CN109926733A - Laser cutting device and laser cutting method - Google Patents
Laser cutting device and laser cutting method Download PDFInfo
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- CN109926733A CN109926733A CN201910255385.9A CN201910255385A CN109926733A CN 109926733 A CN109926733 A CN 109926733A CN 201910255385 A CN201910255385 A CN 201910255385A CN 109926733 A CN109926733 A CN 109926733A
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Abstract
The present invention relates to a kind of laser cutting device and laser cutting methods, laser cutting device, it include: laser module, camera model and spectroscope, laser module and camera model are in face of setting, spectroscope is set between laser module and camera model, spectroscope is provided with reflecting coating towards the side of laser module, and spectroscope is provided with light transmission coating towards the side of camera model.Laser cutting method includes the following steps, camera model is arranged on the optical axis of laser, towards laser, workpiece is placed between laser and camera model the incidence surface of camera model, camera model is for taking pictures to workpiece to determine that cutting path, laser are cut according to cutting path；Spectroscope is set between workpiece and camera model, and spectroscope is provided with reflecting coating towards the side of laser, and spectroscope is provided with light transmission coating towards the side of camera model.Have the advantages that small in size, cutting accuracy is high.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to a kind of laser cutting device and laser cutting method.
Background technique
As electric car industry constantly upgrades, the capacity of battery is required also to be continuously improved with multiplying power.
The positive plate or negative electrode tab of battery are process by sheet material, and industry internal ratio more typically uses hardware mould
Tool punching, produces positive plate or negative electrode tab with design outline, for example, hardware dies punching needs to use die-cutting machine and mould
Tool, with the increase of number of use, die wear causes the pole piece edge produced to generate burr, and traditional die-cutting machine
Volume is big, and it is larger to occupy production site.
Summary of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of laser cutting device and laser cutting method, there is volume
Advantage small, cutting accuracy is high.
A kind of laser cutting device, comprising:
Laser module, for emitting laser to cut to workpiece；
Camera model, for taking pictures to the workpiece to determine cutting path, the laser module and the camera
Module faces are to setting, and the workpiece is between the laser module and the camera model；And
Spectroscope is set between the laser module and the camera model, and the laser module is along the cutting path
When mobile, the spectroscope can change the direction of propagation of some or all of laser module transmitting laser, the light splitting
Mirror surface is provided with reflecting coating to the side of the laser module, and the spectroscope is provided with towards the side of the camera model
Light transmission coating.
The laser module includes: in one of the embodiments,
Mould group is moved, the movement mould group includes fixing seat and mobile terminal；And
The mobile terminal of the movement mould group is arranged in laser, and the movement mould group is for driving the laser along institute
It is mobile to state cutting path, and during the motion, the laser of the laser transmitting is at least capable of camera model described in direct projection
Camera lens.
The camera model includes: in one of the embodiments,
Industrial camera, and
Cleaning assemblies, the cleaning assemblies include the air hose dried towards the camera lens of the industrial camera.
The spectroscope is between the industrial camera and workpiece in one of the embodiments,.
The air hose is dried towards between the industrial camera and the spectroscope in one of the embodiments,.
It in one of the embodiments, further include that cutting between the laser module and the camera model is flat
Platform, the Cutting platform are provided with peephole, the camera model can pass through institute for carrying workpiece on the Cutting platform
Peephole is stated to take pictures to workpiece.
Light source is provided on the Cutting platform in one of the embodiments, the Cutting platform is arranged in the light
Between source and the camera model.
It in one of the embodiments, further include traction roller group, the traction roller group includes at least two transfer rollers, workpiece warp
That crosses two transfer rollers is pulled into the Cutting platform.
It in one of the embodiments, further include for carrying out clean hairbrush module to the workpiece after cutting, along work
The conveying direction of part, the hairbrush module are set to the laser module downstream.
