CN109950011A - Packaging, packaging tool and its packaging technology - Google Patents
Packaging, packaging tool and its packaging technology Download PDFInfo
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- CN109950011A CN109950011A CN201910286501.3A CN201910286501A CN109950011A CN 109950011 A CN109950011 A CN 109950011A CN 201910286501 A CN201910286501 A CN 201910286501A CN 109950011 A CN109950011 A CN 109950011A
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- packaging
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- inclusion enclave
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Abstract
The invention discloses packagings, in the cavity including being filled in non cohesive gel gum cover through inclusion enclave made of spontaneous curing or heating, be wrapped in the intracorporal packaging body of the package and expose to the leg that the inclusion enclave is electrically connected with the packaging body.The encapsulation of the realization packaging body of convenience and high-efficiency is capable of in the setting for passing through non cohesive gel gum cover with the packaging of this structure design, and the packaging encapsulation after encapsulation is fine and close, and stable structure is reliable；The present invention also provides packaging tool, which is capable of the encapsulation of realization packaging rapidly and efficiently, easy to process, easy to operate；The present invention also provides packaging technologies, and the packaging technology process is simple, are easy to the molding of packaging, at low cost, easy to operate.
Description
Technical field
The present invention relates to varistor encapsulation technology field more particularly to packagings, packaging tool and its packaging technology.
Background technique
The encapsulating process of existing varistor is carried out by the way of heat absorption blue powder encapsulating powder, and concrete operations are as follows:
It will be put into heat cured resin powder after varistor welding body or the heating of module welding body, resin powder partial melting is in core
It is stained with one layer of thin resin layer in piece welding body, increases after multi-pass operation, after arriving defined encapsulating thickness, then is solidified
Packaging is completed afterwards.
It is encapsulated using aforesaid way, there are encapsulating process complexity, and encapsulating is not fine and close, and binding force is poor, and there are air for inside, produce
The problems such as raw creeping discharge, but also concentrate that there are following application problems:
1) lightning stroke through-current capacity: encapsulating is not fine and close and encapsulating faying face is there are factors such as air, leads to through-flow grade of being struck by lightning
Not high, through-flow number is insufficient, is easy to generate edge-punching failure at edge.
2) cannot pass through thermophilic digestion (121 DEG C, 100%RH, 2atm, 96H) reliability test；
3) high/low temperature circulation (- 55 DEG C/125 DEG C 15 DEG C/min 30min dwell time) reliability test number only may be used
By 10 times, it is not able to satisfy the requirement of 500,700,1000 high/low temperatures circulation.
4) for when by power current, the factors such as accumulation of heat and encapsulating air heat expansion cause pressure-sensitive explosion on fire.
5) homogeneous is encapsulated, and is easy to generate encapsulating stress on lead periphery, is easy cracking when lightning stroke or high/low temperature recycle and makes
At failure.
6) encapsulates thinner thickness, needs blue powder encapsulating thickness thicker, needs repeatedly to encapsulate repeatedly.
Therefore, for above-mentioned many defects, urgent need improves its encapsulating structure and its technique.
Summary of the invention
The first object of the present invention is to provide a kind of packaging, and packaging encapsulation is fine and close, and stable structure is reliable,
It is easy to manufacture.
The second object of the present invention is to provide a kind of packaging tool, which is capable of being packaged for convenience and high-efficiency
The encapsulation of device, it is at low cost, it is time saving and energy saving.
The third object of the present invention is to provide a kind of packaging technology, and the packaging technology is simple, be easy to packaging at
Type, it is easy to operate.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of packaging, through package made of spontaneous curing or heating in the cavity including being filled in non cohesive gel gum cover
Body is wrapped in the intracorporal packaging body of the package and exposes to the leg that the inclusion enclave is electrically connected with the packaging body.
A kind of electronic equipment, including packaging described above.
A kind of packaging tool, including upper die and lower die, and be inserted in the upper die and lower die and be formed by molding cavity
Interior packaging body material strip；Multiple non cohesive gel forming cavities are evenly equipped in the middle part of the lower die upper surface, in the upper mold upper surface
Portion is set to the lower die and on the locating slot and the non cohesive gel forming cavity through multiple locating slots, the upper mould cover is evenly equipped with
Under be correspondingly arranged；Muscle portion between the adjacent locating slot offers the elongated slot for packaging body material strip positioning.
