CN109963401A - The manufacturing method and Double-side line substrate of Double-side line substrate - Google Patents
The manufacturing method and Double-side line substrate of Double-side line substrate Download PDFInfo
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- CN109963401A CN109963401A CN201910268380.XA CN201910268380A CN109963401A CN 109963401 A CN109963401 A CN 109963401A CN 201910268380 A CN201910268380 A CN 201910268380A CN 109963401 A CN109963401 A CN 109963401A
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- 239000000758 substrate Substances 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000008859 change Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 37
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 6
- 239000003550 marker Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 241001290864 Schoenoplectus Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 239000011159 matrix material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract
A kind of manufacturing method of Double-side line substrate and Double-side line substrate, manufacturing method includes: offer substrate, and wherein substrate includes first surface and second surface, and first surface and second surface are relative to each other；The first alignment mark and the first patterned circuit are formed on first surface；The position of the first alignment mark is sensed with optical positioning apparatus；The second alignment mark is formed on second surface according to the position of the first alignment mark；The position of the second alignment mark is sensed with optical positioning apparatus；And the second patterned circuit is formed on second surface, wherein the second patterned circuit is aligned the first patterned circuit in the normal direction of substrate according to the position of the second alignment mark.
Description
Technical field
The present invention relates to a kind of manufacturing methods of circuit base plate, and especially with regard to a kind of manufacture of Double-side line substrate
Method and Double-side line substrate.
Background technique
Existing display device includes display panel, and display panel includes substrate, multiple pixel units and multiple edge elements
Part, substrate include viewing area with around the marginal zone of viewing area, and pixel unit is to be arranged in viewing area, and edge member is then set
Set in marginal zone, edge member can further connect corresponding pixel unit, edge member can be used to drive pixel unit or
It can be used as the ground path of pixel unit.Image can be presented in the viewing area of display panel, and marginal zone is then to belong to dark space, can not
Image is presented.Therefore, display device can have frame to cover marginal zone, and only expose viewing area.In addition, there are also a kind of now
Spliced display device, such spliced display device have multiple display panels, these display panels can be arranged in a matrix fashion
It arranges and is stitched together, large-sized image is presented.
From the point of view of the surface area of substrate, if the accounting of marginal zone is bigger, the frame of display device can be thicker, or spells
The dark space connect between adjacent two display panel of formula display device then can be more obvious.In order to reduce the accounting of marginal zone, existing one
Kind double-sided substrate, pixel unit is the upper surface that double-sided substrate is arranged in, and at least part of edge member is then set to
The lower surface of double-sided substrate.In this way, which the element being arranged needed for marginal zone tails off, and the accounting of marginal zone can also reduce.
Summary of the invention
Pixel unit and part edge member can be respectively arranged at the upper surface of substrate under by existing double-sided substrate
The accounting of the marginal zone of substrate is reduced on surface whereby.But, due to needing electrical property between pixel unit and corresponding edge member
Connection, therefore position has to precisely to align each other in the pixel unit of upper and lower surfaces with corresponding edge member respectively.It is existing
Only there is alignment mark for contraposition in technology on a wherein surface for upper and lower surfaces, so that the element of upper and lower surfaces is difficult to
It precisely aligns and may cause electric connection failure.In addition, the element that shuts out the light of the meeting of upper and lower surfaces can not precise overlay,
And lightproof area is caused to increase, effect is presented in the image for influencing final products.
An at least embodiment of the invention proposes the manufacturing method and Double-side line substrate of a kind of Double-side line substrate, so that
Element on opposite two surfaces of Double-side line substrate can be accurately positioned.
An at least embodiment of the invention proposes the manufacturing method and Double-side line substrate of a kind of Double-side line substrate, to keep away
Exempt from the electric connection failure of the element on opposite two surfaces, and avoids lightproof area increase.
An at least embodiment of the invention proposes a kind of manufacturing method of Double-side line substrate comprising: substrate is provided,
Middle substrate includes first surface and second surface, and first surface and second surface are relative to each other；Formed the first alignment mark with
First patterned circuit is on first surface；The position of the first alignment mark is sensed with optical positioning apparatus；According to the first contraposition
The position of label forms the second alignment mark on second surface；The position of the second alignment mark is sensed with optical positioning apparatus；
And the second patterned circuit is formed on second surface, wherein the second patterned circuit exists according to the position of the second alignment mark
The first patterned circuit is aligned in the normal direction of substrate.
