present invention will be described below with reference to the drawings.
As shown in fig. 1 and 2, the electrodeposited diamond conditioner for molding 1 includes: a grinding wheel 2, a diamond abrasive grain layer 3 provided on the grinding wheel 2, and octahedral single crystal diamond abrasive grains 4 provided on an outer peripheral surface 22 of the grinding wheel 2.
(grinding wheel)
As shown in fig. 1 and 2, the grinding wheel 2 is, for example, a steel member, has tapered surfaces 21 (a front tapered surface 21f and a rear tapered surface 21b) that are tapered toward the outer periphery on both front and rear surfaces, and is formed in a disk shape. As the heat-treated steel member, for example, quenched and tempered Steel (SUJ) is used. The tapered surface 21f extends continuously from the surface of a thick disc portion 23 provided at the center of the grinding wheel 2 to the outer peripheral surface 22. The back tapered surface 21b extends from the back surface of a thick disk portion 23 formed to be thick in the central portion of the grinding wheel 2 to the outer peripheral surface 22, continuing from the surface of a step portion 24 formed with a step in the direction in which the thickness is reduced. The outer peripheral surface 22 is formed to have a narrow width along the direction of the rotation axis CL by the front tapered surface 21f and the rear tapered surface 21b which are formed to be thinner toward the outer peripheral surface (see fig. 3 and 4).
In the grinding wheel 2, the side where the front tapered surface 21f, in which the diamond abrasive grain layer 3 is formed in a band shape with a predetermined width, is formed, is referred to as the front side, and the side where the rear tapered surface 21b, in which the diamond abrasive grain layer 3 is formed in a band shape with a width narrower than that of the front tapered surface 21f, is formed, is referred to as the rear side. A front belt-shaped portion 25f is formed in a belt shape with a predetermined width on the outer peripheral edge portion 26 of the front tapered surface 21f of the grinding wheel 2. Further, the back tapered surface 21b has a back band-shaped portion 25b formed in the outer peripheral edge portion 26 so as to have a width smaller than that of the band-shaped portion 25 f. The band-shaped portion 25f and the back band-shaped portion 25b are formed with a diamond abrasive grain layer 3 coated with a plurality of small-diameter diamond abrasive grains 31 by a plating layer described later.
(Diamond grit layer)
The small-diameter diamond abrasive grains 31 constituting the diamond abrasive grain layer 3 are diamond abrasive grains having a grain size of #60/80, for example. The small-diameter diamond abrasive grains 31 are plated on the grinding wheel 2 by a plating layer 32 formed by electroplating to form the diamond abrasive grain layer 3.
(mounting groove)
As shown in fig. 9, a plurality of (80 in the present embodiment) mounting grooves 5 are provided in the outer peripheral surface 22 of the grinding wheel 2, and the opposing groove inner wall surfaces 51a and 51b of the mounting grooves 5 are formed at 110 °, and the groove channels 52 extend parallel to the direction of the rotation axis CL of the grinding wheel 2. Octahedral single crystal diamond abrasive grains 4 are fixed one by one in each mounting groove 5. As shown in fig. 7, the octahedral single crystal diamond abrasive grains 4 form regular octahedrons called octahedral type, the particle size being, for example, # 16/18. Both inner wall surfaces 51a and 51b of the mounting groove 5 shown in fig. 9 are formed at a predetermined angle of 110 °. As shown in fig. 11, two base end side miller indices {1, 1} planes M1, M2 of the octahedral single crystal diamond grains 4 adjacent to each other at an angle of 110 ° are attached to both of the groove inner wall surfaces 51a, 51 b. (here, the two base end portion side miller indices {1, 1} planes are two miller indices {1, 1} planes, out of eight miller indices {1, 1} planes of the octahedral single-crystal diamond abrasive grain 4, which are arranged on the rotation axis CL side (the mounting groove 5 side) of the grindstone 2 and are bonded to the two in-groove wall surfaces 51a, 51b of the mounting groove 5. further, the two base end portion side miller indices {1, 1} planes correspond to the "mounting crystal plane"), and the head portion side miller indices {1, 1} plane is two miller indices {1, 1} planes arranged on the opposite side of the mounting groove 5 from the two base end portion side miller indices {1, 1} planes positioned on the mounting groove 5 side as the mounting crystal plane.
In this case, in the mounting groove 5, when the octahedral single crystal diamond abrasive grain 4 is mounted, as shown in fig. 7 and 9, the apexes 42 and 43 (the apex 42 is represented by coordinates (1, 0) and the apex 43 is represented by coordinates (-1, 0)) where the two base end portion side miller indices {1, 1} planes M1 and M2 of the octahedral single crystal diamond abrasive grain 4 and the two head portion side miller indices {1, 1} planes H1 and H2 facing the two base end portion side miller indices {1, 1} planes M1 and M2 intersect can be arranged at a position closer to the rotation axis CL side than the outer peripheral surface 22 in the radial direction of the grinding wheel 2 (see fig. 7 and 11).
The two groove inner wall surfaces 51a and 51b of the mounting groove 5 and the two base end side miller index {1, 1} surfaces M1 and M2 adjacent to each other at 110 ° of the octahedral single crystal diamond abrasive grain 4 are bonded by the adhesive 6. The adhesive 6 can be an epoxy resin-based nonconductive adhesive, for example.
(octahedral single crystal diamond grit)
The octahedral single-crystal diamond abrasive grains 4 are plated on the outer peripheral surface 22 of the grindstone 2 by the plating layer 32 together with the small-diameter diamond abrasive grains 31 (see fig. 5, 6, and 15). In this case, the plating layer 32 covers the two base end side miller indices {1, 1} planes M1, M2, and the top portions 42, 43 intersecting the two head side miller indices {1, 1} planes H1, H2, and plates the octahedral single-crystal diamond abrasive grains 4 to the outer peripheral surface 22 (see fig. 5, 6, 7, and 15). Thus, the octahedral single crystal diamond abrasive grains 4 are firmly plated on the outer peripheral surface 22 of the grinding wheel 2 by the plating layer 32.
