CN109950185B - Wafer spin-drying equipment - Google Patents
Wafer spin-drying equipment Download PDFInfo
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- CN109950185B CN109950185B CN201910315136.4A CN201910315136A CN109950185B CN 109950185 B CN109950185 B CN 109950185B CN 201910315136 A CN201910315136 A CN 201910315136A CN 109950185 B CN109950185 B CN 109950185B
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Abstract
The invention relates to the technical field of semiconductor wafer processing devices, in particular to wafer drying equipment. The wafer spin-drying equipment comprises a bearing box, a rotary disc and a rotating device; the rotating device is in driving connection with the turntable and can enable the turntable to rotate along the axis of the turntable; the bearing boxes are arranged on the rotary table, and the bearing boxes are even in number, and the even number of bearing boxes are uniformly arranged along the circumferential direction of the rotary table. The invention aims to provide wafer spin-drying equipment to solve the technical problem that the wafer spin-drying equipment in the prior art is low in production efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer processing devices, in particular to wafer drying equipment.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Various circuit element structures can be processed and manufactured on the silicon wafer to form electronic component products with specific electrical functions. As the size of the integrated circuit on the semiconductor wafer is developed to the micron level, the requirement for cleaning the semiconductor wafer in the manufacturing process is higher and higher, and particularly, the semiconductor wafer is polluted by dust particles and metal in the manufacturing process, which easily causes the damage of the circuit function in the wafer, the short circuit or the open circuit, and the like, thereby causing the failure of the integrated circuit and the formation of the geometric characteristics. Therefore, in the manufacturing process, in addition to the removal of external pollution sources, cleaning is also required to effectively remove impurities such as micro-dust, metal ions, and organic matters remaining on the wafer by using chemical solution or gas without damaging the surface characteristics and the electrical characteristics of the wafer.
The typical silicon wafer wet cleaning process in the industry is to remove organics and metals → remove particles → remove metals → centrifugal drying in a spin-drying unit. As the scale of integrated circuits is expanding, the cost and environmental pollution of large, complex and expensive wet chemical cleaning equipment, chemicals, pure water, exhaust gas, wastewater treatment, etc. are the biggest challenges in future cleaning processes. At present, the wafer spin-drying unit has low production efficiency, can not fully utilize resources, and can not meet the requirement of modern wafer cleaning and spin-drying.
Therefore, the present application provides a new wafer spin-drying apparatus for the above-mentioned problems.
Disclosure of Invention
The invention aims to provide wafer spin-drying equipment to solve the technical problem that the wafer spin-drying equipment in the prior art is low in production efficiency.
Based on the above purpose, the invention provides a wafer spin-drying device, which comprises a rotary disc and a rotating device;
the rotating device is in driving connection with the turntable and can enable the turntable to rotate along the axis of the turntable; the carousel evenly is provided with even number along its circumference and bears the weight of the box.
In the above technical solution, the rotating device of the present invention further includes a motor and a transmission disc, the motor is connected to the transmission disc in a driving manner, and the turntable is fixedly connected to the transmission disc.
In any of the above technical solutions, further, the rotating apparatus of the present invention further includes a cover, a first sealing assembly, and a second sealing assembly;
the motor is arranged in the cover body;
the first seal assembly comprises an upper shaft seal disc and a lower shaft seal disc; the transmission disc is connected to the cover body through the shaft seal upper disc and the shaft seal lower disc in sequence;
the second sealing assembly comprises a sealing shaft sleeve and a sealing ring; the output shaft of the motor is connected with the transmission disc through the sealing shaft sleeve, and the sealing ring is arranged at the joint of the sealing shaft sleeve and the transmission disc.
In any of the above technical solutions, further, the wafer spin-drying apparatus of the present invention further includes a frame and a fixing plate; the cover body is fixedly connected to the fixed plate, and the fixed plate is connected to the rack;
and a damping device is connected between the cover body and the fixing plate.
In any of the above technical solutions, further, the damping device of the present invention includes a rubber damping block; one end of the rubber shock absorption block is fixedly connected with the cover body, and the other end of the rubber shock absorption block is fixedly connected with the fixed plate.