An at least embodiment of the invention proposes a kind of Double-side line substrate comprising substrate, the first alignment mark, first
Patterned circuit, the second alignment mark and the second patterned circuit.Substrate includes first surface and second surface, first surface with
Second surface is relative to each other.First alignment mark is located on first surface, and the first patterned circuit is located on first surface.Second
Alignment mark is located on second surface, wherein projection of second alignment mark in the normal direction of substrate is relevant to the first contraposition
Label.Second patterned circuit is located on second surface, wherein the second patterned circuit is aligned the first pattern in the normal direction
Change route.
In conclusion a kind of manufacturing method of proposed Double-side line substrate and Double-side line substrate according to the present invention is all
More embodiments, so that can be accurately positioned for the element on opposite two surfaces in the processing procedure of Double-side line substrate, make opposite two
Counter element on surface can be exactly aligned with each other, thus avoid the electric connection failure of the counter element on opposite two surfaces
May, and lightproof area increase can also be avoided.
Describe detailed features and advantage of the invention in detail in embodiments below, content is enough to make any familiar
Related technician understands technology contents of the invention and implements accordingly, and according to content disclosed in this specification, claim
Book and attached drawing, it is any to be familiar with related technician and be readily understood upon the relevant purpose of the present invention and advantage.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 show the schematic top view of the Double-side line substrate of one embodiment of the invention；
Fig. 2 show the bottom view of the Double-side line substrate of Fig. 1；
Fig. 3 show the diagrammatic cross-section at the 3-3 line segment of Fig. 1；
Fig. 4 show the flow chart of the manufacturing method of the Double-side line substrate of one embodiment of the invention；
Fig. 5 show the processing procedure schematic diagram one of the Double-side line substrate of one embodiment of the invention；
Fig. 6 show the processing procedure schematic diagram two of the Double-side line substrate of one embodiment of the invention；
Fig. 7 show the processing procedure schematic diagram three of the Double-side line substrate of one embodiment of the invention；
Fig. 8 show the processing procedure schematic diagram four of the Double-side line substrate of one embodiment of the invention；
Fig. 9 show the processing procedure schematic diagram five of the Double-side line substrate of one embodiment of the invention；
Figure 10 show the processing procedure schematic diagram six of the Double-side line substrate of one embodiment of the invention；
Figure 11 show the processing procedure schematic diagram seven of the Double-side line substrate of one embodiment of the invention；
Figure 12 show the processing procedure schematic diagram eight of the Double-side line substrate of one embodiment of the invention；
Figure 13 show the processing procedure schematic diagram nine of the Double-side line substrate of one embodiment of the invention；And
Figure 14 show the processing procedure schematic diagram ten of the Double-side line substrate of one embodiment of the invention.
Wherein, appended drawing reference:
20 Double-side line substrates
100 substrates
110 first surfaces
120 second surfaces
130 wiring regions
140 marginal zones
150 panel areas
210 first alignment marks
211 squares
220 second alignment marks
221 squares
300 first patterned circuits
310 first line layers
320 first insulating layers
330 semiconductor layers
340 second line layers
350 ohmic contact layers
360 transparency conducting layers
400 second patterned circuits
410 tertiary circuit layers
420 second insulating layers
430 the 4th line layers
500 optical positioning apparatus
COM ground line
D drain electrode
G grid
M transmission line
MT1, MT2 metal layer
ND normal direction
PR1, PR2 photoresist layer
S source electrode
TF transparent film layer
S101 forms metal layer on first surface
S103 forms the first alignment mark and first line layer on first surface
S105 forms the first patterned circuit on first surface according to the position of the first alignment mark
S107 forms transparent film layer and photoresist layer on second surface
S109 is according to the position of the first alignment mark, and group's case photoresist layer and transparent film layer are to form second
Alignment mark is on second surface
S111 forms metal layer and photoresist layer on second surface
S113 is according to the position of the second alignment mark, and group's case photoresist layer and metal layer are to form third line
Road floor is on second surface
S115 forms the second patterned circuit on second surface according to the position of the second alignment mark
Specific embodiment
Structural principle and working principle of the invention are described in detail with reference to the accompanying drawing:
Fig. 1 and Fig. 2 are please referred to, Fig. 1 show the schematic top view of the Double-side line substrate 20 of one embodiment of the invention, figure
2 show the bottom view of the Double-side line substrate 20 of Fig. 1.In the present embodiment, Double-side line substrate 20 is for making
Display panel, but not limited to this.Double-side line substrate 20 includes substrate 100, the first alignment mark 210 and the second alignment mark
220.Substrate 100 includes first surface 110 and second surface 120, and first surface 110 and second surface 120 are relative to each other.The
One alignment mark 210 is located on first surface 110, and the second alignment mark 220 is located on second surface 120.In the present embodiment
In, substrate 100 can divide into wiring region 130 and marginal zone 140.Wiring region 130 can be used to that the electricity that can be used for showing image is arranged
Sub-circuit mould group, the active member that the pixel unit of such as display panel includes with it.Marginal zone 140 surround wiring region 130, and
Marginal zone 140 is provided with the first alignment mark 210 and the second alignment mark 220.
