CN104673176B - A kind of electron pouring sealant and preparation method thereof - Google Patents
A kind of electron pouring sealant and preparation method thereof Download PDFInfo
- Publication number
- CN104673176B CN104673176B CN201510103763.3A CN201510103763A CN104673176B CN 104673176 B CN104673176 B CN 104673176B CN 201510103763 A CN201510103763 A CN 201510103763A CN 104673176 B CN104673176 B CN 104673176B
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- CN
- China
- Prior art keywords
- glue
- parts
- pouring sealant
- weight
- dioctyl phthalate
- Prior art date
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- 239000000565 sealant Substances 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 52
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims abstract description 14
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims abstract description 14
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 claims abstract description 7
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims abstract description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000001413 amino acids Chemical class 0.000 claims abstract description 7
- 150000002009 diols Chemical class 0.000 claims abstract description 7
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000909 polytetrahydrofuran Polymers 0.000 claims abstract description 7
- 239000011701 zinc Substances 0.000 claims abstract description 7
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 6
- 238000007711 solidification Methods 0.000 abstract description 6
- 230000008023 solidification Effects 0.000 abstract description 6
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000012188 paraffin wax Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
Abstract
The present invention relates to electron pouring sealant field, particularly to a kind of electron pouring sealant and preparation method thereof.This electron pouring sealant, its be characterized in that include A glue and can the B glue of mixed use, wherein A glue is made up of the raw material of following parts by weight: Oleum Ricini 300 320 parts, dioctyl phthalate 900 parts, 500 parts of tricresyl phosphate fat, hexamethylene diisocyanate 2000 parts, amino-acid zinc 2 parts；Wherein B glue is made up of the raw material of following parts by weight: polytetrahydrofuran diol 1000 parts, dioctyl phthalate 800 parts, 600 parts of tricresyl phosphate fat, chlorinated paraffin 52 800 parts.This product is easy to use, transparent shape after solidification, attractive in appearance, and removes easily, will not damage wiring board, it is simple to wiring board is continuing with, it is to avoid waste, preparation time is greatly shortened.
Description
(1) technical field
The present invention relates to electron pouring sealant field, particularly to a kind of electron pouring sealant and preparation method thereof.
(2) background technology
Electron pouring sealant belongs to liquid before uncured, has mobility, and glue viscosity is according to the material of product, property
Can, the difference of production technology and otherwise varied.Casting glue could realize its use value after being fully cured, can rise after solidification
To waterproof and dampproof, dust-proof, insulation, heat conduction, secrecy, anticorrosion, heatproof, shockproof effect.
Electron pouring sealant is mainly used in wiring board encapsulation, to play waterproof and dampproof, dust-proof, insulation, anticreep, fire-retardant work
With, but after present electron pouring sealant a period of time, yellowing easily occurs, affect attractive in appearance, and on wiring board, electronics fills
Difficulty is removed in sealing, if wiring board goes wrong, cannot repair, be continuing with, can only abandon, and is very waste.Ask for above-mentioned
Inscribe, a kind of electron pouring sealant and preparation method thereof disclosed in 8 days Mays in 2013, but preparation process is the most long, serious shadow
Ring the yield of product, unfavorable to enterprise development, need to improve.
(3) summary of the invention
The invention provides a kind of transparent, be easy to the electron pouring sealant and preparation method thereof removed.
The present invention is achieved through the following technical solutions:
A kind of electron pouring sealant, its be characterized in that include A glue and can the B glue of mixed use,
Wherein A glue is made up of the raw material of following parts by weight:
Oleum Ricini 300-320 part
Dioctyl phthalate 900 parts
500 parts of tricresyl phosphate fat
Hexamethylene diisocyanate 2000 parts
Amino-acid zinc 2 parts；
Wherein B glue is made up of the raw material of following parts by weight:
Polytetrahydrofuran diol 1000 parts
Dioctyl phthalate 800 parts
600 parts of tricresyl phosphate fat
Chlorinated paraffin-52 800 parts.