The octahedral single crystal diamond abrasive grains 4 shown in fig. 3 to 6 are not in the shape of the octahedral crystals themselves, but are shaped so as to match the edge faces of the small-diameter diamond abrasive grains 31 arranged in the diamond abrasive grain layer 3. The cleavage plane CS refers to a plane in a specific direction when the crystal is easily broken in the direction, and is a plane parallel to the {1, 1} plane (also the miller index {1, 1} plane in this case) in the case of the octahedral single crystal diamond 4. As shown in fig. 5 and 6, the octahedral single crystal diamond abrasive grains 4 have a plane miller index {1, 1} plane parallel to the cleavage plane CS on the outer surface. When the position other than the cleavage plane CS is processed, the diamonds are rubbed against each other and polished. Small-diameter diamond abrasive grains 31 are also arranged between the plurality of octahedral single crystal diamond abrasive grains 4 arranged on the outer peripheral surface 22 of the grindstone 2. The outer peripheral surface 22 of the grinding wheel 2 in the case where the mounting groove 5 is not formed in the octahedral single crystal diamond abrasive grain 4 is positioned so that a virtual plane in contact with the center position where the octahedral single crystal diamond abrasive grain 4 is mounted and a cleavage plane CS of the octahedral single crystal diamond abrasive grain 4 are not parallel to each other and intersect at an angle of 35 °.
A center hole 27 to be fitted into a center boss projecting toward the shaft end of the drive shaft SFr, SFl (see fig. 16) is provided through the center of the grinding wheel 2. Around the center hole 27, three female screw holes 28 formed with female screws and three bolt holes 29 through which bolts are inserted are formed (see fig. 1 and 2).
(order of production method)
Next, a method for manufacturing the electrodeposited diamond dresser 1 for molding the threaded grindstone for gear grinding will be described with reference to fig. 8 to 15.
The grinding wheel 2 is formed into a disk shape by, for example, a grinder (grinding wheel forming process/step 101 (hereinafter, the step is simply referred to as "S") (see fig. 8). The grindstone 2 is formed of a hardened and tempered steel member, and has front and rear tapered surfaces 21f and 21b formed on the front and rear surfaces of the outer peripheral portion so as to be thinner toward the outer periphery. The tapered surface 21f is formed to extend continuously from the surface of a thick disc portion 23 provided at the central portion of the grinding wheel 2 to the outer peripheral surface 22. A thick disk portion 23 is formed at the center portion on the back side of the grinding wheel 2, and a step portion 24 is formed at the outer peripheral portion of the thick disk portion 23, the step portion being formed in a direction in which the thickness becomes thinner. The inner tapered surface 21b is formed to be continuous from the surface of the thinly formed end portion of the step portion 24 and to extend to the outer peripheral surface 22.
A center hole 27 through which the drive shafts SFr and SFl (see fig. 16) pass is provided in the center of the grinding wheel 2. Around the center hole 27, three female screw holes 28 provided with female screws and three bolt holes 29 through which bolts are inserted are provided (see fig. 1).
Next, the mounting groove 5 is formed in the outer peripheral surface 22 of the grinding wheel 2 by, for example, wire machining (mounting groove forming step/S102) (see fig. 9). As shown in fig. 7 and 9, the groove channel 52 of the mounting groove 5 extends in the direction of the rotation axis CL of the grinding wheel 2, and the opposing groove inner wall surfaces 51a and 51b have an angle of 110 ° and are formed with the following depth dimensions: that is, the depth dimension (see fig. 9 and 11) at which the two apexes 42 and 43 of each of the attached octahedral single crystal diamond abrasive grains 4 on the side where the two base end side miller indices {1, 1} planes M1 and M2 adjacent to each other at the ridge line 41 at an angle of 110 ° are separated from each other can be arranged closer to the rotation axis CL than the outer peripheral surface 22 in the radial direction of the grinding wheel 2. A plurality of mounting grooves 5 are formed at predetermined intervals on the outer peripheral surface 22 of the grinding wheel 2 (at 80 in the present embodiment).
Next, the octahedral single crystal diamond abrasive grains 4 are bonded to the inner wall surfaces 51a and 51b of the mounting groove 5 (octahedral single crystal diamond abrasive grain bonding step/S103) (see fig. 10 and 11). In this case, the two base end side miller index {1, 1} surfaces M1, M2 adjacent to each other at the ridge line 41 at an angle of 110 ° of the octahedral single crystal diamond abrasive grain 4 are bonded to the groove inner wall surfaces 51a, 51b with the binder 6. As the adhesive 6, for example, an epoxy adhesive can be used as a nonconductive adhesive.
Next, the plurality of small-diameter diamond abrasive grains 31 are brought into contact with the band-shaped portions 25f and 25b of the tapered surface 21 of the grindstone 2 and the outer peripheral surface 22 of the grindstone 2 (small-diameter diamond abrasive grain contact step/S104) (see fig. 13). This contact is performed by bringing a plurality of small-diameter diamond abrasive grains 31 housed in a container, not shown, into contact with the tapered surface 21 and the outer peripheral surface 22.
Next, the grindstone 2 bonded with the octahedral single crystal diamond abrasive grains 4 and in contact with the small-diameter diamond abrasive grains 31 is temporarily plated by electroplating in a nickel solution (first electroplating step/S105) (see fig. 12/14). The plating vessel 7 contains a plating solution 71 containing, for example, boric acid, nickel sulfate, nickel chloride, or the like. A nickel electrode 72 is provided as an anode in the plating liquid 71. The grinding wheel 2 is assigned as a cathode. The grindstone 2 is fastened to the flange 73a of the conductive support member 73 connected to the cathode terminal by a nut 74, and the grindstone 2 vertically sandwiches a rubber masking member 77 with a base plate 75 and a vinyl chloride bracket 76. By this plating, a plating layer 32 is formed between the small-diameter diamond abrasive grains 31 in contact with the surface of the grinding wheel 2 and the grinding wheel 2, and the small-diameter diamond abrasive grains 31 are temporarily plated on the surface of the grinding wheel 2 (see fig. 14).
Next, the excess small-diameter diamond abrasive grains 31 that have not been temporarily plated on the surface of the grinding wheel 2 are removed (excess small-diameter diamond abrasive grain removal step S106) (see fig. 14). This enables the diamond abrasive grain layer 3 to be formed as a single abrasive grain layer with high shape accuracy.
Next, the plating layer 32 is further formed on the grinding wheel 2 from which the excessive small-diameter diamond abrasive grains 31 have been removed (second plating step/S107) (see fig. 15). The plating layer 32 is further grown, and thereby the octahedral single crystal diamond abrasive grains 4 are plated on the outer circumferential surface 22 while covering two base end side miller indices {1, 1} surfaces M1, M2, and top portions 42, 43 intersecting two head side miller indices {1, 1} surfaces H1, H2 facing the two base end side miller indices {1, 1} surfaces M1, M2. In this case, the plating layer 32 firmly and finally plates the base end side of the octahedral single crystal diamond abrasive grains 4 (the side where the octahedral single crystal diamond abrasive grains 4 are fixed to the grindstone 2) to the outer peripheral surface 22 of the grindstone 2.