In any of the above technical solutions, further, the wafer spin-drying apparatus of the present invention further includes a positioning device;
the positioning device comprises a cam and a pressing component;
the compression assembly comprises a linear driving piece and a bearing;
the linear driving piece is connected to the cover body, the linear driving piece is in driving connection with a rotating shaft, and the bearing is fixedly connected to the rotating shaft; the cam is fixedly connected to an output shaft of the motor, and the peripheral surface of the bearing corresponds to the peripheral surface of the cam;
the linear driving piece can drive the bearing to be close to or far away from the cam through the rotating shaft.
In any of the above technical solutions, the positioning device further includes an encoder, where the encoder is used for monitoring the rotation speed of the motor and is electrically connected to the linear driving element.
In any of the above technical solutions, further, the cam of the present invention has a plurality of cams, and the plurality of cams are arranged at intervals along the output shaft of the motor; the pressing assemblies are arranged uniformly along the circumferential direction of the cam;
the plurality of pressing components correspond to the plurality of cams one to one.
In any of the above technical solutions, further, the compression assembly of the present invention further includes a double elbow joint;
the linear driving piece is in driving connection with the rotating shaft through the double-elbow joint.
In any of the above technical solutions, further, the pressing assembly of the present invention further includes an adjusting plate;
the adjusting plate is fixedly connected with the cover body, a long hole is formed in the adjusting plate, and the linear driving piece is fixed in the long hole through a bolt.
By adopting the technical scheme, the invention has the following beneficial effects:
in the prior art, wafer drying equipment is generally single-box drying, namely, the wafer drying equipment is provided with a bearing box, a drying machine can only dry wafers in one bearing box at one time, and the production efficiency is low. Aiming at the problems, the wafer spin-drying equipment provided by the invention has even number of bearing boxes, wafers in the bearing boxes can be spin-dried at one time, and the spin-drying efficiency is improved.
Specifically, the working process of the spin-drying equipment is as follows: the wafer is placed in the bearing box, the rotating device drives the rotating disc to rotate, so that the wafer in the bearing box on the rotating disc rotates, liquid on the surface of the wafer is thrown out under the action of centrifugal force, and the wafer is dried.
It should be noted that there are even number of the carrying boxes, for example, the number of the carrying boxes is two, four, six or eight, and the even number of the carrying boxes are uniformly arranged along the circumferential direction of the turntable, so that the carrying boxes on the turntable correspond to each other two by two, that is, two carrying boxes corresponding to each other two by two are symmetrical along the center of the turntable. Therefore, the spin-drying equipment can accommodate wafers of various specifications at the same time, only two wafers of the same specification are required to be placed in the two corresponding bearing boxes, and when the rotary disc rotates, the dynamic balance of the rotary disc can be realized, for example, when the number of the bearing boxes is six, wafers of three specifications can be accommodated at the same time; or the number of the carrying boxes is four, and the carrying boxes can accommodate wafers of two specifications at the same time.
In conclusion, the wafer spin-drying equipment can dry a plurality of wafers simultaneously and can also dry wafers of various specifications simultaneously, so that the production efficiency of the spin-drying equipment is improved, resources can be fully utilized, and the requirements of modern wafer cleaning and spin-drying are met.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer spin-drying apparatus according to an embodiment of the present invention;
fig. 2 is a front view of a wafer spin-drying apparatus provided in an embodiment of the present invention;
fig. 3 is a left side view of a wafer spin-drying apparatus provided in an embodiment of the present invention;
fig. 4 is a sectional view of the wafer dehydrating apparatus shown in fig. 3 in a direction of a-a.
Icon: 1-a carrying box; 2-a turntable; 3-a rotating device; 31-a motor; 32-a transmission disc; 33-a cover; 34-shaft seal upper disc; 35-shaft seal lower disc; 4, fixing a plate; 5-a rubber shock-absorbing block; 6-a positioning device; 61-a cam; 62-a linear drive; 63-a bearing; 64-a rotating shaft; 65-an encoder; 66-adjusting plate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Examples
Referring to fig. 1 to 4, the embodiment provides a wafer spin-drying apparatus, which includes a carrying box 1, a turntable 2 and a rotating device 3; the rotating device 3 is connected with the turntable 2 in a driving way and can enable the turntable 2 to rotate along the axis of the turntable; the rotating disc 2 is evenly provided with an even number of bearing boxes 1 along the circumferential direction. That is, there are an even number of the carrying boxes 1, and the even number of the carrying boxes 1 are uniformly arranged along the circumferential direction of the turntable 2.
