CN102110505A - Mould pressing plastic package method for resistance network - Google Patents
Mould pressing plastic package method for resistance network Download PDFInfo
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- CN102110505A CN102110505A CN2010105923490A CN201010592349A CN102110505A CN 102110505 A CN102110505 A CN 102110505A CN 2010105923490 A CN2010105923490 A CN 2010105923490A CN 201010592349 A CN201010592349 A CN 201010592349A CN 102110505 A CN102110505 A CN 102110505A
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Abstract
The invention discloses a mould pressing plastic package method for a resistance network, and belongs to the technical field of a package method for an electronic element. In the conventional method, the resistance network to be packaged is placed in a plastic shell, is hung after resin is injected or immersed and is packaged and cured after the resin is naturally cured or is cured by heating. The invention aims to solve the technical problem that: the resistance network is packaged and cured with solid-state plastic which has completely controlled ingredients and quality and is subjected to pretreatment by using a molding press or an injection molding machine at a high temperature under high pressure, so that the uniformity and the consistency of a package material are guaranteed, the doping of the package material is eliminated, the airtightness of packed resistor and resistance network is greatly improved, and all possible quality hidden troubles of reduced insulating strength and inconsistency are completely solved. The short-time overload capacity of the resistance network packaged by the new method can be greatly improved by about over three times.
Description
Technical field:
The present invention relates to a kind of method for packing of electronic component, particularly relate to a kind of mold pressing plastic packaging method of resistor network.
Background technology:
Operation technique is to put into plastic casing according to the resistor network that certain rule is welded to connect at present, injects resin then, and the resistor network that perhaps will be welded to connect immerses in the resin, treats that resin spontaneous curing or heating cure are with the resistor network package curing.This method has simple to operate easy, even can not use machinery equipment, efficient height, low cost and other advantages.But this method is operated the influence with environment easily, has following problem;
1. the uniformity of inserts in the resin and resin can't be consistent;
2. be subjected to the influence of ambient humidity and process container surface attachments, be mixed with small steam bubble and impurity in the resin after the encapsulation;
3. density is low and inhomogeneous after resin nature or the heating cure, and air-tightness is not high, and the low-density part absorbs moist gas easily;
Resin be shell do not soak into fluid because the space is very little, poor flow quality, showing between resin after the curing and the shell is very rough, has retained the gas and the airborne steam of some solvents, even some impurity;
5. resin is different with the plastic casing coefficient of thermal expansion, can occur shell and resin part after the variations in temperature even all separate, make the inside of network resistor produce one deck gas film, even shell occurs and come off, the result makes network resistor be more prone to adsorb gas, is more prone to be subjected to the harmful effect of environment;
6. most of sheathing material can not bear high-temperature process, so the stabilized treatment and the operating ambient temperature of the network resistor of this method encapsulation generally can not be higher than 70 ℃;
7. higher most of sheathing material and the resin of cost performance do not possess fire resistance, is not suitable for the product with safety requirements;
8. most of sheathing material solvent resistance and corrosion-resistant, above-mentioned in addition can not bear high temperature, so in the actual installation welding process, Feng Zhuan network resistor all can not be applicable to automation welding methods such as wave soldering or immersed solder like this, and must adopt manual repair welding, not only production efficiency is low, also inevitably produces scaling powder residual in the circuit board after the repair welding and the hidden danger of quality that causes the wiring board dielectric strength to reduce attached to other foreign material on the scaling powder.
Above-mentioned these problems have very big randomness, these problems can't all be simulated and find to the production process and the proper testing instrument of normal precision net resistance, make and in the use of these products, have hidden danger inevitably, affect the precision and the performance of precision resistance network, affect the quality and the performance of the high-end instrument of using these precision resistance networks.
Summary of the invention:
The invention provides a kind of new resistor network mold pressing plastic packaging method, it improves the resistance after the encapsulation and the air-tightness of resistor network greatly, has thoroughly solved inconsistent, unstable, uncertain problem of network resistor dielectric strength and hidden danger of quality.
The technical solution used in the present invention is as follows:
The resistor network that discrete resistors more than two or two is required welding or connects according to reality, the resistor network that to make of ceramic substrate and slurry maybe, put into mould according to the certain size requirement, mould is put into moulding press, moulding material is put into moulding press according to actual materials amount, under certain pressure and certain temperature, carry out the HTHP encapsulation.
The HTHP method for packing has thoroughly been got rid of the inhomogeneities of encapsulating material and has thoroughly been got rid of the gas in the encapsulating material and mixed, and has thoroughly got rid of consequent dielectric strength and reduced and problem of unstable.
The method for packing that the present invention proposes makes the resistor network of encapsulation have extremely strong corrosion resistance, can after welding, use the cleaning solution agent of any needs to clean, can carry out the automation welding, not only improved production efficiency greatly, and thoroughly got rid of owing to after the repair welding hidden danger of quality that unavoidably has scaling powder residual on the wiring board and cause the wiring board dielectric strength to reduce attached to other foreign material on the scaling powder.
The method for packing that the present invention proposes makes the resistor network of encapsulation have high adaptive capacity to environment.