(action)
Next, a case of dressing a threaded grindstone for gear grinding (hereinafter, referred to as a threaded grindstone) W using the electrodeposited diamond dresser 1 for molding of the threaded grindstone for gear grinding of the present embodiment will be briefly described.
First, as shown in fig. 16, the electrodeposited diamond dresser 1 for molding is provided at the opposite ends of the two drive shafts SFr and SFl arranged coaxially so as to be relatively non-rotatable by bolts B or the like. The two forming electrodeposited diamond dresser 1(1R, 1L) are disposed so that the front tapered surfaces 21f on which the diamond abrasive layer 3 is provided face each other. The drive shafts SFr and SFl are rotated by transmitting a drive torque to a drive motor (not shown) via a reduction gear (not shown). The rotational speed of the drive shafts SFr and SFl is configured to be changed to an arbitrary peripheral speed by a mechanism for switching the transmission ratio of the reduction gear. The two drive shafts SFr and SFl are assembled to an approaching/separating movement mechanism (not shown) that approaches and separates in the direction of the rotation axis CL.
The threaded grindstone W as a grinding object is assembled to a rotation shaft, not shown, which is rotatable at a peripheral speed different from the peripheral speed of the drive shafts SFr and SFl, so as to be relatively non-rotatable. The drive shafts SFr and SFl and the rotation shaft on which the threaded grinder W is mounted are mounted on a cutting movement mechanism (not shown) which is not shown and which can be moved closer to and away from each other in a parallel state. The drive shafts SFr and SFl and the rotary shaft to which the threaded grinding wheel W is attached are attached to a feed moving mechanism (not shown) that is capable of moving relatively in the axial direction in conjunction with the rotation of the rotary shaft to which the threaded grinding wheel W is attached.
In dressing, for example, the peripheral speed of the threaded grindstone W is set lower than the peripheral speed of the forming electrodeposited diamond dresser 1, and the forming electrodeposited diamond dresser 1 and the threaded grindstone W are rotated in opposite directions so as to rotate in the same tangential direction at the contact point. Then, the cutting amount is adjusted by the cutting movement mechanism and the bottom side surfaces (side surfaces WF) of the thread teeth of the threaded grinding tool W are trimmed by approaching the cutting amount. In synchronization with the rotation of the thread shape of the threaded grindstone W, the forming electrodeposited diamond dresser 1 and the threaded grindstone W are moved relative to each other in the axial direction by the feed moving mechanism, and the side surface WF and the thread bottom WB of the threaded grindstone W are continuously dressed. In this case, the cutting amounts of the two shaping electrodeposited diamond dressers 1 are synchronized by the cutting movement mechanism, and the feed movement mechanism adjusts the feed amount of the two shaping electrodeposited diamond dressers 1 so as to match the side surface shapes of the respective side surfaces WFr, WFl.
In dressing, when the outer peripheral surface 22 is in contact with the side surface WF and the thread bottom WB, the octahedral single crystal diamond grains 4 are mainly dressed on the outer peripheral surface 22 whose width is narrowed by the front tapered surface 21f and the back tapered surface 21b provided on both sides of the outer peripheral portion. Therefore, the dressing can be performed with high accuracy in accordance with the shape of the precise threaded grinder W. Furthermore, since a plurality of octahedral single crystal diamond abrasive grains 4 are arranged in the circumferential direction on the outer circumferential surface 22, dressing is mainly performed by the octahedral single crystal diamond abrasive grains 4, and it is possible to prevent the falling off of the small-diameter diamond abrasive grains 31 and further prevent the grinding wheel 2 itself from being damaged.
(comparison data with the past)
As shown in fig. 17, the conventional dresser can perform 900 times dressing when dressing with the conventional dresser and the dresser of the present embodiment in which the octahedral single crystal diamond abrasive grains are arranged on the outer peripheral surface, whereas the present electrodeposited diamond dresser 1 for molding can perform more than 1600 times dressing, and durability of about 1.8 times was confirmed.
As is apparent from the above description, the electrodeposited diamond dresser 1 for molding a threaded grindstone for gear grinding of the present embodiment includes, in the electrodeposited diamond dresser 1 for molding a threaded grindstone for gear grinding: a grinding wheel 2 made of hardened and tempered steel, which is formed in a disk shape having a front tapered surface 21f and a rear tapered surface 21b provided on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral surface 22, and is rotationally driven around a rotation axis CL; a diamond abrasive grain layer 3 extending in a band-like shape with a predetermined width at the outer peripheral edge portions of the front tapered surface 21f and the back tapered surface 21b, and coated with a plurality of small-diameter diamond abrasive grains 31 by an electrolytic plating layer 32; a plurality of mounting grooves 5 formed on the outer peripheral surface 22 of the grinding wheel 2 in parallel with the rotation axis CL and having both in-groove wall surfaces 51a and 51b at a predetermined angle; and octahedral single-crystal diamond abrasive grains 4 that are formed into a granular shape larger than the small-diameter diamond abrasive grains 31, have two base-end-side miller index planes M1, M2 (attachment planes (octahedral planes oc1, oc2)) equal to a predetermined angle, and are formed such that when the two base-end-side miller index planes M1, M2 are attached to the both in-groove wall surfaces 51a, 51b, the planes parallel to the outer peripheral surface 22 of the grindstone 2 do not form crystals of the cleavage plane CS, and the two base-end-side miller index planes M1, M2 of each octahedral single-crystal diamond abrasive grain 4 are plated on the both in-groove wall surfaces 51a, 51b of the attachment groove 5 of the grindstone 2 by the plating layer 32.
Conventionally, in the grinding wheel 2 thinned toward the outer peripheral surface 22, the outer peripheral surface 22 is narrowed by the front tapered surface 21f and the back tapered surface 21b provided on both sides of the outer peripheral portion, and the number of small-diameter diamond abrasive grains 31 per unit area is small. Therefore, a large dressing load is applied to the small-diameter diamond abrasive grains 31 arranged on the outer peripheral surface 22. However, a plurality of large granular-shaped octahedral single crystal diamond abrasive grains 4 are plated along the circumferential direction on the outer circumferential surface 22 of the grindstone 2, and dressing is performed mainly by the octahedral single crystal diamond abrasive grains 4 at the time of dressing. Therefore, the octahedral single crystal diamond abrasive grains 4 can reduce the load applied to the diamond abrasive grain layer 3, prevent the diamond abrasive grains 31 having a small grain diameter from falling off, and further prevent the grinding wheel 2 itself from being damaged, thereby extending the life of the dresser.