A kind of packaging technology, including following operating procedure:
1), packaging body welds: packaging body and leg being carried out welding and form welding body；
2), inclusion enclave material processing: it will be used to form the liquid state colloid stirring of inclusion enclave and vacuumize process, removes colloid
Interior bubble；Or the glue cake for being used to form inclusion enclave is heated into liquid；
3) the liquid colloidal colloid in step 2 is injected in non cohesive gel gum cover by way of dispensing or extruding, then will
It is positioned in welding body insertion non cohesive gel gum cover in step 1 and by jig；
4) residue glue, is removed；
5), cutting, packaging.
Beneficial effects of the present invention: the present invention provides a kind of packagings, the cavity including being filled in non cohesive gel gum cover
It is interior through inclusion enclave made of spontaneous curing or heating, be wrapped in the intracorporal packaging body of the package and expose to the package
The leg that body is electrically connected with the packaging body.Pass through the setting of non cohesive gel gum cover, Neng Goufang with the packaging of this structure design
Just the encapsulation of packaging body is efficiently realized, and the packaging after encapsulation encapsulates densification, stable structure is reliable；The present invention also provides
A kind of packaging tool, which is capable of the encapsulation of realization packaging rapidly and efficiently, easy to process, easy to operate fast
It is prompt；The present invention also provides a kind of packaging technologies, and the packaging technology process is simple, are easy to the molding of packaging, at low cost, behaviour
Make convenient and efficient.
Detailed description of the invention
Fig. 1 is in the present invention without the pressure-sensitive device of non cohesive gel gum cover.
Fig. 2 is the explosion-proof type pressure-sensitive device that non cohesive gel gum cover is had in the present invention.
Fig. 3 is the front axonometric drawing of packaging tool of the present invention.
Fig. 4 is the exploded view of packaging tool of the present invention.
Fig. 5 is the axonometric drawing of packaging tool lower die lower bottom part in Fig. 4.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of packaging is present embodiments provided, which includes warp in the cavity for being filled in non cohesive gel gum cover 3
Inclusion enclave 2, the packaging body 1 that is wrapped in the inclusion enclave 2 made of spontaneous curing or heating and expose to the inclusion enclave
2 legs 12 being electrically connected with the packaging body 1.Specifically, as shown in connection with fig. 4, packaging body 1 includes a piezoresistive wafer 11,
The electrode of the piezoresistive wafer 11 is electrically connected with the leg 12.
Further, in the present embodiment, the inclusion enclave 2 is set as multilayer from inside to outside, positioned at the wrapping layer of innermost layer
(one layer directly contacted with piezoresistive wafer 11) is set as the elastic glue-line with damping characteristic.It, can with the design of this structure
By the setting of the elastic glue-line with damping characteristic, piezoresistive wafer 11 is avoided to bear high lightning stroke or power frequency overcurrent,
When accumulating biggish heat and energy, inclusion enclave is burst, can effectively buffer moment generation great energy, slow down or
Prevent above-mentioned abnormal generation.
Further, the lapping that inclusion enclave 2 described in the present embodiment is 20%~95% containing mass percent, institute
It states lapping and is set as silicon or/and silica or/and aluminum oxide, and/or zirconium oxide, be arranged with this, Neng Gouqi
To following effect:
1) wellability of these materials and 11 zinc oxide of piezoresistive wafer is preferable, it is easier to be attached to piezoresistive wafer 11
Surface, 11 inclusion enclave of piezoresistive wafer that colloid is formed by curing can greatly reduce the air of interface cohesion, improve the cause of package
Close property.On the one hand 11 side wall creeping discharge of piezoresistive wafer is reduced, the risk of 11 edge breakdown of piezoresistive wafer is reduced；To
Improve the through-current capacity grade and number of anti-lightning；Pass through the package mode, since the risk of creeping discharge is greatly lowered, pressure-sensitive electricity
The metalization layer or silver layer for hindering piece 11 can expand its area to sidewall direction, to promote its through-current capacity that is struck by lightning, improve tolerance.
