CN1099614C - 为微型机械装置提供牺牲分隔层的方法 - Google Patents

为微型机械装置提供牺牲分隔层的方法 Download PDF

Info

Publication number
CN1099614C
CN1099614C CN95107256A CN95107256A CN1099614C CN 1099614 C CN1099614 C CN 1099614C CN 95107256 A CN95107256 A CN 95107256A CN 95107256 A CN95107256 A CN 95107256A CN 1099614 C CN1099614 C CN 1099614C
Authority
CN
China
Prior art keywords
supporting member
photoresist layer
photoresist
pillar
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95107256A
Other languages
English (en)
Other versions
CN1117148A (zh
Inventor
詹姆斯·C·贝克
斯科特·H·普伦格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN1117148A publication Critical patent/CN1117148A/zh
Application granted granted Critical
Publication of CN1099614C publication Critical patent/CN1099614C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

一制作微型机械装置的方法,其采用从一基底高起的支承件支承可运动件。首先,制作有反射性顶面的支承件。然后在支承件上沉积一层光刻胶,使其厚度基本上覆盖反射性顶面。将光刻胶层曝光,产生出在支承件之上的曝光强的区域和在各支承件之间的曝光弱的区域。这样使得可对后续的显影工序进行控制,使在各支承件之间的光刻胶材料被除去一些之后的高度与支承件的反射性顶面在同一平面内,同时保证将支承件之上的光刻胶材料除去。