Further, a plurality of mounting grooves 5 having both in-groove wall surfaces 51a, 51b at a predetermined angle of 110 ° are formed in the outer peripheral surface 22 of the grindstone 2 in parallel with the rotation axis CL, and the octahedral single crystal diamond abrasive grains 4 are plated on both in-groove wall surfaces 51a, 51b so that the surface parallel to the outer peripheral surface 22 of the grindstone 2 does not become the cleavage surface CS by passing through both base end side miller index surfaces M1, M2 equal to the predetermined angle of 110 ° of both in-groove wall surfaces 51a, 51 b. Therefore, the octahedral single crystal diamond abrasive grains 4 are not easily crushed and firmly fixed to the grinding wheel 2, and the life as a dresser can be extended.
The octahedral single crystal diamond abrasive grains 4 are firmly fixed to the both in-groove wall surfaces 51a, 51b of the mounting groove 5 in which the groove 52 is parallel to the rotation axis CL by the two base end side miller indices {1, 1} surfaces M1, M2 as mounting crystal planes which are adjacent to each other at the ridge line 41 and which make an angle of 110 ° of the octahedral single crystal diamond abrasive grains 4. Therefore, during dressing, the forces from the dressing load applied to the octahedral single crystal diamond abrasive grains 4 in the circumferential direction and the radial direction act on both the inner wall surfaces 51a and 51b of the groove of the grindstone 2, and the octahedral single crystal diamond abrasive grains 4 are reliably plated by the plating layer 32. This can prevent damage to the diamond abrasive grain layer 3, and can prolong the life of the dresser.
The octahedral single crystal diamond abrasive grains 4 tend to be easily broken by the cleavage thereof against a force acting parallel to the miller indices {1, 1} plane. However, the octahedral single crystal diamond abrasive grains 4 according to the present embodiment are fixed to the two in-groove wall surfaces 51a and 51b of the mounting groove 5 in which the groove 52 is parallel to the rotation axis CL by the two base-end-side miller indices {1, 1} surfaces M1 and M2. Therefore, the grinding wheel 2 to which a large dressing load is applied has a circumferential direction at an angle of 35 ° with respect to the head-side miller indices {1, 1} planes H1, H2 to be dressed, so that the octahedral single-crystal diamond abrasive grains 4 are hardly broken, and the life of the dresser can be maintained for a long time.
The octahedral single-crystal diamond abrasive grains 4 are plated with the plating layer 32 covering the tops 42 and 43 where the two base-end-side miller indices {1, 1} planes M1 and M2 intersect the two head-side miller indices {1, 1} planes H1 and H2. Therefore, the octahedral single crystal diamond abrasive grains 4 have a structure that is difficult to fall off from the mounting groove 5. This can prevent damage to the grinding wheel 2 itself caused by the dropping of the octahedral single crystal diamond abrasive grains 4, and can prolong the life of the dresser as a dresser that can perform dressing using the octahedral single crystal diamond abrasive grains 4.
In the grinding wheel 2, the load applied to the small-diameter diamond abrasive grains 31 on the outer peripheral surface 22 of the grinding wheel 2 is reduced by the octahedral single crystal diamond abrasive grains 4, and damage to the grinding wheel 2 itself can be prevented compared to the conventional grinding wheel. The small-diameter diamond abrasive grains 31 and the octahedral single crystal diamond abrasive grains 4 are plated on the grinding wheel 2 by the plating layer 32. Therefore, the small-diameter diamond abrasive grains 31 and the octahedral single crystal diamond abrasive grains 4 can be removed from the grinding wheel 2 by peeling the plating layer 32 with a peeling agent or the like, and the used grinding wheel 2 without damage can be easily reused as a new dresser.
Further, a plurality of octahedral single crystal diamond abrasive grains 4 arranged along the circumferential direction are provided on the outer peripheral surface 22 of the grindstone 2 narrowed by the front tapered surface 21f and the back tapered surface 21b provided on both sides of the outer peripheral portion of the grindstone 2 which is thinned toward the outer peripheral portion. Therefore, the precisely formed side surface WF and thread bottom WB of the threaded grinding wheel W can be precisely dressed by the octahedral single crystal diamond abrasive grains 4.
Further, small-diameter diamond abrasive grains 31 are plated between the plurality of octahedral single crystal diamond abrasive grains 4 through plating layers 32 on the outer peripheral surface 22 of the grindstone 2.
Accordingly, the small-diameter diamond abrasive grains 31 plated between the octahedral single crystal diamond abrasive grains 4 can reliably prevent the outer peripheral surface 22 of the grindstone 2 from being damaged.
The two base end side miller indices {1, 1} surfaces M1, M2, and the apexes 42, 43 intersecting the two head side miller indices {1, 1} surfaces H1, H2, which are opposed to the two base end side miller indices {1, 1} surfaces M1, M2, are disposed closer to the rotation axis CL side than the outer peripheral surface 22 in the radial direction of the grinding wheel 2.
Accordingly, in each of the octahedral single crystal diamond abrasive grains 4, the apexes 42 and 43 where the two base end side miller indices {1, 1} planes M1 and M2 intersect the two head side miller indices {1, 1} planes H1 and H2 are arranged closer to the rotation axis CL side than the outer peripheral surface 22 in the radial direction of the grinding wheel 2. Therefore, each of the octahedral single crystal diamond abrasive grains 4 can be stably fixed in each mounting groove 5 in a state where half or more thereof are fitted, and the octahedral single crystal diamond abrasive grains 4 are less likely to fall off from the outer peripheral surface 22 of the grindstone 2, and a long-life dresser can be obtained.
The small-particle-size diamond abrasive grains 31 had a particle size of #20/30 to #100/120, and the octahedral single-crystal diamond abrasive grains 4 had a particle size of #12/14 to # 60/80.
Accordingly, the octahedral single crystal diamond abrasive grains 4 having a grain size ratio suitable for protecting the small-diameter diamond abrasive grains 31 constituting the diamond abrasive layer 3 can be easily set, and a long-life dresser can be obtained.