Still further aspect, in this way, after improving 11 welding body of piezoresistive wafer and the compactness of wrapping layer, packaging body it is close
Envelope property greatly improves, even if being also able to achieve high leakproofness in the case where high vapour pressure；
2) add up in piezoresistive wafer 11 after certain energy can by the vaporization of the tin layers of metalization layer and welding pin or
The macromolecule resin of cracking temperature low in wrapping layer is cracked into vaporization, to generate explosion, phenomena such as flame；These materials are height
Fusing point insulating inorganic object, as refractory material without being cleaved；Still further aspect, the ability of heat transfer are above high score subtree
Rouge, when 11 temperature of piezoresistive wafer rises, heat can be radiated by wrapping layer, and tin layers high temperature melting penetrates into these inorganic materials
In material, temperature rise is avoided to sharply increase the vaporization of generation.
3) thermal expansion coefficient of these materials is closer to 11 material of piezoresistive wafer, and the compactness of package is more preferable, by force
Degree is more preferable；In package, there is no the welding bodies of protrusion is wrapped up isolator CTE and is easier to adjust due to the encapsulating characteristic of colloid
It is whole, so that inclusion enclave and piezoresistive wafer 11 will not generate cracking when cooling thermal impact or high/low temperature recycle, destroy pressure-sensitive
Resistor disc 11 or the leakproofness for destroying its package, to greatly improve the performance of its cooling thermal impact and high/low temperature circulation.
Further, the conduction material that the inclusion enclave 2 is 0~15% containing mass percent, the conduction material
Thermal conductivity >=80W/ (mK), the conduction material are set as one or more of copper, aluminium, silver, carbon, graphite or graphene.
The conduction material that 0~15% is added in inclusion enclave improves the property of its heat transfer on the basis of not reducing packaging body insulating properties
Can, facilitate the heat dissipation of piezoresistive wafer, the accumulation of 11 heat of piezoresistive wafer can be effectively reduced, to improve pressure-sensitive electricity
Hinder the through-flow grade of lightning stroke, number of lightning strokes and the power frequency tolerance of piece.
In order to promote the processing efficiency of the packaging, production cost is effectively reduced, it is described after being formed in the present embodiment
The individual packages device as shown in Figure 1 with the separately positioned formation of the non cohesive gel gum cover 3 of inclusion enclave 2, non cohesive gel gum cover 3 is as packet
Envelope mold is to be reused.It is filled in the cavity of non cohesive gel gum cover 3 through package made of spontaneous curing or heating
After body 2 solidifies, due to being not easy to bond between inclusion enclave 2 and non cohesive gel gum cover 3, the packaging after molding that can be convenient
Taken out from non cohesive gel gum cover 3, the non cohesive gel gum cover 3 may be configured as hard gum cover or flexible gum cover at this time, in order to prevent with
Bonding is generated between non cohesive gel gum cover 3, is conducive to demould, the epoxy resin of the inclusion enclave 2 containing 20-70%, the hard
Gum cover is set as fluoro containing polymers polymer, and the flexible glue set is set as silicon rubber.Further, when to non cohesive gel gum cover
When material in 3 is heating and curing, in order to enable non cohesive gel gum cover 3 is able to bear certain high temperature, it is described in the present embodiment
The tolerable temperature of non cohesive gel gum cover 3 is greater than or equal to 240 DEG C.
Further, in order to enable above-mentioned packaging has certain explosion-resistance characteristic, packaging can also be arranged
At as shown in Fig. 2, being wholely set inclusion enclave 2 with the non cohesive gel gum cover, since non cohesive gel gum cover 3 has certain damping special
Property elastic non cohesive gel gum cover 3, design by this method, preferable explosion-proof work can be played to internal inclusion enclave 2 and packaging body 1
With, then formed explosion-proof type pressure-sensitive device.
Further, the packaging body includes at least one piezoresistive wafer, the electrode of the piezoresistive wafer 11 and institute
State leg electrical connection.Piezoresistive wafer 11 and can also be passed through into ceramic gas discharge tube, resistance, capacitor, inductance, TVS, TSS
The device of equal elements composition is packaged together.Electrode can be blocky, stratiform or film-form；Leg, which can be monomer, to be connected
Sheet, can both encapsulate plug-in unit piezoresistive wafer 11, also can wrap sealed paster piezoresistive wafer 11.
The present embodiment additionally provides a kind of electronic equipment, including packaging described above.