Due to the arrangement, the wafer drying equipment can dry the wafers in the bearing boxes 1 at one time, and the drying efficiency is improved.
Specifically, the working process of the spin-drying equipment is as follows: the wafer is placed in the bearing box 1, the rotating device 3 drives the rotating disc 2 to rotate, so that the wafer in the bearing box 1 on the rotating disc 2 rotates, liquid on the surface of the wafer is thrown out under the action of centrifugal force, and the wafer is dried.
It should be noted that there are even number of the carrying boxes 1, for example, the number of the carrying boxes 1 is two, four, six or eight, and the even number of the carrying boxes 1 are uniformly arranged along the circumferential direction of the turntable 2, so that the carrying boxes 1 on the turntable 2 correspond to each other two by two, that is, two carrying boxes 1 corresponding to each other two by two are symmetrical along the center of the turntable 2. Therefore, the spin-drying equipment can accommodate wafers of various specifications at the same time, only two wafers of the same specification need to be placed in the two corresponding bearing boxes 1, when the rotary disc 2 rotates, the dynamic balance of the rotary disc 2 can be realized, for example, when the number of the bearing boxes 1 is six, wafers of three specifications can be accommodated at the same time; alternatively, as shown in fig. 1, the number of the cassettes 1 is four, and two types of wafers can be accommodated at the same time.
In conclusion, the wafer spin-drying equipment provided by the embodiment can dry a plurality of wafers simultaneously and also can dry wafers of various specifications simultaneously, so that the production efficiency of the spin-drying equipment is improved, resources can be fully utilized, and the requirement of cleaning and spin-drying modern wafers is met.
Preferably, referring to fig. 4, the rotating device 3 includes a motor 31 and a transmission disc 32, the motor 31 is drivingly connected to the transmission disc 32, and the turntable 2 is fixedly connected to the transmission disc 32.
Preferably, the motor 31 is a servo motor, the speed and position control precision of the servo motor is very accurate, and the rotation precision of the turntable 2 is improved, so that the rotation angle of the turntable 2 can be conveniently controlled, and the accurate positioning of the turntable 2 is facilitated.
Optionally, the transmission disc 32 is connected to the rotary disc 2 by means of snap-fit, or screw-thread connection.
Preferably, referring to fig. 2-4, the rotating device 3 further comprises a housing 33, a first sealing assembly and a second sealing assembly; the motor 31 is disposed in the cover 33.
The first seal assembly includes an upper shaft seal disc 34 and a lower shaft seal disc 35; the transmission disc 32 is connected to the cover 33 through an upper shaft seal disc 34 and a lower shaft seal disc 35 in sequence; the second sealing assembly comprises a sealing shaft sleeve and a sealing ring; the output shaft of the motor 31 is connected with the transmission disc 32 through a sealing shaft sleeve, and the sealing ring is arranged at the joint of the sealing shaft sleeve and the transmission disc 32.
Optionally, referring to fig. 4, the cover 33 includes an upper cover and a lower cover, and the upper cover and the lower cover are connected by snapping, fastening, or screwing to form the cover 33.
Due to the arrangement of the first sealing assembly, the connection sealing performance between the cover body 33 and the transmission disc 32 is improved, impurities such as dust and the like are prevented from entering the cover body 33 through a gap between the cover body 33 and the rotating disc to pollute the motor 31, and the service life of the motor 31 is prolonged; in addition, the cover body 33 also supports the transmission disc 32 through the upper shaft seal disc 34 and the lower shaft seal disc 35, so that the rotation stability of the transmission disc 32 is improved, and the rotation stability of the turntable 2 is also improved; the second sealing component improves the connection sealing performance between the output shaft of the motor 31 and the transmission disc 32, prevents liquid thrown out of the wafer from polluting the motor 31 through the transmission disc 32, and further prolongs the service life of the motor 31.
Preferably, referring to fig. 2 to 4, the wafer spin-drying apparatus further includes a frame (not shown) and a fixing plate 4; the cover body 33 is fixedly connected to the fixed plate 4, and the fixed plate 4 is connected to the frame; a damping device is connected between the cover 33 and the fixing plate 4.