The method for manufacturing the electrodeposited diamond dresser 1 for molding the threaded grindstone W for gear grinding includes: a grinding wheel forming step of forming a grinding wheel 2 of hardened and tempered steel into a disk shape having a front tapered surface 21f and a rear tapered surface 21b provided on both sides of an outer peripheral surface 22 so as to be thinner toward the outer peripheral surface; a mounting groove forming step of forming a plurality of mounting grooves 5 at predetermined intervals on the outer peripheral surface 22 of the grinding wheel 2, the mounting grooves 5 having groove channels 52 extending in the direction of the rotation axis CL of the grinding wheel 2 and opposing groove inner wall surfaces 51a, 51b at an angle of 110 °; an octahedral single crystal diamond abrasive grain bonding step of bonding the octahedral single crystal diamond abrasive grains 4 to the groove inner wall surfaces 51a and 51b of the respective mounting grooves 5 with the adhesive 6 by using the base end side miller indices {1, 1} surfaces M1 and M2 of the octahedral single crystal diamond abrasive grains 4 which are adjacent to each other at the ridge line 41 and form an angle of 110 °; a diamond abrasive grain contact step of bringing the plurality of small-diameter diamond abrasive grains 31 into contact with a range (front belt-shaped portion 25f, back belt-shaped portion 25b) extending in a band-like shape with a predetermined width at the outer peripheral edge portion of the front tapered surface 21f and back tapered surface 21b of the grindstone 2, and the outer peripheral surface 22; a first plating step of forming a plating layer 32 formed by plating on the outer peripheral surface 22 to which the octahedral single crystal diamond grains 4 are bonded and which is in contact with the small-diameter diamond grains 31, and the band-shaped extension ranges (the front band-shaped portion 25f and the back band-shaped portion 25b) of the front tapered surface 21f and the back tapered surface 21b in contact with the small-diameter diamond grains 31, and plating the octahedral single crystal diamond grains 4 and the small-diameter diamond grains 31 onto the grindstone 2; and a second plating step of growing and thickly forming the plating layer 32 formed on the grindstone 2 by the first plating step, thereby covering the top portions 43, 42 where the two base end side miller indices {1, 1} surfaces M1, M2 and the two head side miller indices {1, 1} surfaces H1, H2 opposed to the two base end side miller indices {1, 1} surfaces M1, M2 intersect, and plating the octahedral single-crystal diamond abrasive grains 4 on the outer circumferential surface 22.
Accordingly, the octahedral single crystal diamond abrasive grains 4 are bonded to the both in-groove wall surfaces 51a and 51b of the mounting groove 5 by fitting the base end-side miller indices {1, 1} surfaces M1 and M2 to the both in-groove wall surfaces 51a and 51b of the mounting groove 5 along the rotation axis CL direction of the groove 52, and therefore the octahedral single crystal diamond abrasive grains 4 can be firmly fixed to the narrow outer peripheral surface 22 of the grindstone 2. Further, since the plating layer 32 covers the two base end side miller indices {1, 1} planes m1.m2 and the top portions 43, 42 intersecting the two head side miller indices {1, 1} planes H1, H2, the electrodeposited diamond dresser 1 for molding having a structure in which the octahedral single crystal diamond abrasive grains 4 are less likely to fall off can be easily manufactured.
In the electrodeposited diamond dresser 1 for molding thus manufactured, the small-diameter diamond abrasive grains 31 and the octahedral single-crystal diamond abrasive grains 4 are plated on the grinding wheel 2 by the plating layer 32, and therefore, the small-diameter diamond abrasive grains 31 and the octahedral single-crystal diamond abrasive grains 4 can be removed from the grinding wheel 2 by peeling the plating layer 32 with a peeling agent or the like, and the used grinding wheel 2 from which the small-diameter diamond abrasive grains 31 and the octahedral single-crystal diamond abrasive grains 4 have been removed and which has not been damaged can be easily reused as a new dresser.
In the present embodiment, the predetermined width for providing the diamond abrasive grain layer 3 is set to be larger in the front tapered surface 21f than in the rear tapered surface 21b, but the present invention is not limited to this. For example, the diamond abrasive grain layer may be provided on the inner tapered surface and the outer tapered surface at the same predetermined width. In this case, dressing may be performed without combining two opposing electrodeposited diamond dressers for forming, and for example, a threaded grinding wheel for gear grinding may be dressed by one electrodeposited diamond dresser for forming.
The grain size of the small-diameter diamond abrasive grains 31 provided in the diamond abrasive grain layer 3 is #60/80, but the grain size is not limited to this, and may be, for example, a grain size in the range of #20/30 to # 100/120.
In the embodiment, the polyhedral single crystal diamond abrasive grains are set to the octahedral single crystal diamond abrasive grains 4/(B), but the embodiment is not limited thereto. For example, as shown in FIG. 18, there can be mentioned hexahedral single-crystal diamond abrasive grains (A), rhombic dodecahedral single-crystal diamond abrasive grains (C), single-crystal diamond abrasive grains (B-1) obtained by mixing crystal planes of hexahedron, octahedral and dodecahedral, single-crystal diamond abrasive grains (B-2, B-3) obtained by mixing crystal planes of octahedron and hexahedral, single-crystal diamond abrasive grains (B-4) obtained by mixing crystal planes of dodecahedron and octahedral, and single-crystal diamond abrasive grains (C-1) obtained by mixing crystal planes of dodecahedron and hexahedral.
Next, a mounting structure of the polyhedral single crystal diamond abrasive grains having different crystal shapes to the grindstone 2 will be described in crystal shape units based on fig. 19 to 23. All of the mounting grooves 5, 5d, 5h, 5do, 5oh of the grinding wheel 2 are formed with the groove channels 52 parallel to the rotational axis CL of the grinding wheel. The binder and the plating layer are not shown, but are used for fixing the octahedral single crystal diamond grains 4/(B) to the grinding wheel 2, similarly to the octahedral single crystal diamond grains.
In mounting the hexahedral single crystal diamond abrasive grains (a), as shown in fig. 19, the mounting groove 5h formed in the grinding wheel 2 is formed so that the angles of the opposing inner groove wall surfaces 51ha, 51hb become 90 °. The hexahedral single crystal diamond abrasive grain (a) is bonded and plated so that two crystal planes (miller indices {1, 0} planes/he) as mounting crystal planes facing each other with the ridge line therebetween form a corner having an angle of 90 ° and the groove 52 of the mounting groove 5h are fitted. The cleavage plane CS of the hexahedral single-crystal diamond abrasive grain (a) is a plane parallel to the crystal plane he. The hexahedral single crystal diamond abrasive grains (a) are held such that the cleavage plane CS forms an angle of 45 ° with respect to the outer peripheral surface 22 of the grindstone 2. In other words, the hexahedral single crystal diamond abrasive grains (a) are positioned so that a virtual plane, which is in contact with the outer peripheral surface 22 of the grinding wheel 2 when the mounting groove 5h is not formed at the center position where the hexahedral single crystal diamond abrasive grains (a) are mounted, is not parallel to the cleavage plane CS of the hexahedral single crystal diamond abrasive grains (a) and intersects at an angle of 45 °.