Description

为微型机械装置提供牺牲 分隔层的方法
本发明涉及微型机械装置,更具体地,涉及其制作工艺过程的一部分,就是提供在制作工艺过程中需要的而在最后须从摹制成的结构下面除去的牺牲分隔层的工艺。
机电学领域中的一项新近发展是各种机械装置的微型化。典型的此类装置有超小型齿轮、杠杆和阀门。这些“微型机械”装置是利用集成电路技术来制造,往往还制成同时带有控制电路。常见的应用实例包括加速度计、压力传感器以及操作机构等。作为另一实例,可以用微型反射镜构成空间光调制器。
为制作微型机械装置,有如制作集成电路一样,需要有一种称之为晶片的载体,在其上面选择性地沉积和摹制薄膜材料。薄膜沉积以及湿和干刻蚀是整个制作工艺过程的组成部分。薄膜被摹制而形成微型机械单元的结构元件。牺牲刻蚀法是用来先形成一种可溶解的“分隔层”,随后在其上生成或沉积一结构层,待结构层摹制成形之后,除去其下面的分隔层。通常是用湿法刻蚀除去可溶层。留下摹制结构并在它与下面的结构之间留下一空气间隙。空气间隙容许成形的元件作转动、弯曲或倾斜等运动。
一种类型的微型机械式空间光调制器是一种采用微小可倾斜反射镜阵列的数字式微型反射镜装置(数镜装置)。为了运动灵活,这些反射镜中的每一个镜子都是安装在由一个或多个支柱支承的铰链上,在位于其下面的控制电路的上方,且以空气间隙分隔开。制造反射镜和其铰链的典型工序是蚀刻出支柱、在各支柱之间形成牺牲的分隔层、在分隔层材料的表面上制作反射镜和铰链并使每一铰链与其支柱相接合、以及除去牺牲材料。许多结构型式的数镜装置要求以这样的方式提供牺牲材料,即要求牺牲材料的顶面与支柱的顶面为同一平面。以往,这一要求至少要用两个步骤来达到,包括在支柱上沉积一层牺牲材料和选择性地刻蚀掉支柱上的材料。一般,选择性刻蚀需要用一种掩蔽膜。
本发明的一个方面是一种制作具有至少一个可运动元件的微型机械装置的方法。至少有一个支承元件制作在一基底上,从基底向上延伸。支承元件有一反射性的顶面。一个光刻胶层沉积在支承元件和其周围的基底上,使其厚度能掩盖住支承元件的顶面。然后令光刻胶层曝光。由于支承元件的顶面是反射性的,紧贴在支承元件的反射性顶面上的光刻胶材料更为高度曝光。然后对光刻胶层进行刻蚀去除,使其在支承元件之间的高度基本上与支承元件的反射性顶面的高度相同。由于在反射性顶面上的区域已被更为高度地曝光,在这些区域光刻胶材料的去除是有保证的,刻蚀的结果是一个由支承元件的反射性顶面和围绕它们的残存光刻胶材料构成的平的表面。然后就可在这一平面上制作可运动的元件,随后除去剩余的光刻胶材料。
本发明的技术优点是可用来在各支承元件之间形成分隔层材料而不损伤它们的完整性。工艺过程的完成不需要掩蔽膜、标线、也没有对准要求,其结果是可提高制造生产率。牺牲材料的表面是与支承元件的顶面在同一平面上,因而接着的可运动元件的制作可在一平直的表面上完成。
图1示出了按照本发明制成的一种类型的微型机械装置的一未偏转的梁型元件,即一数字式微型反射镜装置(微镜装置)。
图2示出了图1中的梁型元件处于一偏转位置。
图3至图9示出了按照本发明制作微型机械装置的工艺过程。
为了举例,下列描述是针对一具体类型的微型机械装置,即“数字式微型反射镜装置”(数镜装置),有时称之为“可变形的反射镜装置”。如以上论及,一个数镜装置具有一个或多个微小的成形在铰链上的反射镜,每一镜子由从一基底高起的支柱所支承。本发明系用于在制作数镜装置过程中在支承立柱之间提供牺牲材料,以便可在平直的表面上制作反射镜。
数镜装置的一项应用是用于形成图象,其中数镜装置有一由几百或几千个可偏转的反射镜组成的阵列,这些反射镜选择性地把光线反射到一图象平面。由数镜装置形成的图象可用于显示系统或应用于非击打式印刷。也可以将数镜装置应用于不涉及图象成形的其他方面,例如光学操纵、光学转换和加速度计。在某些这类应用中,“反射镜”无需是反射性的。并且,在某些应用中,数镜装置是以模拟而不是数字方式工作。总地来说,“数镜装置”这一术语在这里用于包括具有至少一个铰链安装的可偏转元件的任何类型的微型机械装置,各元件由一空气间隙分隔于基底,并可相对于基底运动。
本发明对其它类型的具有可运动元件的微型机械装置也有用。与数镜装置的反射镜相类似,其它微型机械装置可以有微小的转子、杠杆、或其它运动零件,这些零件由空气间隙所分隔而有运动自由度。
图1和图2示出了一数镜装置的单一反射镜元件10。在图1中,反射镜11未偏转,而在图2中,反射镜11因向一落地电极17倾斜而偏转了。如上所述,各种数镜装置应用场合可采用单一的或组成阵列的反射镜元件10。
图1和图2的反射镜元件10称为“扭转梁”型元件。也可以制作其它类型的反射镜元件10,包括悬臂梁型的和弯曲梁型的。题为“空间光调制器及方法”的美国专利第4,662,746号中,题为“空间光调制器”的美国专利第4,956,610号中,题为“空间光调制器和方法”的美国专利第5,061,049号中,题为“多层可变形的反射镜装置”的美国专利第5,083,857号中,以及美国专利编号08/097,824号中,描述了各种类型的数镜装置。这些专利中的每一个专利都已转让给得克萨斯仪表公司(Texas Instruments Incorporated),这里提及以供参考。
在用于图象显示的工作中,用一光源照射到数镜装置的表面上。可用一透镜组来把光线成形到与反射镜元件10阵列差不多大小并使此光线射向反射镜元件阵列。每一反射镜元件10有一装在扭转铰链12上的倾斜反射镜11,而扭转铰链12附着在支柱13上。这些支柱13是成形在基底15上并从基底15向上伸出。各反射镜11位于一控制电路14的上方,控制电路包括制作在基底15上的地址电路和存储电路。