The method for packing that the present invention proposes makes the resistor network of encapsulation can carry out further high-temperature process, thereby has further improved precision resistance stability of network and reliability.
The encapsulating material of fire-retardant IC use is adopted in the method for packing suggestion that the present invention proposes, thereby can satisfy the security performance requirement of high-end product.
The method for packing that the present invention proposes makes the resistor network of encapsulation have the high capability of overload that bears, and can improve more than three times approximately.
Embodiment:
In the present invention, produce the resistor network of superhigh precision and ultralow temperature coefficient, after adopting discrete resistors the process suitable series connection and parallel connection more than two or two, put into specific mould, use moulding press or injection molding machine under high temperature and high pressure, to realize the injection moulding encapsulation, actual temp and pressure are adjusted in the process of concrete operations according to the volume size of resistor network and the performance of injection-moulded plastic, good to encapsulate, the smooth in appearance densification is full, pore-free is a criterion of acceptability, resistance, precision, temperature coefficient, matching precision, the coupling temperature coefficient, the number of leading foot and the shape of interval between the leading foot and mould are used according to reality and will be shown and specific.
The encapsulated plastic material can be selected the material of different heat conductivility parameters and different mobile performances, with performance parameter and the cost performance parameter that product is provided to greatest extent according to the serviceability and the mould structure of encapsulation back resistor network.The encapsulated plastic material is a thermoset plastics, and plastics solidify under HTHP.
The plastics that above-mentioned encapsulation is used can be powderies, also can manufacture biscuit in advance, put into moulding press and carry out mold pressing encapsulation after the high frequency preheater preheating, the secondary pollution of material has been avoided in the waste that the latter could further enhance productivity and reduce plastic material.
Described mould is put into moulding press and is heated to design temperature, and according to the performance of different encapsulating material and resistor network, design temperature can be from 120 ℃ to 260 ℃, by test parameters and packaging effect decision.
Claims (3)
1. new resistor network mold pressing plastic packaging method, the mold pressing plastic packaging method that it is characterized in that a kind of resistor network, discrete resistors more than two or two is required the resistor network of welding back composition according to reality, put into mould, mould is put into moulding press be heated to design temperature, again plastics are put into moulding press according to actual materials amount, under certain pressure and certain temperature, encapsulate.
2. a kind of new resistor network mold pressing plastic packaging method according to claim 1 is characterized in that described mould puts into moulding press and be heated to design temperature, and design temperature is from 120 ℃ to 260 ℃.
3. a kind of new resistor network mold pressing plastic packaging method according to claim 1, the encapsulated plastic material is a thermoset plastics, plastics solidify under HTHP.。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105923490A CN102110505A (en) | 2010-12-16 | 2010-12-16 | Mould pressing plastic package method for resistance network |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105923490A CN102110505A (en) | 2010-12-16 | 2010-12-16 | Mould pressing plastic package method for resistance network |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102110505A true CN102110505A (en) | 2011-06-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105923490A Pending CN102110505A (en) | 2010-12-16 | 2010-12-16 | Mould pressing plastic package method for resistance network |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102110505A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107882697A (en) * | 2017-11-03 | 2018-04-06 | 索爱菊 | A kind of wind generator set blade anti-icing and deicing system |
| CN107910145A (en) * | 2017-10-12 | 2018-04-13 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of embedded varistor and its manufacture craft |
| CN109950011A (en) * | 2019-04-10 | 2019-06-28 | 深圳市槟城电子有限公司 | Packaging, packaging tool and its packaging technology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2741687A (en) * | 1953-08-21 | 1956-04-10 | Erie Resistor Corp | Pyrolytic carbon resistors |
| US3171875A (en) * | 1962-03-12 | 1965-03-02 | Model Engineering & Mfg Corp | Cold molded resistor and method of fabricating same |
| DE3603912A1 (en) * | 1985-02-09 | 1986-08-14 | Alps Electric Co., Ltd., Tokio/Tokyo | Electronic network module and a method for producing the same |
-
2010
- 2010-12-16 CN CN2010105923490A patent/CN102110505A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2741687A (en) * | 1953-08-21 | 1956-04-10 | Erie Resistor Corp | Pyrolytic carbon resistors |
| US3171875A (en) * | 1962-03-12 | 1965-03-02 | Model Engineering & Mfg Corp | Cold molded resistor and method of fabricating same |
| DE3603912A1 (en) * | 1985-02-09 | 1986-08-14 | Alps Electric Co., Ltd., Tokio/Tokyo | Electronic network module and a method for producing the same |
Non-Patent Citations (1)
| Title |
|---|
| 袁德昌: "塑封固定电阻网络技术和试验", 《微电子学与计算机》, no. 12, 31 December 1992 (1992-12-31) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910145A (en) * | 2017-10-12 | 2018-04-13 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of embedded varistor and its manufacture craft |
| CN107882697A (en) * | 2017-11-03 | 2018-04-06 | 索爱菊 | A kind of wind generator set blade anti-icing and deicing system |
| CN109950011A (en) * | 2019-04-10 | 2019-06-28 | 深圳市槟城电子有限公司 | Packaging, packaging tool and its packaging technology |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110629 |