That is, the fixing plate 4 serves to connect the spin drying apparatus to the frame. Optionally, the cover 33 and the frame are connected by clamping, fastening, or screwing; the fixing plate 4 and the frame are connected by clamping, fastening or threaded connection and the like.
The produced vibration when motor 31 starts can transmit the cover body 33 of being connected with it, through set up damping device between cover body 33 and fixed plate 4 to make damping device with the vibration buffering of cover body 33, absorb, prevent that the vibration transmission from transmitting for fixed plate 4, thereby avoided fixed plate 4 to transmit the vibration for the frame to a certain extent, improved the stability of equipment operation.
As one way of realisation, with reference to fig. 2-4, the damping device comprises a rubber damper block 5; one end of the rubber shock absorption block 5 is fixedly connected to the cover body 33, and the other end is fixedly connected to the fixing plate 4.
Optionally, as shown in fig. 1 to fig. 3, the damping block and the cover 33 are connected by bolts, but the connection is not limited to the above connection manner, and may also be in other manners such as clamping or buckling, as long as the damping block and the cover 33 can be fixedly connected; pass through bolted connection between snubber block and the fixed plate 4, but not limited to above connected mode, still can be for other modes such as joint or lock joint, it as long as can realize fixed connection between snubber block and the fixed plate 4 can.
Preferably, referring to fig. 2-4, the wafer drying apparatus further comprises a positioning device 6; the positioning device 6 comprises a cam 61 and a pressing component; the hold-down assembly comprises a linear drive 62 and a bearing 63; the linear driving element 62 is connected to the cover 33, the linear driving element 62 is connected to a rotating shaft 64 in a driving manner, and the bearing 63 is fixedly connected to the rotating shaft 64; the cam 61 is fixed on the output shaft of the motor 31, and the peripheral surface of the bearing 63 is opposite to the peripheral surface of the cam 61; the linear drive 62 can drive the bearing 63 toward or away from the cam 61 via the rotating shaft 64.
The circumferential surface of the bearing 63 is opposite to the circumferential surface of the cam 61, that is, the bearing 63 is as high as the cam 61 in the axial direction of the cam 61, and thus the bearing 63 can contact and abut against the cam 61 when moving in the direction approaching the cam 61.
Alternatively, the motor 31 is a single shaft motor or a dual shaft motor, preferably, the motor 31 is a dual shaft motor, one output shaft is drivingly connected to the transmission plate 32, and the other output shaft is drivingly connected to the cam 61.
After the wafer is dried by the spin drying device, the power supply of the motor 31 is cut off, the motor 31 is gradually decelerated, at this time, the linear driving member 62 drives the bearing 63 to move towards the direction close to the cam 61 until the bearing 63 abuts against the cam 61, and as the linear driving member 62 continues to push, the bearing 63 contacts with the circumferential surface of the cam 61 and rotates, so as to push the cam 61 to continue to rotate until the bearing 63 gradually abuts against the groove on the circumferential surface of the cam 61, so that the braking on the cam 61, that is, the braking on the motor 31 is realized, at this time, because the linear driving member 62 is connected with the position of the cover body 33, the position fixing of the stop rotation of the cam 61, that is, the position fixing of the output shaft of the motor 31 is realized, so that the position of the rotating disc 2 on the motor 31 is fixed, and finally the position of the bearing box 1 on the rotating disc 2, so that the robot can accurately take out the wafer in the carrier 1.
Optionally, the linear driving element 62 is an air cylinder, a cylinder of the air cylinder is fixedly connected to the cover 33, a piston rod is fixedly connected to the rotating shaft 64, and the bearing 63 is sleeved on the rotating shaft 64 and is fixedly connected to the rotating shaft 64. The piston rod extends relative to the cylinder to effect movement of the bearing 63 in a direction towards the cam 61 and the piston rod retracts relative to the cylinder to effect movement of the bearing 63 in a direction away from the cam 61. The linear actuator 62 may be a ball screw, a linear module, or the like, but is not limited to the above form as long as the linear movement of the drive bearing 63 is achieved.