将根据控制电路14的存储单元中的数据的电压施加到位于反射镜11的相对角落之下的两个地址电极16。反射镜11与其地址电极16之间的静电力可通过选择性地将电压施加于地址电极16来产生。静电力使每一反射镜11倾斜或+10度(ON)左右或-10度(OFF)左右,从而调制入射到数镜装置表面上的光。从“ON”反射镜11反射来的光被经过光学系统指向一图象平面。从“OFF”反射镜11来的光线被反射离开图象平面。最后所得到的图案形成一图象。每帧图象过程中反射镜11处于“ON”状态的时间比例决定着灰度等级。可以借助于一色盘或用一三数镜装置加上彩色。
实际上,反射镜11和其地址电极16构成了电容器。当适当的电压施加于反射镜11和其地址电极16时,产生的静电力(吸引力或推斥力)就使反射镜11朝向起吸引作用的地址电极16倾斜或离开起推斥作用的地址电极16。反射镜11一直倾斜到其边缘接触位于下面的一落地电极17。
一旦地址电极16和反射镜11之间的静电力消失,存储在铰链12内的能量就提供一回复力使反射镜11返回到非偏转位置。可以对反射镜11或地址电极16施加适当的电压以帮助反射镜11返回至其未偏转位置。
图3至图9示出了本发明之方法的几个方面。为了举例,本发明的方法针对制作上述类型的数镜装置的一单个镜元件10来描述。总地来说,本方法可用于制作一具有反射镜元件10阵列的数镜装置,或制作具有至少一个可运动元件的任何微型机械装置,这种元件是通过去除牺牲材料而制成于一空气间隙的上方。
本方法可在一晶片上进行,晶片接着分割成若干“芯片”,每一芯片有一反射镜元件10阵列。图3至图9的工艺过程特别适用于这种类型元件的批量生产,并且容易并入用于制造数镜装置或其它微型机械装置的生产流水线。
在图3中,数镜装置阵列的一反射镜元件10已通过摹制其两个支柱13部分地制成。在其它类型的微型机械装置中,可以用某种其它类型的“支承元件”,例如用连续隆起的线条来支承某种其它类型的“可运动元件”,取代支承反射镜11的支柱13。通常,支承元件可以是任何形状的,只要是从一基底向上伸出而形成一用于支承微型机械装置的一可运动元件的支承面即可。在本说明的举例中,支承元件是支支柱13,而可运动元件是铰链安装的反射镜11。
一反射层31已沉积在支柱13上。反射层31可用任何反射性材料制成,而且相对于用于摹制结构部件的其它层来说可以很薄。并且,下面将说明,反射层31不必是一连续层,就本发明的目的而言,其只要能覆盖支柱13的顶面就足够了。在其它装置中,支柱13或其它支承元件可以全部由一种反射性材料制成,这样就省去了加反射层31的必要。
图3A示出了一可任选的步序,用这一步序可摹制仅仅覆盖支柱13的顶面和侧面的反射层31。就数镜装置来说,反射层31可用一种导电材料制成并且还摹制成电极16和17。以这种方式摹制反射层31对本发明并不重要,但是关于图5的说明将指出,这样的摹制可用来增大支柱13之上的面积和各支柱13之间的面积之间的曝光差别。
在图4中,一个光刻胶材料层41已沉积在反射层31上。这一沉积可以用例如喷涂成形的各种方法来进行。各种光敏材料都可用作层41,如同用在集成电路制造中一样。在这一说明的举例中,光刻胶材料是一种阳性光刻胶,其某些部分将因曝光到辐射能而被显影剂或刻蚀剂除去。层41比用于形成支柱13的层要厚得多,以致层41从基底15向上伸到一大于支柱13和在支柱13上的反射层31的组合高度的高度(厚度),光刻胶层41的厚度约为支柱13之高度的两倍是合适的。通常,层41要有足够的厚度,至少要能实际地克服支柱13之上的一种模制效应,以便形成一基本上平直的上表面。然而,由于下面将说明的工艺过程,在某种程度上,在层41沉积后支柱13上的一种“模制”效应将会自行补偿。
在图5中,光刻胶层41被曝光。曝光是一种“泛光”曝光。就是说,不用掩蔽膜,层41的整个表面都曝光。支柱13起着“就地掩蔽膜”的作用,其意义是支柱引起某些区域与其它区域的一种曝光差别。更具体地说,支柱13上方的层41的较薄区域比各支柱13之间的较厚区域将受到较强的曝光。在图5中,虚线表示出了曝光较强的区域61和曝光较弱的区域62。各种因素决定着这两种区域的曝光差别量,例如曝光时间、层31的反射率、以及层41在两种区域61和62之间的厚度差等。这些因素应作调整,以便差别曝光能使支柱13上方区域的刻蚀速度比各支柱13之间的区域的刻蚀速度要快,快一个所需要的刻蚀速率增量。要考虑的一点是曝光时间不得使层41达到饱和,所谓饱和是指所有区域变成等量曝光。
虽然没有示出,在图5的曝光工序之后,并且是在图6和图7的刻蚀工序之前,可以进行一烘烤工序。这一烘烤工序的目的是要形成一个其刻蚀更容易预测和控制的层41。
在图6和图7中,光刻胶层41正在显影,显影是通过湿法刻蚀层41来完成。如图所示,层41的曝光较强的区域61比曝光较弱的区域62被除去得快。
在图8中,层41的刻蚀已完成。刻蚀的定时一直是控制的,以使曝光较弱的区域62被除去到与支柱13和反射层31的组合高度相同的高度。本发明的一个优点是,由于区域61的曝光较强,其除去速率比曝光较弱的区域62的除去速率快。因而,当区域62被刻蚀降低至一等于支柱13和反射层31的组合高度的高度时,区域61的除去肯定达到那一高度。
在层41的刻蚀完成之后,对晶片进行烘烤,以使层41的残留光刻胶材料能经得起后续的制作工序。这一残留的光刻胶材料在支柱13之间起一种“分隔层”作用。该分隔层的顶面与支柱13的反射性顶面处于同一平面上。
在图9中,形成反射镜11和铰链12的一层材料业已沉积和摹制。在用于其它微型机械装置的情况下,随后可通过沉积适当的材料并将其刻蚀成所需的形状而在这一层上制作出各种可运动元件。以上列举的与图1和图2有关的数镜装置专利提供了更多的关于如何为各种不同类型的数镜装置制作反射镜和铰链的细节。
虽然业已参照具体的实施例描述了本发明,但这些描述不能被认为是有限制意义。各种对已揭示的实施例的改型以及其他可能的实施例对本技术领域的熟练人员将是很明显的。因此,这里认为,所附权利要求书将复盖在本发明的真正范围内的全部改型。

