CN103464337A - Dispensing curing device - Google Patents
Dispensing curing device Download PDFInfo
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- CN103464337A CN103464337A CN2013103511061A CN201310351106A CN103464337A CN 103464337 A CN103464337 A CN 103464337A CN 2013103511061 A CN2013103511061 A CN 2013103511061A CN 201310351106 A CN201310351106 A CN 201310351106A CN 103464337 A CN103464337 A CN 103464337A
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- side plate
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Abstract
The invention relates to a dispensing curing device, which comprises a bottom plate, a heat conduction support part, a peripheral edge part and a heating element. The bottom plate has a first surface, on which the heat conduction support part is disposed. The peripheral edge part is arranged on the first surface and around the heat conduction support part. An air conduction ring groove is arranged between the peripheral edge part and the heat conduction support part, and the peripheral edge part is also equipped with an air inlet guide hole and an air outlet guide hole that are communicated with the air conduction ring groove. The first height between the heat conduction support part and the first surface is smaller than the second height between the peripheral edge part and the first surface. The heating element is disposed in the heat conduction support part. The dispensing curing device can realize rapid curing of gel, thus being in favor of enhancing the efficiency of the dispensing process.
Description
Technical field
The present invention relates to a kind of display panels manufacture technology field, and be particularly related to the some glue solidify device that the some glue process in a kind of display panels manufacturing process is used.
Background technology
In recent years, along with the development of Display Technique, liquid crystal display is applied in the display device as Portable movable electronic products such as smart mobile phone, panel computers more and more widely.In the manufacturing process of display panels; after giving the good external circuits plate of display panels pressing, before the assembling backlight module; need to apply one deck in the terminal region of display panels and solidify glue; in order to protect the terminal region circuit, can prevent from that foreign conducting matter from dropping to cause its short circuit between terminal, avoid terminal region to be exposed to for a long time in air causing portion of terminal pin corrosion etc.
At present, tower non-(Tuffy) glue is to use one of more curing glue during display panels is made.Tuffy glue is to be dissolved in the formed colloid of organic solvent butyl acetate by macromolecular material methyl cyclohexane, after organic solvent butyl acetate heat absorption volatilization in the Tuffy micelle colloid, being curable film-forming, is the key that improves the colloid curing rate therefore accelerate the volatilization of butyl acetate organic solvent.But, the solidification equipment that the existing some glue process with Tuffy glue does not have particularly suitable is cured it, after main employing will be put glue, display panels is placed on the mode of naturally drying in room temperature environment, therefore, use at present the hardening time of Tuffy glue longer, usually need the time of about 5～6 minutes, thereby cause the production efficiency of a glue process lower.
Summary of the invention
The object of the invention is to, a kind of some glue solidify device is provided, can realize the particularly rapid curing of Tuffy micelle colloid of colloid, thereby be conducive to the efficiency of hoist point glue process.
It is to adopt following technical scheme to realize that the present invention solves its technical problem.
The present invention proposes a kind of some glue solidify device and comprises base plate, heat conduction support portion, surrounding edge and heating element heater.Base plate has first surface.The heat conduction support portion is arranged at first surface.Surrounding edge is arranged at first surface and around the heat conduction support portion.There is the air guide annular groove between surrounding edge and heat conduction support portion, and there is the air inlet guide hole be communicated with the air guide annular groove and the guide hole of giving vent to anger.The heat conduction support portion highly is less than second height of surrounding edge with respect to first surface with respect to first of first surface.Heating element heater is arranged in the heat conduction support portion.
In preferred embodiment of the present invention, above-mentioned surrounding edge comprises that head and the tail connect the first side plate, the second side plate, the 3rd side plate, the 4th side plate successively.The first side plate is relative with the 3rd side plate, and the second side plate is relative with the 4th side plate.Air inlet guide hole and the guide hole of giving vent to anger are arranged at respectively the first side plate and the 3rd side plate.
In preferred embodiment of the present invention, above-mentioned the second side plate comprises a plurality of protuberances, the plurality of protuberance protrudes towards the side away from the 4th side plate, and the second side plate also has a plurality of openings towards the 4th side plate, and a plurality of openings are corresponding a plurality of protuberance being connected with the air guide annular groove respectively.
In preferred embodiment of the present invention, above-mentioned heat conduction support portion has supporting surface, and has a plurality of vacuum suction hole that connects supporting surface.
In preferred embodiment of the present invention, above-mentioned a plurality of vacuum suction hole is interconnected in the inside of heat conduction support portion.
In preferred embodiment of the present invention, above-mentioned some glue solidify device also comprises vacuum tube, and this vacuum tube is connected with a plurality of vacuum suction hole.