As shown in Figures 1 and 2, in the present embodiment, wiring region 130 can divide into four panel areas 150, these panel areas
150 can be cut into independent panel respectively, these independent panels can respectively as the single display panel of display device,
It can be used as multiple display panels spliced in a matrix fashion of spliced display device.Also, Double-side line substrate 20 by into
One step is cut to be formed in the processing procedure of display panel, and marginal zone 140 can be cut, and only panel area 150 can be left
As display panel, therefore, the first alignment mark 210 and the second alignment mark 220 of marginal zone 140 also can and then be removed and
It will not be as a part of display panel.In some embodiments, wiring region 130 can also divide into two, three, five or six
A panel area 150 with first-class various quantity, and each panel area 150 can be cut into respectively independent panel using it is individual as
The display panel of single a display device；Alternatively, wiring region 130 can also only distinguish as single panel area 150.
The diagrammatic cross-section at the 3-3 line segment of Fig. 1 is shown referring again to Fig. 3, Fig. 3.Double-side line substrate 20 further includes
First patterned circuit 300 and the second patterned circuit 400, the first patterned circuit 300 are located on first surface 110, and the
Two patterned circuits 400 are located on second surface 120.As shown in Figure 1 to Figure 3, in the present embodiment, the first patterned circuit
300 be to be located on the first surface 110 of wiring region 130, and the second patterned circuit 400 is the second table positioned at wiring region 130
On face 120, and the second patterned circuit 400 is that the first patterned circuit 300 is aligned on the normal direction ND of substrate 100.And
And first alignment mark 210 be to be set on the first surface 110 of marginal zone 140, and the second alignment mark 220 is to be set to
On the second surface 120 of marginal zone 140.
As shown in Figure 1 to Figure 3, in the present embodiment, the second alignment mark 220 towards substrate 100 normal direction ND throwing
Shade is about the first alignment mark 210.Wherein, the first alignment mark 210 and the second alignment mark 220 are along normal direction ND
Projection on one surface 110 can refer to the view shown in Fig. 1 on X/Y plane, and the first alignment mark 210 and the second register guide
Note 220 can refer to the view shown in Fig. 2 on X/Y plane along projection of the normal direction ND on second surface 120.For example,
First alignment mark 210 can be located adjacent one another with projection of second alignment mark 220 on X/Y plane, and the first alignment mark 210
It is to be located at specific position of the substrate 100 on X/Y plane with the second alignment mark 220.In the present embodiment, the first alignment mark
210 and second alignment mark 220 it is each there are four, four the first alignment marks 210 are located at four the second alignment marks 220
Quadrangle of the substrate 100 on X/Y plane, and every one first alignment mark 210 is neighbouring corresponding second register guide on X/Y plane
Note 220.
In some embodiments, the first alignment mark 210 at least two, and 2 first alignment marks 210 are located at
Two corners on the diagonal line of substrate 100；Also, the second alignment mark 220 also at least two, and 2 second alignment marks
220 are located at two corners on the diagonal line of substrate 100.For example, 2 first alignment marks 210 and 2 second register guides
Note 220 can be respectively arranged at the upper left corner and the lower right corner of substrate 100 shown in FIG. 1.First alignment mark 210 and the second register guide
Note 220 respectively has at least two setting, it can be ensured that the accuracy of positioning and contraposition can reach the processing procedure institute of Double-side line substrate 20
The basic demand needed.In some embodiments, on each specific position of X/Y plane, the first alignment mark 210 and second pair
Position label 220 can also be respectively provided with one, three or five or more.
As shown in figure 3, in the present embodiment, the method for the first alignment mark 210 and the second alignment mark 220 towards substrate 100
The projection of line direction ND is not overlapped, be so conducive in processing procedure according to the first alignment mark 210 and the second alignment mark 220 into
Row contraposition, after related description is specified in.