A kind of laser cutting method, comprising the following steps:
Camera model is arranged on the optical axis of laser, the incidence surface of the camera model towards laser, set by workpiece
Between laser and camera model, the camera model is described for being taken pictures to the workpiece to determine cutting path
Laser is cut according to the cutting path；
Spectroscope is set between workpiece and the camera model, and the spectroscope is arranged towards the side of the laser
There is reflecting coating, the spectroscope is provided with light transmission coating towards the side of the camera model.
The utility model has the advantages that by face of setting, optimizing the layout of equipment, reducing equipment laser module and camera model
Volume；By the way that spectroscope is arranged, spectroscope is provided with reflecting coating, the light splitting mirror surface towards the side of the laser module
The side of the camera model is provided with light transmission coating, the laser of laser module transmitting is completely or partially reflected by reflecting coating
Fall, to protect camera model, and the light of camera model can normally be taken pictures by light transmission coating.
Detailed description of the invention
Fig. 1 and Fig. 2 is the aspect graph of the workpiece of the laser cutting device inputted in the application one embodiment, by laser
After cutter device, it is processed to state shown in Fig. 2；
Fig. 3 is the schematic elevation view of the laser cutting device in the application one embodiment；
Fig. 4 is the schematic perspective view of the laser cutting device in the application one embodiment；
Fig. 5 is the structural schematic diagram of the laser module of the laser cutting device in the application one embodiment；
Fig. 6 is the partial structure diagram of the laser cutting device in the application one embodiment, is basically illustrated in figure
Camera model and laser module；
Fig. 7 is the partial structure diagram of the laser cutting device in the application one embodiment, is basically illustrated in figure
Camera model and spectroscope.
Appended drawing reference: 100, tab；110, cutting line；120, fillet；130, joint；210, laser module；211, it transports
Dynamic model group；2111, fixing seat；2112, mobile terminal；212, laser；220, camera model；221, industrial camera；222, it cleans
Component；2221, air hose；230, spectroscope；231, reflecting coating；232, light transmission coating；233, support frame；234, connecting hole；
240, Cutting platform；241, adsorption hole；242, peephole；250, light source；260, traction roller group；261, transfer roller；270, hairbrush mould
Block；271, the first brush roll；272, the second brush roll；273, cylinder；280, output module.
Specific embodiment
To facilitate the understanding of the present invention, referring to relevant drawings to invention is more fully described.It is given in attached drawing
Present pre-ferred embodiments are gone out.But the invention can be realized in many different forms, however it is not limited to described herein
Embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding of the disclosure of invention more preferably thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes.
Fig. 1-Fig. 2 is the aspect graph of the workpiece of the laser cutting device inputted in the application one embodiment, by laser
After cutter device, it is processed to state shown in Fig. 2.The workpiece can be the tab of battery in one of the embodiments,
100, tab 100 is the metallic conductor for extracting positive and negative anodes from battery core, is generally made of sheet metal.By the application
In laser cutting device before, workpiece configurations, which have been worked upon, to be finished, and workpiece becomes band, and is filled by laser cutting in the application
It sets, band-like workpiece is cut, to isolate several single tabs 100, i.e., final product.The application is with tab
Laser cutting device is illustrated for 100, but the laser cutting device in the application is not limited to the processing of tab 100,
As long as needing to be applicable in the laser cutting device in the application by cutting isolated product.
As shown in Figure 1, dotted line show cutting line 110, i.e. laser cutting device position to be cut.
Fig. 3 is the schematic elevation view of the laser cutting device in the application one embodiment, and Fig. 4 is the application one implementation
The schematic perspective view of laser cutting device in example.
As shown in figure 3, laser cutting device includes laser module 210 and camera model 220.Wherein, laser module 210 is used
In transmitting laser to be cut to tab 100；Camera model 220 is cut for taking pictures workpiece to determine cutting path
Secant 110 is located on cutting path, and laser module 210 and camera model 220 face setting, so as to reduce the whole of equipment
Body volume.But since laser module 210 and camera model 220 are in face of setting, the laser that laser module 210 emits being capable of direct projection
The camera lens of camera model 220, to cause to damage to camera lens.It can be by the way that laser module 210 and camera model 220 be staggered and be set
It sets, to protect camera model 220, but can also accordingly increase equipment volume.