Preferably, referring to fig. 2, the positioning device 6 further comprises an encoder 65, wherein the encoder 65 is used for monitoring the rotation speed of the motor 31 and is electrically connected with the linear drive 62.
When the power supply to the motor 31 is cut off, the rotation speed of the motor 31 is gradually reduced, the encoder 65 monitors the rotation speed of the motor 31, and when the rotation speed of the motor 31 reaches a preset speed, the encoder 65 sends the signal to the linear driving member 62, and the linear driving member 62 obtains the information and moves the corresponding driving bearing 63 in a direction close to the cam 61.
Preferably, referring to fig. 4, the cam 61 is provided in plurality, and the plurality of cams 61 are provided at intervals along the output shaft of the motor 31; the number of the pressing assemblies is multiple, and the pressing assemblies are uniformly arranged along the circumferential direction of the cam 61; the plurality of pressing members correspond to the plurality of cams 61 one to one, respectively.
It should be noted that the number of the grooves formed between two adjacent cam protrusions on each cam 61 is a first number, and the number of the cams 61 is not greater than the first number. Wherein, the quantity of cam 61 is the same with the quantity that compresses tightly the subassembly, and when the quantity of cam 61 was first quantity, the quantity that compresses tightly the subassembly also was first quantity, and when cam 61 rotated, all had bearing 63 to carry out the butt braking in every recess on the cam 61, consequently guaranteed accuracy and the reliability to cam 61 location to finally realized guaranteeing accuracy and the reliability to bearing box 1 location.
Alternatively, in the present embodiment, referring to fig. 4, there are two cams 61, and the two cams 61 are arranged at intervals along the output shaft of the motor 31; the two pressing assemblies are oppositely arranged along the radial direction of the cam 61, so that the two pressing assemblies are uniformly distributed along the circumferential direction of the cam 61; the two pressing assemblies correspond to the two cams 61 one-to-one, respectively.
That is, in the axial direction of the cam 61, the bearing 63 of one pressing assembly is flush with one cam 61, and the bearing 63 of the other pressing assembly is flush with the other cam 61. When the motor 31 needs to be braked, the linear driving pieces 62 of the two pressing assemblies simultaneously drive the bearing 63 to move towards the direction close to the cam 61, so that the motor 31 is braked in two directions simultaneously, and the braking reliability and stability of the motor 31 are improved.
Preferably, as shown in FIG. 4, the compression assembly further includes a dual toggle joint; the linear drive 62 is drivingly connected to the shaft 64 via a double toggle joint. With the arrangement, the connection strength between the rotating shaft 64 and the linear driving element 62 is improved, so that the linear driving element 62 drives the rotating shaft 64 to move more stably.
Preferably, as seen in FIG. 4, the hold down assembly further includes an adjustment plate 66; the adjusting plate 66 is fixedly connected to the cover 33, a long hole is formed in the adjusting plate 66, and the linear driving member 62 is fixed to the long hole through a bolt. This is provided to facilitate the linear actuator 62 to move on the adjustment plate 66, thereby achieving the adjustment of the position of the linear actuator 62 relative to the cover 33 to facilitate the linear actuator 62 to correspond to the cam 61.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (8)
1. A wafer drying device is characterized by comprising a rotary disc (2) and a rotating device (3);
the rotating device (3) is in driving connection with the turntable (2) and can enable the turntable (2) to rotate along the axis of the turntable; the turntable (2) is uniformly provided with an even number of bearing boxes (1) along the circumferential direction;
the rotating device (3) comprises a motor (31) and a transmission disc (32), the motor (31) is in driving connection with the transmission disc (32), and the rotating disc (2) is fixedly connected with the transmission disc (32);
the rotating device (3) further comprises a cover body (33), and the motor (31) is arranged in the cover body (33); the transmission disc (32) is connected to the cover body (33);
also comprises a positioning device (6); the positioning device (6) comprises a cam (61) and a pressing component; the compression assembly comprises a linear driving part (62) and a bearing (63); the linear driving piece (62) is connected to the cover body (33), the linear driving piece (62) is in driving connection with a rotating shaft (64), and the bearing (63) is fixedly connected to the rotating shaft (64); the cam (61) is fixedly connected with an output shaft of the motor (31), and the peripheral surface of the bearing (63) is opposite to the peripheral surface of the cam (61); the linear driving piece (62) can drive the bearing (63) to approach or separate from the cam (61) through the rotating shaft (64);
cutting off the power supply of the motor (31), gradually reducing the speed of the motor (31), driving the bearing (63) to move towards the direction close to the cam (61) by the linear driving part (62) at the moment until the bearing (63) is abutted with the cam (61), and with the continuous pushing of the linear driving part (62), the bearing (63) is contacted with the peripheral surface of the cam (61) and rotates to push the cam (61) to continuously rotate until the bearing (63) is gradually abutted with the groove on the peripheral surface of the cam (61), so that the cam (61) is braked.