As shown in Figure 1 to Figure 3, in the present embodiment, the first alignment mark 210 includes multiple spaced squares 211,
The arrangement equally spaced from each other of multiple squares 211 of first alignment mark 210, and the square 211 of the first alignment mark 210 is in the side X
To be each provided with two or more in Y-direction.For example, the first alignment mark 210 includes four squares 211,
In there are three square 211 be equidistant radial arrangement along the Y direction, and between wherein thering are two squares 211 to be then equidistant along the X direction
Every arrangement.In the processing procedure of the first patterned circuit 300, production equipment needs first to position through the first alignment mark 210, will
First patterned circuit 300 aligns and is formed in the exact position of first surface 110.In addition, in the system of the second alignment mark 220
Cheng Zhong, production equipment are also required to first position through the first alignment mark 210, the second alignment mark 220 are aligned and is formed in
The exact position of second surface 120.
For example, production equipment can have optical positioning apparatus 500 (please referring to Fig. 6), such optical positioning apparatus 500
Such as, but not limited to be laser ranging system, such laser ranging system can on X/Y plane scanning substrate 100 first surface
110.When laser ranging system scans on first surface 110, waveform does not have fluctuating, when laser ranging system scanning to the
When either one alignment mark 210 block 211, a string wave can be generated, that is to say, that when laser ranging system along the X direction
When by the first alignment mark 210, two squares 211 of the first alignment mark 210 can be continuously swept in a short time and are generated
Two string waves, using production equipment can determine herein with the presence of alignment mark, and then judge first automatically according to the two string waves
The position of alignment mark 210 in the X direction；And when laser ranging system passes through the first alignment mark 210 along the Y direction, meeting
Three squares 211 of the first alignment mark 210 are continuously swept in a short time and generate three string waves, and production equipment can be true whereby
Determine herein with the presence of alignment mark, and then judges the position of the first alignment mark 210 in the Y direction automatically according to these three string waves
It sets.Whereby, production equipment can confirm the first alignment mark 210 in the coordinate of X/Y plane and be positioned.
In the present embodiment, the square 211 of the first alignment mark 210 X-direction with each in Y-direction there are two above to set
It sets, the situation that can avoid production equipment erroneous judgement occurs.For example, if laser ranging system along the X direction or Y-direction scanning, and
A string wave is only generated in certain time (or in the certain distance that is moved of laser ranging system), this indicates laser ranging dress
Not the first alignment mark 210 sensed is set, and may be because other protrusions or other factors cause this string wave anti-
It answers, therefore production equipment can filter out above-mentioned such situation according to internal judgment mechanism, to avoid judging by accident.
As shown in Figure 1 to Figure 3, in the present embodiment, the second alignment mark 220 also includes multiple spaced squares
221, the arrangement equally spaced from each other of multiple squares 221 of the second alignment mark 220, and the square 221 of the second alignment mark 220 exists
Two or more are each provided in X-direction and Y-direction.For example, the second alignment mark 220 includes three squares 221,
Wherein having two squares 221 is equidistant radial arrangement along the Y direction, and it is then equidistant along the X direction for wherein having two squares 221
It is alternatively arranged.In the processing procedure of the second patterned circuit 400, production equipment needs first to position through the second alignment mark 220, with
Second patterned circuit 400 is aligned and is formed in the exact position of second surface 120.Production equipment penetrates the second alignment mark
The explanations of 220 positioning can refer to aforementioned, and similarly, in the present embodiment, the square 221 of the second alignment mark 220 is in X-direction
With the situation generation that there are two above settings, and so also avoidable production equipment is judged by accident also each in Y-direction.
In the present embodiment, the first alignment mark 210 and the second alignment mark 220 are using square 211,221 as label
Object, and the square 221 of the square 211 of the first alignment mark 210 and the second alignment mark 220 is length and width on X/Y plane
Degree is all the square of 20 microns (micrometer).In some embodiments, the first alignment mark 210 and the second alignment mark
Other kind of shape of non-square also can be used in 220 marker.In the present embodiment, the marker of the first alignment mark 210
Quantity it is not identical as the quantity of the marker of the second alignment mark 220.For example, the square 211 of the first alignment mark 210 has four
It is a, and there are three the squares 221 of the second alignment mark 220.In some embodiments, the marker of the first alignment mark 210
Quantity also can be identical with the quantity of the marker of the second alignment mark 220.
As shown in figure 3, in the present embodiment, the first patterned circuit 300 includes first line layer 310, the first insulating layer
320, semiconductor layer 330 and the second line layer 340.First line layer 310 includes grid G, and the adjacent first surface 110 of grid G.