The preparation method of the electron pouring sealant of the present invention, comprises the following steps:
(1) prepared by A glue: Oleum Ricini 300kg, dioctyl phthalate 900kg, phosphotriester 500kg are placed in reaction
In still, it is heated to 110 DEG C, after vaccum dewatering, is cooled to 40 DEG C, be subsequently adding hexamethylene diisocyanate 2000kg, amino-acid zinc 2kg,
Reaction 15min discharging obtains A glue；
(2) prepared by B glue: by polytetrahydrofuran diol 1000kg, dioctyl phthalate 800kg, phosphotriester 600kg
Add in reactor, be heated to 130 DEG C, add chlorinated paraffin-52,800kg after vaccum dewatering, add dibutyl tin laurate
(by 0.1% interpolation of B glue weight), is then cooled to 90 DEG C, and after adding 5kg ethanol, then vaccum dewatering 20min, discharging obtains B glue；
(3) A glue, the mixing of B glue: A glue is mixed homogeneously by weight 1:2 with B glue, is subsequently poured into encapsulating mould solidification i.e.
Can.
Adding the firming agent of B glue weight 0.01%-0.1% after adding chlorinated paraffin-52, the addition of firming agent is according to client
Requirement.
The technical parameter of this product is:
Voltage strength is 16.5kv/mm, and volume resistance is 8.9 × 1011Ω cm, dielectric constant is 3.5, dielectric loss angle
Just it is being cut to 1.1 × 10-1, absorbance (under room temperature, being placed in 48h in distilled water) is 0.14%, and hot strength is 0.62Mpa, breaks and stretches
Long rate is 135%.
The invention have the benefit that this product is easy to use, transparent shape after solidification, attractive in appearance, and remove easily, no
Wiring board can be damaged, it is simple to wiring board is continuing with, it is to avoid waste, preparation time is greatly shortened.
(4) detailed description of the invention
Embodiment 1:
The preparation method of the electron pouring sealant of the present embodiment is:
(1) prepared by A glue: Oleum Ricini 300kg, dioctyl phthalate 900kg, phosphotriester 500kg are placed in reaction
In still, it is heated to 110 DEG C, after vaccum dewatering, is cooled to 40 DEG C, be subsequently adding hexamethylene diisocyanate 2000kg, amino-acid zinc 2kg,
Reaction 15min discharging obtains A glue；
(2) prepared by B glue: by polytetrahydrofuran diol 1000kg, dioctyl phthalate 800kg, phosphotriester 600kg
Add in reactor, be heated to 130 DEG C, add chlorinated paraffin-52,800kg after vaccum dewatering, add dibutyl tin laurate
(by 0.1% interpolation of B glue weight), is then cooled to 90 DEG C, and after adding 5kg ethanol, then vaccum dewatering 20min, discharging obtains B glue；
(3) A glue, the mixing of B glue: A glue is mixed homogeneously by weight 1:2 with B glue, is subsequently poured into encapsulating mould solidification i.e.
Can.
Embodiment 2
The preparation method of the electron pouring sealant of the present embodiment is:
(1) prepared by A glue: Oleum Ricini 320kg, dioctyl phthalate 900kg, phosphotriester 500kg are placed in reaction
In still, it is heated to 110 DEG C, after vaccum dewatering, is cooled to 40 DEG C, be subsequently adding hexamethylene diisocyanate 2000kg, amino-acid zinc 2kg,
Reaction 12min discharging obtains A glue；
(2) prepared by B glue: by polytetrahydrofuran diol 1000kg, dioctyl phthalate 800kg, phosphotriester 600kg
Add in reactor, be heated to 130 DEG C, add chlorinated paraffin-52,800kg after vaccum dewatering, add dibutyl tin laurate
(by 0.1% interpolation of B glue weight), is then cooled to 90 DEG C, and after adding 5kg ethanol, then vaccum dewatering 20min, discharging obtains B glue；
(3) A glue, the mixing of B glue: A glue is mixed homogeneously by weight 1:3 with B glue, is subsequently poured into encapsulating mould solidification i.e.
Can.