2. Wafer spin-drying apparatus according to claim 1, characterized in that said rotating means (3) further comprise a first sealing assembly and a second sealing assembly;
the first seal assembly comprises an upper shaft seal disc (34) and a lower shaft seal disc (35); the transmission disc (32) is connected to the cover body (33) through the upper shaft seal disc (34) and the lower shaft seal disc (35) in sequence;
the second sealing assembly comprises a sealing shaft sleeve and a sealing ring; the output shaft of the motor (31) is connected with the transmission disc (32) through the sealing shaft sleeve, and the sealing ring is arranged at the joint of the sealing shaft sleeve and the transmission disc (32).
3. Wafer spin-drying apparatus according to claim 2, characterized in that it further comprises a frame and a fixing plate (4); the cover body (33) is fixedly connected to the fixing plate (4), and the fixing plate (4) is connected to the rack;
a damping device is connected between the cover body (33) and the fixing plate (4).
4. Wafer spin-drying apparatus according to claim 3, characterized in that said damping means comprise a rubber damping block (5); one end of the rubber shock absorption block (5) is fixedly connected with the cover body (33), and the other end of the rubber shock absorption block is fixedly connected with the fixing plate (4).
5. Wafer spin-drying apparatus according to claim 1, characterized in that the positioning device (6) further comprises an encoder (65), the encoder (65) being adapted to monitor the rotational speed of the motor (31) and being electrically connected to the linear drive (62).
6. The wafer spin-drying apparatus according to claim 1, wherein the cam (61) is provided in plurality, and the plurality of cams (61) are arranged at intervals along the output shaft of the motor (31); the pressing assemblies are arranged uniformly along the circumferential direction of the cam (61);
the plurality of pressing components correspond to the plurality of cams (61) one by one respectively.
7. The wafer spin apparatus of claim 1, wherein the hold-down assembly further comprises a double elbow joint;
the linear driving piece (62) is in driving connection with the rotating shaft (64) through the double-elbow joint.
8. The wafer spin-drying apparatus of claim 1, wherein the hold-down assembly further comprises an adjustment plate (66);
adjusting plate (66) rigid coupling in cover body (33), the slot hole has been seted up on adjusting plate (66), linear drive spare (62) is through the bolt fastening in the slot hole.
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| CN201910315136.4A CN109950185B (en) | 2019-04-18 | 2019-04-18 | Wafer spin-drying equipment |
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| CN201910315136.4A CN109950185B (en) | 2019-04-18 | 2019-04-18 | Wafer spin-drying equipment |
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| CN111536783B (en) * | 2020-07-10 | 2020-09-29 | 清华大学 | Marangoni drying device with adjustable spraying angle |
| CN111863701B (en) * | 2020-07-27 | 2021-03-16 | 常州瑞择微电子科技有限公司 | Photomask wet process chuck |
| CN116974141B (en) * | 2023-09-22 | 2023-12-15 | 贵州华龙电子设备有限公司 | Multi-specification wafer spin-drying device |
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| CN104001704A (en) * | 2014-05-19 | 2014-08-27 | 中国电子科技集团公司第四十五研究所 | Multi-station rotary support special for rotary washing device |
| CN106024674A (en) * | 2016-05-11 | 2016-10-12 | 中国电子科技集团公司第四十五研究所 | Multi-station rotating stand device for washing and drying equipment and method for cleaning wafer |
| CN107565856A (en) * | 2017-09-28 | 2018-01-09 | 陈春渊 | A kind of brake apparatus of the mechanism of motor driving |
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|---|---|
| CN109950185A (en) | 2019-06-28 |
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