Claims (18)

1.一种制作具有由支承元件可运动地支承着的可运动元件的微型机械装置的方法,所述支承元件从一基底向上高起并有一与基底隔开的自由端,所述方法包括下列工序:
使支承元件的自由端成为对辐射能有反射性的;
在基底上沉积一层光刻胶,使其初始厚度足以覆盖支承元件的自由端;
将所述光刻胶层的自由表面对着辐射能进行泛光曝光,不用掩蔽膜;
对光刻胶进行显影,以产生一连续的起支承元件作用的表面,该表面包含支承元件的自由端和残留的、减薄了的光刻胶层的自由表面;
从沉积在起支承元件作用的表面上的材料制作可运动元件;以及
除去残余的光刻胶。
2.如权利要求1所述的方法,其特征在于,所述沉积在起支承元件作用的表面的材料的至少一种与支承元件的自由端相接触。
3.如权利要求1所述的方法,其特征在于,相对于光刻胶层的初始厚度的曝光时间小于使光刻胶层曝光饱和所需的时间。
4.如权利要求1所述的方法,其特征在于,使在光刻胶层的自由表面和支承元件的自由端之间的光刻胶比光刻胶层的初始厚度更强地曝光于辐射能,以便通过显影以比除去基底上的光刻胶的速率快的速率除去支承元件自由端上方的光刻胶。
5.一种采用无掩蔽膜牺牲层工艺制作具有至少一个可运动元件的微型机械装置的方法,它包括以下工序:
在一基底上制作至少一个用于支承所述可运动元件的支承元件,所述支承元件从所述基底向上伸出并有一反射性的顶面;
在所述支承元件上及其周围的基底上沉积一光刻胶层,所述光刻胶层的厚度大于所述反射性顶面和所述基底之间的距离,以使所述光刻胶层覆盖所述支承元件的所述反射性顶面;
将所述光刻胶层进行均匀的曝光;
将所述光刻胶层进行显影,使所述光刻胶层被除去而暴露所述支承元件的所述反射性顶面,从而形成一个由所述支承元件的所述反射性顶面和在所述周围基底上的残留光刻胶层的顶面组成的一表面;
在所述平的表面上制作所述可运动元件;
在所述可运动元件制作完成后除去所述残留的光刻胶材料。
6.如权利要求5所述的方法,其特征在于,所述制作至少一个支承元件的工序是通过在所述支承元件上和所述支承元件周围的基底上沉积一层反射性材料而部分地完成。
7.如权利要求5所述的方法,其特征在于,所述制作至少一个支承元件的工序是通过用一种反射性材料制作所述支承元件而完成。
8.如权利要求5所述的方法,其特征在于,所述沉积一光刻胶层的工序是通过将所述光刻胶层的厚度沉积到一为所述至少一个支承元件的高度的两倍而完成。
9.如权利要求5所述的方法,其特征在于,还包括在所述显影工序之前烘烤所述光刻胶层的工序。
10.如权利要求5所述的方法,其特征在于,还包括在所述显影工序之后烘烤所述光刻胶层的工序。
11.如权利要求5所述的方法,其特征在于,所述曝光工序的曝光时间比所述光刻胶层的曝光饱和时间短。
12.如权利要求5所述的方法,其特征在于,所述微型机械装置具有一个微型机械元件阵列,每一元件具有至少一个支承元件和至少一个可运动元件,而且其特征在于,所述显影工序产生出位于所述各支承元件之间的由所述残留的光刻胶材料构成的分隔层区域。
13.一种用于制造具有至少一个可偏转的反射镜元件的一种数字式微型反射镜的方法,它包括下列工序:
在一基底上制作至少一个用于支承所述反射镜元件的支柱,所述支柱从所述基底向上延伸并有一反射性的顶面;
在所述支柱和周围的基底上沉积一层光刻胶,所述光刻胶层的厚度能覆盖住所述支柱的所述反射性顶面;
将所述光刻胶层曝光;
将所述光刻胶层进行显影,使所述光刻胶层被去除以暴露所述支柱,从而形成一个由所述支柱的反射性顶面和所述周围基底上的残留光刻胶材料的顶面组成的表面;
在所述平的表面上制作所述可偏转的反射镜元件;以及
在所述可偏转的反射镜元件制作完成后除去所述残留的光刻胶材料。
14.如权利要求13所述的方法,其特征在于,所述制作至少一个支柱的工序是通过在所述支柱和其周围的基底上沉积一个反射材料层来进行的。
15.如权利要求13所述的方法,其特征在于,所述制作至少一个支柱的工序是通过用一种反射性材料制作所述支柱来进行的。
16.如权利要求13所述的方法,其特征在于,所述沉积一光刻胶层的工序是通过将所述光刻胶层的厚度沉积到一为所述支柱高度的两倍而完成。
17.如权利要求13所述的方法,其特征在于,还包括在所述显影工序之前烘烤所述光刻胶层的工序。
18.如权利要求13所述的方法,其特征在于,还包括在所述显影工序之后烘烤所述光刻胶层的工序。
CN95107256A 1994-06-21 1995-06-19 为微型机械装置提供牺牲分隔层的方法 Expired - Fee Related CN1099614C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/263,208 1994-06-21
US08/263,208 US5454906A (en) 1994-06-21 1994-06-21 Method of providing sacrificial spacer for micro-mechanical devices