In addition, in mounting the rhombic dodecahedron single crystal diamond abrasive grain (C), as shown in fig. 20, the opposing intra-groove wall surfaces 51da, 51db formed in the mounting groove 5d of the grindstone 2 have: thread bottom surfaces 51dab, 51dbb having a predetermined angle of 120 ° at the groove thread root; and vertical surfaces 51dav, 51dbv continuous with the upper ends of the thread bottom surfaces 51dab, 51dbb and rising to the outer peripheral surface 22. In addition, in the diamond dodecahedral single crystal diamond abrasive grain (C), two base end side crystal planes (for example, a miller index (1, 0) plane do1 and a miller index (1, 0, 1) plane do2) as mounting crystal planes opposed to each other with the ridge line RL (see fig. 18) interposed therebetween are aligned at a corner of an angle of 120 ° with the groove lane 52 of the mounting groove 5d, and at this time, the perpendicular crystal plane do is aligned with the perpendicular planes 51dav, 51dbv, and bonded and plated. Two sides S1 and S2 formed by two head-side crystal surfaces do3 and do4 facing the two base-end side crystal surfaces do1 and do2 and by perpendicular crystal surfaces do5 and do6 are configured to be located closer to the rotation axis CL than the outer peripheral surface 22. Further, the two base end side crystal planes are the miller index (1, 0) plane do1 and the miller index (1, 0, 1) plane do2, but the present invention is not limited to this, and the two base end side crystal planes may be configured by the miller index (1, 0) plane and the miller index (0, 1) plane, for example. The cleavage plane CS of the rhombic dodecahedral single crystal diamond abrasive grain (C) corresponds to a regular triangular plane formed by the base surfaces of the triangular pyramids, considering a triangular pyramid having three oblique sides extending from the vertex, with the vertex at which the three crystal planes do intersect, being equal in length (see fig. 18). The rhombic dodecahedron single crystal diamond abrasive grains (C) are held in a state where the cleavage plane CS is inclined with respect to the outer peripheral surface 22 of the grinding wheel 2.
In addition, in mounting the single crystal diamond abrasive grains (B-2, B-3) represented by the octahedral crystal plane oc and the hexahedral crystal plane he, as shown in FIG. 21, the opposing intra-groove wall surfaces 51oha, 51ohb formed in the mounting groove 5oh of the grindstone 2 have: thread root surfaces 51ohab and 51ohbb forming 110 degrees at the groove thread root; and vertical surfaces 51ohav and 51ohbv that rise from the upper portions of the thread bottom surfaces 51ohab and 51ohbb to the outer peripheral surface 22.
As shown in fig. 21, the single-crystal diamond abrasive grains (B-2 and B-3) having the octahedral crystal plane oc and the hexahedral crystal plane he were fixed by fitting the octahedral crystal planes oc1 and oc2 as two base end side crystal planes to the thread bottom surfaces 51ohab and 51ohbb of the mounting groove 5oh and fitting the hexahedral crystal plane he to the vertical surfaces 51ohav and 51 ohbv. The two head-side crystal surfaces oc3 and oc4 facing the two base-end crystal surfaces oc1 and oc2 and the two sides Si1 and Si2 formed by the perpendicular crystal surfaces he1 and he2 are configured to be located closer to the rotation axis CL than the outer peripheral surface 22. In the case of the single-crystal diamond abrasive grains (B-2, B-3) represented by the octahedral crystal plane oc and the hexahedral crystal plane he, the crystal plane used for dressing was the octahedral crystal plane oc. Therefore, the cleavage plane is parallel to the octahedral crystal plane oc, and the single-crystal diamond abrasive grains (B-2, B-3) represented by the octahedral crystal plane oc and the hexahedral crystal plane he are held in a state in which the cleavage plane is inclined with respect to the outer peripheral surface 22 of the grinding wheel 2.
In addition, the hardness of the Miller index {1, 1} plane constituting the crystal plane oc of the octahedron among the crystal planes of the diamond single crystal is higher than the hardness of the Miller index {1, 0} plane constituting the crystal plane he of the hexahedron. Therefore, as shown in fig. 21, the octahedral crystal face oc is mounted on the side opposite to the mounting groove 5oh side (radially outside the grinding wheel 2), and can be trimmed using the miller index {1, 1} face having high hardness. This makes it possible to delay the progress of wear of the single crystal diamond abrasive grains (B-2, B-3) represented by the octahedral crystal plane oc and the hexahedral crystal plane he, and to provide a dresser having a long service life.
In mounting the single crystal diamond abrasive grains (B-1) represented by the rhombic dodecahedral crystal plane do, the octahedral crystal plane oc, and the hexahedral crystal plane he, as shown in fig. 22, the opposing intra-groove wall surfaces 51doha, 51dohb formed in the mounting groove 5doh of the grindstone 2 have: thread bottom surfaces 51dohab and 51dohbb forming 110 degrees at the thread root of the groove; vertical surfaces 51dohav and 51dohbv standing up to the outer peripheral surface 22; and two median inclined surfaces 51doham, 51dohbm formed between the upper end portions of the thread bottom surfaces 51dohab, 51dohbb and the lower end portions of the vertical surfaces 51dohav, 51dohbv at 71 °.
The single crystal diamond abrasive grains (B-1) represented by the rhombic dodecahedron crystal face do, the octahedron crystal face oc, and the hexahedron crystal face he were fixed by fitting the octahedron crystal faces oc1, oc2 as two base end side crystal faces to the thread bottom surfaces 51dohab, 51dohbb of the mounting groove 5doh, and the hexahedron crystal face he to the vertical surfaces 51dohav, 51 dohbv. In addition, the sides Si1, Si2 formed by the crystal planes do of the two adjoining dodecahedrons are matched with the median slopes 51doham, 51dohbm, respectively. The two sides Shd1, Shd2 (see fig. 22) formed by the hexahedral crystal plane he and the dodecahedral crystal plane do are configured to be located closer to the rotation axis CL than the outer peripheral surface 22. The crystal faces for dressing of the single-crystal diamond abrasive grain (B-1) represented by the crystal face do of the rhombic dodecahedron, the crystal face oc of the octahedron, and the crystal face he of the hexahedron are mainly the crystal face do of the dodecahedron and the crystal face oc of the octahedron. The single-crystal diamond abrasive grains (B-1) represented by the rhombic dodecahedral crystal plane do, the octahedral crystal plane oc, and the hexahedral crystal plane he all have cleavage planes of the crystals inclined with respect to the outer peripheral surface 22 of the grinding wheel 2.