First insulating layer 320 abuts first surface 110 and covers grid G on the normal direction ND of substrate 100.Semiconductor layer 330 covers
The first insulating layer of lid 320 and grid G is overlapped on the normal direction ND of substrate 100.Second line layer 340 includes source S and leakage
Pole D, source S and drain D are covered on semiconductor layer 330, and source S and drain D are not in direct contact each other.Source S and leakage
Pole D is overlapped grid G on the normal direction ND of substrate 100, and source S with drain D is connected each other through semiconductor layer 330
It connects.In the present embodiment, the first patterned circuit 300 can be used as is used to drive pixel unit (not shown) on display panel
Active member, but not limited to this.
As shown in figure 3, in the present embodiment, the second patterned circuit 400 includes tertiary circuit layer 410, second insulating layer
420 and the 4th line layer 430.Tertiary circuit layer 410 abuts second surface 120.Second insulating layer 420 abuts second surface 120
And the tertiary circuit layer 410 of part is covered on the normal direction ND of substrate 100.4th line layer 430 covers second insulating layer
420, and the 4th line layer 430 contacts tertiary circuit layer 410 on the normal direction ND of substrate 100.In the present embodiment, second
Patterned circuit 400 can be used as the driving element for driving the first patterned circuit 300, can e.g. transmit signal or electric power
To the driving element of grid G, but not limited to this.
In the present embodiment, the first patterned circuit 300 is to be electrically connected corresponding second patterned circuit 400, citing
For, the tertiary circuit of the grid G of the first line of the first patterned circuit 300 shown in Fig. 3 and the second patterned circuit 400
Layer 410 can be electrically connected to each other.In some embodiments, grid G and tertiary circuit layer 410, which can pass through, is arranged in substrate 100
The via hole (not shown) of corresponding position and be electrically connected to each other, the via hole is, for example, glass via hole (Through
Glass Via, TGV), but not limited to this.
As shown in figure 3, in the present embodiment, the first patterned circuit 300 further includes ohmic contact layer 350.Ohmic contact
Layer 350 covers the semiconductor layer 330 of parts, and ohmic contact layer 350 is between source S and semiconductor layer 330 and drain D
Between semiconductor layer 330.Ohmic contact layer 350 helps to reduce the resistance between source S and semiconductor layer 330 and drain electrode
Resistance between D and semiconductor layer 330.In the present embodiment, first line layer 310, which further includes, is grounded COM, and second
Line layer 340 further includes transmission line M, and the first patterned circuit 300 further includes transparency conducting layer 360.It is grounded COM adjacent the
One surface 110, and the first insulating layer 320 covers ground line COM, the first patterned circuit on the normal direction ND of substrate 100
300 can pass through ground line COM ground connection.Transmission line M abuts the first insulating layer 320 and is overlapped on the normal direction ND of substrate 100
It is grounded COM.Adjacent first insulating layer 320 of transparency conducting layer 360 and the covering transmission line M on the normal direction ND of substrate 100
With the drain D of part, transmission line M can pass through transparency conducting layer 360 with drain D and be electrically connected to each other, transmission line M and drain D
Between can pass through transparency conducting layer 360 and transmit signal or electric power.
It is on the normal direction ND of substrate 100 about aforementioned second patterned circuit 400 and the first patterned circuit 300
The setting being in alignment with each other, for example, the tertiary circuit layer 410 of the second patterned circuit 400 and the first patterned circuit 300
The grid G of first line layer 310 is in alignment with each other on the normal direction ND of substrate 100, and tertiary circuit layer 410 and grid G
It is completely overlapped on the normal direction ND of substrate 100, that is to say, that tertiary circuit layer 410 and grid G are projected on X/Y plane
Profile, the two shape is completely overlapped within profile the greater with equal in magnitude and completely overlapped or profile smaller.?
In the case that grid G and the material of tertiary circuit layer 410 are lighttight metal, grid G and tertiary circuit layer 410 are in substrate
Completely overlapped setting on 100 normal direction ND can make grid G and tertiary circuit layer 410 (be equivalent to substrate in light direction
100 normal direction ND) on can block the area (hereinafter referred to as lightproof area) of light and reach minimum.On the contrary, if grid G
Completely not be overlapped on the normal direction ND of substrate 100 with tertiary circuit layer 410, then its lightproof area can maximize.And if grid
Pole G is Chong Die in the normal direction ND upper part of substrate 100 with tertiary circuit layer 410, then it is complete to be still greater than the two for its lightproof area
Lightproof area when full weight is folded.In general, bright for image can be made to be more clear, it may be desirable to substrate can be minimized as far as possible
Lightproof area caused by element on 100.In addition to this, to enable tertiary circuit layer 410 and grid G through aforesaid base plate
Via hole on 100 and be electrically connected to each other, tertiary circuit layer 410 and grid G are also required in processing procedure in the normal of substrate 100
It is exactly aligned with each other on the ND of direction.