Publications (2)

Publication Number Publication Date
CN1117148A CN1117148A (zh) 1996-02-21
CN1099614C true CN1099614C (zh) 2003-01-22

Family

ID=23000835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95107256A Expired - Fee Related CN1099614C (zh) 1994-06-21 1995-06-19 为微型机械装置提供牺牲分隔层的方法

Country Status (8)

Country Link
US (1) US5454906A (zh)
EP (1) EP0689077B1 (zh)
JP (1) JPH0862517A (zh)
KR (1) KR100346876B1 (zh)
CN (1) CN1099614C (zh)
CA (1) CA2149932A1 (zh)
DE (1) DE69524816T2 (zh)
TW (1) TW284862B (zh)

Families Citing this family (169)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219015B1 (en) 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
US6674562B1 (en) 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US6426013B1 (en) 1993-10-18 2002-07-30 Xros, Inc. Method for fabricating micromachined members coupled for relative rotation
US6467345B1 (en) 1993-10-18 2002-10-22 Xros, Inc. Method of operating micromachined members coupled for relative rotation
US6044705A (en) * 1993-10-18 2000-04-04 Xros, Inc. Micromachined members coupled for relative rotation by torsion bars
US7550794B2 (en) 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US8014059B2 (en) 1994-05-05 2011-09-06 Qualcomm Mems Technologies, Inc. System and method for charge control in a MEMS device
US7123216B1 (en) 1994-05-05 2006-10-17 Idc, Llc Photonic MEMS and structures
US6680792B2 (en) 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US7297471B1 (en) 2003-04-15 2007-11-20 Idc, Llc Method for manufacturing an array of interferometric modulators
KR100209401B1 (ko) * 1994-07-21 1999-07-15 전주범 광로조절장치의 제조방법
US5879866A (en) * 1994-12-19 1999-03-09 International Business Machines Corporation Image recording process with improved image tolerances using embedded AR coatings
US5841579A (en) 1995-06-07 1998-11-24 Silicon Light Machines Flat diffraction grating light valve
DE19547584A1 (de) * 1995-12-20 1997-07-03 Cms Mikrosysteme Gmbh Chemnitz Mikromechanisches Array und Verfahren zu dessen Herstellung
US7471444B2 (en) 1996-12-19 2008-12-30 Idc, Llc Interferometric modulation of radiation
US5982553A (en) 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
US6088102A (en) 1997-10-31 2000-07-11 Silicon Light Machines Display apparatus including grating light-valve array and interferometric optical system
US6074569A (en) * 1997-12-09 2000-06-13 Hughes Electronics Corporation Stripping method for photoresist used as mask in Ch4 /H2 based reactive ion etching (RIE) of compound semiconductors
WO1999052006A2 (en) 1998-04-08 1999-10-14 Etalon, Inc. Interferometric modulation of radiation
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US6271808B1 (en) 1998-06-05 2001-08-07 Silicon Light Machines Stereo head mounted display using a single display device
US6101036A (en) 1998-06-23 2000-08-08 Silicon Light Machines Embossed diffraction grating alone and in combination with changeable image display
US6130770A (en) 1998-06-23 2000-10-10 Silicon Light Machines Electron gun activated grating light valve
US6215579B1 (en) 1998-06-24 2001-04-10 Silicon Light Machines Method and apparatus for modulating an incident light beam for forming a two-dimensional image
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
CN1232858C (zh) * 1998-09-24 2005-12-21 反射公司 带有自限制微型机械元件的双层介质反射空间光调制器
TW408417B (en) * 1999-05-03 2000-10-11 Ind Tech Res Inst Planar-shape thin probe having electrostatic actuator manufactured by using sacrificed layer technology and its manufacturing method
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
JP2001188187A (ja) * 1999-12-28 2001-07-10 Sony Corp マイクロミラー装置及びこれを用いた光ディスク装置並びにマイクロミラー装置の製造方法
US20020071169A1 (en) * 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
US6753638B2 (en) 2000-02-03 2004-06-22 Calient Networks, Inc. Electrostatic actuator for micromechanical systems
US6505811B1 (en) * 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US6825967B1 (en) 2000-09-29 2004-11-30 Calient Networks, Inc. Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same
US6556741B1 (en) 2000-10-25 2003-04-29 Omm, Inc. MEMS optical switch with torsional hinge and method of fabrication thereof
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6958123B2 (en) * 2001-06-15 2005-10-25 Reflectivity, Inc Method for removing a sacrificial material with a compressed fluid
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6589625B1 (en) 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6544863B1 (en) 2001-08-21 2003-04-08 Calient Networks, Inc. Method of fabricating semiconductor wafers having multiple height subsurface layers
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6574033B1 (en) 2002-02-27 2003-06-03 Iridigm Display Corporation Microelectromechanical systems device and method for fabricating same
US7728339B1 (en) 2002-05-03 2010-06-01 Calient Networks, Inc. Boundary isolation for microelectromechanical devices
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
DE10256116B4 (de) * 2002-11-29 2005-12-22 Infineon Technologies Ag Elektronisches Bauteil und Verfahren zur Herstellung desselben
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
TW594360B (en) 2003-04-21 2004-06-21 Prime View Int Corp Ltd A method for fabricating an interference display cell
TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
US7221495B2 (en) 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
TWI231865B (en) 2003-08-26 2005-05-01 Prime View Int Co Ltd An interference display cell and fabrication method thereof
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7471440B2 (en) * 2003-10-27 2008-12-30 Spatial Photonics, Inc. Fabricating micro devices using sacrificial materials
US7012726B1 (en) 2003-11-03 2006-03-14 Idc, Llc MEMS devices with unreleased thin film components
US7142346B2 (en) 2003-12-09 2006-11-28 Idc, Llc System and method for addressing a MEMS display
US7161728B2 (en) 2003-12-09 2007-01-09 Idc, Llc Area array modulation and lead reduction in interferometric modulators
US20050134141A1 (en) * 2003-12-23 2005-06-23 Jovica Savic Meso-microelectromechanical system having a glass beam and method for its fabrication
US7706050B2 (en) 2004-03-05 2010-04-27 Qualcomm Mems Technologies, Inc. Integrated modulator illumination
US7060895B2 (en) 2004-05-04 2006-06-13 Idc, Llc Modifying the electro-mechanical behavior of devices
US7164520B2 (en) 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
US7156365B2 (en) * 2004-07-27 2007-01-02 Kelsey-Hayes Company Method of controlling microvalve actuator
EP1779173A1 (en) 2004-07-29 2007-05-02 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
US7499208B2 (en) 2004-08-27 2009-03-03 Udc, Llc Current mode display driver circuit realization feature
US7889163B2 (en) 2004-08-27 2011-02-15 Qualcomm Mems Technologies, Inc. Drive method for MEMS devices
US7551159B2 (en) 2004-08-27 2009-06-23 Idc, Llc System and method of sensing actuation and release voltages of an interferometric modulator
US7560299B2 (en) 2004-08-27 2009-07-14 Idc, Llc Systems and methods of actuating MEMS display elements
US7515147B2 (en) 2004-08-27 2009-04-07 Idc, Llc Staggered column drive circuit systems and methods
US7602375B2 (en) 2004-09-27 2009-10-13 Idc, Llc Method and system for writing data to MEMS display elements
US7843410B2 (en) 2004-09-27 2010-11-30 Qualcomm Mems Technologies, Inc. Method and device for electrically programmable display
US7368803B2 (en) 2004-09-27 2008-05-06 Idc, Llc System and method for protecting microelectromechanical systems array using back-plate with non-flat portion
US20060176487A1 (en) 2004-09-27 2006-08-10 William Cummings Process control monitors for interferometric modulators
US7893919B2 (en) 2004-09-27 2011-02-22 Qualcomm Mems Technologies, Inc. Display region architectures
US7417735B2 (en) 2004-09-27 2008-08-26 Idc, Llc Systems and methods for measuring color and contrast in specular reflective devices
US7161730B2 (en) 2004-09-27 2007-01-09 Idc, Llc System and method for providing thermal compensation for an interferometric modulator display
US7679627B2 (en) 2004-09-27 2010-03-16 Qualcomm Mems Technologies, Inc. Controller and driver features for bi-stable display
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7415186B2 (en) 2004-09-27 2008-08-19 Idc, Llc Methods for visually inspecting interferometric modulators for defects
US8310441B2 (en) 2004-09-27 2012-11-13 Qualcomm Mems Technologies, Inc. Method and system for writing data to MEMS display elements
US7944599B2 (en) 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7405924B2 (en) 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7310179B2 (en) 2004-09-27 2007-12-18 Idc, Llc Method and device for selective adjustment of hysteresis window
US7136213B2 (en) 2004-09-27 2006-11-14 Idc, Llc Interferometric modulators having charge persistence
US7626581B2 (en) 2004-09-27 2009-12-01 Idc, Llc Device and method for display memory using manipulation of mechanical response
US7545550B2 (en) 2004-09-27 2009-06-09 Idc, Llc Systems and methods of actuating MEMS display elements
US7813026B2 (en) 2004-09-27 2010-10-12 Qualcomm Mems Technologies, Inc. System and method of reducing color shift in a display
US7808703B2 (en) 2004-09-27 2010-10-05 Qualcomm Mems Technologies, Inc. System and method for implementation of interferometric modulator displays
US7675669B2 (en) 2004-09-27 2010-03-09 Qualcomm Mems Technologies, Inc. Method and system for driving interferometric modulators
US7345805B2 (en) 2004-09-27 2008-03-18 Idc, Llc Interferometric modulator array with integrated MEMS electrical switches
US7289259B2 (en) 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
TW200628833A (en) 2004-09-27 2006-08-16 Idc Llc Method and device for multistate interferometric light modulation
US8878825B2 (en) 2004-09-27 2014-11-04 Qualcomm Mems Technologies, Inc. System and method for providing a variable refresh rate of an interferometric modulator display
US7532195B2 (en) 2004-09-27 2009-05-12 Idc, Llc Method and system for reducing power consumption in a display
US7719500B2 (en) 2004-09-27 2010-05-18 Qualcomm Mems Technologies, Inc. Reflective display pixels arranged in non-rectangular arrays
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7583429B2 (en) 2004-09-27 2009-09-01 Idc, Llc Ornamental display device
US7920135B2 (en) 2004-09-27 2011-04-05 Qualcomm Mems Technologies, Inc. Method and system for driving a bi-stable display
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US7653371B2 (en) 2004-09-27 2010-01-26 Qualcomm Mems Technologies, Inc. Selectable capacitance circuit