In preferred embodiment of the present invention, above-mentioned heating element heater comprises resistance wire.
In preferred embodiment of the present invention, above-mentioned resistance wire is nickel-chromium resistance wire.
In preferred embodiment of the present invention, above-mentioned some glue solidify device also comprises air induction conduit and outtake tube, is arranged at respectively in air inlet guide hole and the guide hole of giving vent to anger.
In preferred embodiment of the present invention, above-mentioned air inlet pipe is provided with pneumatic control valve.
The invention has the beneficial effects as follows, the heat conduction support portion of of the present invention some glue solidify device is less than the height of edge part with respect to first surface with respect to the height of first surface, there is the air guide annular groove between surrounding edge and heat conduction support portion, the air guide annular groove provides the space of gas flow, further utilizes the heating element heater of inside, heat conduction support portion to carry out heat treated to the gas in the air guide annular groove.After a glue product is positioned over the heat conduction support portion and covers the air guide annular groove, heated gas can the air guide annular groove in from the air inlet guide hole, towards the guide hole of giving vent to anger, flow, thereby the volatilization of the organic solvent in the colloid on the glue product of acceleration point, and then the acceleration colloid is curing, shorten the efficiency of hardening time with the hoist point glue process.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
The accompanying drawing explanation
Figure 1 shows that the top view of the some glue solidify device of first embodiment of the invention.
Figure 2 shows that the cutaway view of the some glue solidify device of the first embodiment of the invention shown in Fig. 1 along the II-II line.
The point glue solidify device that Figure 3 shows that the first embodiment of the invention shown in Fig. 1 is used view.
Figure 4 shows that the top view of the some glue solidify device of second embodiment of the invention.
Figure 5 shows that the top view of some matrix plate of the some glue solidify device of corresponding second embodiment of the invention.
The specific embodiment
Reach for further setting forth the present invention technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, the specific embodiment, structure, feature and effect thereof that foundation the present invention is proposed are described in detail as follows:
Relevant aforementioned and other technology contents of the present invention, Characteristic can be known and present in the following detailed description coordinated with reference to graphic preferred embodiment.By the explanation of the specific embodiment, when can be to reach technological means and the effect that predetermined purpose takes to be able to more deeply and concrete understanding to the present invention, yet appended graphic only being to provide with reference to the use with explanation not be used for the present invention is limited.
Figure 1 shows that the top view of the some glue solidify device of first embodiment of the invention.Figure 2 shows that the cutaway view of the some glue solidify device of the first embodiment of the invention shown in Fig. 1 along the II-II line.Please see figures.1.and.2 in the lump, in the present embodiment, some glue solidify device 100 comprises base plate 110 and is arranged at heat conduction support portion 120, surrounding edge 130 and the heating element heater 140 on base plate 110.
Particularly, in the present embodiment, base plate 110 is for example rectangular, but, not as limit, the shape and size of base plate can change and determine according to a glue product.Base plate 110 has relative first surface 111 and second surface 112.The first surface 111 of base plate 110 has the first central area 113 and 113 the peripheral regions 114 around central area.Heat conduction support portion 120, surrounding edge 130 and heating element heater 140 all are arranged on the first surface 111 of base plate 110.The second surface 112 of base plate 110 is fixed in the surface of corresponding workbench for a glue solidify device 100, thereby makes invocation point glue solidify device 100 can be fixed in the surface of corresponding workbench.In addition, the material of base plate 110 for example can be selected the refractory metal material.
Heat conduction support portion 120 is arranged at the first surface 111 of base plate 110, and is positioned at the central area 113 of first surface 111.Heat conduction support portion 120 has the first height H 1 with respect to the first surface 111 of base plate 110.The material of heat conduction support portion 120, such as being the Heat Conduction Materials such as metal, is not particularly limited at this.Heat conduction support portion 120 has supporting surface 121, the back side 122 relative with supporting surface 121 and the side 123 between connection and supporting surface 121 and the back side 122.Supporting surface 121 is all surfaces parallel with the first surface 111 of base plate 110 with the back side 122, and side 123 is vertical with the first surface 111 of base plate.Wherein, the heat conduction support portion 120 back side 122 is arranged at the first surface 111 of base plate 110.
For fear of a glue product, on the supporting surface 121 of heat conduction support portion 120, be moved, the present embodiment is will put on the supporting surface 121 that the glue product is fixed on heat conduction support portion 120 by the mode of vacuum suction, but not as limit.In the present embodiment, heat conduction support portion 120 has a plurality of vacuum suction hole 124 that connects supporting surface 121.A plurality of vacuum suction hole 124 is evenly distributed on supporting surface 121, and be array and arrange, but not as limit, as long as can vacuum suction fixing point glue product.It is worth mentioning that, a plurality of vacuum suction hole 124 is such as can be that each is connected to device for vacuum generation such as vavuum pump etc. by vacuum tube separately.For the simplification device structure, in the present embodiment, a plurality of vacuum suction hole 124 is to be interconnected in the inside of heat conduction support portion 120, be provided with the guide hole 115 be communicated with vacuum suction hole 124 in base plate 110, vacuum tube 125 is arranged in guide hole 115, and a plurality of vacuum suction hole 124 is connected to device for vacuum generation (not shown) such as vavuum pump etc. by vacuum tube 125.
There is a determining deviation between surrounding edge 130 and 120 side, heat conduction support portion 123, thereby form air guide annular groove 105 between surrounding edge 130 and heat conduction support portion 120.It should be noted that, the shape of air guide annular groove 105 is not limited to the rectangle annular groove of the present embodiment, air guide annular groove 105 can be designed according to distribution and the position of the some micelle colloid on a glue product, so that the some micelle colloid fully is exposed in air guide annular groove 105, is advisable.In the present embodiment, the first side plate 131, the second side plate 132, the 3rd side plate 133, the 4th side plate 134 equate with the distance between 120 side, heat conduction support portion 123.In other specific embodiment, the distance between the first side plate 131, the second side plate 132, the 3rd side plate 133, the 4th side plate 134 and 120 side, heat conduction support portion 123 also can be unequal.
In addition, in the present embodiment, the first side plate 131, the second side plate 132, the 3rd side plate 133 and the 4th side plate 134 equate with respect to the height of the first surface 111 of base plate 110, thereby surrounding edge 130 has the second height H 2 with respect to the first surface 111 of base plate 110.And heat conduction support portion 120 is less than second height H 2 of surrounding edge 130 with respect to the first surface 111 of base plate 110 with respect to the first height H 1 of the first surface 111 of base plate 110.The height difference of the second height H 2 and the first height H 1 can be determined by a thickness of glue product, and the height difference of common the second height H 2 and the first height H 1 is more than or equal to a thickness of glue product and is advisable.In addition, space projection to the shape and size of first surface 11 and the shape and size of some glue product that enclose due to the first side plate 131, the second side plate 132, the 3rd side plate 133 and the 4th side plate 134 are complementary, like this, when a glue product is positioned over heat conduction support portion 120, can effectively coordinate surrounding edge 130, make air guide annular groove 105 form relatively airtight space.
For the ease of the turnover of ambient atmos, surrounding edge 130 also has the air inlet guide hole 135 be communicated with air guide annular groove 105 and the guide hole 136 of giving vent to anger.In the present embodiment, air inlet guide hole 135 and the guide hole 136 of giving vent to anger are arranged at respectively the first side plate 133 and the 3rd side plate 134, in order to ambient atmos is imported from air inlet guide hole 135, after the air guide annular groove 105 of flowing through, then derive from the guide hole 136 of giving vent to anger.For the ease of importing and exporting of gas, preferably, can in air inlet guide hole 135 and the guide hole 136 of giving vent to anger, air induction conduit 106 and outtake tube 107 be set respectively.Further, for the air pressure that carries out the conductor air-flow, control, can be provided with pneumatic control valve 108 in air inlet pipe 106.
In the present embodiment, 120 inside, heat conduction support portion also are provided with heating element heater 140, for thermal source is provided, and by heat conduction support portion 120 conduction heats, the gas in the air guide annular groove 105 of 120 sides 123 around the heat conduction support portion are heated.In the present embodiment, heating element heater 140 comprises the resistance wire that is embedded at 120 inside, heat conduction support portion, and it is by the heating of switching on of built-in or external power supply (not shown).Usually, required heating-up temperature can be different because of the difference of a micelle colloid, take Tuffy glue as example, and heating-up temperature is for example to be controlled at 50 ℃ of left and right.If adopt resistance wire heating element 130, additional predetermined voltage can reach required heating-up temperature after the conduction time of setting.Particularly, conduction time can be according to formula (1) Q=Ct*m* Δ T=I
2* R*t is calculated, and wherein Ct is specific heat capacity, and m is quality, and Δ T is the variations in temperature before and after energising, and I is electric current, and R is resistance, and t is conduction time.For instance, resistance wire as heating element heater 140 can be for example nickel-chromium resistance wire (Cr20Ni80), diameter is about 2mm, and length is about 0.5m, and specific heat capacity is approximately 0.45J/ (Kg* ℃), quality is 0.02639Kg/m, resistance is 0.347 Ω/m, if initial temperature is 30 ℃, heating-up temperature is 50 ℃, energising voltage is while being 3V, can calculate conduction time t by formula (1) and be about 10 seconds.In other words, adopt the nickel-chromium resistance wire that initial temperature is 30 ℃ to be heated as heating element heater 140, approximately about 10 seconds, can reach 50 ℃ of required heating-up temperatures.Too high for fear of heating-up temperature, after the conduction time of setting, can be cut off the power supply to heating element heater 140, again according to being heated the conduction time of setting, or calculate conduction time according to required heating-up temperature and resistance wire parameter again and heated while needing.
The point glue solidify device 100 that Figure 3 shows that the first embodiment of the invention shown in Fig. 1 is used view.Please refer to Fig. 3, point glue solidify device 100 is for example the display panels 200 after a glue for solidification point glue product, the shape and size of the display panels 200 after putting glue solidify device 100 and putting glue match, especially, the some micelle colloid 210 on the display panels 200 after some glue fully is exposed in air guide annular groove 105.Display panels 200 after a glue is positioned on heat conduction support portion 120, and be fixed by the vacuum suction in vacuum suction hole 124, now, the size of the display panels 200 after some glue is greater than heat conduction support portion 120, therefore can cover air guide annular groove 105, and be resisted against surrounding edge 130(the first side plate 131, the second side plate 132, the 3rd side plate 133 and the 4th side plate 134), thus make air guide annular groove 105 form relatively airtight annular flow space.Gas flows into air guide annular groove 105 from air inlet guide hole 135 and flows, and flows to through air guide annular groove 105 guide hole 136 outflows of giving vent to anger.When concrete curing operation, utilize the heating element heater 140 that is built in 120 inside, heat conduction support portion to be heated, heat can be heated the flowing gas in the air guide annular groove 105 of 120 sides 123 around the heat conduction support portion by the conduction of heat conduction support portion 120.Like this, mobile heated air just can the acceleration point micelle colloid in the volatilization of organic volatile solvent, thereby the acceleration point micelle colloid solidify to shorten hardening time approximately 50%, and then the efficiency of hoist point glue process.
Figure 4 shows that the top view of the some glue solidify device of second embodiment of the invention.Figure 5 shows that the top view of some matrix plate of the some glue solidify device of corresponding second embodiment of the invention.Please in the lump with reference to Fig. 4 and Fig. 5, the structure of the some glue solidify device 100a of the present embodiment and the some glue solidify device 100 of the first embodiment is roughly the same, the difference of the two is, the second side plate 132 of the surrounding edge 130 of some glue solidify device 100a comprises a plurality of protuberances 137 that protrude towards the side away from the 4th side plate 134, the second side plate 132 also has a plurality of openings 138 towards the 4th side plate 134, a plurality of openings 138 are corresponding with a plurality of protuberances 137 respectively, and extend in corresponding protuberance 137, a plurality of openings 138 are connected with air guide annular groove 105.In fact, the structure of point glue solidify device 100a is the structure for points of engagement glue product, particularly, air guide annular groove 105, a plurality of protuberance 137 and a plurality of opening 138 are designed according to distribution and the position of the some micelle colloid on a structure of glue product and some glue product, so that the some micelle colloid fully is exposed in air guide annular groove 105.
Figure 5 shows that the top view of the display panels after the some glue of some glue solidify device of corresponding second embodiment of the invention.In the present embodiment, a plurality of for example flexible circuit boards (Flexible printed circuit, FPC) of the 202a of section that flexibly connect that the display panels 200a after some glue comprises display panels main body 201a and is connected in display panels main body 201a.Display panels 200a after a glue is positioned on heat conduction support portion 120, and be fixed by the vacuum suction in vacuum suction hole 124, now, the size of display panels 200a after some glue is greater than heat conduction support portion 120, therefore can cover air guide annular groove 105, and be resisted against surrounding edge 130(the first side plate 131, the second side plate 132, the 3rd side plate 133 and the 4th side plate 134), simultaneously a plurality of flexibly connect the 202a of section can be respectively against a plurality of protuberances 137 and cover a plurality of openings 138, thereby make air guide annular groove 105 form relative airtight annular flow space with a plurality of openings 138.Heating air flow can further flow to a plurality of openings 138 so that display panels main body 201a is carried out to rapid curing with the some micelle colloid that flexibly connects the 202a of section junction or flexibly connect the 202a of section.
Above provided by the present invention some glue solidify device is described in detail, applied specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention simultaneously.
Claims (10)
1. a some glue solidify device, is characterized in that, it comprises:
Base plate, have first surface;
The heat conduction support portion, be arranged on this first surface;
Surrounding edge, be arranged on this first surface and around this heat conduction support portion, there is the air guide annular groove between this surrounding edge and this heat conduction support portion, and have the air inlet guide hole be communicated with this air guide annular groove and the guide hole of giving vent to anger, and this heat conduction support portion highly is less than second height of this surrounding edge with respect to this first surface with respect to first of this first surface; And
Heating element heater, be arranged in this heat conduction support portion.
2. as claimed in claim 1 some glue solidify device, it is characterized in that, this surrounding edge comprises that head and the tail connect the first side plate, the second side plate, the 3rd side plate, the 4th side plate successively, this first side plate is relative with the 3rd side plate, this second side plate is relative with the 4th side plate, and this air inlet guide hole and this guide hole of giving vent to anger are arranged at respectively this first side plate and the 3rd side plate.
3. as claimed in claim 2 some glue solidify device, it is characterized in that, this second side plate comprises a plurality of protuberances, the plurality of protuberance protrudes towards the side away from the 4th side plate, this second side plate also has a plurality of openings towards the 4th side plate, and the plurality of opening is corresponding the plurality of protuberance being connected with this air guide annular groove respectively.
4. as claimed in claim 1 some glue solidify device, is characterized in that, this heat conduction support portion has supporting surface, and have a plurality of vacuum suction hole that connects this supporting surface.
5. as claimed in claim 4 some glue solidify device, is characterized in that, the plurality of vacuum suction hole is interconnected in the inside of this heat conduction support portion.
6. as claimed in claim 4 some glue solidify device, is characterized in that, this glue solidify device also comprises vacuum tube, and this vacuum tube is connected with the plurality of vacuum suction hole.
7. as claimed in claim 1 some glue solidify device, is characterized in that, this heating element heater comprises resistance wire.
8. as claimed in claim 7 some glue solidify device, is characterized in that, this resistance wire is nickel-chromium resistance wire.
9. as claimed in claim 1 some glue solidify device, is characterized in that, this glue solidify device also comprises air induction conduit and outtake tube, is arranged at respectively in this air inlet guide hole and this guide hole of giving vent to anger.
10. as claimed in claim 1 some glue solidify device, is characterized in that, this air inlet pipe is provided with pneumatic control valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310351106.1A CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310351106.1A CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
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| Publication Number | Publication Date |
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| CN103464337A true CN103464337A (en) | 2013-12-25 |
| CN103464337B CN103464337B (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310351106.1A Active CN103464337B (en) | 2013-08-13 | 2013-08-13 | Point glue solidify device |
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| CN (1) | CN103464337B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105032711A (en) * | 2015-07-09 | 2015-11-11 | 北京中电科电子装备有限公司 | Dispensing device |
| CN105855134A (en) * | 2016-06-03 | 2016-08-17 | 杭州奥克光电设备有限公司 | Optical fiber core inserting, dispensing and curing integrated manufacture assembly line |
| CN105964514A (en) * | 2016-06-30 | 2016-09-28 | 锐嘉（宜兴）科技有限公司 | Mobile phone shell assembling glue drying device |
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| EP0954049A2 (en) * | 1998-04-28 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
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| CN202387642U (en) * | 2011-12-20 | 2012-08-22 | 东莞市冠佳电子设备有限公司 | Automatic dispensing and curing device |
| CN102688831A (en) * | 2012-05-31 | 2012-09-26 | 中天宽带技术有限公司 | Constant temperature heating device for automatic gelatine grouter |
| CN202762604U (en) * | 2012-08-15 | 2013-03-06 | 吴江市博众精工科技有限公司 | Adhesive dispensing and curing device |
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| EP0954049A2 (en) * | 1998-04-28 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| CN201346523Y (en) * | 2009-01-06 | 2009-11-18 | 思林菲加热器材(东莞)有限公司 | Dispensing system |
| CN101951731A (en) * | 2010-10-18 | 2011-01-19 | 卓盈微电子（昆山）有限公司 | Improved heating platform for glue curing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105032711A (en) * | 2015-07-09 | 2015-11-11 | 北京中电科电子装备有限公司 | Dispensing device |
| CN105855134A (en) * | 2016-06-03 | 2016-08-17 | 杭州奥克光电设备有限公司 | Optical fiber core inserting, dispensing and curing integrated manufacture assembly line |
| CN105964514A (en) * | 2016-06-30 | 2016-09-28 | 锐嘉（宜兴）科技有限公司 | Mobile phone shell assembling glue drying device |
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|---|---|
| CN103464337B (en) | 2016-02-24 |
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Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |
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