As shown in figure 3, spectroscope 230 is arranged between laser module 210 and camera model 220, spectroscope 230 is towards sharp
The side of optical module 210 is provided with reflecting coating 231, and spectroscope 230 is provided with light transmission coating towards the side of camera model 220
232.The laser that laser module 210 emits cuts workpiece along cutting path, when laser module 210 is irradiated to spectroscope
When on 230 reflecting coating 231, all or part of laser is reflected by reflecting coating 231, and then can not be irradiated to camera mould
On the camera lens of block 220, or the laser intensity being irradiated on the camera lens of camera model 220 is weakened severely, to prevent laser pair
The lens chip calcination of camera model 220 or the degree of injury for delaying camera model 220.For example, the transmitting of laser module 210 swashs
Light can be reflected away all by reflecting coating 231；For another example, in the laser that laser module 210 emits, a part of laser (such as receive
Rice red light portion) it is reflected away by reflecting coating 231, to weaken the intensity of the laser across spectroscope 230, and pass through light splitting
The laser intensity of mirror 230 is unlikely to that camera model 220 is caused to be damaged, or camera model 220 can be delayed to be damaged；For another example,
A part is reflected by reflecting coating 231 in the laser that laser module 210 emits, and a part is reflected by reflecting coating 231, is reflected
The laser fallen cannot inject the camera lens of camera model 220 naturally, completely or partially enter camera model 220 in the laser being refracted
Camera lens after, camera model 220 will not be caused to damage, or camera model 220 can be delayed to be damaged.And camera model 220
When taking pictures, light can be through the reflecting coating 231 on spectroscope 230, to realize positioning function of taking pictures.The application passes through optimization
The arrangement of laser module 210 and camera model 220, reduces the occupied space of equipment, so that device structure is more compact.
Fig. 5 be one embodiment in laser module 210 structural schematic diagram, laser module 210 can emit laser with
Band-like workpiece is cut, workpiece can be cut off after cutting, form independent tab 100.As shown in figure 5, mode of laser
Block 210 includes movement mould group 211 and laser 212.Wherein, movement mould group 211 is for driving laser 212 to move, laser
212 cut workpiece along cutting line 110 shown in Fig. 1.As shown in figure 5, movement mould group 211 includes fixing seat 2111 and movement
End 2112, has determined cutting path after being taken pictures by camera model 220 to workpiece, movement mould group 211 just driving laser 212 along cutting
It is mobile to cut path.In order to make device miniaturization, as shown in figure 3, laser 212 can emit downward laser, camera mould group
Positioned at the lower section of laser 212, when moving mould group 211 and driving laser 212 mobile, a moment laser can be against camera
The camera lens of module 220 emits laser, by spectroscope 230 by this beam laser reflection, to protect camera model 220.For example, movement
Mould group 211 may include X-direction driving mould group and Y-direction driving mould group, to drive laser 212 to move in two-dimensional surface；Also
It can further include that Z-direction drives mould group, to drive laser 212 to move in three-dimensional space.In other embodiments, it transports
Dynamic model group 211 can also drive mould group for other linear drives mould groups or curve.
Fig. 6 is the partial structure diagram of the laser cutting device in one embodiment, basically illustrates camera mould in figure
Block 220 and laser module 210.Wherein, camera model 220 includes industrial camera 221 and cleaning assemblies 222.Fig. 7 is an implementation
The partial structure diagram of laser cutting device in example basically illustrates camera model 220 and spectroscope 230 in figure.Such as Fig. 7
Shown, cleaning assemblies 222 includes the air hose 2221 dried towards the camera lens of industrial camera 221.By air hose 2221 towards camera lens
Blowing, to remove the dust for being attached to camera lens surface.As shown in fig. 7, spectroscope 230 is located at 221 top of industrial camera, air hose
2221 dry towards between industrial camera 221 and spectroscope 230.Since spectroscope 230 and industrial camera 221 are arranged at laser
Below module 210 and workpiece, the dust that laser module 210 generates when cutting to workpiece can be deposited in spectroscope to falling
230 and industrial camera 221 camera lens on, will affect when dust accumulation is to certain thickness the effect and camera of spectroscope 230
It takes pictures effect, artificial cleaning spectroscope is replaced towards blowing between industrial camera 221 and spectroscope 230 by air hose 2221 at this time
230 and industrial camera 221, reduce the cost of manual maintenance.