The processing of above-mentioned packaging for convenience, in conjunction with shown in Fig. 3 to Fig. 5, the present embodiment additionally provides a kind of encapsulation
Jig, the packaging tool include upper mold 41 and lower die 42, and are inserted in the upper mold 41 and lower die 42 is formed by forming cavity
Intracorporal packaging body material strip 5；Multiple non cohesive gel forming cavities 421, the upper mold 41 are evenly equipped in the middle part of 42 upper surface of lower die
Through multiple locating slots 411 are evenly equipped with, the upper mold 41 is covered on the lower die 42 and the locating slot 411 at the middle part of upper surface
It is correspondingly arranged with about the 421 non cohesive gel forming cavity；Muscle portion between the adjacent locating slot 411 is offered for the envelope
Fill the elongated slot 412 that body material strip 5 positions.
Further, the packaging body material strip 5 in the present embodiment includes the positioning strip being arranged in the elongated slot 412
51, and the multiple to be packaged packaging bodies 1 uniformly distributed along the 51 one side length direction of positioning strip, with 1 electricity of packaging body
The leg 12 of connection and the positioning strip 51 are bonded in the one side wall of positioning strip 51 by adhesive tape.
In the present embodiment, the quadrangle of 42 upper surface of lower die is embedded with positioning pin 422, the positioning pin 422 with open up
Location hole in the 41 bottom surface quadrangle of upper mold matches, and enables 42 precise positioning of upper mold 41 and lower die, then facilitates
The folding of upper mold 41 and lower die 42.
The present embodiment additionally provides a kind of packaging technology, specifically includes following operating procedure:
1), packaging body 1 welds: packaging body 1 and leg 12 being carried out welding and form welding body；In this implementation, packaging body 1 with
For piezoresistive wafer 11, before being packaged to it, first packaging body 1 and leg 12 are welded as a whole.
2), 2 material processing of inclusion enclave: it will be used to form the liquid state colloid stirring of inclusion enclave 2 and vacuumize process, removes glue
Internal bubble；Or the glue cake for being used to form inclusion enclave 2 is heated into liquid；
3), the liquid colloidal colloid in step 2 is injected in non cohesive gel gum cover 3 by way of dispensing or extruding, then
It will be determined in the chip varistor body insertion non cohesive gel gum cover 3 for being welded with leg 12 in step 1 and by above-mentioned jig
Position；
4) residue glue, is removed；After die sinking, the remaining glue for overflowing locating slot 411 is cleared up.
5), cutting, packaging.
When carrying out above-mentioned technological operation, the surface of the inclusion enclave 2 after solidifying in order to prevent forms hole, can also be upper
State between step 2 and step 3 increase pressurization vacuum step, i.e., by the port to the non cohesive gel gum cover 3 in above-mentioned steps 3 into
Row pressurization near the air extrusion of colloid or faying face to colloid and extraneous faying face, then vacuumizes.
Above-mentioned technical process can select the colloid and matched non cohesive gel gum cover of different performance according to the demand of client
, need to consider that blue powder encapsulating powder if appropriate for technique, is not suitable for the powder of the technique without blue powder encapsulating process before picture
Body cannot use.The range of choice of which colloid is wider, and the package quality of product is absorbed in the selection of colloid, goes forward side by side one
Step meets the requirement of high reliability.Different thickness or shape can be designed to meet the requirement of encapsulating filling, not by technique
Limitation, as long as the non cohesive gel gum cover 3 that design is different, above-mentioned technique can encapsulate different multilayer colloids, to meet difference
Encapsulating reliability requirement, such as thermophilic digestion, high/low temperature circulation etc. performances.Its simple process, mold opening cost are low.
In above-mentioned technique, can mold by non cohesive gel gum cover 3 as encapsulating colloid, while also one as packaging
Point, non cohesive gel gum cover 3 has certain damping characteristic, can prevent varistor from generating in big lightning stroke or power current
High temperature makes solder tin layers or encapsulating colloid crack to form high temperature and high pressure gas, so that rubber shell bursts, non cohesive gel gum cover 3 has resistance to
High temperature and high damping characteristic can buffer this high impact force, allow high-temperature gas slow release, without causing high-temp combustion,
It is explosion-proof to achieve the effect that.
When carrying out above-mentioned technological operation, in order to avoid the inner surface of non cohesive gel gum cover 3 is made because of the coarse reasons such as rough
At 2 outer surface of the inclusion enclave blistering after solidification, the inner wall of the non cohesive gel gum cover 3 is provided with the non cohesive gel coating of low viscosity, institute
State the elastic film layer that non cohesive gel coating is set as soft.