It can be seen from the above, on the processing procedure of Double-side line substrate 20, production equipment need through the first alignment mark 210 with
Second alignment mark 220 is accurately positioned and is aligned to realize, so that the first patterned circuit 300 and the second patterned circuit
400 can accurately be in alignment with each other.
The manufacturer of the Double-side line substrate 20 of one embodiment of the invention is shown with Fig. 5 to Figure 14, Fig. 4 referring to figure 4.
The flow chart of method, shown in Fig. 5 to Figure 14 be respectively one embodiment of the invention Double-side line substrate 20 processing procedure schematic diagram one to
Ten.Wherein, each step of Fig. 4 can be respectively corresponding to Fig. 5 to Figure 14, and Double-side line base made by Fig. 4 and Fig. 5 to Figure 14
Plate 20 is such as, but not limited to the Double-side line substrate 20 of Fig. 1 to Fig. 3, therefore the structure of related elements can refer to connection relationship
Fig. 1 to Fig. 3 and aforementioned related description, repeat no more in this.Illustrate the processing procedure of Double-side line substrate 20 below.
As shown in figure 5, in the present embodiment, substrate 100 can be first provided first, e.g. a piece of pretreated glass base
Plate 100, and this substrate 100 is fixed on to the particular platform (not shown) of production equipment, such as jig, to carry out subsequent system
Journey.Then, as shown in figs. 4 and 5, step S101 is to form metal layer MT1 on the first surface 110 of substrate 100.
As shown in Fig. 4 and Fig. 6, step S103 is to form the first alignment mark 210 with first line layer 310 in first surface
On 110.In this step, metal layer MT1 can be patterned as by patterning process such as exposure, development and etchings
First alignment mark 210 and first line layer 310.That is, first line layer 310 is by same with the first alignment mark 210
The metal layer MT1 of sample, it is formed together by same processing procedure, and the material of the first alignment mark 210 and first line layer 310
It is identical.It has been observed that optical positioning apparatus 500 can be used to sense the first alignment mark 210 that this step is completed, it is subsequent to meet
The positioning and contraposition demand of processing procedure.In the present embodiment, optical positioning apparatus 500 may include laser ranging system, but be not limited to
This.
As shown in Fig. 4 and Fig. 7, step S105 is the position according to the first alignment mark 210, forms the first patterned circuit
300 in being on first surface 110.In this step, production equipment can pass through optical positioning apparatus 500 and sense the first alignment mark
210 position and positioned, and align to form the first patterned circuit 300 according to the position of the first alignment mark 210.Citing
For, after first line layer 310 and the first alignment mark 210 are formed together, production equipment can be according to the first alignment mark
210 position, through exposure, develop with etching etc. patterning process, further by the first patterned circuit 300 other
Element contraposition is formed in scheduled position, and the other elements are, for example, the first insulating layer 320 above-mentioned, semiconductor layer 330, Europe
Nurse contact layer 350, the second line layer 340 and transparency conducting layer 360.
In some embodiments, after the first alignment mark 210 also can first be formed on first surface 110, further according to first
The position of alignment mark 210 forms the other elements of first line layer 310 and the first patterned circuit 300；Alternatively, the first contraposition
Label 210 any one can be formed together with the other elements of the first patterned circuit 300, in the case, the first patterned lines
The formation on road 300 can also be aligned by other positioning tools.
As shown in Fig. 4 and Fig. 8, step S107 is to form transparent film layer TF and photoresist layer PR1 on second surface 120.?
In this step, the first patterned circuit 300 on the first surface 110 of substrate 100 has completed, therefore on particular platform
Substrate 100 can be reversed 180 degree and make second surface 120 upward, to carry out the production of subsequent second patterned circuit 400.It connects
, transparent film layer TF can be initially formed on second surface 120, then re-forming photoresist layer PR1 on transparent film layer TF.Due to base
Plate 100 itself is transparent with the transparent film layer TF on second surface 120, therefore optical positioning apparatus 500 can penetrate the second table
The transparent film layer TF in face 120 and substrate 100 and sense the first alignment mark 210 positioned at first surface 110.For example,
After substrate 100 is reversed and second surface 120 forms transparent film layer TF, the second table is first penetrated with optical positioning apparatus 500
The transparent film layer TF in face 120 and sense the first alignment mark 210 and positioned, re-form photoresist layer PR1, then carry out subsequent
Processing procedure.