As shown in fig. 7, spectroscope 230 is arranged between industrial camera 221 and workpiece, specifically, the fixation of spectroscope 230 is set
It sets above the camera lens of industrial camera 221.Specifically, 221 top of industrial camera can be fixed on by support frame 233.Support
Connecting hole 234 is offered on frame 233 adjusts the angle of spectroscope 230 after the fixing axle of spectroscope 230 is inserted into connecting hole 234,
It may then pass through bolt and the fixing axle of spectroscope 230 lock onto connecting hole 234.As shown in figs. 4 and 7, camera model 220
Including two industrial cameras 221, air hose 2221 is divided into two sections by a supervisor and is in charge of, and is in charge of for two and is respectively facing two sides camera mould
Block 220 is blowed with spectroscope 230.
As shown in figure 4, further including the Cutting platform 240 between laser module 210 and camera model 220, cutting is flat
Platform 240 is for carrying workpiece.Several adsorption holes 241 are provided on the table top of Cutting platform 240, adsorption hole 241 is connected with absorption
Device, after on workpiece motion s to Cutting platform 240, adsorbent equipment carries out air-breathing and forms negative pressure, and workpiece is fixed on and is cut
It cuts on platform 240, to prevent workpiece displacement in laser cutting.As shown in fig. 6, being provided with peephole on Cutting platform 240
242, peephole 242 is connected to 240 upper and lower of Cutting platform, and camera model 220 can clap workpiece by peephole 242
According to.Specifically, there are two peephole 242 can be set, peephole 242 is corresponding with camera model 220, and peephole 242
In the surface of the camera lens of camera model 220.As shown in Figure 1, industrial camera 221 is by peephole 242 to the fillet on workpiece
120 carry out positioning of taking pictures, as shown in Fig. 2, there is fillet 120 at four angles of each tab 100, as shown in Figure 1, workpiece two sides are each
There are two fillet 120, the joint 130 of two fillets 120 of the every side of workpiece is located on cutting line 110, therefore, is justified by shooting
Angle 120 can position workpiece cutting line 110 to be cut.
Further, as shown in figure 4, being provided with light source 250 in the top of Cutting platform 240, the setting of Cutting platform 240 exists
Between light source 250 and camera model 220, shining to be radiated on workpiece by light source 250 forms backlight, to make the shape of workpiece
It is more clear, so to improve camera model 220 to the accuracy of workpiece identification, further enables industrial camera 221 smart
True positioning fillet 120, and then accurate determining cutting line 110.
In one embodiment, as shown in figure 3, further including traction roller group 260, traction roller group 260 includes at least two and turns
Roller 261, workpiece are pulled into Cutting platform 240 by two transfer rollers 261.When laser module 210 is cut, traction roller
Group 260 can suspend traction, when work piece cut is separated into single tab 100 by laser module 210, traction roller group 260 after
The tab 100 cut down is pushed away forward Cutting platform 240 by continuous starting, posterior workpiece.
In one embodiment, as shown in figure 3, further including hairbrush module 270 and output module 280, along the defeated of workpiece
Direction, i.e., the direction from Fig. 3 from left to right are sent, workpiece passes through hair after laser module 210 is cut into single tab 100
Brush module 270 cleans tab 100, to remove the dust generated in cutting process.Hairbrush module 270 includes being located below
First brush roll 271 and the second brush roll 272 for being located above, further include the motor for being respectively used to driving two brush rolls rotation,
The second brush roll 272 being located above is driven by cylinder 273, can be gone up and down relative to the first brush roll 271, and tab 100 passes through first
Between brush roll 271 and the second brush roll 272, the first brush roll 271 and the second brush roll 272 respectively clean the two sides of tab 100.
Output module 280 can be for example linear conveyer belt, and after tab 100 is cut down from workpiece, traction component pushes tab
100 move right, pass through hairbrush module 270 after, tab 100 is shifted on linear conveyer belt, then by linear conveyer belt after
It is continuous that tab 100 is conveyed.For another example, referring to Fig. 3, when workpiece is transported to the right on Cutting platform 240, the right end of workpiece at this time
It has reached between the first brush roll 271 of hairbrush module 270 and the second brush roll 272, Cutting platform 240 passes through vacuum suction pair
Workpiece is positioned, and hairbrush module 270 can rotate at this time, can not also be rotated, when laser module 210 by tab 100 from work
After cutting down on part, cylinder 273 drives the second brush roll 272 to move downward, and the first brush roll 271 is synchronous with the second brush roll 272
Rotation, during cleaning tab 100, the first brush roll 271 and the second brush roll 272 press tab 100, also by tab 100
It shifts onto the right on output module 280.
The application one embodiment also provides a kind of laser cutting method, comprising the following steps:
Camera model is arranged on the optical axis of laser, the incidence surface of the camera model towards laser, set by workpiece
Between laser and camera model, the camera model is described for being taken pictures to the workpiece to determine cutting path
Laser is cut according to the cutting path；
Spectroscope is set between workpiece and the camera model, and the spectroscope is arranged towards the side of the laser
There is reflecting coating, the spectroscope is provided with light transmission coating towards the side of the camera model.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.Several implementations of the invention above described embodiment only expresses
Mode, the description thereof is more specific and detailed, and but it cannot be understood as the limitations to patent of invention range.It should be understood that
It is that for those of ordinary skill in the art, without departing from the inventive concept of the premise, several deformations can also be made
And improvement, these are all within the scope of protection of the present invention.Therefore, the scope of protection of the patent of the present invention should be with appended claims
It is quasi-.
Claims (10)
1. a kind of laser cutting device characterized by comprising
Laser module, for emitting laser to cut to workpiece；
Camera model, for taking pictures to the workpiece to determine cutting path, the laser module and the camera model
In face of setting, and the workpiece is between the laser module and the camera model；And
Spectroscope is set between the laser module and the camera model, and the laser module is moved along the cutting path
When, the spectroscope can change the direction of propagation of some or all of laser module transmitting laser, the light splitting mirror surface
The side of the laser module is provided with reflecting coating, the spectroscope is provided with light transmission towards the side of the camera model
Coating.
2. laser cutting device according to claim 1, which is characterized in that the laser module includes:
Mould group is moved, the movement mould group includes fixing seat and mobile terminal；And
The mobile terminal of the movement mould group is arranged in laser, and the movement mould group is for driving the laser to cut described in
It is mobile to cut path, and during the motion, the laser of the laser transmitting is at least capable of the camera lens of camera model described in direct projection.
3. laser cutting device according to claim 1, which is characterized in that the camera model includes:
Industrial camera, and
Cleaning assemblies, the cleaning assemblies include the air hose dried towards the camera lens of the industrial camera.
4. laser cutting device according to claim 3, which is characterized in that the spectroscope be located at the industrial camera with
Between workpiece.
5. laser cutting device according to claim 4, which is characterized in that the air hose is towards the industrial camera and institute
It states and dries between spectroscope.
6. laser cutting device according to claim 1, which is characterized in that further include be located at the laser module with it is described
Cutting platform between camera model, the Cutting platform are provided with peephole, institute for carrying workpiece on the Cutting platform
Stating camera model can take pictures to workpiece by the peephole.
7. laser cutting device according to claim 6, which is characterized in that be provided with light source, institute on the Cutting platform
Cutting platform is stated to be arranged between the light source and the camera model.
8. laser cutting device according to claim 6, which is characterized in that it further include traction roller group, the traction roller group
Including at least two transfer rollers, workpiece is pulled into the Cutting platform by two transfer rollers.
9. laser cutting device according to claim 6, which is characterized in that further include for being carried out to the workpiece after cutting
Clean hairbrush module, along the conveying direction of workpiece, the hairbrush module is set to the laser module downstream.
10. a kind of laser cutting method, which comprises the following steps:
Camera model is arranged on the optical axis of laser, towards laser, workpiece is placed in sharp the incidence surface of the camera model
Between light device and camera model, the camera model is for taking pictures to the workpiece to determine cutting path, the laser
Device is cut according to the cutting path；
Spectroscope is set between workpiece and the camera model, and the spectroscope is provided with instead towards the side of the laser
Light coating, the spectroscope are provided with light transmission coating towards the side of the camera model.
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| CN201910255385.9A CN109926733A (en) | 2019-04-01 | 2019-04-01 | Laser cutting device and laser cutting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910255385.9A CN109926733A (en) | 2019-04-01 | 2019-04-01 | Laser cutting device and laser cutting method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112440002A (en) * | 2020-10-13 | 2021-03-05 | 苏州凯荣激光科技有限公司 | Laser engraving device |
| WO2023193217A1 (en) * | 2022-04-08 | 2023-10-12 | 宁德时代新能源科技股份有限公司 | Marking processing method and apparatus for continuous composite material belt, and computer device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070084838A1 (en) * | 2004-12-07 | 2007-04-19 | Chih-Ming Hsu | Method and cutting system for cutting a wafer by laser using a vacuum working table |
| CN101559629A (en) * | 2009-05-12 | 2009-10-21 | 苏州德龙激光有限公司 | Coaxial image system applied to LED laser cutting device |
| CN101564794A (en) * | 2009-05-12 | 2009-10-28 | 苏州德龙激光有限公司 | Ultraviolet laser device for cutting copper substrate for high-power LED chip |
| JP4777826B2 (en) * | 2006-05-25 | 2011-09-21 | 日本碍子株式会社 | Sheet processing machine |
| CN102554463A (en) * | 2012-02-14 | 2012-07-11 | 中国科学院福建物质结构研究所 | Coaxial CCD (charge coupled device) imaging system applied to laser cutting |
| CN108097503A (en) * | 2018-02-08 | 2018-06-01 | 浙江粤强家具科技有限公司 | The traction of furniture decoration wood skin and diced system |
-
2019
- 2019-04-01 CN CN201910255385.9A patent/CN109926733A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070084838A1 (en) * | 2004-12-07 | 2007-04-19 | Chih-Ming Hsu | Method and cutting system for cutting a wafer by laser using a vacuum working table |
| JP4777826B2 (en) * | 2006-05-25 | 2011-09-21 | 日本碍子株式会社 | Sheet processing machine |
| CN101559629A (en) * | 2009-05-12 | 2009-10-21 | 苏州德龙激光有限公司 | Coaxial image system applied to LED laser cutting device |
| CN101564794A (en) * | 2009-05-12 | 2009-10-28 | 苏州德龙激光有限公司 | Ultraviolet laser device for cutting copper substrate for high-power LED chip |
| CN102554463A (en) * | 2012-02-14 | 2012-07-11 | 中国科学院福建物质结构研究所 | Coaxial CCD (charge coupled device) imaging system applied to laser cutting |
| CN108097503A (en) * | 2018-02-08 | 2018-06-01 | 浙江粤强家具科技有限公司 | The traction of furniture decoration wood skin and diced system |
Non-Patent Citations (4)
| Title |
|---|
| 刘辉: "《红外光电探测原理》", 30 April 2016 * |
| 周坚华: "《遥感技术常用名词手册》", 30 November 1992 * |
| 张幼文: "《红外光学工程》", 30 November 1982 * |
| 马拉卡拉（D.MALACARA）主编，白国强译: "《光学车间检验》", 31 August 1983 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112440002A (en) * | 2020-10-13 | 2021-03-05 | 苏州凯荣激光科技有限公司 | Laser engraving device |
| WO2023193217A1 (en) * | 2022-04-08 | 2023-10-12 | 宁德时代新能源科技股份有限公司 | Marking processing method and apparatus for continuous composite material belt, and computer device |
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Application publication date: 20190625 |
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