In addition, the hardness of the Miller index {1, 1} plane constituting the octahedral crystal plane oc and the Miller index {1, 0} plane constituting the dodecahedron crystal plane do among the crystal planes of the diamond single crystal is higher than the hardness of the Miller index {1, 0} plane constituting the hexahedral crystal plane he. Therefore, as shown in fig. 22, the miller indices {1, 1} plane of the octahedral crystal plane oc and the miller indices {1, 1} plane of the dodecahedral crystal plane do are mounted on the side opposite to the mounting groove 5doh (radially outside the grindstone 2), and the truing can be performed using the crystal planes oc and do having high hardness. This makes it possible to delay the progress of wear of the single crystal diamond abrasive grains (B-1) represented by the dodecahedral rhombic crystal plane do, the octahedral crystal plane oc, and the hexahedral crystal plane he, and thus to provide a long-life dresser.
In mounting the single crystal diamond abrasive grains (B-4) having the rhombic dodecahedron crystal face do and the octahedron crystal face oc, as shown in fig. 23, the opposing intra-groove wall surfaces 51doa, 51dob formed in the mounting groove 5do of the grindstone 2 have: thread root surfaces 51doab, 51dobb formed at 110 ° to the groove thread root; and two upper inclined surfaces 51doau, 51dobu formed continuously and oppositely to the upper end portions of the thread bottom surfaces 51doab, 51dobb at an angle of 71 °.
The single-crystal diamond abrasive grains (B-4) having the rhombic dodecahedron crystal face do and the octahedron crystal face oc were fixed by fitting the octahedron crystal faces oc1 and oc2 to the thread ridge bottom surfaces 51doab and 51dobb of the mounting groove 5do, as two base end side crystal faces. The sides Si1 and Si2 formed by the crystal planes do of the two adjoining dodecahedrons are matched with the upper inclined surfaces 51doau and 51dobu, respectively. Two apexes AP1 and AP2 (see fig. 23) formed by four dodecahedral crystal planes are configured to be located closer to the rotation axis CL than the outer peripheral surface 22. In the single-crystal diamond abrasive grains (B-4) having the rhombic dodecahedral crystal planes do and the octahedral crystal planes oc, the cleavage planes of the crystals are all kept inclined with respect to the outer peripheral surface 22 of the grindstone 2.
The mounting of the single crystal diamond abrasive grains (C-1) represented by the crystal planes do and he of the rhombohedral and the crystal planes he is based on the rhombohedral single crystal diamond abrasive grains (C), and the description thereof is omitted.
The grain size of the octahedral single crystal diamond abrasive grains 4 is #16/18, but the grain size is not limited to this. For example, if the grain size is in the range of #12/14 to #60/80, it is preferable to use large #12/14 for the octahedral single crystal diamond abrasive grain when the small-grain diamond abrasive grain is large # 20/30.
In addition, 80 octahedral single crystal diamond abrasive grains 4 are arranged on the outer peripheral surface 22 of the grindstone 2, but the grinding wheel is not limited thereto. The diamond abrasive grains can be arranged in any number, for example, 70 or 100, depending on the size (grain size) of the small-diameter diamond abrasive grains of the diamond abrasive grain layer or the length of the outer peripheral surface of the grinding wheel.
The plating of the small-diameter diamond abrasive grains and the polyhedral single-crystal diamond abrasive grains is performed by electroplating, but the plating is not limited thereto. For example, the diamond abrasive grains having a small particle diameter and the polyhedral single crystal diamond abrasive grains may be plated by forming a plating layer by electroless plating or electroplating.
The adhesive 6 is a nonconductive adhesive, but is not limited thereto, and may be a conductive adhesive, for example. As the conductive adhesive, for example, an epoxy resin adhesive mixed with a conductive filler can be used. Examples of the conductive filler include carbon fillers such as carbon black and graphite, and metal fillers such as Ni and Cu powders. In the case where the octahedral single crystal diamond abrasive grains are bonded by the conductive binder, the plating layer grows from the conductive binder to which the octahedral single crystal diamond abrasive grains are bonded, and no gap is generated between the octahedral single crystal diamond abrasive grains and the plating layer. This makes it possible to more firmly fix the plating layer.
As described above, the specific configuration described in the above embodiment is merely an example of the present invention, and the present invention is not limited to such a specific configuration, and various embodiments can be adopted without departing from the spirit of the present invention.
(possibility of Industrial utilization)
An electrodeposited diamond dresser for molding which can be used for a threaded grinding tool for gear grinding which is required to have high accuracy and long life.
Description of reference numerals
1 … electro-deposition diamond trimmer for shaping; 2 … grinding wheel; 21 … a taper; 21f … surface taper; 21r … internal taper; 22 … outer peripheral surface; 25f … band-shaped parts (band-shaped range); 25b … back band (band-shaped range); 26 … outer peripheral edge portion; 3 … a diamond abrasive grain layer; 31 … small particle size diamond grit; 32 … electroplated (plated); 4 … octahedral single crystal diamond grit (polyhedral single crystal diamond grit); 41 … ridge; 42 … top; 43 … top; 5 … mounting groove; 51a … two wall surfaces in the groove; 51b … two wall surfaces in the groove; 52 … groove channel; 6 … an adhesive; CL … axis of rotation; crystal planes (installation crystal planes) of do1, do2 … dodecahedron; crystal faces of oc1 and oc2 … octahedrons (mounting crystal faces); h1, H2 … head-side miller indices {1, 1} planes; m1 and M2 … basal end Miller indices {1, 1} plane (mounting crystal plane).