Claims (1)
1. an electron pouring sealant, it is characterised in that: include A glue and can the B glue of mixed use,
Wherein A glue is made up of the raw material of following weight:
Oleum Ricini 300 parts
Dioctyl phthalate 900 parts
Phosphotriester 500 parts
Hexamethylene diisocyanate 2000 parts
Amino-acid zinc 2 parts；
Wherein B glue is made up of the raw material of following weight:
Polytetrahydrofuran diol 1000 parts
Dioctyl phthalate 800 parts
Phosphotriester 600 parts
Chlorinated paraffin-52 800 parts
The addition of dibutyl tin laurate is the 0.1% of B glue weight,
The preparation method of described electron pouring sealant, comprises the following steps:
(1) prepared by A glue: Oleum Ricini 300kg, dioctyl phthalate 900kg, phosphotriester 500kg are placed in reactor,
It is heated to 110 DEG C, after vaccum dewatering, is cooled to 40 DEG C, be subsequently adding hexamethylene diisocyanate 2000kg, amino-acid zinc 2kg, reaction
15min discharging obtains A glue；
(2) prepared by B glue: polytetrahydrofuran diol 1000kg, dioctyl phthalate 800kg, phosphotriester 600kg are added
In reactor, it is heated to 130 DEG C, addition chlorinated paraffin-52 after vaccum dewatering, 800kg, addition dibutyl tin laurate, two
Dibutyl tin laurate presses 0.1% interpolation of B glue weight, is then cooled to 90 DEG C, after adding 5kg ethanol, then vaccum dewatering 20min
Discharging obtains B glue；
(3) A glue, the mixing of B glue: A glue is mixed homogeneously by weight 1:2 with B glue, is subsequently poured into encapsulating mould and solidifies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510103763.3A CN104673176B (en) | 2015-03-10 | 2015-03-10 | A kind of electron pouring sealant and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510103763.3A CN104673176B (en) | 2015-03-10 | 2015-03-10 | A kind of electron pouring sealant and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104673176A CN104673176A (en) | 2015-06-03 |
| CN104673176B true CN104673176B (en) | 2016-10-05 |
Family
ID=53308781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510103763.3A Active CN104673176B (en) | 2015-03-10 | 2015-03-10 | A kind of electron pouring sealant and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN104673176B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105238332A (en) * | 2015-07-17 | 2016-01-13 | 济南伟传信息技术有限公司 | Convenient-to-use transparent beautiful electronic potting adhesive and preparation method thereof |
| CN106845608A (en) * | 2016-12-30 | 2017-06-13 | 镇江市民卡有限公司 | A kind of gluing type whole-mount technology of Citizen Card Item electronic component |
| CN107189749A (en) * | 2017-06-23 | 2017-09-22 | 华娜 | A kind of electron pouring sealant and preparation method thereof |
| CN111944473B (en) * | 2020-08-20 | 2021-09-17 | 中电保力（北京）科技有限公司 | Bi-component strippable daub and preparation method thereof |
| CN115678479B (en) * | 2022-10-10 | 2023-12-08 | 无锡东润电子材料科技有限公司 | Low dielectric loss polyurethane packaging material for capacitor and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164473A (en) * | 1990-01-16 | 1992-11-17 | Miles Inc. | Two-component polyurethane adhesive |
| CN101319129A (en) * | 2007-06-08 | 2008-12-10 | 上海精细文化用品有限公司 | Single-component solvent-free damp solidifying polyurethane adhesion agent and method of producing the same |
-
2015
- 2015-03-10 CN CN201510103763.3A patent/CN104673176B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164473A (en) * | 1990-01-16 | 1992-11-17 | Miles Inc. | Two-component polyurethane adhesive |
| CN101319129A (en) * | 2007-06-08 | 2008-12-10 | 上海精细文化用品有限公司 | Single-component solvent-free damp solidifying polyurethane adhesion agent and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104673176A (en) | 2015-06-03 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zheng Yifan Inventor before: Hu Huimei |
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| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160901 Address after: 250000 No. 4569 Fenghuang Road, hi tech Zone, Shandong, Ji'nan Applicant after: Jinan Weichuan Information Technology Co., Ltd. Address before: 250000, room 2, unit 19, Building 102, Huayuan Road 5, Licheng District, Shandong, Ji'nan Applicant before: Jinan Jiao Tai Information Technology Co., Ltd |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Peng Kefu Inventor after: Peng Yuanyuan Inventor after: Peng Qiuxia Inventor after: Yang Xingbing Inventor after: Che Zhiwen Inventor after: Zhang Weixiang Inventor before: Zheng Yifan |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170607 Address after: 402660, Tongnan District, Chongqing Industrial Park, block A3-1/01 (health energy green No. 1 building, business facade two, E axis, -31 axis) Patentee after: Jiangchuan Chongqing chemical (Group) Co., Ltd. Address before: 250000 No. 4569 Fenghuang Road, hi tech Zone, Shandong, Ji'nan Patentee before: Jinan Weichuan Information Technology Co., Ltd. |