US7289256B2 (en) 2004-09-27 2007-10-30 Idc, Llc Electrical characterization of interferometric modulators
US7420725B2 (en) 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same
US7710629B2 (en) 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. System and method for display device with reinforcing substance
US7724993B2 (en) 2004-09-27 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7916103B2 (en) 2004-09-27 2011-03-29 Qualcomm Mems Technologies, Inc. System and method for display device with end-of-life phenomena
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US8008736B2 (en) 2004-09-27 2011-08-30 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device
US7446927B2 (en) 2004-09-27 2008-11-04 Idc, Llc MEMS switch with set and latch electrodes
US7343080B2 (en) 2004-09-27 2008-03-11 Idc, Llc System and method of testing humidity in a sealed MEMS device
US7692839B2 (en) 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US7453579B2 (en) 2004-09-27 2008-11-18 Idc, Llc Measurement of the dynamic characteristics of interferometric modulators
US7936497B2 (en) 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7299681B2 (en) 2004-09-27 2007-11-27 Idc, Llc Method and system for detecting leak in electronic devices
US7359066B2 (en) 2004-09-27 2008-04-15 Idc, Llc Electro-optical measurement of hysteresis in interferometric modulators
US7355780B2 (en) 2004-09-27 2008-04-08 Idc, Llc System and method of illuminating interferometric modulators using backlighting
US7920136B2 (en) 2005-05-05 2011-04-05 Qualcomm Mems Technologies, Inc. System and method of driving a MEMS display device
US7948457B2 (en) 2005-05-05 2011-05-24 Qualcomm Mems Technologies, Inc. Systems and methods of actuating MEMS display elements
KR20080027236A (ko) 2005-05-05 2008-03-26 콸콤 인코포레이티드 다이나믹 드라이버 ic 및 디스플레이 패널 구성
US7372617B2 (en) * 2005-07-06 2008-05-13 Peter Enoksson Hidden hinge MEMS device
CN101228091A (zh) 2005-07-22 2008-07-23 高通股份有限公司 用于mems装置的支撑结构及其方法
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
RU2468988C2 (ru) 2005-07-22 2012-12-10 Квалкомм Инкорпорэйтэд Устройства мэмс, имеющие поддерживающие структуры, и способы их изготовления
US7355779B2 (en) 2005-09-02 2008-04-08 Idc, Llc Method and system for driving MEMS display elements
US8391630B2 (en) 2005-12-22 2013-03-05 Qualcomm Mems Technologies, Inc. System and method for power reduction when decompressing video streams for interferometric modulator displays
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7636151B2 (en) 2006-01-06 2009-12-22 Qualcomm Mems Technologies, Inc. System and method for providing residual stress test structures
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US8194056B2 (en) 2006-02-09 2012-06-05 Qualcomm Mems Technologies Inc. Method and system for writing data to MEMS display elements
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7903047B2 (en) 2006-04-17 2011-03-08 Qualcomm Mems Technologies, Inc. Mode indicator for interferometric modulator displays
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US8049713B2 (en) 2006-04-24 2011-11-01 Qualcomm Mems Technologies, Inc. Power consumption optimized display update
US7649671B2 (en) 2006-06-01 2010-01-19 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device with electrostatic actuation and release
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7702192B2 (en) 2006-06-21 2010-04-20 Qualcomm Mems Technologies, Inc. Systems and methods for driving MEMS display
US7835061B2 (en) 2006-06-28 2010-11-16 Qualcomm Mems Technologies, Inc. Support structures for free-standing electromechanical devices
US7777715B2 (en) 2006-06-29 2010-08-17 Qualcomm Mems Technologies, Inc. Passive circuits for de-multiplexing display inputs
US7388704B2 (en) 2006-06-30 2008-06-17 Qualcomm Mems Technologies, Inc. Determination of interferometric modulator mirror curvature and airgap variation using digital photographs
US7527998B2 (en) 2006-06-30 2009-05-05 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control
JP4327183B2 (ja) * 2006-07-31 2009-09-09 株式会社日立製作所 内燃機関の高圧燃料ポンプ制御装置
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7545552B2 (en) 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
US8068268B2 (en) 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
US7514361B2 (en) * 2007-08-20 2009-04-07 International Business Machines Corporation Selective thin metal cap process
US7851239B2 (en) * 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US8736590B2 (en) 2009-03-27 2014-05-27 Qualcomm Mems Technologies, Inc. Low voltage driver scheme for interferometric modulators
US7864403B2 (en) 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
WO2011126953A1 (en) 2010-04-09 2011-10-13 Qualcomm Mems Technologies, Inc. Mechanical layer of an electromechanical device and methods of forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US9340415B2 (en) * 2014-03-18 2016-05-17 Texas Instruments Incorporated MEMS device with non-planar features
JP6613593B2 (ja) * 2015-04-01 2019-12-04 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP2016194631A (ja) 2015-04-01 2016-11-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
US12103843B2 (en) 2021-01-20 2024-10-01 Calient.Ai Inc. MEMS mirror arrays with reduced crosstalk