Claims (6)

1. An electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding, comprising:
a grinding wheel made of hardened and tempered steel, which is formed into a disk shape having tapered surfaces on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral surface, and which is rotationally driven around a rotation axis;
a diamond abrasive grain layer extending in a band-like shape with a predetermined width at an outer peripheral edge portion of the tapered surface, the diamond abrasive grain layer being coated with a plurality of small-diameter diamond abrasive grains by a plating layer;
a plurality of mounting grooves formed on the outer peripheral surface of the grinding wheel in parallel with the rotation axis and having two in-groove wall surfaces forming a predetermined angle; and
polyhedral single-crystal diamond abrasive grains which are formed into a granular shape larger than the small-particle-diameter diamond abrasive grains, have mounting crystal planes equal to the predetermined angle, and are crystals in which a plane parallel to the outer peripheral surface of the grindstone does not become a cleavage plane when the mounting crystal planes are mounted on both wall surfaces in the groove,
the mounting crystal faces of the respective polyhedral single-crystal diamond abrasive grains are plated on both the groove inner wall faces of the mounting groove of the grindstone by the plating layer,
the plurality of polyhedral single-crystal diamond abrasive grains are a plurality of dodecahedral single-crystal diamond abrasive grains,
the mounting crystal face includes: two base end side crystal planes opposed at an angle of 120 ° with respect to a ridge line appearing in the dodecahedral single-crystal diamond abrasive grain; and two vertical surfaces which are continuous with the basal end part side crystal surface and are vertically arranged when the dodecahedron single crystal diamond abrasive grains are installed in the installation groove,
the grinding wheel has a plurality of mounting grooves disposed on the outer peripheral surface, wherein the grooves extend in the direction of the rotation axis and the two opposing wall surfaces in the grooves are 120 DEG for the plurality of mounting grooves,
the two inner wall surfaces of each mounting groove and the two base end side crystal faces of each dodecahedral single-crystal diamond abrasive grain are bonded together with a binder,
the plating layer covers two sides where two head-side crystal planes opposed to each other with respect to the two base-side crystal planes intersect with the two perpendicular planes to plate the dodecahedral mono-crystalline diamond abrasive grains on the outer peripheral surface,
the side where the two head-side crystal planes intersect the two perpendicular planes is disposed closer to the rotation axis than the outer peripheral surface in the radial direction of the grinding wheel.
2. The electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding according to claim 1,
the particle size of the small-particle-size diamond abrasive grains is #20/30 to #100/120,
the grain size of the polyhedral single-crystal diamond abrasive grains is #12/14 to # 60/80.
3. An electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding, comprising:
a grinding wheel made of hardened and tempered steel, which is formed into a disk shape having tapered surfaces on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral surface, and which is rotationally driven around a rotation axis;
a diamond abrasive grain layer extending in a band-like shape with a predetermined width at an outer peripheral edge portion of the tapered surface, the diamond abrasive grain layer being coated with a plurality of small-diameter diamond abrasive grains by a plating layer;
a plurality of mounting grooves formed on the outer peripheral surface of the grinding wheel in parallel with the rotation axis and having two in-groove wall surfaces forming a predetermined angle; and
polyhedral single-crystal diamond abrasive grains which are formed into a granular shape larger than the small-particle-diameter diamond abrasive grains, have mounting crystal planes equal to the predetermined angle, and are crystals in which a plane parallel to the outer peripheral surface of the grindstone does not become a cleavage plane when the mounting crystal planes are mounted on both wall surfaces in the groove,
the mounting crystal faces of the respective polyhedral single-crystal diamond abrasive grains are plated on both the groove inner wall faces of the mounting groove of the grindstone by the plating layer,
the plurality of polyhedral single-crystal diamond abrasive grains are a plurality of octahedral single-crystal diamond abrasive grains,
the mount crystal plane is a base end side Miller index {1, 1} plane at an angle of 110 DEG and adjoining with a ridge line in the octahedral single crystal diamond abrasive grain,
the grinding wheel has a plurality of mounting grooves disposed on the outer peripheral surface, wherein the grooves extend in the direction of the rotation axis and the two opposing wall surfaces in the grooves are 110 DEG for the plurality of mounting grooves,
the two inner wall surfaces of each mounting groove and the two base end side Miller index {1, 1} surfaces of each octahedral single crystal diamond abrasive grain are bonded together with an adhesive,
the plating layer coats a top portion where the two base end side miller indices {1, 1} planes and the two head side miller indices {1, 1} planes intersect, and plates the octahedral single-crystal diamond abrasive grains on the outer peripheral surface, the two head side miller indices {1, 1} planes and the two base end side miller indices {1, 1} planes being opposed to each other,
the apex portion where the two base end portion side miller index {1, 1} planes and the two head portion side miller index {1, 1} planes intersect is disposed closer to the rotation axis side than the outer peripheral surface in the radial direction of the grinding wheel, and the two head portion side miller index {1, 1} planes and the two base end portion side miller index {1, 1} planes are opposed to each other.
4. The electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding according to claim 3,
the small-diameter diamond abrasive grains are plated between the plurality of octahedral single crystal diamond abrasive grains on the outer peripheral surface of the grinding wheel through the plating layer.
5. The electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding according to claim 3,
the particle size of the small-particle-size diamond abrasive grains is #20/30 to #100/120,
the grain size of the polyhedral single-crystal diamond abrasive grains is #12/14 to # 60/80.
6. A method for manufacturing an electrodeposited diamond dresser for molding a threaded grinding tool for gear grinding, comprising the steps of:
a grinding wheel forming step of forming a grinding wheel made of hardened and tempered steel into a disk shape having tapered surfaces on both sides of an outer peripheral portion so as to be thinner toward the outer peripheral portion;
a mounting groove forming step of forming a plurality of mounting grooves at predetermined intervals on an outer peripheral surface of the grinding wheel, the mounting grooves having grooves extending in a direction of a rotation axis of the grinding wheel and facing inner wall surfaces of the grooves forming an angle of 110 °;
an octahedral single crystal diamond abrasive grain bonding step of bonding the octahedral single crystal diamond abrasive grains to both wall surfaces in the grooves of the mounting grooves with an adhesive by using two base end side miller index {1, 1} surfaces adjoining with each other at a ridge line at an angle of 110 ° in the octahedral single crystal diamond abrasive grains;
a diamond abrasive grain contact step of bringing a plurality of small-diameter diamond abrasive grains into contact with a range extending in a band-like shape with a predetermined width at an outer peripheral edge portion of the tapered surface of the grinding wheel and the outer peripheral surface; and
a plating step of forming a plating layer formed by plating on the outer peripheral surface to which the octahedral single crystal diamond abrasive grains are bonded and which is in contact with the small-diameter diamond abrasive grains and the tapered surface in contact with the small-diameter diamond abrasive grains, the small-diameter diamond abrasive grains being plated on the outer peripheral surface and the range extending in a band shape, and the octahedral single crystal diamond abrasive grains being plated on the outer peripheral surface so as to cover a top portion where the two base end side miller indices {1, 1} surfaces and the two head side miller indices {1, 1} surfaces intersect with each other, the two head side miller indices {1, 1} surfaces and the two base end side miller indices {1, 1} surfaces being opposed to each other,
in the mounting groove forming step, the depth of each mounting groove is set to be as follows: the apex portion of each of the attached octahedral single crystal diamond abrasive grains, which is located on a side separated from each other of the two base end side miller index {1, 1} planes adjoining at an angle of 110 ° and along a ridge line, may be located closer to the rotation axis than the outer peripheral surface in the radial direction of the grindstone.
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