Elastic film layer can form thin film buffer layer, thin film buffer layer filling in the inner wall of non cohesive gel gum cover 3
Non cohesive gel gum cover 3 coarse inner surface, then forms smooth planar surface.The thin film buffer layer has more than non cohesive gel mold
The soft higher characteristic of elasticity.When colloid is filled in the non cohesive gel mold with non cohesive gel thin film buffer layer, colloid and film
Substantially not by closed stomata between buffer layer, it is not easy to stomata is formed on surface, is pressurizeed when colloid internal gas passes through, one
Portion gas is squeezed out colloid, and a part can be extruded to the boundary of colloid and thin film buffer layer by the air inside gluey colloid
Face；It is vacuumized, since thin film buffer layer is softer, is understood after being extruded to faying face from soft thin film buffer layer and colloid again
Faying face in release, later using solidification, colloid has certain structural strength after solidifying, inside such colloid and
Surface is not in hole, and surface is also smooth.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (20)
1. a kind of packaging, it is characterised in that: in the cavity including being filled in non cohesive gel gum cover through spontaneous curing or heating and
At inclusion enclave, be wrapped in the intracorporal packaging body of the package and expose to the inclusion enclave and be electrically connected with the packaging body
Leg.
2. a kind of packaging according to claim 1, it is characterised in that: the inclusion enclave after sizing is not glued with described
Glue gum cover is separately positioned.
3. a kind of packaging according to claim 1, it is characterised in that: the inclusion enclave after sizing is not glued with described
Glue gum cover is wholely set.
4. a kind of packaging according to claim 3, it is characterised in that: the non cohesive gel gum cover is set as having damping
The elastic non cohesive gel gum cover of characteristic.
5. a kind of packaging according to claim 1, it is characterised in that: the inclusion enclave is set as more from inside to outside
Layer.
6. packaging according to claim 5, it is characterised in that: be set as that there is damping positioned at the wrapping layer of innermost layer
The elastic glue-line of characteristic.
7. a kind of packaging according to claim 1, it is characterised in that: the tolerable temperature of the non cohesive gel gum cover is greater than
Or it is equal to 240 DEG C.
8. a kind of packaging according to claim 1, it is characterised in that: the packaging body contains at least one pressure-sensitive electricity
Piece is hindered, the electrode of the piezoresistive wafer is electrically connected with the leg.
9. a kind of packaging according to claim 1, it is characterised in that: the inclusion enclave contains mass percent and is
20%~95% lapping, the lapping be set as silicon or/and silica or/and aluminum oxide, and/or
Zirconium oxide.
10. a kind of packaging according to claim 1, it is characterised in that: it is 0 that the inclusion enclave, which contains mass percent,
~15% conduction material, thermal conductivity >=80 W/ (mK) of the conduction material.
11. a kind of packaging according to claim 10, which is characterized in that the conduction material be set as copper, aluminium,
One or more of silver, carbon, graphite or graphene.
12. a kind of packaging according to claim 1, it is characterised in that: the non cohesive gel gum cover is set as hard rubber
Set or flexible gum cover.
13. a kind of packaging according to claim 12, it is characterised in that: the inclusion enclave contains the ring of 20-70%
Oxygen resin, the hard rubber set are set as fluoro containing polymers polymer, and the flexible glue set is set as silicon rubber.
14. a kind of electronic equipment, it is characterised in that: including packaging described in claim 1 to 13 any one.
15. a kind of packaging tool for packaging described in claim 1 to 13 any one, it is characterised in that: including upper
Mould and lower die, and be inserted in the upper die and lower die and be formed by the intracorporal packaging body material strip of forming cavity；Table in the lower die
Multiple non cohesive gel forming cavities are evenly equipped in the middle part of face, the middle part of the upper mold upper surface, which is run through, is evenly equipped with multiple locating slots, described
Upper mould cover is set to the lower die and the locating slot is correspondingly arranged up and down with the non cohesive gel forming cavity；The adjacent locating slot it
Between muscle portion offer for the packaging body material strip positioning elongated slot.
16. packaging tool according to claim 15, it is characterised in that: the packaging body material strip includes being arranged in the length
Positioning strip in slot, and the multiple to be packaged packaging bodies uniformly distributed along the positioning strip one side length direction, with the envelope
The leg of dress body electrical connection is detachably connected with the positioning strip.