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710732A (en) * 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US4662746A (en) 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) * 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4956610A (en) 1988-02-12 1990-09-11 Pgm Diversified Industries, Inc. Current density measurement system by self-sustaining magnetic oscillation
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5314572A (en) * 1990-08-17 1994-05-24 Analog Devices, Inc. Method for fabricating microstructures
US5312513A (en) * 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators

Also Published As

Publication number Publication date
US5454906A (en) 1995-10-03
DE69524816D1 (de) 2002-02-07
EP0689077A3 (en) 1997-05-21
EP0689077B1 (en) 2002-01-02
CA2149932A1 (en) 1995-12-22
EP0689077A2 (en) 1995-12-27
KR100346876B1 (ko) 2002-11-18
JPH0862517A (ja) 1996-03-08
DE69524816T2 (de) 2002-08-29
KR960002496A (ko) 1996-01-26
TW284862B (zh) 1996-09-01
CN1117148A (zh) 1996-02-21

Similar Documents

Publication Publication Date Title
CN1099614C (zh) 为微型机械装置提供牺牲分隔层的方法
KR100413014B1 (ko) 개선된지지포스트를구비한마이크로기계장치및그제조방법과,디지털마이크로미러장치
US5526951A (en) Fabrication method for digital micro-mirror devices using low temperature CVD
EP1315016B1 (en) Yokeless hidden hinge digital micromirror device
KR100261400B1 (ko) 변형가능한 미러 셔터 디바이스 및 이의 제조방법
US20030203530A1 (en) Single crystal silicon micromirror and array
KR20040104408A (ko) Mems 장치 및 그 형성 방법
JPH0854555A (ja) 微小機械式装置用の改良されたヒンジ
US5661611A (en) Thin film actuated mirror array and method for the manufacture thereof
JP2008503772A (ja) 多段階位置を有するディスクリート制御マイクロミラー
US7651734B2 (en) Micromechanical device fabrication
US20020126368A1 (en) Post metal etch clean process using soft mask
US20030025981A1 (en) Micromachined optical phase shift device
CN110650917B (zh) 微机电系统中分离的突起/凹进特征
JP4958041B2 (ja) 回折格子、光変調器及び表示装置
EP1558954B1 (en) Method of producing a movable lens structure for a light shaping unit
KR100531222B1 (ko) 마이크로 미러 제조방법
KR100691476B1 (ko) 마이크로미러 액튜에이터
WO2006114127A1 (en) Mems device with mutually perpendicular deflectable reflective and electrode surfaces

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee