CN109945980A - A kind of stamp hole bond pad surface pasting type pyroelectric sensor - Google Patents
A kind of stamp hole bond pad surface pasting type pyroelectric sensor Download PDFInfo
- Publication number
- CN109945980A CN109945980A CN201910245813.XA CN201910245813A CN109945980A CN 109945980 A CN109945980 A CN 109945980A CN 201910245813 A CN201910245813 A CN 201910245813A CN 109945980 A CN109945980 A CN 109945980A
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- China
- Prior art keywords
- circuit board
- stamp hole
- supporting element
- pad circuit
- hole pad
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- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 230000006698 induction Effects 0.000 claims abstract description 24
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 16
- 239000010703 silicon Substances 0.000 claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims description 12
- 229920006335 epoxy glue Polymers 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000005616 pyroelectricity Effects 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The present invention relates to a kind of stamp hole bond pad surface pasting type pyroelectric sensors, including stamp hole pad circuit board, IC chip, induction member, supporting element and metal pipe cap, IC chip is placed in the middle part of stamp hole pad circuit board upper end, IC chip and stamp hole pad circuit board electrical connection；The two sides that the upper end of stamp hole pad circuit board corresponds to IC chip are provided with silicon spacer；Induction member is placed between two silicon spacers, induction member and stamp hole pad circuit board electrical connection；Supporting element is placed in the upper end of stamp hole pad circuit board, and supporting element is removably connect with stamp hole pad circuit board；Supporting element structure annular in shape, supporting element is around silicon spacer；Metal pipe cap is placed in the upper end of supporting element, and is tightly connected with supporting element.Compared with the prior art, the configuration of the present invention is simple is reliable, the airtightness to induction member and IC chip is able to achieve, convenient for handling and exporting to signal；Promotion signal is anti-interference.
Description
Technical field
The present invention relates to pyroelectric sensor technical fields, specifically, in particular to a kind of stamp hole bond pad surface patch
Dress type pyroelectric sensor.
Background technique
The prior art forms space to chip using common base and ceramic gasket, plastic cement gasket, then reconnects induction
Member draws the pyroelectric sensor of signal, has the disadvantage that
1, general TO pedestal needs to process gasket, assembly gasket；2, gasket built in current production, size are big；3, client
Manual plug-in unit is needed to weld, it is artificial high；4, current Surface Mount pyroelectric sensor is not easy manual welding and signal is easy to interfere.
Summary of the invention
The present invention is directed to solve one of above-mentioned technical problem in the prior art at least to a certain extent.For this purpose, this hair
A bright purpose is to propose that a kind of structure is simple, reduces welding difficulty, reduces the stamp hole bond pad surface patch of signal interference
Dress type pyroelectric sensor.
The technical scheme to solve the above technical problems is that a kind of stamp hole bond pad surface pasting type pyroelectricity passes
Sensor, including stamp hole pad circuit board, IC chip, induction member, supporting element and metal pipe cap, the IC chip are placed in the postal
The middle part of ticket hole pad circuit board upper end, the IC chip and the stamp hole pad circuit board electrical connection；The stamp eyelet welding
The two sides that the upper end of disk circuit board corresponds to the IC chip are provided with silicon spacer, two silicon spacers with the stamp hole
The upper surface of pad circuit board is fixedly connected；The induction member is placed between two silicon spacers, induction member with it is described
Stamp hole pad circuit board electrical connection；
The supporting element is placed in the upper end of the stamp hole pad circuit board, the supporting element and stamp hole pad electricity
Road plate removably connects；The supporting element structure annular in shape, the supporting element is around the silicon spacer；The metal pipe cap is set
It is tightly connected in the upper end of the supporting element, and with the supporting element.
The beneficial effects of the present invention are: simple and reliable for structure, stamp hole pad circuit board technology is mature；Metal pipe cap and branch
Support member is tightly connected, and the airtightness to induction member and IC chip is able to achieve, convenient for handling and exporting to signal；Promotion signal
It is anti-interference.
Based on the above technical solution, the present invention can also be improved as follows.
Further, optical filter is provided on the metal pipe cap, the optical filter is fixedly connected with the metal pipe cap；Institute
State the corresponding top in the induction member of optical filter.
Beneficial effect using above-mentioned further scheme is: optical filter can be such that the infra-red radiation of specific wavelength selectively leads to
It crosses, is incuded convenient for induction member, promote induction precision.
Further, the lower end of the supporting element is provided with limited block, and the limited block is fixedly connected with the supporting element；Institute
It states stamp hole pad circuit board and corresponds to and be provided with perforation at the limited block, the limited block protrudes into the perforation.
Beneficial effect using above-mentioned further scheme is: limited block protrudes into perforation, can make supporting element by limited block
It removably connects with stamp hole pad circuit board, is tightly connected convenient for metal pipe cap and supporting element.
Further, the edge of the supporting element is provided with annular trough body, and the annular is protruded into the lower part of the metal pipe cap
In groove body, the lower part of the metal pipe cap is connect by epoxy glue with the sealed bottom of the annular trough body.
Beneficial effect using above-mentioned further scheme is: passing through epoxy glue and annular trough body by the lower part of metal pipe cap
Sealed bottom connection, be tightly connected convenient for metal pipe cap and supporting element；It is able to achieve the airtightness to induction member and IC chip, just
It is handled and exported in signal；Promotion signal is anti-interference.
Further, the upper end of the stamp hole pad circuit board is provided with power cathode, and the power cathode covers postal
The area of ticket hole pad circuit board upper surface is greater than 2/3rds of the upper end area of the stamp hole pad circuit board.
Beneficial effect using above-mentioned further scheme is: the face of stamp hole pad circuit board upper surface shared by power cathode
Product ratio is big, effectively avoids the interference of peripheral signal.
Detailed description of the invention
Fig. 1 is a kind of fractionation structural representation of stamp hole bond pad surface pasting type pyroelectric sensor of the present invention；
Fig. 2 is the front view of stamp hole pad circuit board of the present invention；
Fig. 3 is the rearview of stamp hole pad circuit board of the present invention.
In attached drawing, parts list represented by the reference numerals are as follows:
1, stamp hole pad circuit board, 1.1, perforation, 1.2, power cathode；
2, IC chip, 3, induction member；
4, supporting element, 4.1, limited block, 4.2, annular trough body；
5, metal pipe cap, 6, silicon spacer, 7, optical filter.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
As shown in Figure 1 to Figure 3, a kind of stamp hole bond pad surface pasting type pyroelectric sensor, including stamp hole pad electricity
Road plate 1, IC chip 2, induction member 3, supporting element 4 and metal pipe cap 5, the IC chip 2 are placed in the stamp hole pad circuit board 1
The middle part of upper end, the IC chip 2 are electrically connected with the stamp hole pad circuit board 1；The stamp hole pad circuit board 1 it is upper
The two sides of the corresponding IC chip 2 in end are provided with silicon spacer 6, two silicon spacers 6 with the stamp hole pad circuit
The upper surface of plate 1 is fixedly connected；The induction member 3 is placed between two silicon spacers 6, the induction member 3 and the stamp
Hole pad circuit board 1 is electrically connected；
The supporting element 4 is placed in the upper end of the stamp hole pad circuit board 1, the supporting element 4 and the stamp eyelet welding
Disk circuit board 1 removably connects；The supporting element 4 structure annular in shape, the supporting element 4 is around the silicon spacer 6；The gold
Belong to the upper end that pipe cap 5 is placed in the supporting element 4, and is tightly connected with the supporting element 4.
It is simple and reliable for structure, 1 technology maturation of stamp hole pad circuit board；Metal pipe cap 5 and supporting element 4 are tightly connected, energy
The airtightness to induction member 3 and IC chip 2 is realized, convenient for handling and exporting to signal；Promotion signal is anti-interference.
In above-described embodiment, optical filter 7, the optical filter 7 and the metal pipe cap 5 are provided on the metal pipe cap 5
It is fixedly connected；The corresponding top in the induction member 3 of the optical filter 7.
Optical filter 7 can make the infra-red radiation of specific wavelength optionally through 3 being incuded convenient for induction member, promotion feeling
Answer precision.
In above-described embodiment, the lower end of the supporting element 4 is provided with limited block 4.1, the limited block 4.1 and the support
Part 4 is fixedly connected；Perforation 1.1, the limited block are provided at the corresponding limited block 4.1 of the stamp hole pad circuit board 1
4.1 protrude into the perforation 1.1.
Limited block 4.1 protrudes into perforation 1.1, can make supporting element 4 and stamp hole pad circuit board 1 can by limited block 4.1
The connection of disassembly is tightly connected convenient for metal pipe cap 5 and supporting element 4.
In above-described embodiment, the edge of the supporting element 4 is provided with annular trough body 4.2, and the lower part of the metal pipe cap 5 is stretched
Enter in the annular trough body 4.2, the lower part of the metal pipe cap 5 passes through the sealed bottom of epoxy glue and the annular trough body 4.2
Connection.
It is connect by epoxy glue with the sealed bottom of annular trough body 4.2 by the lower part of metal pipe cap 5, is convenient for metal pipe cap
5 are tightly connected with supporting element 4；It is able to achieve the airtightness to induction member 3 and IC chip 2, convenient for handling and exporting to signal；
Promotion signal is anti-interference.
In above-described embodiment, the upper end of the stamp hole pad circuit board 1 is provided with power cathode 1.2, the power supply
The area that cathode 1.2 covers 1 upper surface of stamp hole pad circuit board is greater than the upper end area of the stamp hole pad circuit board 1
2/3rds.
The area ratio of 1 upper surface of stamp hole pad circuit board shared by power cathode 1.2 is big, effectively avoids peripheral signal
Interference.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of stamp hole bond pad surface pasting type pyroelectric sensor, it is characterised in that: including stamp hole pad circuit board
(1), IC chip (2), induction first (3), supporting element (4) and metal pipe cap (5), the IC chip (2) are placed in the stamp eyelet welding
The middle part of disk circuit board (1) upper end, the IC chip (2) are electrically connected with the stamp hole pad circuit board (1)；The stamp hole
The two sides that the upper end of pad circuit board (1) corresponds to the IC chip (2) are provided with silicon spacer (6), two silicon spacers (6)
It is fixedly connected with the upper surface of the stamp hole pad circuit board (1)；The induction first (3) is placed in two silicon spacers
(6) between, the induction first (3) is electrically connected with the stamp hole pad circuit board (1)；
The supporting element (4) is placed in the upper end of the stamp hole pad circuit board (1), the supporting element (4) and the stamp hole
Pad circuit board (1) removably connects；The supporting element (4) structure annular in shape, the supporting element (4) is around the silicon spacer
(6)；The metal pipe cap (5) is placed in the upper end of the supporting element (4), and is tightly connected with the supporting element (4).
2. a kind of stamp hole bond pad surface pasting type pyroelectric sensor according to claim 1, it is characterised in that: the gold
Belong to and being provided with optical filter (7) on pipe cap (5), the optical filter (7) is fixedly connected with the metal pipe cap (5)；The optical filter
(7) corresponding in the top for incuding first (3).
3. a kind of stamp hole bond pad surface pasting type pyroelectric sensor according to claim 1, it is characterised in that: the branch
The lower end of support member (4) is provided with limited block (4.1), and the limited block (4.1) is fixedly connected with the supporting element (4)；The postal
It is provided with perforation (1.1) at the corresponding limited block (4.1) of ticket hole pad circuit board (1), the limited block (4.1) is protruded into described
It perforates in (1.1).
4. a kind of stamp hole bond pad surface pasting type pyroelectric sensor according to claim 1, it is characterised in that: the branch
The edge of support member (4) is provided with annular trough body (4.2), and the annular trough body (4.2) are protruded into the lower part of the metal pipe cap (5)
Interior, the lower part of the metal pipe cap (5) is connect by epoxy glue with the sealed bottom of the annular trough body (4.2).
5. a kind of stamp hole bond pad surface pasting type pyroelectric sensor according to claim 1, it is characterised in that: the postal
The upper end of ticket hole pad circuit board (1) is provided with power cathode (1.2), and the power cathode (1.2) covers stamp hole pad
The area of circuit board (1) upper surface is greater than 2/3rds of the upper end area of the stamp hole pad circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910245813.XA CN109945980A (en) | 2019-03-28 | 2019-03-28 | A kind of stamp hole bond pad surface pasting type pyroelectric sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910245813.XA CN109945980A (en) | 2019-03-28 | 2019-03-28 | A kind of stamp hole bond pad surface pasting type pyroelectric sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109945980A true CN109945980A (en) | 2019-06-28 |
Family
ID=67012673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910245813.XA Pending CN109945980A (en) | 2019-03-28 | 2019-03-28 | A kind of stamp hole bond pad surface pasting type pyroelectric sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN109945980A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001908A1 (en) * | 2002-06-25 | 2003-12-31 | Matsushita Electric Works, Ltd. | Infrared sensor package |
| CN201017088Y (en) * | 2007-03-21 | 2008-02-06 | 昆山钜亮光电科技有限公司 | Surface stick-mounting camera module group |
| CN201937955U (en) * | 2010-11-26 | 2011-08-17 | 比亚迪股份有限公司 | Circuit board and module |
| CN102564603A (en) * | 2010-12-07 | 2012-07-11 | 南阳森霸光电有限公司 | Pyroelectric infrared sensor |
| CN204405192U (en) * | 2014-12-19 | 2015-06-17 | 南阳森霸光电股份有限公司 | SMD intelligent pyroelectric infrared sensor |
| WO2016192035A1 (en) * | 2015-06-02 | 2016-12-08 | 东莞传晟光电有限公司 | Pyroelectric sensor |
| CN208187562U (en) * | 2018-04-26 | 2018-12-04 | 焦作子亮红外传感有限公司 | Patch type pyroelectric infrared sensor |
| CN209764275U (en) * | 2019-03-28 | 2019-12-10 | 东莞传晟光电有限公司 | Surface-mounted pyroelectric sensor for stamp hole welding pad |
-
2019
- 2019-03-28 CN CN201910245813.XA patent/CN109945980A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001908A1 (en) * | 2002-06-25 | 2003-12-31 | Matsushita Electric Works, Ltd. | Infrared sensor package |
| CN201017088Y (en) * | 2007-03-21 | 2008-02-06 | 昆山钜亮光电科技有限公司 | Surface stick-mounting camera module group |
| CN201937955U (en) * | 2010-11-26 | 2011-08-17 | 比亚迪股份有限公司 | Circuit board and module |
| CN102564603A (en) * | 2010-12-07 | 2012-07-11 | 南阳森霸光电有限公司 | Pyroelectric infrared sensor |
| CN204405192U (en) * | 2014-12-19 | 2015-06-17 | 南阳森霸光电股份有限公司 | SMD intelligent pyroelectric infrared sensor |
| WO2016192035A1 (en) * | 2015-06-02 | 2016-12-08 | 东莞传晟光电有限公司 | Pyroelectric sensor |
| CN208187562U (en) * | 2018-04-26 | 2018-12-04 | 焦作子亮红外传感有限公司 | Patch type pyroelectric infrared sensor |
| CN209764275U (en) * | 2019-03-28 | 2019-12-10 | 东莞传晟光电有限公司 | Surface-mounted pyroelectric sensor for stamp hole welding pad |
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