As shown in Fig. 4 and Fig. 9 to Figure 11, step S109 is the position according to the first alignment mark 210, group's case photoresist layer
PR1 and transparent film layer TF are to form the second alignment mark 220 on second surface 120.In this step, production equipment can pass through
Optical positioning apparatus 500 senses the position of the first alignment mark 210 and is positioned, and according to the position of the first alignment mark 210
It sets to form the second alignment mark 220.Also, as shown in figure 9, production equipment can be according to the position pattern of the first alignment mark 210
Change photoresist layer PR1.Then, as shown in Figure 10, production equipment can be etched equal processing procedures according to patterned photoresist layer PR1, and
Correspondingly pattern transparent film layer TF.Finally, as shown in figure 11, production equipment can remove patterned photoresist layer PR1, and be stayed
Under transparent film layer TF be the second alignment mark 220.In other words, the second alignment mark 220 is according to the first alignment mark
210 position and patterned transparent film layer TF and formed.In the present embodiment, in the processing procedure for forming the second alignment mark 220,
Since production equipment needs to sense the position of the first alignment mark 210 through optical positioning apparatus 500 to form the second register guide
Note 220, therefore the first alignment mark 210 does not overlap each other on normal direction ND with the second alignment mark 220, to avoid the
Two alignment marks 220 block the first alignment mark 210 and influence the sensing of optical positioning apparatus 500.
As shown in Fig. 4 and Figure 12, step S111 is to form metal layer MT2 and photoresist layer PR2 on second surface 120.?
In this step, metal layer MT2 can be initially formed on second surface 120, being subsequently formed photoresist layer PR2 on metal layer MT2.And
And production equipment can pass through the position that optical positioning apparatus 500 senses the second alignment mark 220.For example, metal layer MT2
The second alignment mark 220 can be covered on the normal direction ND of substrate 100 and is swelled, and correspondingly, photoresist layer PR2 also can be in method
On the ND of line direction correspond to the second alignment mark 220 in place of swell.Optical positioning apparatus 500 can pass through above-mentioned protuberance and sense
The position of second alignment mark 220.
As shown in Fig. 4 and Figure 13, step S113 is the position according to the second alignment mark 220, group case photoresist layer PR2 with
Metal layer MT2 is to form tertiary circuit layer 410 on second surface 120.In this step, production equipment can pass through optical alignment
Device 500 senses the position of the second alignment mark 220 and is positioned, and forms the according to the position of the second alignment mark 220
The tertiary circuit layer 410 of two patterned circuits 400.For example, production equipment be according to the position of the second alignment mark 220,
By exposing, developing and the patterning process such as etching, patterning photoresist layer PR2 and metal layer MT2, and remove patterned
Photoresist layer PR2, the metal layer MT2 finally left form tertiary circuit layer 410.
As shown in Fig. 4 and Figure 14, step S115 is the position according to the second alignment mark 220, forms the second patterned lines
Road 400 is on second surface 120.In this step, production equipment can pass through optical positioning apparatus 500 and sense the second alignment mark
220 position and positioned, and according to the position of the second alignment mark 220 formed the second patterned circuit 400.Citing comes
It says, after the formation of tertiary circuit layer 410, production equipment can continue the position according to the second alignment mark 220, by such as exposing
The patterning process such as light, development and etching are further formed the other elements of the second patterned circuit 400, such as second insulating layer
420 and the 4th line layer 430.After the second patterned circuit 400 completes, Double-side line substrate 20 is also corresponding to be completed.
Illustrated according to preceding process it is found that since the position of the second patterned circuit 400 is to correspond precisely to the second contraposition
The position of label 220, and the position of the second alignment mark 220 is to correspond precisely to the first alignment mark 210, and the first register guide
The position of note 210 is to correspond precisely to the first patterned circuit 300, and therefore, the position of the second patterned circuit 400 can be accurate right
Should be in the position of the first patterned circuit 300, and the second patterned circuit 400 is accurate on the normal direction ND of substrate 100
It is aligned the first patterned circuit 300.For example, method of the tertiary circuit layer 410 of the second patterned circuit 400 in substrate 100
It is the grid G of the first line layer 310 of the first patterned circuit of Accurate align 300 on the ND of line direction, with sharp tertiary circuit layer 410
Aforementioned via hole with grid G through substrate 100 is electrically connected, and is also beneficial to minimum tertiary circuit layer 410 and is made with grid G
At aforementioned lightproof area.
In conclusion a kind of manufacturing method of proposed Double-side line substrate and Double-side line substrate according to the present invention is all
More embodiments, so that can pass through and be accurately positioned with respect to the alignment mark on two surfaces in the processing procedure of Double-side line substrate, and
Keep the counter element on opposite two surfaces exactly aligned with each other according to alignment mark in production, in this way, can make opposite
Counter element on two surfaces can be connected accurately, to avoid the electric connection failure of the counter element on opposite two surfaces, and
Lightproof area can be also minimized, to avoid causing lightproof area to increase.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (10)
1. a kind of manufacturing method of Double-side line substrate characterized by comprising
A substrate is provided, wherein the substrate includes a first surface and a second surface, and the first surface and the second surface
Opposite to each other；
One first alignment mark and one first patterned circuit are formed on the first surface；
The position of first alignment mark is sensed with an optical positioning apparatus；
One second alignment mark is formed on the second surface according to the position of first alignment mark；
The position of second alignment mark is sensed with the optical positioning apparatus；And
One second patterned circuit is formed on the second surface according to the position of second alignment mark, wherein second pattern
Change route and is aligned first patterned circuit in the normal direction of the substrate.
2. the manufacturing method of Double-side line substrate as described in claim 1, which is characterized in that wherein according to first register guide
The position of note forms second alignment mark and further includes in the step on the second surface:
A transparent film layer is coated in the second surface；And
The transparent film layer is patterned according to the position of first alignment mark, to form second alignment mark.
3. the manufacturing method of Double-side line substrate as described in claim 1, which is characterized in that wherein form first register guide
Note is further included with first patterned circuit in the step on the first surface:
A metal layer is formed on the first surface；
The metal layer is patterned, to form a first line layer of first alignment mark Yu first patterned circuit；And
An insulating layer, the semi-conductor layer and one second of first patterned circuit are formed according to the position of first alignment mark
Line layer, wherein the insulating layer, the semiconductor layer with second line layer be overlapped First Line in the normal direction of the substrate
Road floor.
4. the manufacturing method of Double-side line substrate as described in claim 1, which is characterized in that the wherein optical positioning apparatus packet
Include a laser ranging system.
5. a kind of Double-side line substrate characterized by comprising
One substrate, including a first surface and a second surface, the first surface and the second surface are relative to each other；
One first alignment mark is located on the first surface；
One first patterned circuit is located on the first surface；
One second alignment mark is located on the second surface, and wherein second alignment mark is in the normal direction of the substrate
One projection is relevant to first alignment mark；And
One second patterned circuit is located on the second surface, and wherein second patterned circuit is aligned in the normal direction
First patterned circuit.
6. Double-side line substrate as claimed in claim 5, which is characterized in that wherein first alignment mark and second contraposition
The projection in the normal direction of the substrate is marked not to be overlapped.
7. Double-side line substrate as claimed in claim 5, which is characterized in that wherein first alignment mark includes multiple intervals
The square of arrangement.
8. Double-side line substrate as described in claim 5 or 7, which is characterized in that wherein second alignment mark includes multiple
Spaced square.
9. Double-side line substrate as claimed in claim 5, which is characterized in that wherein first alignment mark at least two,
And 2 first alignment mark is located at two corners on the diagonal line of the substrate；And second alignment mark at least two
It is a, and 2 second alignment mark is located at two corners on the diagonal line of the substrate.
10. Double-side line substrate as claimed in claim 5, which is characterized in that wherein first patterned circuit is electrically connected
Corresponding second patterned circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107132544A TWI664885B (en) | 2018-09-14 | 2018-09-14 | Fabricating method of double-sided circuit board and double-sided circuit board |
| TW107132544 | 2018-09-14 |
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| Publication Number | Publication Date |
|---|---|
| CN109963401A true CN109963401A (en) | 2019-07-02 |
| CN109963401B CN109963401B (en) | 2021-04-27 |
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| CN201910268380.XA Active CN109963401B (en) | 2018-09-14 | 2019-04-03 | Method for manufacturing double-sided circuit substrate and double-sided circuit substrate |
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| TW (1) | TWI664885B (en) |
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| CN1987581A (en) * | 2005-12-23 | 2007-06-27 | 群康科技(深圳)有限公司 | Position alignment mark and liquid crystal panel with position alignment mark |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202011781A (en) | 2020-03-16 |
| CN109963401B (en) | 2021-04-27 |
| TWI664885B (en) | 2019-07-01 |
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