17. a kind of packaging tool according to claim 15, it is characterised in that: the quadrangle of the lower die upper surface is embedded with
Positioning pin, the positioning pin are matched with the location hole for being opened in upper mold bottom surface quadrangle.
18. a kind of packaging technology for packaging described in claim 1 to 12 any one, which is characterized in that including
Following operating procedure:
1), packaging body welds: packaging body and leg being carried out welding and form welding body；
2), inclusion enclave material processing: it will be used to form the liquid state colloid stirring of inclusion enclave and vacuumize process, removes gas in colloid
Bubble；Or the glue cake for being used to form inclusion enclave is heated into liquid；
3), the liquid colloidal colloid in step 2 is injected in non cohesive gel gum cover by way of dispensing or extruding, then by step
It is positioned in welding body insertion non cohesive gel gum cover in 1 and by jig；
4) residue glue, is removed；
5), cutting, packaging.
19. packaging technology according to claim 17, which is characterized in that further include following operating procedure:
Pressurization vacuumizes: the step is carried out between step 2 and step 3 by the port to the non cohesive gel gum cover in step 3
Pressurization near the air extrusion of colloid or faying face to colloid and extraneous faying face, then vacuumizes, avoids the packet after solidifying
The surface for wrapping up in body forms hole.
20. packaging technology according to claim 17, which is characterized in that the inner wall of the non cohesive gel gum cover is provided with low viscous
The non cohesive gel of degree is coated with, and the non cohesive gel coating is set as the elastic film layer of soft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910286501.3A CN109950011A (en) | 2019-04-10 | 2019-04-10 | Packaging, packaging tool and its packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910286501.3A CN109950011A (en) | 2019-04-10 | 2019-04-10 | Packaging, packaging tool and its packaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109950011A true CN109950011A (en) | 2019-06-28 |
Family
ID=67014181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910286501.3A Pending CN109950011A (en) | 2019-04-10 | 2019-04-10 | Packaging, packaging tool and its packaging technology |
Country Status (1)
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| CN (1) | CN109950011A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111588985A (en) * | 2020-05-27 | 2020-08-28 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110505A (en) * | 2010-12-16 | 2011-06-29 | 陈小诚 | Mould pressing plastic package method for resistance network |
| CN104201274A (en) * | 2014-09-29 | 2014-12-10 | 苏州金科电子有限公司 | Diode composite package structure and manufacture method thereof |
| CN106398227A (en) * | 2016-07-28 | 2017-02-15 | 天津凯华绝缘材料股份有限公司 | A silicone composition, a preparing method thereof and uses of the composition |
| CN109065305A (en) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | A kind of band two temperature insurance piezoresistor and preparation method thereof |
| CN209859719U (en) * | 2019-04-10 | 2019-12-27 | 深圳市槟城电子有限公司 | Packaging device, electronic equipment and packaging jig thereof |
-
2019
- 2019-04-10 CN CN201910286501.3A patent/CN109950011A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110505A (en) * | 2010-12-16 | 2011-06-29 | 陈小诚 | Mould pressing plastic package method for resistance network |
| CN104201274A (en) * | 2014-09-29 | 2014-12-10 | 苏州金科电子有限公司 | Diode composite package structure and manufacture method thereof |
| CN106398227A (en) * | 2016-07-28 | 2017-02-15 | 天津凯华绝缘材料股份有限公司 | A silicone composition, a preparing method thereof and uses of the composition |
| CN109065305A (en) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | A kind of band two temperature insurance piezoresistor and preparation method thereof |
| CN209859719U (en) * | 2019-04-10 | 2019-12-27 | 深圳市槟城电子有限公司 | Packaging device, electronic equipment and packaging jig thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111588985A (en) * | 2020-05-27 | 2020-08-28 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
| CN111588985B (en) * | 2020-05-27 | 2021-02-19 | 微智医疗器械有限公司 | Implant device and method of assembling the same |
| WO2021238418A1 (en) * | 2020-05-27 | 2021-12-02 | 微智医疗器械有限公司 | Implant device and assembling method therefor |
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Address after: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Applicant after: Shenzhen Penang Electronics Co.,Ltd. Address before: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Applicant before: Shenzhen Bencent Electronics Co.,Ltd. |
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Application publication date: 20190628 |